JP2001322036A5 - - Google Patents
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- JP2001322036A5 JP2001322036A5 JP2001056039A JP2001056039A JP2001322036A5 JP 2001322036 A5 JP2001322036 A5 JP 2001322036A5 JP 2001056039 A JP2001056039 A JP 2001056039A JP 2001056039 A JP2001056039 A JP 2001056039A JP 2001322036 A5 JP2001322036 A5 JP 2001322036A5
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001056039A JP4644954B2 (ja) | 2000-03-09 | 2001-02-28 | 研磨装置 |
| US09/800,580 US6797623B2 (en) | 2000-03-09 | 2001-03-08 | Methods of producing and polishing semiconductor device and polishing apparatus |
| KR1020010012287A KR100741148B1 (ko) | 2000-03-09 | 2001-03-09 | 반도체 소자의 제조 및 연마 방법, 및 연마 장치 |
| US10/327,860 US7186322B2 (en) | 2000-03-09 | 2002-12-26 | Methods of producing and polishing semiconductor device and polishing apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000071083 | 2000-03-09 | ||
| JP2000-71083 | 2000-03-09 | ||
| JP2001056039A JP4644954B2 (ja) | 2000-03-09 | 2001-02-28 | 研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001322036A JP2001322036A (ja) | 2001-11-20 |
| JP2001322036A5 true JP2001322036A5 (enExample) | 2008-03-06 |
| JP4644954B2 JP4644954B2 (ja) | 2011-03-09 |
Family
ID=26587477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001056039A Expired - Fee Related JP4644954B2 (ja) | 2000-03-09 | 2001-02-28 | 研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4644954B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4409807B2 (ja) * | 2002-01-23 | 2010-02-03 | 株式会社荏原製作所 | 基板処理方法 |
| JP2003311537A (ja) * | 2002-04-30 | 2003-11-05 | Sony Corp | 研磨方法、研磨装置及び半導体装置の製造方法 |
| US20070108066A1 (en) * | 2005-10-28 | 2007-05-17 | Applied Materials, Inc. | Voltage mode current control |
| JP5252271B2 (ja) * | 2008-05-02 | 2013-07-31 | 株式会社ニコン | 研磨装置 |
| WO2010052917A1 (ja) * | 2008-11-07 | 2010-05-14 | 株式会社ロキテクノ | 研磨ヘッド、研磨装置及び基板研磨体 |
| JP5590477B2 (ja) * | 2013-04-19 | 2014-09-17 | 株式会社ニコン | 研磨装置 |
| JP6454326B2 (ja) | 2014-04-18 | 2019-01-16 | 株式会社荏原製作所 | 基板処理装置、基板処理システム、および基板処理方法 |
| JP6749569B2 (ja) * | 2017-02-17 | 2020-09-02 | 東邦エンジニアリング株式会社 | 研磨装置のヘッド進退装置 |
| KR102254027B1 (ko) * | 2019-11-28 | 2021-05-20 | (주)천우테크 | 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템 |
| KR102214115B1 (ko) * | 2020-10-12 | 2021-02-09 | 임재균 | 현장 실시용 스텐리스 스틸 전해 부식 장치 |
| CN113894373B (zh) * | 2021-08-31 | 2022-07-29 | 安徽工程大学 | 一种恒力电解磨削加工装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5144568A (ja) * | 1974-10-16 | 1976-04-16 | Nippon Telegraph & Telephone | Denkaikaseiso |
| JP4204649B2 (ja) * | 1996-02-05 | 2009-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3824345B2 (ja) * | 1996-04-26 | 2006-09-20 | 東京エレクトロン株式会社 | 研磨方法および研磨装置 |
| JP3125049B2 (ja) * | 1996-12-05 | 2001-01-15 | 工業技術院長 | タングステンの電解鏡面研磨方法 |
| US5911619A (en) * | 1997-03-26 | 1999-06-15 | International Business Machines Corporation | Apparatus for electrochemical mechanical planarization |
| JPH11345789A (ja) * | 1998-06-01 | 1999-12-14 | Toshiba Corp | 研磨方法 |
| JP4513145B2 (ja) * | 1999-09-07 | 2010-07-28 | ソニー株式会社 | 半導体装置の製造方法および研磨方法 |
| US6355153B1 (en) * | 1999-09-17 | 2002-03-12 | Nutool, Inc. | Chip interconnect and packaging deposition methods and structures |
| US6299741B1 (en) * | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
| JP2001326204A (ja) * | 2000-03-09 | 2001-11-22 | Sony Corp | 半導体装置の製造方法および研磨方法 |
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2001
- 2001-02-28 JP JP2001056039A patent/JP4644954B2/ja not_active Expired - Fee Related