JP3858564B2 - Chip-type electronic component, manufacturing method thereof, and printed circuit board on which the chip-type electronic component is mounted - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip-type electronic component that is used by being mounted on a printed circuit board, a manufacturing method thereof, and a printed circuit board on which the chip-type electronic component is mounted.
[0002]
[Prior art]
A conventional chip-type electronic component of this type will be described with reference to the drawings by taking a surface-mounted chip-type capacitor as an example.
[0003]
11A to 11C are partial sectional views showing a state in which a conventional chip-type capacitor is mounted on a printed circuit board and a state in which a load is applied to the capacitor and peeled in this state. 40 is a capacitor in which a capacitor element (not shown) is housed, 41 is a seat plate mounted on the opening side of the capacitor 40, 42 is a sealing member (not shown) sealing the opening portion of the capacitor 40, and the seat plate. 41 is a lead wire for external drawing led out through 41, and this lead wire 42 is inserted through the seat plate 41 and then bent at a right angle along a groove provided in the seat plate 41, thereby The bent part becomes an electrode terminal and is connected to the printed board by soldering. Reference numeral 43 is a printed circuit board on which the capacitor 40 is mounted, 44 is a connecting portion provided on the printed circuit board 43, and 45 is solder for connecting the connecting portion 44 and the lead wire.
[0004]
[Problems to be solved by the invention]
However, in the chip-type capacitor 40 having the above-described conventional configuration, as shown in FIG. 11B, after being mounted on the printed circuit board 43, the capacitor 40 is mounted in a direction parallel to the mounting surface of the printed circuit board 43 (arrow direction in the figure). When a load F is applied from the outside, the lead wire 42 starts to peel from the connecting portion 44 while the base portion (capacitor side) of the lead wire 42 is deformed, and the peeling proceeds as if the tape is peeled off, As a result, as shown in FIG. 11C, there is a problem that even a weak load is peeled off.
[0005]
The final peel strength at this time is the peel strength at the weakest part of the joint strength between the lead wire 42 and the solder 45, or between the solder 45 and the connecting portion 44, or between the connecting portion 44 and the printed circuit board 43. It is what appears.
[0006]
The present invention solves such a conventional problem, and provides a chip-type electronic component having a high strength against a load applied from the outside after being mounted on a printed board, a manufacturing method thereof, and a printed board on which the chip-type electronic component is mounted. It is the purpose.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention includes a case storing an element having a lead wire, a sealing member sealing the opening of the case, and a hole through which the lead wire is inserted. In addition, in a chip-type electronic component comprising a seat plate mounted on the sealing member side with a groove in which a lead wire inserted through the hole and bent in a right angle direction is fitted, a fixed groove connected to the groove in which the lead wire is fitted Is provided on the peripheral surface of the seat plate, and the tip end of the lead wire bent along the groove into which the lead wire fits is further bent along the fixed groove, and the tip end of the lead wire is processed into a flat shape. the wide engagement portion than the width of the fixing groove provided in the circumferential surface of the seat plate is provided, which the engaging portion provided in the lead wire has a configuration that engages the end of the fixing groove of the seat plate by With this configuration, When a load is applied from the outside after mounting on the circuit board, the lead wire and the seat plate are firmly bonded, so the lead wire is peeled off from the soldered part at a stretch. Since the entire joining surface with the attachment portion contributes to the peel strength, an effect of providing a chip-type electronic component having an extremely high peel strength can be obtained.
[0011]
According to a second aspect of the present invention, an element having a lead wire is housed in a case, the opening of the case is sealed with a sealing member, and then the lead wire inserted through a hole provided in the sealing member. Chip-shaped electronic device in which the case containing the bent lead wire is placed in an injection molding die and a resin seat plate is injection-molded on the opening side of the case. This is a component manufacturing method, and this manufacturing method provides an effect of being able to exhibit extremely high vibration resistance because the seat plate is integrated with the case.
[0012]
According to a third aspect of the present invention, in the printed circuit board having a connection portion to which the lead wire of the chip-type electronic component is connected, the connection portion is constituted by a resist portion having a land pattern and an opening provided thereon. The width of the opening provided in the resist portion is larger than the lead wire width plus twice the lead wire thickness, and the land pattern width is wider than the opening width of the resist portion. The chip shape is smaller than the outer diameter of the electronic component. This configuration improves the peel strength between the printed circuit board and the land pattern and forms the solder fillet in an optimal state. The effect that the joint strength by soldering of the lead wire of an electronic component and a connection part can be improved greatly is acquired.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
Hereinafter, the first and second aspects of the present invention will be described using the first embodiment.
[0014]
FIG. 1A is a partial cross-sectional front view of a state in which a chip-type electronic component according to Embodiment 1 of the present invention is mounted on a printed circuit board. In FIG. 1, reference numeral 1 denotes a capacitor as a chip-type electronic component. The capacitor 1 is configured by housing an element (not shown) having a lead wire in a bottomed cylindrical case 2 and sealing the opening of the case 2 with a sealing member (not shown). Yes. Reference numeral 3 denotes a pair of lead wires led out from the capacitor 1, 4 denotes a seat plate provided on the opening side of the capacitor 1, and the pair of lead wires 3 extends along a groove provided in the seat plate 4. The front end of the seat plate 4 is further bent from the peripheral surface of the seat plate 4 to the opposite side of the groove to form a hook portion 3a. Reference numeral 5 denotes a printed circuit board, 6 denotes a land pattern as a connecting portion provided on the printed circuit board 5, and 7 denotes solder connecting the land pattern 6 and the lead wire 3.
[0015]
As shown in FIG. 1B, the capacitor 1 according to this embodiment configured as described above has a seat plate when a load F is applied to peel the capacitor 1 mounted on the printed circuit board 5 from the outside. The lead wire 3 provided with the hook portion 3a at the tip via 4 is difficult to be deformed and the entire contact surface between the lead wire 3 and the solder 7 is peeled off at a stretch, so that the entire contact surface contributes to the peel strength. Therefore, the peel strength is 1.5 to 2 times that of the conventional product.
[0016]
Although the first embodiment has been described with the configuration in which the tip portion of the lead wire 3 is bent so as to go around from the peripheral surface of the seat plate 4 to the opposite surface side of the groove, the hook portion 3a is formed. However, the present invention is not limited to this, and the lead wire 3 is fixed to the seat plate 4 by means of welding, adhesion, press-fitting, or the like. The same effect can be obtained even if the tip of the lead wire 3 is fixed to the fixing groove.
[0017]
(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.
[0018]
2 (a) and 2 (b) are a front view and a side view showing a chip-type electronic component according to Embodiment 2 of the present invention, in which 8 is a capacitor as a chip-type electronic component. The capacitor 8 is configured by housing an element (not shown) having a lead wire in a bottomed cylindrical case 9 and sealing the opening of the case 9 with a sealing member (not shown). Yes. Reference numeral 10 denotes a pair of lead wires connected to the element and led out from the capacitor 8. Reference numeral 11 denotes a seat plate provided on the opening side of the capacitor 8. The lead wire 10 is attached to the bottom surface of the seat plate 11. A groove that is bent and stored, and a fixed groove 11a connected to the groove are provided on the peripheral surface. Reference numeral 10a denotes an engaging portion formed by processing the tip portion of the lead wire 10 into a flat shape so as to be wider than the fixing groove 11a of the seat plate 11, and this engaging portion 10a is used as an end of the fixing groove 11a of the seat plate 11. The lead wire 10 is fixed to the seat plate 11 by engaging with.
[0019]
In the capacitor 8 according to the second embodiment configured as described above, as in the first embodiment, when a load F that peels off the capacitor 8 mounted on the printed circuit board is applied from the outside, the seat plate 11 Since the lead wire 10 provided with the engaging portion 10a at the tip so as to be engaged with the terminal end of the fixing groove 11a provided on the lead wire is difficult to be deformed and the entire contact surface between the lead wire 10 and the solder is peeled off at a stretch, the entire contact surface Will contribute to the peel strength, and will exhibit a peel strength 1.5 to 2 times that of conventional products.
[0020]
(Embodiment 3)
The third aspect of the present invention will be described below with reference to the third embodiment.
[0021]
3A and 3B are a front view and a bottom view showing a lead wire of a chip-type electronic component according to Embodiment 3 of the present invention, in which 12 is a capacitor as the chip-type electronic component. The lead wire is derived, 12a is a soldering surface formed by bending the lead wire 12, 12b is an uneven portion provided on the soldering surface 12a, and the uneven portion 12b is embossed, The effective surface area of the soldering surface 12a is expanded by being formed by etching or pressing.
[0022]
The capacitor according to the third embodiment configured as described above is similar to the first and second embodiments described above, by providing the uneven surface portion 12b on the soldering surface 12a of the lead wire 12 to increase the effective surface area. In addition, when a load F that peels off the capacitor mounted on the printed circuit board is applied from the outside, the lead wire 12 with improved soldering strength is difficult to deform, and the entire contact surface between the lead wire 12 and the solder peels off at once. Therefore, since the entire contact surface contributes to the peel strength, the peel strength is 1.5 to 2 times that of the conventional product.
[0023]
(Embodiment 4)
Hereinafter, the fourth aspect of the present invention will be described with reference to the fourth embodiment.
[0024]
4 to 9 show a method for manufacturing a chip-type electronic component according to Embodiment 4 of the present invention. First, capacitors as shown in FIGS. 4A and 4B are manufactured. In the figure, reference numeral 13 denotes a capacitor as a chip-type electronic component. The capacitor 13 houses an element (not shown) having a lead wire in a bottomed cylindrical case 14. It is configured by sealing the opening with a sealing member (not shown). Reference numeral 15 denotes a pair of lead wires led out from the capacitor 13, and 15a denotes a terminal portion having an engaging portion 15b formed by processing a part of the lead wire 15 into a flat shape, which is mounted on a printed circuit board. It is a location that becomes a connection portion to be soldered.
[0025]
Next, as shown in FIG. 5, the terminal portions 15a of the pair of lead wires 15 led out from the capacitor 13 are bent at right angles so as to be symmetrical outwardly, and then as shown in FIG. The capacitor 13 in which the terminal portions 15a of the pair of lead wires 15 are bent at right angles toward the outside is put into a molding die composed of an upper die 16 and a lower die 17, and a note provided on the die is provided. The seat plate 20 is injection-molded by filling the mold 19 with the molten resin 19 from the inlet 18.
[0026]
Next, as shown in FIG. 7, the capacitor 13 on which the seat plate 20 is formed is taken out of the molding die and mounted on the cutting die 21, and is engaged with the terminal portions 15 a of the pair of lead wires 15 by the cutter 22. After cutting the tip portion leaving the joint portion 15b, the engaging portions 15b of the pair of lead wires 15 are bent by the forming mold 23 as shown in FIG. As shown in b), the capacitor 13 is manufactured by engaging the engaging portion 15b with the end of the fixing groove 24 provided in the seat plate 20.
[0027]
As described above, in the capacitor manufacturing method according to the fourth embodiment, the seat plate 20 is injection molded after the engaging portions 15b of the pair of lead wires 15 led out from the capacitor 13 are bent. When the load F that can be securely fixed to the seat plate 20 and peels off the capacitor mounted on the printed circuit board is applied from the outside as in the first to third embodiments, the lead wire 15 is Since the entire contact surface between the lead wire 15 and the solder is peeled off at a stroke because it becomes difficult to deform, the entire contact surface contributes to the peel strength, so that it can exhibit a peel strength 1.5 to 2 times that of the conventional product. It will be possible.
[0028]
In the fourth embodiment, an engaging portion 15b is provided at the distal end portion of the lead wire 15, and the engaging portion 15b is engaged with the end of the fixing groove 24 provided on the peripheral surface of the seat plate 20. Although described above, the present invention is not limited to this, and a fixing groove for fixing the lead wire 15 to the seat plate 20 or connecting to a groove provided on the seat plate 20 is provided on the peripheral surface of the seat plate 20. Even if the tip of the lead wire 15 is fixed to the fixing groove, the same effect can be obtained.
[0029]
(Embodiment 5)
The fifth aspect of the present invention will be described below with reference to the fifth embodiment.
[0030]
FIGS. 10A and 10B are a partial cross-sectional front view showing a state where the chip-type electronic component according to the fifth embodiment of the present invention is mounted on the printed board, and a plan view of the principal part of the printed board. , 25 is a capacitor as a chip-type electronic component, 26 is a pair of lead wires derived from the capacitor 25, and 27 is a seat plate mounted on the opening side of the capacitor 25. 28 is a printed circuit board having a connecting portion to which the lead wire 26 of the capacitor 25 is connected, 29 is a land pattern formed on the printed circuit board 28, 30 is a resist section formed on the land pattern 29, 31 Is an opening provided in the resist portion 30. The width W2 of the opening 31 is equal to or larger than the width W1 of the lead wire 26 plus twice the thickness H of the lead wire 26, and the land pattern 29 has a width W2. The width W <b> 3 is wider than the width W <b> 2 of the opening 31 of the resist portion 30 and is smaller than the outer diameter of the capacitor 25.
[0031]
Since the printed circuit board 28 according to the fifth embodiment configured as described above has an increased contact area between the printed circuit board 28 and the land pattern 29, the peel strength is improved and the solder fillet is formed in an optimum state. The joint strength by soldering between the 25 lead wires 26 and the opening 31 of the resist portion 30 can be greatly improved, and the capacitor mounted on the printed circuit board 28 as in the first to fourth embodiments. When a load F that peels 25 is applied from the outside, the lead wire 26 is difficult to deform and the entire contact surface between the lead wire 26 and the solder is peeled off at a stretch, so that the entire contact surface contributes to the peel strength. Therefore, the peel strength is 1.5 to 2 times that of the conventional product.
[0032]
【The invention's effect】
As described above, according to the present invention, even when a load that peels off the chip-type electronic component mounted on the printed circuit board is applied from the outside, the lead wire bent along the groove provided in the seat plate is provided. It is possible to provide a chip-type electronic component with excellent reliability that it is difficult to be deformed. In addition, by using the printed circuit board of the present invention, the above effect can be further enhanced, and the contribution is large.
[Brief description of the drawings]
1A is a partial cross-sectional front view of a chip-type capacitor according to a first embodiment of the present invention mounted on a printed circuit board. FIG. 1B is a diagram illustrating a chip-shaped capacitor mounted on the printed circuit board is peeled from the outside. FIG. 2 (a) is a front view of a chip-type capacitor according to a second embodiment of the present invention. FIG. 3 (a) is a side view of the same. FIG. 4B is a bottom view showing the lead wire of the chip-type capacitor according to the third embodiment of the present invention. FIG. 4A shows a method for manufacturing the chip-shaped capacitor according to the fourth embodiment of the present invention. Front view (b) Same side view [FIG. 5] Front view showing a state where lead wires are bent by the same manufacturing method. [FIG. 6] Front view showing a state where a seat plate is injection-molded by the same manufacturing method. Cut the unnecessary part of the lead wire by the manufacturing method FIG. 8 is a front view showing a state in which a lead wire is formed by the manufacturing method. FIG. 9A is a front view showing a chip-type capacitor manufactured by the manufacturing method. FIG. 10A is a partial cross-sectional front view of a chip-type capacitor according to a fifth embodiment of the present invention mounted on a printed circuit board. FIG. 10B is a plan view of the principal part of the printed circuit board. ) Partial cross-sectional front view of a conventional chip-type capacitor mounted on a printed circuit board (b) Part showing a state when a load is applied to peel the chip-shaped capacitor mounted on the printed circuit board from the outside Cross-sectional front view (c) Partial cross-sectional front view showing a state where the chip-shaped capacitor is peeled off
1, 8, 13, 25 Capacitors 2, 9, 14 Case 3, 10, 12, 15, 26 Lead wire 3a Hook 4, 11, 20, 27 Seat plate 5 Printed circuit board 6 Land pattern 7 Solder 10a, 15b Engagement Portions 11a, 24 Fixed groove 12a Soldering surface 12b Uneven portion 15a Terminal portion 16 Upper die 17 Lower die 18 Inlet 19 Molten resin 21 Cutting die 22 Cutter 23 Forming die 28 Printed circuit board 29 Land pattern 30 Resist portion 31 Opening portion

Claims (3)

An element having a lead wire for external lead, a bottomed cylindrical case housing this element, and a sealing member that seals the opening of the case with a hole through which the lead wire for external lead is inserted And a chip-type electronic component comprising a seat plate mounted on the sealing member side with a hole through which the lead wire for external lead is inserted and a groove into which the lead wire inserted through the hole and bent at a right angle is fitted In the above, a fixing groove connected to the groove into which the lead wire fits is provided on the peripheral surface of the seat plate, and the leading end of the lead wire bent along the groove into which the lead wire fits is further bent along the fixing groove. A chip-type electronic component in which an engaging portion provided wider than the width of the fixed groove is engaged with the fixed groove by processing the tip portion into a flat shape.   The element having the lead wire for external lead was housed in a bottomed cylindrical case, and then the opening of the case was sealed with a sealing member, and then inserted through a hole provided in the sealing plate. After bending the lead wire for external drawing in a right angle direction, the case including the bent lead wire is placed in an injection mold and a resin seat plate is injected to the opening side of the case. A method of manufacturing a chip-type electronic component that is to be molded.   In a printed circuit board having a plurality of connecting portions to which lead wires for external lead serving as electrode terminals of a chip-type electronic component are connected, the connecting portions are formed by a resist portion having a land pattern and an opening provided thereon. And the width of the opening provided in the resist portion is equal to or larger than the dimension obtained by adding twice the thickness of the lead wire to the width of the lead wire, and the width of the land pattern is larger than the width of the opening portion of the resist portion. A printed circuit board for mounting chip-type electronic components that are formed to be narrower than the outer diameter of chip-type electronic components.

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