WO2022030210A1 - Capacitor and manufacturing method therefor - Google Patents

Abstract

The purpose of the technology of the present disclosure is to provide a structure for a capacitor that increases the strength of adhesion to a wiring board, for example, and also to suppress an increase in the manufacturing load of the capacitor.　A capacitor main body (4) includes an outer case (12); a sealing member (16) that has first insertion hole sections (24-1, 24-2) and that is attached to the opening of the outer case; and terminal leads (18-1, 18-2) that have a bent section (20) and an exposed terminal section (22). A pedestal (6) is installed on the sealing member side of the capacitor main body and has: second insertion hole sections (26-1, 26-2) through which the terminal leads are inserted; and guide grooves (28-1, 28-2) which are formed on the substrate mounting surface and in which the exposed terminal section is disposed. Resin layers (8-1, 8-2) are disposed between the pedestal and the sealing member, and in a section of the interior of the insertion holes formed by the first insertion hole section and the second insertion hole section. A fixing resin (10) is disposed between the two sides of the exposed terminal section and the edges of the guide grooves, and is formed integrally with the resin layers.

Description

Capacitors and their manufacturing methods

This disclosure relates to a capacitor that can be mounted on a wiring board such as a circuit board and a manufacturing method thereof.

To mount a capacitor on a wiring board such as a circuit board, the capacitor is equipped with a pedestal, for example. The terminal leads of the capacitor are pulled out to the outer surface of the pedestal (that is, the board mounting surface), bent, and soldered to, for example, a wiring board. Capacitors used for such mounting are called surface mount capacitors. This surface mount type capacitor is highly versatile and is used in automobiles, for example.

When the capacitor is installed outdoors such as in a car, the environmental temperature around the installation of the capacitor rises. Therefore, the capacitor needs to withstand a high temperature environment. For example, a resin layer is formed between the sealing body of the capacitor and the pedestal to enhance the sealing property of the capacitor (for example, Patent Document 1). According to such a configuration, the heat resistance of the capacitor can be improved. In the capacitor provided with this pedestal, an insertion hole is formed in the pedestal, and the terminal lead of the capacitor is arranged outside the pedestal, that is, on the board mounting surface side through the insertion hole.

It is known that the tip of the terminal lead penetrating the insertion hole of the pedestal is fitted into the recess of the pedestal in which the ribbon solder or the cream solder is sandwiched (for example, Patent Document 2). Capacitors with such a configuration prevent inadequate solder connections. That is, the facing surface of the terminal lead to the substrate and the side surface of the terminal lead are connected to the substrate by soldering, and the solder connection between the capacitor and the substrate is strengthened. The following ideas (1) and (2) exist regarding the connection between the capacitor and the board.
Idea (1): Solder should be pre-arranged on the side of the terminal lead to strengthen the connection between the capacitor and the board.
Idea (2): In order to strengthen the connection between the capacitor and the board, it is better to expose the side of the terminal lead so that the solder adheres to the side of the terminal lead when mounting the board.

Japanese Unexamined Patent Publication No. 60-245121 Japanese Unexamined Patent Publication No. 60-148105

By the way, the solder connection contributes to the mechanical connection between the wiring board and the terminal lead. Whether or not the solder connection is sufficient is generally affected by the amount of solder adhered and the adhered area. Whether or not the solder connection is sufficient is generally a problem of the connection structure between the wiring board and the terminal lead, and is affected by the soldering process such as the reflow process.

The hardness and shape of solder change due to heating in the soldering process. Therefore, even if the solder is provided in the vicinity of the terminal leads, the capacitor manufacturer cannot confirm or inspect the final state of the board-mounted portion of the capacitor before board-mounting at the time of sale of the capacitor.

For capacitors for which solder is provided by simple pinching, care must be taken to prevent the solder from falling off or peeling off, for example. Further, in a capacitor in which ribbon solder is provided by sandwiching, care must be taken so that the terminal leads are not pushed up by the restoring force of the ribbon solder, for example.

Patent Document 1 and Patent Document 2 neither disclose nor suggest such a problem, and the configurations disclosed in Patent Document 1 and Patent Document 2 cannot solve such a problem.

Therefore, the first object of the technique of the present disclosure is to provide, for example, a structure of a capacitor that enhances the adhesive strength with a wiring board, and to suppress an increase in the manufacturing load of this capacitor. Here, "fixing strength" does not mean the strength of a simple connection determined by soldering, but is a term that means the fixing strength of a capacitor to a wiring board, that is, the shear strength.

The second object of the present disclosure technique is, for example, to make it possible to confirm a capacitor in a state substantially the same as that of a capacitor mounted on a wiring board at the time of sale of the capacitor.

According to the first aspect of the present disclosure, the capacitor includes a capacitor body, a pedestal, a resin layer, and a fixing resin. The capacitor body has an outer case, a sealing member having a first insertion hole portion and attached to the opening of the outer case, and a bent portion and an exposed terminal portion that are led out from the first insertion hole portion. Includes terminal leads and has. The pedestal has a second insertion hole portion which is installed on the sealing member side of the capacitor body and through which the terminal lead is inserted, and a guide groove formed on the substrate mounting surface and where the exposed terminal portion is arranged. The resin layer is arranged between the pedestal and the sealing member, and a part of the inside of the insertion hole formed by the first insertion hole portion and the second insertion hole portion. The fixing resin is arranged between both side surfaces of the exposed terminal portion of the terminal lead and the edge of the guide groove, and is integrally formed with the resin layer.

In the capacitor, the fixing resin may be arranged along the exposed terminal portion of the terminal lead.

In the capacitor, the resin layer may cover a part of the bent portion.

In the capacitor, the surface of the fixing resin may be at the same position as the board mounting surface or on the inner side of the pedestal with respect to the board mounting surface.

In the capacitor, the central axis of the terminal lead may be arranged on the outer edge side of the pedestal with respect to the center of the opening of the insertion hole.

In the capacitor, the pedestal may further have a connection groove on the substrate mounting surface for connecting the second insertion hole portion on the anode side and the second insertion hole portion on the cathode side.

According to the second aspect of the present disclosure, a method for manufacturing a capacitor includes an outer case, a sealing member having a first insertion hole and attached to the opening of the outer case, and the first insertion hole. A step of manufacturing a capacitor main body including a terminal lead derived from a portion, a step of manufacturing a pedestal having a second insertion hole portion and a guide groove formed on a substrate mounting surface, and a step of manufacturing the pedestal with the capacitor main body. The step of installing the terminal lead on the sealing member side and inserting the terminal lead into the second insertion hole portion to expose it to the substrate mounting surface side, and bending the terminal lead to the terminal lead. By the step of forming the portion and the exposed terminal portion and arranging the exposed terminal portion in the guide groove, between the pedestal and the sealing member, and the first insertion hole portion and the second insertion hole portion. A step of forming a resin layer in a part of the inside of the insertion hole to be formed, and a step of forming a fixing resin integral with the resin layer between both side surfaces of the exposed terminal portion and the edge of the guide groove. including.

In the step of forming the fixing resin, the resin whose viscosity has been reduced by the heat treatment may move from the inside of the insertion hole to the guide groove to form the fixing resin.

In the method for manufacturing a capacitor, the heat treatment may cure the resin between the pedestal and the sealing member and the resin inside the insertion hole.

According to the technology of the present disclosure, one of the following effects can be obtained.

(1) The integrally formed resin layer and fixed resin enhance the integrity of the capacitor body and pedestal, and strengthen the binding force of the terminal leads, especially the exposed terminals, to the pedestal. Therefore, for example, the fixing strength of the capacitor can be increased.

(2) Since the fixing resin is integrally formed with the resin layer, it is possible to suppress an increase in the manufacturing load of the capacitor.

(3) Since the fixing resin is placed between the exposed terminal part and the edge of the guide groove, the change in the connection part of the capacitor to the wiring board is small in the capacitor connection process such as the reflow process. Therefore, when the production of the capacitor is completed, it is possible to confirm the almost final state of the capacitor. Capacitors that change little after manufacture are beneficial, for example, from the standpoint of quality assurance.

It is a figure which shows an example of the capacitor which concerns on 1st Embodiment. It is a partial sectional view of a capacitor. It is a perspective view of a pedestal. It is a figure which shows an example of the manufacturing process of a capacitor. It is a figure which shows an example of the capacitor which concerns on Example 1. FIG. It is a figure which shows an example of the capacitor which concerns on Example 2. FIG. It is a figure which shows an example of the capacitor which concerns on Example 3. FIG. It is a figure which shows the test result of the stickiness of the capacitor which concerns on an Example. It is a figure which shows the test result of the stickiness of the capacitor which concerns on a comparative example. It is a figure which shows an example of the capacitor which concerns on 2nd Embodiment. It is a bottom view of the pedestal. It is a bottom view of the pedestal of the capacitor which concerns on the modification.

Hereinafter, embodiments and the like will be described with reference to the drawings.

First Embodiment

A of FIG. 1 is a cross-sectional view showing an example of a capacitor according to the first embodiment, and B of FIG. 1 is a partial bottom view of the capacitor. In A of FIG. 1, a part of the capacitor body is omitted. A of FIG. 2 and B of FIG. 2 are partially enlarged views of A of FIG. A of FIG. 3 and B of FIG. 3 are perspective views of the pedestal. FIG. 3A shows a main body installation surface (that is, a surface portion of the pedestal on the sealing member side) installed on the main body of the capacitor. FIG. 3B shows a facing surface (that is, an outer surface of the pedestal or a board mounting surface) of the main body mounting surface. The configurations shown in FIGS. 1 to 3 are examples, and the techniques of the present disclosure are not limited to such configurations. In the present specification, the capacitor main body side is treated as "upper" and the pedestal side is treated as "lower", and "flat surface" and "bottom surface" on the drawing are defined.

Capacitor 2 is an example of an electronic component, for example, an electrolytic capacitor or an electric double layer capacitor. The capacitor 2 includes a capacitor body 4, a pedestal 6, resin layers 8-1, 8-2, and a fixed resin 10. The pedestal 6 is installed in the capacitor body 4, the resin layer 8-1 is arranged in the gap between the pedestal 6 and the capacitor body 4, and the resin layer 8-2 is the second insertion hole 26- formed in the pedestal 6. It is arranged inside 1, 26-2. The capacitor 2 can be mounted on a wiring board such as a circuit board.

The capacitor body 4 can be used alone as a capacitor. The capacitor main body 4 includes an outer case 12, a capacitor element 14, and a sealing member 16. The capacitor element 14 is enclosed in the outer case 12, and the sealing member 16 is attached to the opening of the outer case 12.

The exterior case 12 is, for example, a bottomed cylindrical aluminum case. The tip of the opening of the outer case 12 is bent at a substantially right angle, so that the end opposite to the bottom of the outer case 12 (hereinafter referred to as "open end") has a flat surface.

The capacitor element 14 is a winding element in which a separator is interposed between the anode foil and the cathode foil and wound, and the terminal leads 18-1 and 18-2 are derived from the same element surface. The capacitor element 14 is impregnated with an electrolytic solution.

The terminal leads 18-1 and 18-2 are made of, for example, a metal having good conductivity. The terminal lead 18-1 is an anode-side terminal, and includes a lead portion drawn from the anode foil of the capacitor element 14 and a terminal portion mounted on a wiring board. The lead portion and the terminal portion are connected and integrated by welding or the like. The terminal lead 18-2 is a cathode side terminal, and includes a lead portion drawn from the cathode foil of the capacitor element 14 and a terminal portion mounted on a wiring board. Similar to the terminal lead 18-1, the lead portion and the terminal portion are connected and integrated by welding or the like. The lead portion is, for example, a columnar shape, and the terminal portion is, for example, a flattened mounting surface side on a wiring board and a rectangular cross section. The terminal portions of the terminal leads 18-1 and 18-2 are bent in opposite directions. The terminal leads 18-1 and 18-2 include a bent portion 20 and an exposed terminal portion 22 formed by bending.

The sealing member 16 is made of, for example, insulating rubber. The sealing member 16 has first insertion holes 24-1 and 24-2 (hereinafter referred to as "insertion holes 24-1 and 24-2") at positions corresponding to the terminal leads 18-1 and 18-2. is doing. The terminal leads 18-1 and 18-2 of the capacitor element 14 penetrate the insertion holes 24-1 and 24-2 of the sealing member 16 and are exposed to the outside of the capacitor body 4.

The pedestal 6 is installed on the sealing member 16 side of the capacitor main body 4. The pedestal 6 is formed of an insulating plate such as an insulating synthetic resin. This insulating synthetic resin may have heat resistance sufficient to withstand heating when mounted on a wiring board, for example, polybutylene terephthalate (PBT), polybutylene terephthalate (PBN), and polyethylene terephthalate (PET). Polyester resin such as polyester resin, polyamide resin such as nylon, polyphenylene sulfide (PPS), polyphenylene oxide (PPO), urea resin, liquid crystal polymer (LCP), phenol resin, or epoxy resin. The pedestal 6 includes second insertion holes 26-1, 26-2 (hereinafter referred to as "insertion holes 26-1, 26-2"), guide grooves 28-1, 28-2, and protrusions 30. And a peripheral wall 32. Further, the pedestal 6 includes a support protrusion 34, a resin injection hole 36, a through hole 38, and a shielding portion 40 as shown in A of FIG. 3, and a stepped portion as shown in B of FIG. It includes 42, 44 and a support portion 46.

The insertion holes 26-1 and 26-2 are holes formed at positions corresponding to the terminal leads 18-1 and 18-2. The pair of terminal leads 18-1 and 18-2 protruding from the capacitor body 4 penetrate the pair of insertion holes 26-1 and 26-2 formed in the pedestal 6, and are on the outer surface side of the pedestal 6, that is, It is pulled out to the board mounting surface side of the pedestal 6. The insertion holes 26-1 and 26-2 together with the insertion holes 24-1 and 24-2 form insertion holes for passing the terminal leads 18-1 and 18-2.

The guide grooves 28-1 and 28-2 are formed on the board mounting surface of the pedestal 6 and extend outward (outer edge side of the pedestal 6) from the insertion holes 26-1 and 26-2. The exposed terminal portions 22 of the bent terminal leads 18-1 and 18-2 are arranged in the guide grooves 28-1 and 28-2. Therefore, the guide grooves 28-1 and 28-2 guide the terminal portions of the terminal leads 18-1 and 18-2. The guide grooves 28-1 and 28-2 are formed by grooves on the substrate mounting surface of the pedestal 6. The guide grooves 28-1 and 28-2 may be formed by a plurality of guide protrusions having a length formed on the outside of the terminal portions of the terminal leads 18-1 and 18-2. The guide grooves 28-1, 28-2, or the guide grooves formed by the plurality of guide protrusions contribute to ensuring the stability of the capacitor 2 at the time of mounting.

The exposed terminal portions 22 of the terminal leads 18-1 and 18-2 are separated from the edges of the guide grooves 28-1 and 28-2. Therefore, the fixing resin 10 is arranged between both side surfaces of the exposed terminal portion 22 and the edges of the guide grooves 28-1 and 28-2, and the exposed terminal portion 22 is fixed to the substrate mounting surface of the pedestal 6. The exposed surface of the exposed terminal portion 22 protrudes from the guide grooves 28-1 and 28-2 so that the guide grooves 28-1 and 28-2 do not interfere with the mounting of the capacitor 2, and the guide grooves 28-1 and 28 It is located outside -2. This exposed surface faces the surface of the wiring board when the board is mounted.

The protrusion 30 is installed on the main body installation surface of the pedestal 6. The protrusion 30 is formed around the insertion holes 26-1 and 26-2 and surrounds the insertion holes 26-1 and 26-2. The protrusion 30 faces the sealing member 16 and separates the resin layer 8-1 adjacent to the protrusion 30 from the insertion holes 26-1 and 26-2. The height of the protrusion 30 may be set to, for example, a height difference H (B in FIG. 2) between the outer surface of the sealing member 16 and the main body installation surface of the pedestal 6, and is lower than the height difference H. May be good or expensive. When the height of the protruding portion 30 is the height difference H, the open end of the outer case 12 and the pedestal 6 come into contact with each other, and the protruding portion 30 of the pedestal 6 and the sealing member 16 come into contact with each other. Since the outer case 12 and the projecting portion 30 function as support portions, the installation of the pedestal 6 is stabilized and the capacitor main body 4 is supported by both the peripheral portion and the central portion. Further, the protruding portion 30 in contact with the sealing member 16 is formed with the pedestal 6 for forming the resin layers 8-1 and 8-2, or for forming the resin layers 8-1 and 8-2 and the fixing resin 10. It is possible to prevent the resin injected between the sealing members 16 from excessively invading the insertion holes 26-1 and 26-2.

As shown in FIG. 3A, the protruding portion 30 has a substantially rectangular shape having a constriction in the central portion in the longitudinal direction, for example. The protruding portion 30 has a retracted portion 48 in the central portion in the longitudinal direction, and the retracted portion 48 forms a constriction. The protruding portion 30 has a flat portion 50 at an end portion in the longitudinal direction.

The protruding portion 30 has grooves 52 and 54 on the surface facing the sealing member 16. The groove portion 52 is formed so as to partially lower the height of the intermediate portion between the insertion hole portion 26-1 and the insertion hole portion 26-2, and extends between the resin injection hole 36 side and the through hole 38 side. Form a resin passage. The flow rate of the resin flowing through the groove 52 can be adjusted according to the width and depth of the groove 52.

The groove portion 54 extends from the flat portion 50 of the protrusion 30 to the insertion holes 26-1 and 26-2 to form a ventilation passage or a resin passage. The groove portion 54 can guide the air or resin extruded by the resin injection to the insertion holes 26-1 and 26-2. The groove portion 54 may allow a part of the injected resin to pass through the injected resin to reach the insertion holes 26-1 and 26-2, for example, for forming the resin layer 8-2 and the fixing resin 10. .. The width, depth, installation interval, or number of installations of the groove portion 54 are appropriately set in consideration of, for example, the amount of air or resin passing through. The groove portion 54 is formed only on the surface of the protrusion 30 on the through hole 38 side, for example. Therefore, it is suppressed that the resin directly passes through the groove portion 54 and flows into the insertion holes 26-1 and 26-2. That is, the resin injected from the resin injection hole 36 flows into the space on the through hole 38 side of the protrusion 30 in the space between the sealing member 16 and the pedestal 6 due to the injection pressure, and then is filled in the space. The resin is pushed into the groove 54 by the pressing force of the resin. Therefore, the resin can be flowed through the groove 54 at a pressure lower than the injection pressure.

The peripheral wall 32 is a peripheral portion of the pedestal 6 and is arranged outside the open end of the outer case 12, and surrounds the open end of the outer case 12. The inner side surface of the peripheral wall 32 has a circular shape so as to follow the outer periphery of the bottomed cylindrical outer case 12. The peripheral wall 32 may be higher than the protrusion 30 and may be at the same height as the protrusion 30 or lower than the protrusion 30.

The support protrusion 34 is an example of a protrusion that supports the open end of the outer case 12, and is partially formed at a position adjacent to the resin layer 8-1 and in contact with the open end of the outer case 12. Will be done. As shown in A of FIG. 3, the support protrusion 34 is the main body installation surface of the pedestal 6 and is formed inside the pedestal 6 with respect to the peripheral wall 32. The support protrusion 34 has an arc shape having a width, and covers the outside of the resin injection hole 36 and the protrusion 30 in an arc shape. Further, although not shown, another support protrusion different from the support protrusion 34 is formed between the through hole 38 and the peripheral wall 32 at a position in contact with the open end of the outer case 12. The other support protrusions have a circular shape and are arranged outside the through hole 38. In the formed portion of the support protrusion 34 and the other support protrusions, the open end of the outer case 12 contacts the support protrusion 34 or another support protrusion, and in the divided portion between the support protrusion 34 and the other support protrusions. The open end of the outer case 12 is separated from the pedestal 6, and a gap is formed between the open end of the outer case 12 and the pedestal 6. The gap between the open end of the exterior case 12 and the pedestal 6 forms a resin path for the resin to flow in between the peripheral wall 32 of the pedestal 6 and the outer peripheral surface of the exterior case 12.

The resin injection hole 36 is an example of an insertion hole used for injecting resin, and is formed at an equal distance from the insertion holes 26-1 and 26-2.

The through hole 38 is formed at the terminal portion where the resin finally flows in, for example, in resin injection, and is used for confirming the resin that has reached the terminal portion along the resin injection path. The through hole 38 is also used for discharging the air extruded by injecting the resin, and the through hole 38 makes it easy to check the filled state of the resin and also makes it easy to discharge the air.

The shielding portion 40 is a peripheral portion of the through hole 38 and is arranged between the through hole 38 and the resin injection hole 36. The shielding portion 40 suppresses the resin injected from the resin injection hole 36 from entering the through hole 38 from the resin injection hole 36 side of the through hole 38. That is, the shielding portion 40 suppresses the through hole 38 from being filled with the resin before the resin reaches the formation region of the resin layer 8-1.

As shown in B of FIG. 3, the step portion 42 is a substrate mounting surface of the pedestal 6 and is formed around the resin injection hole 36. The step portion 42 is used, for example, for aligning the resin injection device connected to the resin injection hole 36 at the time of resin injection. The step portion 42 provides a space for preventing the resin in the vicinity of the resin injection hole 36 from protruding from the substrate mounting surface of the pedestal 6.

As shown in B of FIG. 3, the step portion 44 is a substrate mounting surface of the pedestal 6 and is formed around the through hole 38. The step portion 44 provides a space for preventing the resin in the vicinity of the through hole 38 from protruding from the substrate mounting surface of the pedestal 6.

As shown in B of FIG. 3, the support portion 46 is a board mounting surface of the pedestal 6 and is formed in the vicinity of the corner portion of the pedestal 6. The support portion 46 can stabilize the posture of the capacitor 2 by point contact in a state where the capacitor 2 is mounted on the wiring board. When the support portion 46 comes into contact with the wiring plate, the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 are slightly separated from the wiring plate. The gap between the exposed terminal portion 22 and the wiring plate makes it possible to secure the thickness of the solder required for connection.

The resin layer 8-1 is provided on the outside of the protrusion 30 and inside the open end of the exterior case 12 between the pedestal 6 and the sealing member 16. The resin layer 8-1 brings the capacitor body 4 and the pedestal 6 into close contact with each other, and seals the outer surface of the sealing member 16 together with the pedestal 6. Further, the resin layer 8-1 strengthens the bonding force of the pedestal 6 to the outer case 12 and the sealing member 16, and enhances the integrity of the capacitor body 4 and the pedestal 6.

The resin layer 8-2 is formed inside the insertion holes 26-1 and 26-2, in other words, the insertion holes formed by the insertion holes 24-1 and 24-2 and the insertion holes 26-1 and 26-2. It is prepared for a part of the inside. The resin layer 8-2 fills the gap between the inner surface of the insertion holes 26-1 and 26-2 and the terminal leads 18-1 and 18-2. Therefore, the sealing property is improved and the amount of gas passing through the insertion holes 26-1 and 26-2 is suppressed. Further, the resin layer 8-2 strengthens the coupling force of the pedestal 6 with respect to the terminal leads 18-1 and 18-2, and enhances the integrity of the capacitor body 4 and the pedestal 6. For example, the resin injected from the resin injection hole 36 reaches the insertion holes 26-1 and 26-2 to form the resin layer 8-2. That is, the resin layer 8-2 is formed in the process of forming the resin layer 8-1, and the manufacturing load is suppressed. However, the resin may be added from the substrate mounting surface of the pedestal 6 to form the resin layer 8-2. If the resin layer 8-2 is formed by the injected resin in a part of the manufactured plurality of capacitors 2, the addition of the resin from the substrate mounting surface can be suppressed, and the manufacturing load is suppressed.

The resin forming the resin layers 8-1 and 8-2 is, for example, a sealing resin that seals the outside of the sealing member 16, and is liquid at the time of filling, but solidifies after filling. At the time of filling, the liquid resin fills the gap between the capacitor body 4 and the pedestal 6 and a part of the inside of the insertion holes 26-1 and 26-2, and after filling, the resin solidifies and the resin layer 8- Form 1, 8-2. The resin forming the resin layers 8-1 and 8-2 may have an affinity for the pedestal 6, the outer case 12, and the sealing member 16 and may have a gas blocking property, and may have a linear expansion coefficient of aluminum (about). It is preferable that it has a linear expansion coefficient close to 23 × 10 ^-6 / ° C., a small amount of shrinkage during curing, and non-hygroscopicity. The resin may be, for example, an epoxy resin, an alkyd resin, a urethane resin, a thermosetting resin, or an ultraviolet curable resin. Further, the epoxy resin may be, for example, a two-component mixed type epoxy resin using an acid anhydride or a one-component type epoxy resin. The resin layers 8-1 and 8-2 formed from such a material have heat resistance to the heat treatment temperature (for example, 270 ° C.) when the capacitor 2 is installed on the wiring board in the solidified state.

The fixed resin 10 is a solidified resin and has the same heat resistance as, for example, resin layers 8-1 and 8-2. The fixing resin 10 is arranged between both side surfaces of the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2, and is integrally formed with the resin layer 8-2. Will be done. The fixing resin 10 fills the gap between both side surfaces of the exposed terminal portion 22 and the edges of the guide grooves 28-1 and 28-2. Therefore, the fixing resin 10 strengthens the bonding force of the exposed terminal portion 22 to the pedestal 6 and enhances the integrity of the exposed terminal portion 22 and the pedestal 6. The resin in the insertion holes 26-1 and 26-2 reaches, for example, the guide grooves 28-1 and 28-2, and flows in the guide grooves 28-1 and 28-2 along the exposed terminal portion 22. The fixing resin 10 is formed. That is, the fixed resin 10 is formed in the process of forming the resin layers 8-1 and 8-2, and the manufacturing load is suppressed. However, the resin may be added from the substrate mounting surface of the pedestal 6 to form the fixed resin 10. If the fixed resin 10 is formed of the resin arriving from the inside of the insertion holes 26-1 and 26-2 in a part of the manufactured plurality of capacitors 2, the addition of the resin from the substrate mounting surface can be suppressed. The manufacturing load is suppressed. The resin forming the fixing resin 10 may be the same as or different from the resin forming the resin layers 8-1 and 8-2.

As shown in B of FIG. 1, the fixing resin 10 may fill a part (for example, half) of the gap between both side surfaces of the exposed terminal portion 22 and the edges of the guide grooves 28-1 and 28-2. , The entire gap may be filled. Further, the arrangement range of the fixing resin 10 may be wider or narrower than half of the gap. The wider the arrangement range of the fixing resin 10, the higher the integrity of the exposed terminal portion 22 and the pedestal 6. The surface of the fixing resin 10 is preferably at the same position as the plane including the top surface of the support portion 46 or the plane including the exposed surface of the exposed terminal portion 22, or is preferably on the pedestal 6 side of these surfaces. It is more preferable that the surface of the fixing resin 10 is at the same position as the substrate mounting surface of the pedestal 6 or is on the inner side of the pedestal 6 rather than these surfaces. That is, it is more preferable that the surface of the fixing resin 10 is inside the guide grooves 28-1 and 28-2. Since the fixing resin 10 does not protrude from these planes or the board mounting surface, the fixing resin 10 does not interfere with the board mounting of the capacitor 2.

As shown in A of FIG. 2, the central axes C1 of the terminal leads 18-1 and 18-2 in the insertion holes 26-1 and 26-2 are the insertion holes 26-1 and 26- on the board mounting surface side. It may be arranged on the outer edge side of the pedestal 6 with respect to the center C2 of the opening of 2 (that is, the opening of the insertion hole on the board mounting surface side). That is, the distance between the terminal leads 18-1 and 18-2 and the inner surface of the insertion holes 26-1 and 26-2 (hereinafter referred to as "separation distance") is the distance of the pedestal 6 on the outer edge side of the pedestal 6. It may be narrower than the separation distance on the center side. Due to the difference in the separation distance, for example, the action of the capillary phenomenon becomes larger on the outer edge side than on the center side, and the low-viscosity resin is on the outer edge side on the opening side of the insertion holes 26-1 and 26-2 (that is, the substrate mounting surface). Can move to the side). Further, the low-viscosity resin may flow into the guide grooves 28-1 and 28-2 through the openings of the insertion holes 26-1 and 26-2. Therefore, as shown in A of FIG. 2, a level difference may occur on the surface of the resin layer 8-2, and the bent portion 20 may be exposed from the resin layer 8-2 on the center side. The gap between the terminal leads 18-1 and 18-2 and the insertion holes 26-1 and 26-2 is filled with resin on the outer edge side, and the resin layer 8-2 is connected to the fixing resin 10. ..

The insertion holes 26-1 and 26-2 may have a stepped portion 56 as shown in B of FIG. In the step portion 56, the opening distance D1 of the insertion holes 26-1 and 26-2 on the board mounting surface side is made larger than the opening distance D2 on the capacitor main body 4 side. The step portion 56 is formed on the inner side surface of the insertion holes 26-1 and 26-2, and is arranged on the side portion side of the step portion 56-1 and the capacitor 2 which are arranged on the central portion side of the capacitor 2. It includes the stepped portion 56-2. The width W1 of the step portion 56-1 is wider than the width W2 of the step portion 56-2. The difference between the width W1 and the width W2 causes a difference in the action of the capillary phenomenon. Further, the opening distance D2 is maintained at a small diameter by the step portion 56, and the gap between the terminal leads 18-1 and 18-2 and the insertion holes 26-1 and 26-2 on the capacitor main body 4 side is reduced. Therefore, the movable range of the terminal leads 18-1 and 18-2 is restricted on the sealing member 16 side. Further, the widths W1 and W2 of the step portions 56-1 and 56-2 allow the amount of resin to move to the outside of the pedestal 6 (board mounting surface) through the insertion holes 26-1 and 26-2.

The shape of the cross section of the insertion holes 26-1 and 26-2 (hereinafter referred to as "main body side cross section") on the capacitor main body 4 side of the step portion 56 has rounded corners, for example, as shown in A of FIG. It is a rectangular shape. As shown in B of FIG. 3, the shape of the cross section of the insertion holes 26-1 and 26-2 (hereinafter referred to as “mounting surface side cross section”) on the board mounting surface side of the step portion 56 is, for example, a part. Is a shape formed by two overlapping circles. The two circles have different sizes, and the large circle contains the cross section on the main body side. The smaller circle of the two circles is located closer to the center of the capacitor 2 than the larger circle.
[Capacitor manufacturing process]

The manufacturing process of the capacitor is an example of the manufacturing method of the capacitor of the present disclosure, and this manufacturing process includes a forming process of the capacitor main body 4, a forming process of the pedestal 6, a mounting process of the pedestal 6, and terminal leads 18-1, 18 -2 includes a molding step, a resin injection step, and a resin curing and fixing resin 10 forming step.

In the step of forming the capacitor main body 4, first, a separator is interposed between the anode foil to which the terminal lead 18-1 is connected and the cathode foil to which the terminal lead 18-2 is connected, and these are wound to form the capacitor element 14. do. After impregnating the capacitor element 14 with an electrolytic solution and enclosing the capacitor element 14 in the outer case 12, the sealing member 16 is attached to the opening of the outer case 12 to form the capacitor body 4. The outer case 12 is made of, for example, aluminum.

In the step of forming the pedestal 6, the pedestal 6 having the above-mentioned shape is formed from the insulating synthetic resin. In the first embodiment, the capacitor element 14 is impregnated with an electrolytic solution to form an electrolytic capacitor, but the present invention is not limited to this, and the capacitor element 14 impregnated with a conductive polymer to form a solid electrolyte layer is used. It may be used as a solid electrolytic capacitor, or it may be a hybrid type capacitor in which a capacitor element 14 impregnated with a conductive polymer is impregnated with an electrolytic solution.

In the mounting process of the pedestal 6, the terminal leads 18-1 and 18-2 of the capacitor main body 4 are passed through the insertion holes 26-1 and 26-2 of the pedestal 6. Then, the pedestal 6 is moved to attach the pedestal 6 to the sealing member 16 side of the capacitor main body 4. In this mounting step, the protruding portion 30 of the pedestal 6 is arranged on the sealing member 16 side.

In the molding process of the terminal leads 18-1 and 18-2, the terminal leads 18-1 and 18-2 are bent along the guide grooves 28-1 and 28-2 of the pedestal 6, and the terminal leads 18-1 and 18-2 are bent. The exposed terminal portion 22 of 2 is arranged in the guide grooves 28-1 and 28-2. By this molding step, as shown in A of FIG. 4, the pedestal 6 is fixed to the capacitor main body 4.

In the resin injection step, as shown in FIG. 4B, the movement of the capacitor body 4 is restricted, and the resin discharge portion 58 of the resin discharge device such as a dispenser is pressed against the resin injection hole 36 of the pedestal 6. Then, the resin is injected into the gap SP (A in FIG. 4) through the resin injection hole 36. The liquid resin injected from the resin injection hole 36 fills the gap SP between the capacitor body 4 and the pedestal 6. The resin spreads around the resin injection hole 36, flows toward the through hole 38 through the gap or groove 52 between the protrusion 30 and the support protrusion 34, and spreads around the through hole 38 and the shielding portion 40. .. Further, a part of the resin flows to the outside of the capacitor body 4 through the outside of the end of the support protrusion 34. Further, a part of the resin may flow into the insertion holes 26-1 and 26-2 through the groove 54.

In the process of curing the resin and forming the fixed resin 10, the injected resin is heated, for example. The heated resin loses its viscosity before curing. Therefore, as shown in FIG. 4C, a part of the resin having a low viscosity passes through the insertion holes 26-1 and 26-2 and moves to the guide grooves 28-1 and 28-2 due to the capillary phenomenon. .. The resin is then cured to integrally form the resin layers 8-1, 8-2 and the fixed resin 10.

The capacitor 2 may be inspected after the resin curing and fixing resin 10 forming steps. If the resin layer 8-2 or the fixing resin 10 is insufficient for the manufacturing standard, the resin may be added from the substrate mounting surface side of the pedestal 6, for example, and then the added resin may be cured. .. Such a resin addition step is performed only on a capacitor in which the resin layer 8-2 or the fixing resin 10 is insufficient for the manufacturing standard. Therefore, the manufacturing load of the capacitor is suppressed as a whole.

A of FIG. 5, A of FIG. 6, and A of FIG. 7 are cross-sectional views showing an example of the capacitor according to the first, second, and third embodiments, respectively, B of FIG. 5, B of FIG. 6, and B of FIG. Is a bottom view of each of those capacitors. The configurations shown in FIGS. 5, 6 and 7 are examples, and the technique of the present disclosure is not limited to such configurations. In FIGS. 5, 6 and 7, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals.

The capacitor 62 according to the first embodiment, the capacitor 72 according to the second embodiment, and the capacitor 82 according to the third embodiment are the same as the capacitor 2 according to the first embodiment except for the resin layer 8-2 and the fixed resin 10. be. The resin layer 8-2 and the fixing resin 10 of the capacitors 62, 72, 82 are different from the resin layer 8-2 and the fixing resin 10 of the capacitor 2 as described below.

In the capacitor 62, the resin layer 8-2 is formed inside the insertion hole 26-1 excluding the opening of the insertion hole 26-1, and is formed in the entire inside of the insertion hole 26-2. (However, the part where the terminal leads 18-1 and 18-2 are arranged is excluded). The gap between the terminal lead 18-2 and the insertion hole 26-2 is entirely filled with resin on both the outer edge side and the center side, and on the center side, the resin layer 8-2 is the terminal lead 18-. It covers a part of the bent portion 20 of 2. The bent portion 20 of the terminal lead 18-1 is exposed. The fixing resin 10 fills half of the gap between both side surfaces of the exposed terminal portion 22 of the terminal lead 18-2 and the edge of the guide groove 28-2, and the resin layer 8-2 in the insertion hole portion 26-2. Is formed integrally with. Air is arranged between both side surfaces of the exposed terminal portion 22 of the terminal lead 18-1 and the edge of the guide groove 28-1. That is, the fixing resin 10 is formed only in the guide groove 28-2.

In the capacitor 72, the resin layer 8-2 is formed in the entire inside of the insertion holes 26-1 and 26-2 (however, except for the portion where the terminal leads 18-1 and 18-2 are arranged). The gap between the terminal leads 18-1 and 18-2 and the insertion holes 26-1 and 26-2 is entirely filled with resin on both the outer edge side and the center side, and the resin layer is formed on the center side. 8-2 covers a part of the bent portion 20 of the terminal leads 18-1 and 18-2. The fixing resin 10 fills half of the gap between both side surfaces of the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2. The fixing resin 10 in the guide groove 28-1 is integrally formed with the resin layer 8-2 in the insertion hole portion 26-1, and the fixing resin 10 in the guide groove 28-2 is formed in the insertion hole portion 26-2. It is integrally formed with the inner resin layer 8-2. That is, the fixing resin 10 is formed in both the guide grooves 28-1 and 28-2.

In the capacitor 82, the resin layer 8-2 is formed in the entire inside of the insertion holes 26-1 and 26-2 (however, except for the portion where the terminal leads 18-1 and 18-2 are arranged). The gap between the terminal leads 18-1 and 18-2 and the insertion holes 26-1 and 26-2 is entirely filled with resin on both the outer edge side and the center side, and the resin layer is formed on the center side. 8-2 covers a part of the bent portion 20 of the terminal leads 18-1 and 18-2. The fixing resin 10 fills the entire gap between both side surfaces of the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2. The fixing resin 10 in the guide groove 28-1 is integrally formed with the resin layer 8-2 in the insertion hole portion 26-1, and the fixing resin 10 in the guide groove 28-2 is formed in the insertion hole portion 26-2. It is integrally formed with the inner resin layer 8-2. That is, the fixing resin 10 is formed in both the guide grooves 28-1 and 28-2.

The capacitor according to the fourth embodiment is the same capacitor as the capacitor 2 according to the first embodiment (for convenience, the capacitor according to the fourth embodiment is also referred to as "capacitor 2"). In the capacitor 2 according to the fourth embodiment, as shown in A of FIG. 1 and B of FIG. 1, the surface of the resin layer 8-2 has a level difference, and the terminal leads 18-1 are located on the center side. The bent portion 20 of 18-2 is exposed from the resin layer 8-2. The fixing resin 10 fills half of the gap between both side surfaces of the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2. The fixing resin 10 in the guide groove 28-1 is integrally formed with the resin layer 8-2 in the insertion hole portion 26-1, and the fixing resin 10 in the guide groove 28-2 is formed in the insertion hole portion 26-2. It is integrally formed with the inner resin layer 8-2. That is, the fixing resin 10 is formed in both the guide grooves 28-1 and 28-2.

The stickiness of the capacitors 2, 62, 72, 82 according to the examples was evaluated by a stickiness test. In the stickiness test, a pushing force was applied to the capacitors 2, 62, 72, and 82 soldered to the substrate along the center line L (B in FIG. 1). The pushing force is "8.5.3 Test U _e3 : Sticking" of Japanese Industrial Standard JIS C600726-221 "Environmental Test Method-Electrical / Electronic-Part 2-21: Test-Test U: Terminal Strength Test Method". It was added as shown in FIG. 11 of this Japanese Industrial Standards with the push jig described in the test method of "Shear strength test". The pushing jig is moved at a speed of 100 mm / min, and the load due to the pushing force, the displacement of the capacitors 2, 62, 72, 82, and immediately before the capacitors 2, 62, 72, 82 are separated from the substrate. The load (hereinafter referred to as "fixing strength") was measured.

A of FIG. 8 is a graph showing the relationship between the load and the displacement of the capacitor 62 according to the first embodiment, and B of FIG. 8 is a graph showing the relationship between the load and the displacement of the capacitor 72 according to the second embodiment. FIG. 8C is a graph showing the relationship between the load and the displacement of the capacitor 2 according to the fourth embodiment. A of FIG. 8 shows the result of one measurement, B of FIG. 8 shows the result of three measurements, and C of FIG. 8 shows the result of three measurements.

The fixing strengths of the capacitors 2, 62, 72 and 82 are as follows. The fixing strength shown below is an average value of the results of three measurements.
(Fixing strength)
Example 1: 129.1 [N (Newton)]
Example 2: 195.4 [N]
Example 3: 213.4 [N]
Example 4: 188.8 [N]

The capacitors according to Comparative Examples 1 and 2 were evaluated in the same manner as the capacitors 2, 62, 72 and 82. The capacitor according to Comparative Example 1 is formed inside the insertion holes 26-1 and 26-2 excluding the openings of the insertion holes 26-1 and 26-2 and the arrangement portions of the terminal leads 18-1 and 18-2. Although it contains the resin layer 8-2, it does not contain the fixing resin 10. In the capacitor according to Comparative Example 2, no resin is injected, and the resin layers 8-1, 8-2 and the fixing resin 10 are not included.

FIG. 9A is a graph showing the relationship between the load and displacement of the capacitor according to Comparative Example 1, and FIG. 9B is a graph showing the relationship between the load and displacement of the capacitor according to Comparative Example 2. A in FIG. 9 shows the results of three measurements, and B in FIG. 9 shows the results of three measurements.

The fixing strength of the capacitors according to Comparative Examples 1 and 2 is as follows. The fixing strength shown below is an average value of the results of three measurements.
(Fixing strength)
Comparative Example 1: 118.4 [N]
Comparative Example 2: 113.7 [N]

From the measurement results of the capacitors of Comparative Example 1 and Comparative Example 2, it can be seen that the fixing strength is increased by the arrangement of the resin layers 8-1 and 8-2. Further, from the measurement results of the capacitors 2, 62, 72, 82 and the capacitor of Comparative Example 1, it can be seen that the fixing strength is increased by the arrangement of the fixing resin 10. By including the resin layers 8-1, 8-2 and the fixing resin 10, the capacitors 2, 62, 72 and 82 can have higher fixing strength than the capacitors of Comparative Examples 1 and 2. It can be seen that even if the fixing resin 10 is arranged only in one of the guide grooves 28-1 and 28-2, the fixing strength of the capacitor is high. The gap between the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2 is filled with the fixing resin 10, and the fixing resin 10 is integrated with at least the resin layer 8-2. It is considered that the degree of integration between the capacitor body 4 and the pedestal 6 is increased, and therefore the fixing strength is improved.

To strengthen the connection between the capacitor and the board, expose the sides of the terminal leads 18-1 and 18-2 so that the solder adheres to the sides of the terminal leads 18-1 and 18-2 when mounting the board. There is an idea that it is better to keep it. However, from the above measurement results, it can be seen that the fixing strength is improved when the side surfaces of the terminal leads 18-1 and 18-2 are fixed to the pedestal 6 with resin rather than being connected to the substrate by solder.

From the measurement results of the capacitors 2, 62, 72, and 82, it can be seen that the wider the arrangement range of the fixing resin 10, the higher the fixing strength. From the measurement results of the capacitors 2 and 72 of Examples 2 and 4, it can be seen that the fixing strength is increased by arranging the resin in the vicinity of the bent portions 20 of the terminal leads 18-1 and 18-2. On the other hand, in the capacitor 2 of the fourth embodiment, since the bent portions 20 of the terminal leads 18-1 and 18-2 are exposed, for example, the bent portions 20 can be welded to the substrate, and the terminals and the substrate can be welded to each other. The effect of lowering the electrical resistance of the connection can be obtained.

From the graphs shown in FIGS. 8 and 9, the capacitors 2, 62, 72 and 82 have smaller displacements with respect to the increase in load than the capacitors according to Comparative Examples 1 and 2 (that is, shown in each graph). It can be seen that the slope of the measured value is large). By increasing the degree of integration of the capacitor body 4 and the pedestal 6, the entire capacitors 2, 62, 72, and 82 can be loaded by the pushing force, so that the fixing force is increased and the capacitors 2, 62, It is considered that 72 and 82 are difficult to separate from the substrate.

Further, when the exposed terminal portions 22 of the terminal leads 18-1 and 18-2 are fixed to the pedestal 6, the stress acting on the exposed terminal portions 22 is dispersed according to the degree of fixing, and the capacitors 2, 62, 72, and the capacitors It is considered that the 82 is difficult to separate from the substrate.

According to the first embodiment and the embodiment, the following actions or effects can be obtained.

(1) The integrity of the capacitor body 4 and the pedestal 6 can be enhanced, and the coupling force of the exposed terminal portion 22 to the pedestal 6 can be strengthened. Therefore, for example, the adhesive strength of the capacitors 2, 62, 72, and 82 to the wiring board can be increased.

(2) Since the fixing resin 10 is integrally formed with the resin layers 8-1 and 8-2, it is possible to suppress an increase in the manufacturing load of the capacitors 2, 62, 72 and 82.

(3) Since the fixed resin 10 is cured by the resin curing process, the capacitors 2, 62, 72 and 82 are connected to the wiring board in the connection process of the capacitors 2, 62, 72 and 82 such as the reflow process. The change in the part is small. Therefore, when the production of the capacitors 2, 62, 72, and 82 is completed, the substantially final state of the capacitors 2, 62, 72, and 82 can be confirmed. Capacitors 2, 62, 72, and 82, which change little after manufacture as compared to capacitors containing sandwiched solder, are useful, for example, from the viewpoint of quality assurance.

Second embodiment

A of FIG. 10 is a cross-sectional view showing an example of the capacitor according to the second embodiment, and B of FIG. 10 is a partial bottom view of the capacitor. In A of FIG. 10, a part of the capacitor body is omitted. FIG. 11 is a bottom view of the pedestal. In FIGS. 10 and 11, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals.

The capacitor 102 is an example of an electronic component, for example, an electrolytic capacitor or an electric double layer capacitor. The capacitor 102 includes a capacitor body 4, a pedestal 106, resin layers 8-1, 8-3, and a fixing resin 10. The pedestal 106 is installed in the capacitor body 4, and the resin layer 8-1 is arranged in the gap between the pedestal 106 and the capacitor body 4. The capacitor 102 can be mounted on a wiring board such as a circuit board. The capacitor body 4, the resin layer 8-1, and the fixing resin 10 are the same as those in the first embodiment, and the description thereof will be omitted.

The pedestal 106 is installed on the sealing member 16 side of the capacitor main body 4. Similar to the pedestal 6 of the first embodiment, the pedestal 106 is formed of an insulating plate such as the above-mentioned insulating synthetic resin. Similar to the pedestal 6 of the first embodiment, the pedestal 106 includes guide grooves 28-1, 28-2, a peripheral wall 32, a resin injection hole 36, a through hole 38, and step portions 42 and 44. A support portion 46 is provided, and a support protrusion portion (not shown) and a shielding portion are provided. The guide grooves 28-1, 28-2, the peripheral wall 32, the resin injection hole 36, the through hole 38, the step portions 42, 44, and the support portion 46 are the same as those in the first embodiment, and the support protrusion portion and the support protrusion portion and the support portion 46 are the same. The shielding portion is the same as the support protrusion 34 and the shielding portion 40 of the first embodiment, and the description thereof will be omitted. The pedestal 106 further includes second insertion holes 126-1, 126-2 (hereinafter referred to as "insertion holes 126-1, 126-2"), a protrusion 130, and a connection groove 160.

The insertion holes 126-1 and 126-2 are holes formed at positions corresponding to the terminal leads 18-1 and 18-2. The pair of terminal leads 18-1 and 18-2 protruding from the capacitor body 4 penetrate the pair of insertion holes 126-1 and 126-2 formed in the pedestal 106, and are on the outer surface side of the pedestal 106, that is, It is pulled out to the board mounting surface side of the pedestal 106. The insertion holes 126-1 and 126-2 together with the insertion holes 24-1 and 24-2 form insertion holes for passing the terminal leads 18-1 and 18-2. The insertion holes 126-1 and 126-2 may have a stepped portion 56 as shown in A and 11 of FIG. The step portion 56 is the same as the step portion 56 of the first embodiment, and the description thereof will be omitted. The shapes of the insertion holes 126-1 and 126-2 are circular as shown in FIG. However, the insertion holes 126-1 and 126-2 may have the same shape as the insertion holes 26-1 and 26-2 of the first embodiment.

The protrusion 130 is the same as the protrusion 30 of the first embodiment, except that the connection groove 160 is formed on the back surface of the protrusion 130, that is, the outer surface of the pedestal 106 or the board mounting surface. The explanation is omitted.

The connection groove 160 is an outer surface of the pedestal 106 or a board mounting surface and is arranged between the insertion holes 126-1 and 126-2. The connection groove 160 is connected to the insertion holes 126-1 and 126-2. Therefore, the connection groove 160 connects the insertion hole portion 126-1 and the insertion hole portion 126-2, and the insertion hole portion 126-1 is connected to the insertion hole portion 126-2 via the connection groove 160. The bottom portion of the connection groove 160 is arranged on the same plane as the stepped portion 56 of the insertion holes 126-1 and 126-2, particularly the stepped portion 56-1. Therefore, there is no step between the connection groove 160 and the step portion 56-1, and the connection groove 160 and the step portion 56 of the insertion holes 126-1 and 126-2 are integrated.

The connection groove 160 is, for example, line-symmetrical with respect to the center line L (B in FIG. 1 and B in FIG. 10) described in the first embodiment, and is narrow in the central portion and has insertion holes 126-1 and 126. It has a wide width at the end on the -2 side. Therefore, the connection groove 160 can flow more liquid resin at the end portion than at the central portion, and the connection groove 160 can guide the liquid resin farther from the end portion. Further, since the width of the connection groove 160 is narrow in the central portion, it is suppressed that the connection groove 160 interferes with the arrangement of the resin injection hole 36 and the through hole 38, and the connection groove 160 is the resin injection hole 36 and the through hole 38. It is possible to avoid connecting to the steps 42 and 44.

The bottom and side walls of the connection groove 160 are preferably flat. The flat bottom and side walls can suppress the turbulence of the flowing resin, and can suppress the formation of, for example, a gap between the bottom and side walls of the connecting groove 160 and the resin.

The resin layer 8-3 is provided inside the insertion holes 126-1 and 126-2 and the connection groove 160. The resin layer 8-3 fills the gap between the inner surface of the insertion holes 126-1 and 126-2 and the terminal leads 18-1 and 18-2, and binds to the fixing resin 10. Therefore, the sealing property is improved and the amount of gas passing through the insertion holes 126-1 and 126-2 is suppressed. The resin layer 8-3 strengthens the coupling force of the pedestal 106 with respect to the terminal leads 18-1 and 18-2, and enhances the integrity of the capacitor body 4 and the pedestal 106. Further, by arranging the resin layer 8-3 inside the connection groove 160, the contact area of the resin layer 8-3 with respect to the pedestal 106 increases. Further, as shown in FIG. 10A, in the cross section for cutting the insertion holes 126-1, 126-2 and the protrusion 130, the resin layer 8-3 comes into contact with the protrusion 130 in three directions, and the resin layer is formed. 8-3 engages the protrusion 130. Therefore, the resin layer 8-3 strengthens the bonding force of the pedestal 106 to the resin layer 8-3 and the bonding force of the pedestal 106 to the terminal leads 18-1 and 18-2, so that the capacitor body 4, the pedestal 106, and the resin layer are strengthened. Increase the integrity of 8-1 and 8-3. The resin forming the resin layer 8-3 is the same as the resin forming the resin layers 8-1 and 8-2 of the first embodiment, and the description thereof will be omitted.

The resin injected from the resin injection hole 36 reaches, for example, the insertion holes 126-1 and 126-2 and the connection groove 160, and the resin that has passed through the insertion hole 126-1 passes through the insertion hole 126-2. It is joined to the passed resin at the connection groove 160. Therefore, the resin layer 8-3 in the insertion hole portion 126-1, the resin layer 8-3 in the insertion hole portion 126-2, and the resin layer 8-3 in the connection groove 160 are integrated. Further, the resin layer 8-3 is formed in the process of forming the resin layer 8-1, and the manufacturing load is suppressed. However, the resin may be added from the substrate mounting surface of the pedestal 106 to form the resin layer 8-3. If the resin layer 8-3 is formed by the injected resin in a part of the manufactured plurality of capacitors 102, the addition of the resin from the substrate mounting surface can be suppressed, and the manufacturing load is suppressed.
[Capacitor manufacturing process]

The manufacturing process of the capacitor is an example of the manufacturing method of the capacitor of the present disclosure, and this manufacturing process includes a forming process of the capacitor main body 4, a forming process of the pedestal 106, a mounting process of the pedestal 106, and terminal leads 18-1, 18 -2 includes a molding step, a resin injection step, and a resin curing and fixing resin 10 forming step. The steps of forming the capacitor body 4, mounting the pedestal 106, molding the terminal leads 18-1 and 18-2, and injecting the resin are the same as those of the first embodiment, and the description thereof will be omitted. ..

In the step of forming the pedestal 106, the pedestal 106 having the above-mentioned shape is formed from the insulating synthetic resin.

In the process of curing the resin and forming the fixed resin 10, the injected resin is heated, for example. The heated resin loses its viscosity before curing. Therefore, as described above in the first embodiment, a part of the resin having a low viscosity passes through the insertion holes 126-1 and 126-2, and the guide grooves 28-1 and 28-2 are caused by the capillary phenomenon. Move to. Further, a part of the resin that has passed through the insertion hole portions 126-1 and 126-2 flows into the connection groove 160, and the resin that has passed through the insertion hole portion 126-1 and the resin that has passed through the insertion hole portion 126-2 are formed. Join at the connection groove 160. The resin is then cured to integrally form the resin layers 8-1, 8-3 and the fixed resin 10.

The capacitor 102 may be inspected after the process of curing the resin and forming the fixing resin 10. If the resin layer 8-3 or the fixing resin 10 is insufficient for the manufacturing standard, the resin may be added from the substrate mounting surface side of the pedestal 106, for example, and then the added resin may be cured. .. Such a resin addition step is performed only on a capacitor in which the resin layer 8-3 or the fixing resin 10 is insufficient for the manufacturing standard. Therefore, the manufacturing load of the capacitor is suppressed as a whole.

As described above in the first embodiment, the capacitor 102 may be a solid electrolytic capacitor by using a capacitor element 14 impregnated with a conductive polymer to form a solid electrolyte layer, or the capacitor 102 may be a conductive polymer. The capacitor element 14 impregnated with the above may be impregnated with an electrolytic solution as a hybrid type capacitor.

According to the second embodiment, the following actions or effects can be obtained.

(1) The same operation or effect as that of the capacitor 2 of the first embodiment can be obtained.

(2) Since the pedestal 106 has the connection groove 160, a part of the resin that has passed through the insertion holes 126-1 and 126-2 can flow into the connection groove 160. Therefore, a space for holding the resin can be secured in the vicinity of the bent portions 20 of the terminal leads 18-1 and 18-2. Since the bent portions 20 of the terminal leads 18-1 and 18-2 are exposed, as described in the fourth embodiment, for example, the bent portions 20 can be welded to the substrate, and the connection between the terminals and the substrate can be achieved. The effect of lowering the electrical resistance of the can be obtained.

(3) The contact area of the resin layer 8-3 with respect to the pedestal 106 increases, and the resin layer 8-3 engages with the protrusion 130. Therefore, the bonding force between the resin layer 8-3 and the pedestal 106 increases at the central portion of the capacitor 102, and the integrity of the capacitor body 4, the pedestal 106, the resin layers 8-1, 8-3, and the fixed resin 10 is enhanced. Be done.

The features, advantages, modifications, etc. of the above embodiments and examples are listed below.

(1) In the first embodiment and the above embodiment, the fixing resin 10 may be arranged in at least one of the guide grooves 28-1 and 28-2. The arranged fixing resin 10 may be arranged in a part of the gap between the terminal leads 18-1 and 18-2 and the edges of the guide grooves 28-1 and 28-2. , It is not limited to half or the whole of the gap described in the first embodiment and the above-mentioned embodiment. The arrangement range of the fixing resin 10 may be wider or narrower than half of the gap. The wider the arrangement range of the fixing resin 10, the higher the integrity of the exposed terminal portion 22 and the pedestal 6. Further, in the second embodiment, the arrangement position of the fixed resin 10 may be deformed in the same manner as in the fixed resin 10 of the first embodiment and the embodiment.

(2) In the above embodiments and examples, the guide grooves 28-1 and 28-2 have a certain width. However, the guide grooves 28-1 and 28-2 may have a non-uniform width. The guide grooves 28-1 and 28-2 may be wide on the insertion hole side and narrow on the outer edge side of the pedestals 6 and 106, for example. By widening the width on the insertion hole side, the resistance of the resin to pass through to the outer edge side is suppressed, and the resin can be easily passed to the edge side.

(3) In the first embodiment and the above embodiment, the bent portion 20 is exposed, or the resin layer 8-2 covers a part of the bent portion 20. However, the bent portion 20 may be buried in the resin layer 8-2. When the bent portion 20 is buried in the resin layer 8-2, the terminal leads 18-1 and 18-2 can be further fixed to the pedestal 6.

(4) The capacitors 2, 62, 72, and 82 of the first embodiment and the embodiment may have a protrusion on the sealing member side instead of the protrusion 30, and the second embodiment may have a protrusion. The capacitor 102 of the form may have a protrusion on the sealing member side instead of the protrusion 130. In this case, the capacitor includes a pedestal having no protrusions 30 and 130 and a sealing member having a protrusion, and the insertion hole is provided by the first insertion hole portion of the sealing member and the second insertion hole portion of the pedestal. Is formed, and the resin layer 8-2 or the resin layer 8-3 is arranged in a part of the inside of the insertion hole. Such capacitors also provide the actions or effects described above in embodiments and examples.

(5) In the first embodiment and the embodiment described above, the opening distance D1 of the insertion holes 26-1 and 26-2 on the board mounting surface side is larger than the opening distance D2 on the capacitor body 4 side. The insertion hole portions 26-1 and 26-2 of the insertion hole have a step portion 56. However, the shape of the insertion hole is not limited to the shape described in the first embodiment. For example, the insertion hole has an inclined surface instead of the stepped portion 56, and the opening distance D1 on the board mounting surface side of the insertion holes 26-1 and 26-2 is larger than the opening distance D2 on the capacitor body 4 side. You may. Further, the insertion hole may not have the stepped portion 56 and may have a uniform opening distance, or may have a plurality of stepped portions formed in a stepped shape. Further, in the second embodiment, the insertion holes 126-1 and 126-2 have a stepped portion 56. However, for example, as described, the insertion hole may have an inclined surface instead of the stepped portion 56. Further, as shown in FIG. 12, the guide grooves 28-1 and 28-2 and the connection groove 160 may be directly connected to the insertion hole portions 126-1 and 126-2 that do not include the step portion 56.

(6) In the first embodiment and the above embodiment, the width W1 of the step portion 56-1 is wider than the width W2 of the step portion 56-2, and therefore, the center of the terminal leads 18-1 and 18-2. The shaft C1 is arranged on the outer edge side of the pedestal 6 with respect to the center C2 of the opening of the insertion hole on the board mounting surface side. However, the width W1 may be the same width as the width W2, and the width W1 may be narrower than the width W2. Since the distance between the centers of the terminal leads 18-1 and 18-2 is larger than the distance between the centers of the two insertion holes, the central axis C1 of the terminal leads 18-1 and 18-2 is the insertion hole on the board mounting surface side. It may be arranged on the outer edge side of the pedestal 6 with respect to the center C2 of the opening.

(7) The materials for forming the pedestals 6, 106, the resin layers 8-1, 8-2, 8-3, the fixing resin 10, the outer case 12, and the sealing member 16 are not limited to the above materials, and may be appropriately changed. You may.

(8) The protruding portions 30 and 130 may surround the insertion holes 26-1, 26-2, 126-1 and 126-2, and may be appropriately changed without being limited to the above-mentioned shape. .. For example, the pedestals 6 and 106 may have two protrusions, which may surround the insertion holes 26-1, 126-1 and the insertion holes 26-2, 126-2, respectively. good. The sealing member 16 may have two protrusions, which may surround the insertion holes 26-1, 126-1 and the insertion holes 26-2, 126-2, respectively. Further, the groove portions 52 and 54 may be installed as needed. The groove portion 54 may be formed on the surface of the resin injection hole 36 side. The groove 54 formed on the surface of the resin injection hole 36 increases the amount of resin flowing to the insertion holes 26-1, 26-2, 126-1, and 126-2, for example, the resin layer 8-2. It is possible to suppress the resin shortage of 8-3 and the fixing resin 10.

(9) In the above embodiment, the resin injection holes 36 are formed in the pedestals 6 and 106, and after the pedestals 6 and 106 are installed in the capacitor main body 4, the resin is injected and the resin layers 8-1, 8-2, 8- 3. The fixing resin 10 is formed, but it may be changed as appropriate. The resin is attached to the capacitor body 4 or the pedestals 6 and 106, and then the pedestals 6 and 106 are attached to the sealing member 16 side of the capacitor body 4 and the resin is spread between the capacitor body 4 and the pedestals 6 and 106 to form a capacitor. The gap between the main body 4 and the pedestals 6 and 106 may be filled with resin. The resin that fills the gap between the capacitor body 4 and the pedestals 6 and 106 forms the resin layer 8-1. According to such a configuration, it is not necessary to provide the resin injection hole 36.

(10) In the second embodiment described above, the pedestal 106 includes one connection groove 160, and the connection groove 160 is connected to the two insertion holes 126-1 and 126-2. However, the pedestal 106 may include, for example, a first connection groove and a second connection groove, the first connection groove may be connected to the insertion hole portion 126-1, and the second connection groove may be the insertion hole portion. It may be connected to 126-2. That is, the connection groove 160 may be divided.

(11) In the second embodiment described above, the resin layer 8-3 is formed in the entire connecting groove 160, that is, in the entire area between the two ends. However, the capacitor 102 of the second embodiment may be provided with a connection groove 160 through which a liquid resin can flow. The resin layer 8-3 may be partially formed in the connecting groove 160 or may not be formed in the connecting groove 160.

(12) The shape of the connection groove 160, the arrangement position of the bottom, the surface state of the bottom and the side wall, and the like may be different from the shape, the arrangement position, the surface state, and the like described in the second embodiment. For example, the width of the connecting groove 160 may be uniform. The bottom portion may be arranged on a plane different from the step portion 56-1, and the bottom portion may be inclined so that the central portion of the connecting groove 160 is shallower than the end portion. The bottom or side wall may have irregularities or steps.

As described above, the most preferred embodiments of the present disclosure have been described, but the techniques of the present disclosure are not limited to the above description, but are described in the claims or disclosed in the specification. It goes without saying that various modifications and changes can be made by those skilled in the art based on the gist of the invention, and it goes without saying that such modifications and changes are included in the scope of the present disclosure.

The technique of the present disclosure can be widely used in electronic devices and is useful.

2, 62, 72, 82, 102 Capacitor 4 Capacitor body 6, 106 Pedestal 8-1, 8-2, 8-3 Resin layer 10 Fixed resin 12 Exterior case 14 Capacitor element 16 Sealing member 18-1, 18-2 Terminal Lead 20 Bent part 22 Exposed terminal part 24-1, 24-2 First insertion hole part 26-1, 26-2, 126-1, 126-2 Second insertion hole part 28-1, 28-2 Guide groove 30, 130 Protrusion part 32 Peripheral wall 34 Support protrusion 36 Resin injection hole 38 Through hole 40 Shielding part 42, 44, 56, 56-1, 56-2 Step part 46 Support part 48 Retreat part 50 Flat part 52, 54 Groove 58 Resin discharge 160 Connection groove

Claims (9)

1. An outer case, a sealing member having a first insertion hole and attached to the opening of the outer case, and a terminal lead derived from the first insertion hole and having a bent portion and an exposed terminal portion. With the capacitor body including
   A pedestal having a second insertion hole portion installed on the sealing member side of the capacitor body and through which the terminal lead is inserted, and a guide groove formed on the substrate mounting surface on which the exposed terminal portion is arranged.
   A resin layer arranged between the pedestal and the sealing member, and a part of the inside of the insertion hole formed by the first insertion hole portion and the second insertion hole portion.
   A fixing resin arranged between both side surfaces of the exposed terminal portion of the terminal lead and the edge of the guide groove and integrally formed with the resin layer,
   Capacitors characterized by being equipped with.
2. The capacitor according to claim 1, wherein the fixing resin is arranged along the exposed terminal portion of the terminal lead.
3. The capacitor according to claim 1 or 2, wherein the resin layer covers a part of the bent portion.
4. The capacitor according to any one of claims 1 to 3, wherein the surface of the fixing resin is at the same position as the board mounting surface or on the inner side of the pedestal with respect to the board mounting surface.
5. The capacitor according to any one of claims 1 to 4, wherein the central axis of the terminal lead is arranged on the outer edge side of the pedestal with respect to the center of the opening of the insertion hole.
6. Claim 1 to claim 1, wherein the pedestal further has a connection groove on the substrate mounting surface for connecting the second insertion hole portion on the anode side and the second insertion hole portion on the cathode side. The capacitor according to any one of 5.
7. A step of manufacturing a capacitor body including an outer case, a sealing member having a first insertion hole and attached to the opening of the outer case, and a terminal lead led out from the first insertion hole.
   A step of manufacturing a pedestal having a second insertion hole portion and a guide groove formed on the substrate mounting surface, and
   A step of installing the pedestal on the sealing member side of the capacitor body and inserting the terminal lead into the second insertion hole portion to expose it to the board mounting surface side.
   A step of bending the terminal lead to form a bent portion and an exposed terminal portion on the terminal lead, and arranging the exposed terminal portion in the guide groove.
   A step of forming a resin layer between the pedestal and the sealing member, and a part of the inside of the insertion hole formed by the first insertion hole portion and the second insertion hole portion.
   A method for manufacturing a capacitor, comprising a step of forming a fixing resin integral with the resin layer between both side surfaces of the exposed terminal portion and the edge of the guide groove.
8. The capacitor according to claim 7, wherein in the step of forming the fixed resin, the resin whose viscosity has been reduced by the heat treatment moves from the inside of the insertion hole to the guide groove to form the fixed resin. Manufacturing method.
9. The method for manufacturing a capacitor according to claim 8, wherein the heat treatment cures the resin between the pedestal and the sealing member and the resin inside the insertion hole.
   

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