JP2001297943A - Chip electronic parts, its manufacturing method, and printed board for mounting it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide chip electronic parts which can stand against a stress applied from the outside after mounted on a printed board, a method of manufac turing the parts, and a printed board for mounting. SOLUTION: The chip electronic parts are constituted in such a way that lead wires 3 bent along the grooves of a seat plate 4 fitted to a case 2 are fixed to the seat plate 4. Consequently, when a stress is applied to the parts after mounted on the printed board 5, the lead wires 3 are stripped off from soldered sections at once, because the lead wired 3 are firmly coupled with the seat late 4. Therefore, the peeling strength of the electronic parts can be increased extremely high, because all joint surfaces between the lead wires 3 and soldered sections contribute to the peeling strength.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component mounted on a printed circuit board or the like and a method of manufacturing the same, and a printed circuit board on which the electronic component is mounted.

[0002]

2. Description of the Related Art A conventional chip-type electronic component of this type will be described with reference to the drawings, taking a surface-mounted chip-type capacitor as an example.

FIGS. 11A to 11C are partial cross-sectional views showing a state in which a conventional chip-type capacitor is mounted on a printed circuit board, and a state in which a load is applied to the capacitor and the capacitor is peeled off in this state. In 11, 40 is a capacitor in which a capacitor element (not shown) is housed, 41 is a seat plate mounted on the opening side of the capacitor 40, 42 is a sealing member (not shown) sealing the opening of the capacitor 40, and It is a lead wire for external lead-out that is led out through the seat plate 41, and this lead wire 42 is bent at a right angle along a groove provided in the seat plate 41 after the seat plate 41 is inserted. Thus, the bent portion becomes an electrode terminal and is connected to the printed board by soldering. 43 is the capacitor 4
Reference numeral 0 denotes a printed circuit board on which the printed circuit board 43 is mounted, reference numeral 44 denotes a connecting portion provided on the printed circuit board 43, and reference numeral 45 denotes solder for connecting the connecting portion 44 to the lead wire.

[0004]

However, in the chip-type capacitor 40 having the above-mentioned conventional structure, FIG.
As shown in FIG. 5, when a load F is externally applied to the capacitor 40 in a direction parallel to the mounting surface of the printed circuit board 43 (the direction of the arrow in the drawing) after mounting on the printed circuit board 43, 11), the lead wire 42 starts to peel off from the connecting portion 44 while the side) is deformed, and the peeling proceeds as if the tape was peeled off.
As shown in (c), there was a problem that the film was peeled off even under a weak load.

The final peeling strength at this time is such that the weakest part of the bonding strength between the lead wire 42 and the solder 45, or between the solder 45 and the connecting part 44, or between the connecting part 44 and the printed circuit board 43 is the weakest. It appears as

The present invention solves such a conventional problem,
It is an object of the present invention to provide a chip-type electronic component having high strength against a load applied from the outside after mounting on a printed circuit board, a method of manufacturing the same, and a printed circuit board on which the electronic component is mounted.

[0007]

According to a first aspect of the present invention, there is provided a case for accommodating an element having a lead wire, and a closure for sealing an opening of the case. In a chip-type electronic component comprising a member and a seat plate attached to the sealing member side, at least a part of a lead wire bent along a groove provided through the sealing member is fixed to the seat plate. Configuration
With this configuration, when a load is applied from the outside after mounting on the printed circuit board, the lead wire and the seat plate are firmly connected, so that the lead wire comes off at a stretch from the soldered part, Since the entire joining surface between the lead wire and the soldered portion contributes to the peel strength, an effect of providing a chip-type electronic component having extremely high peel strength can be obtained.

According to a second aspect of the present invention, a fixing groove is provided on a peripheral surface of the seat plate for connecting to a groove provided in the seat plate, into which the lead wire fits, and the tip of the lead wire bent along the groove is provided. In this configuration, the portion is further fixed by bending the portion along the fixing groove. With this configuration, the operation and effect obtained by the invention of claim 1 can be further enhanced. can get.

According to a third aspect of the present invention, an engaging portion having a width wider than a width of a fixing groove provided on a peripheral surface of a seat plate is provided by processing a front end portion of a lead wire into a flat shape. This is a configuration in which the provided engaging portion is engaged with the terminal end of the fixing groove of the seat plate. With this configuration, the operation and effect obtained by the invention according to claim 1 can be further enhanced. The operation and effect are obtained.

According to a fourth aspect of the present invention, at least the soldering surface of the lead wire bent along the groove into which the lead wire provided on the seat plate fits is provided with irregularities. Accordingly, the effect of increasing the soldering area and improving the soldering strength between the lead wire and the soldered portion can be obtained.

According to a fifth aspect of the present invention, an element having a lead wire is housed in a case, an opening of the case is sealed with a sealing member, and subsequently, the device is inserted through a hole provided in the sealing member. After bending the lead wire in a right angle direction, a case including the bent lead wire is arranged in an injection molding die, and a resin seat plate is injection-molded on the opening side of the case. This is a method of manufacturing a chip-type electronic component. With this manufacturing method, an operation and effect that extremely high vibration resistance can be exhibited because the seat plate is integrated with the case can be obtained.

According to a sixth aspect of the present invention, there is provided a printed circuit board having a connection portion to which a lead wire of a chip-type electronic component is connected, wherein the connection portion has a land pattern and a resist having an opening provided thereon. The width of the opening provided in the resist portion is equal to or greater than a dimension obtained by adding twice the thickness of the lead wire to the width of the lead wire, and the width of the land pattern is greater than the width of the opening portion of the resist portion. It is also designed to have a configuration that is narrower than the outer diameter of the chip-type electronic component, which increases the peel strength between the printed circuit board and the land pattern and allows the solder fillet to be formed in an optimal state. In addition, the effect that the bonding strength of the lead wire and the connection portion of the chip-type electronic component by soldering can be greatly improved can be obtained.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) Hereinafter, the first and second aspects of the present invention will be described with reference to the first embodiment.

FIG. 1A is a partial cross-sectional front view showing a state in which a chip-type electronic component according to Embodiment 1 of the present invention is mounted on a printed circuit board. In FIG. 1A, reference numeral 1 denotes a capacitor as the chip-type electronic component. The capacitor 1 has an element (not shown) having a lead wire housed in a bottomed cylindrical case 2 and the opening of the case 2 is sealed with a sealing member (not shown). It is configured. Three
Are a pair of lead wires derived from the capacitor 1, 4
Is a seat plate provided on the opening side of the capacitor 1. The pair of lead wires 3 is bent along a groove provided in the seat plate 4, and the front end of the lead wire 3 is further bent around the seat plate 4. The hook portion 3a is formed by being bent from the surface so as to go around the opposite side of the groove. Reference numeral 5 denotes a printed circuit board, 6 denotes a land pattern as a connecting portion provided on the printed circuit board 5, and 7 denotes solder connecting the land pattern 6 and the lead wire 3.

As shown in FIG. 1 (b), the capacitor 1 according to the present embodiment having the above-described configuration is provided with a load F that peels off the capacitor 1 mounted on the printed circuit board 5 from outside. The lead wire 3 provided with the hook portion 3a at the distal end via the seat plate 4 is hardly deformed, and the entire contact surface between the lead wire 3 and the solder 7 is peeled off at a stretch, so that the entire contact surface contributes to the peel strength. Thus, a peel strength 1.5 to 2 times that of the conventional product is exhibited.

In the first embodiment, the hook 3a is formed by bending the leading end of the lead wire 3 from the peripheral surface of the seat plate 4 to the side opposite to the groove. The present invention is not limited to this. The lead wire 3 is fixed to the seat plate 4 by means of welding, bonding, press fitting, or the like, or a fixing groove for connecting to the groove provided on the seat plate 4 is provided. The same effect can be obtained by fixing the leading end of the lead wire 3 to the fixing groove provided on the peripheral surface.

(Embodiment 2) Hereinafter, the second embodiment of the present invention will be described with reference to Embodiment 2.

FIGS. 2A and 2B are a front view and a side view showing a chip-type electronic component according to a second embodiment of the present invention. In FIG. 2, reference numeral 8 denotes a capacitor as the chip-type electronic component. The capacitor 8 accommodates an element (not shown) having a lead wire in a cylindrical case 9 having a bottom.
The opening of the case 9 is sealed by a sealing member (not shown). Reference numeral 10 denotes a pair of lead wires connected to the element and led out of the capacitor 8, 11 denotes a seat plate provided on the opening side of the capacitor 8, and the lead wire 10 is provided on the bottom surface of the seat plate 11. A groove that is bent and stored and a fixing groove 11a that is connected to the groove are provided on the peripheral surface. 10a is a fixing groove 1 of the seat plate 11 formed by flattening the tip of the lead wire 10.
1a is an engaging portion formed wider than the engaging portion 1a.
The lead wire 10 is fixed to the seat plate 11 by engaging Oa with the end of the fixing groove 11 a of the seat plate 11.

The capacitor 8 according to the second embodiment having the above-described configuration is similar to the first embodiment when a load F that peels off the capacitor 8 mounted on the printed circuit board is applied from the outside. Fixed groove 1 provided in seat plate 11
The lead wire 10 provided with the engaging portion 10a at the distal end so as to engage with the terminal end of the lead 1a is difficult to deform, and the entire contact surface between the lead wire 10 and the solder is peeled off at a stretch, so that the entire contact surface contributes to the peel strength. 1.5 ~ of conventional products
It will exhibit twice the peel strength.

(Embodiment 3) Hereinafter, the third embodiment of the present invention will be described with reference to a third embodiment.

FIGS. 3 (a) and 3 (b) are a front view and a bottom view, respectively, showing lead wires of a chip-type electronic component according to a third embodiment of the present invention. In FIG. Lead wire derived from the capacitor of
Reference numeral 2a denotes a soldering surface formed by bending the lead wire 12, and 12b denotes an uneven portion provided on the soldering surface 12a. The uneven portion 12b is formed by embossing, etching, pressing, or the like. By doing so, the effective surface area of the soldering surface 12a is enlarged.

The capacitor according to the third embodiment having the above-described structure has a configuration in which the effective surface area is increased by providing the uneven surface 12b on the soldering surface 12a of the lead wire 12, thereby increasing the effective surface area. Similarly to 2, when a load F that peels off the capacitor mounted on the printed circuit board is applied from the outside, the lead wire 12 with improved soldering strength is hardly deformed, and the entire contact surface between the lead wire 12 and the solder is formed. Are peeled off at once, so that the entire contact surface contributes to the peel strength, so that the peel strength is 1.5 to 2 times that of the conventional product.

(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to Embodiment 4.

FIGS. 4 to 9 show a method of manufacturing a chip-type electronic component according to a fourth embodiment of the present invention. First, a capacitor as shown in FIGS. 4A and 4B is manufactured. . In FIG. 1, reference numeral 13 denotes a capacitor as a chip-type electronic component. The capacitor 13 accommodates an element (not shown) having a lead wire in a bottomed cylindrical case 14. The opening is sealed by a sealing member (not shown).
Reference numeral 15 denotes a pair of lead wires derived from the capacitor 13, and reference numeral 15a denotes a terminal portion having an engaging portion 15b formed by processing a part of the lead wire 15 into a flat shape, and is mounted on a printed circuit board. This is where the connection portion will be soldered.

Next, as shown in FIG. 5, terminal portions 15a of a pair of lead wires 15 led out from the capacitor 13 are formed.
6 are bent outward at right angles so as to be symmetrical, and as shown in FIG. 6, the terminal portions 15a of the pair of lead wires 15 are bent outward at right angles. The seat plate 20 is injection-molded by placing it in a molding die composed of a lower die 16 and a lower die 17 and filling the molten resin 19 into the die through an injection port 18 provided in the die.

Next, as shown in FIG. 7, the capacitor 13 on which the seat plate 20 is formed is taken out of the molding die, mounted on the cutting die 21, and the terminal portions of the pair of lead wires 15 are After cutting off the distal end portion while leaving the engaging portion 15a and the engaging portion 15b, the engaging portion 15b of the pair of lead wires 15 is bent by the forming mold 23 as shown in FIG. ), (B), the engaging portion 15b is fixed to the fixing groove 2 provided in the seat plate 20.
In this case, the capacitor 13 is manufactured so as to engage with the end of the capacitor 4.

As described above, in the method of manufacturing the capacitor according to the fourth embodiment, the engaging portion 15b of the pair of lead wires 15 derived from the capacitor 13 is bent and then the seat plate 20 is bent.
The lead wire 15 is connected to the seat plate 2 by injection molding.
0, and when a load F that peels off the capacitor mounted on the printed circuit board is applied from the outside similarly to the first to third embodiments,
Since the lead wire 15 is hardly deformed and the entire contact surface between the lead wire 15 and the solder is peeled off at a stretch, the entire contact surface contributes to the peel strength, so that the peel strength is 1.5 to 2 times that of the conventional product. It will be able to demonstrate.

In the fourth embodiment, an engaging portion 15b is provided at the end of the lead wire 15, and the engaging portion 15b is engaged with the end of the fixing groove 24 provided on the peripheral surface of the seat plate 20. Although the present invention is not limited to this, the lead wire 15 is fixed to the seat plate 20 or a fixing groove for connecting to the groove provided in the seat plate 20 is formed around the seat plate 20. A similar effect can be obtained even if the front end of the lead wire 15 is fixed in this fixing groove in the surface.

(Embodiment 5) Hereinafter, a fifth embodiment of the present invention will be described with reference to a fifth embodiment.

FIGS. 10 (a) and 10 (b) are a partial sectional front view showing a state in which a chip-type electronic component according to a fifth embodiment of the present invention is mounted on a printed circuit board and a plan view of a main part of the printed circuit board. In the drawing, reference numeral 25 denotes a capacitor as a chip-type electronic component; 26, a pair of lead wires derived from the capacitor 25; and 27, a seat plate mounted on the opening side of the capacitor 25. 28 is a printed circuit board having a connection portion to which the lead wire 26 of the capacitor 25 is connected, 29 is a land pattern formed on the printed circuit board 28, 30 is a resist portion formed on the land pattern 29, 31 Is an opening provided in the resist portion 30. The width W2 of the opening 31 is equal to or larger than the width W1 of the lead wire 26 plus twice the thickness H of the lead wire 26, and The width W3 is wider than the width W2 of the opening 31 of the resist unit 30, and the width of the capacitor 2
5 is smaller than the outer diameter dimension.

In the printed circuit board 28 according to the fifth embodiment thus configured, the contact area between the printed circuit board 28 and the land pattern 29 is increased, so that the peel strength is improved and the solder fillet is formed in an optimum state. For,
The bonding strength by soldering between the lead wire 26 of the capacitor 25 and the opening 31 of the resist portion 30 can be greatly improved, and the printed circuit board 28 is mounted on the printed circuit board 28 as in the first to fourth embodiments. When a load F that peels off the capacitor 25 is applied from the outside, the lead wire 26 is hardly deformed, and the entire contact surface between the lead wire 26 and the solder is peeled off at a stretch, so that the entire contact surface contributes to the peel strength. As a result, a peel strength 1.5 to 2 times that of the conventional product is exhibited.

[0032]

As described above, according to the present invention, even when a load for peeling off a chip-type electronic component mounted on a printed circuit board is applied from the outside, it is bent along the groove provided in the seat plate. It is possible to provide a highly reliable chip-type electronic component in which the obtained lead wire is hardly deformed. Further, by using the printed circuit board of the present invention, the above effects can be further enhanced, and the contribution thereof is large.

[Brief description of the drawings]

FIG. 1 (a) is a partial cross-sectional front view showing a state where a chip-type capacitor according to a first embodiment of the present invention is mounted on a printed circuit board; and (b) a chip-type capacitor mounted on the printed circuit board is peeled from the outside. Partial sectional front view showing the state when such a load is applied

FIG. 2A is a front view showing a chip-type capacitor according to a second embodiment of the present invention; FIG.

FIG. 3 (a) is a front view showing a lead wire of a chip-type capacitor according to a third embodiment of the present invention.

FIG. 4 (a) is a front view showing a method for manufacturing a chip-type capacitor according to a fourth embodiment of the present invention.

FIG. 5 is a front view showing a state where the lead wire is bent by the manufacturing method.

FIG. 6 is a front view showing a state where the seat plate is injection molded by the same manufacturing method.

FIG. 7 is a front view showing a state in which an unnecessary portion of the lead wire is cut by the same manufacturing method.

FIG. 8 is a front view showing a state where the lead wire is formed by the same manufacturing method.

9A is a front view showing a chip-type capacitor manufactured by a manufacturing method, and FIG.

FIG. 10A is a partial cross-sectional front view showing a state where a chip-type capacitor according to a fifth embodiment of the present invention is mounted on a printed circuit board. FIG.

11A is a partial cross-sectional front view showing a state in which a conventional chip-type capacitor is mounted on a printed circuit board. FIG. 11B is a view in which a load is applied to the chip-type capacitor mounted on the printed circuit board to separate it from the outside. (C) Partial sectional front view showing a state in which the chip-type capacitor is peeled off.

[Explanation of symbols]

 1, 8, 13, 25 Capacitor 2, 9, 14 Case 3, 10, 12, 15, 26 Lead wire 3a Hook 4, 11, 20, 27 Seat plate 5 Printed circuit board 6 Land pattern 7 Solder 10a, 15b Engage Parts 11a, 24 Fixing groove 12a Soldering surface 12b Irregular part 15a Terminal part 16 Upper die 17 Lower die 18 Injection 19 Melt resin 21 Cutting die 22 Cutter 23 Forming die 28 Printed circuit board 29 Land pattern 30 Resist part 31 Opening

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Tetsuo Sonoda 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 5E319 AA03 AC01 AC11 BB05 CC22 GG20 5E336 AA04 BB01 CC02 CC06 CC32 CC43 CC53 DD22 DD26 EE01 GG14 GG16

Claims (6)

[Claims] 1. An element having a lead wire for external lead-out, a bottomed cylindrical case housing the element, and a hole through which the external lead-out lead wire is inserted. A sealed sealing member, a hole through which the lead wire for external drawing is inserted, and a seat plate attached to the sealing member side with a groove into which a lead wire that is inserted in the hole and bent in a right angle direction fits. A chip-type electronic component, wherein at least a part of the bent lead wire is fixed to the seat plate. 2. A fixing groove connected to a groove in which a lead wire provided on a seat plate is fitted is provided on a peripheral surface of the seat plate, and a tip end of the lead wire bent along the groove is further attached to the fixing groove. 2. The chip-type electronic component according to claim 1, wherein the chip-type electronic component is fixed by being bent along. 3. An engaging portion having a width wider than a width of a fixing groove provided on a peripheral surface of a seat plate is formed by flattening a distal end portion of a lead wire, and the engaging portion provided on the lead wire is formed as described above. 3. The chip-type electronic component according to claim 2, wherein said chip-type electronic component is engaged with an end of a fixing groove of said seat plate. 4. The chip-type electronic component according to claim 1, wherein at least the soldering surface of the lead wire bent along the groove into which the lead wire provided on the seat plate is fitted has irregularities. 5. An element having a lead wire for external drawing is housed in a bottomed cylindrical case, and subsequently, the opening of the case is sealed with a sealing member, and then provided on the sealing plate. After bending the lead wire for external pull-out inserted through the hole through the hole at right angles, the case including the bent lead wire is arranged in an injection molding die, and a resin material is formed on the opening side of the case. A method of manufacturing a chip-type electronic component in which a seat plate is injection-molded. 6. A printed circuit board having a plurality of connecting portions to which external lead wires serving as electrode terminals of a chip-type electronic component are connected, wherein the connecting portions are a land pattern and an opening provided thereon. The width of the opening provided in the resist portion is equal to or larger than the dimension obtained by adding twice the thickness of the lead wire to the width of the lead wire, and the width of the land pattern is the same as that of the resist portion. A printed circuit board for mounting a chip-type electronic component having a size larger than the width of the opening and smaller than the outer diameter of the chip-type electronic component.