JP2001316888A - 半導体基板のメッキ処理システム - Google Patents

半導体基板のメッキ処理システム

Info

Publication number
JP2001316888A
JP2001316888A JP2000133454A JP2000133454A JP2001316888A JP 2001316888 A JP2001316888 A JP 2001316888A JP 2000133454 A JP2000133454 A JP 2000133454A JP 2000133454 A JP2000133454 A JP 2000133454A JP 2001316888 A JP2001316888 A JP 2001316888A
Authority
JP
Japan
Prior art keywords
plating
semiconductor substrate
unit
section
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000133454A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001316888A5 (https=
Inventor
Wataru Okase
亘 大加瀬
Takenobu Matsuo
剛伸 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000133454A priority Critical patent/JP2001316888A/ja
Priority to US09/846,660 priority patent/US6716329B2/en
Publication of JP2001316888A publication Critical patent/JP2001316888A/ja
Publication of JP2001316888A5 publication Critical patent/JP2001316888A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000133454A 2000-05-02 2000-05-02 半導体基板のメッキ処理システム Pending JP2001316888A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000133454A JP2001316888A (ja) 2000-05-02 2000-05-02 半導体基板のメッキ処理システム
US09/846,660 US6716329B2 (en) 2000-05-02 2001-05-01 Processing apparatus and processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000133454A JP2001316888A (ja) 2000-05-02 2000-05-02 半導体基板のメッキ処理システム

Publications (2)

Publication Number Publication Date
JP2001316888A true JP2001316888A (ja) 2001-11-16
JP2001316888A5 JP2001316888A5 (https=) 2007-04-05

Family

ID=18641949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000133454A Pending JP2001316888A (ja) 2000-05-02 2000-05-02 半導体基板のメッキ処理システム

Country Status (1)

Country Link
JP (1) JP2001316888A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118843721A (zh) * 2023-08-23 2024-10-25 株式会社荏原制作所 基板处理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118843721A (zh) * 2023-08-23 2024-10-25 株式会社荏原制作所 基板处理装置

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