JP2001287154A - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法

Info

Publication number
JP2001287154A
JP2001287154A JP2000104579A JP2000104579A JP2001287154A JP 2001287154 A JP2001287154 A JP 2001287154A JP 2000104579 A JP2000104579 A JP 2000104579A JP 2000104579 A JP2000104579 A JP 2000104579A JP 2001287154 A JP2001287154 A JP 2001287154A
Authority
JP
Japan
Prior art keywords
polishing
slurry
slurry supply
wafer
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000104579A
Other languages
English (en)
Japanese (ja)
Inventor
Takaharu Kunugi
敬治 功刀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2000104579A priority Critical patent/JP2001287154A/ja
Priority to US09/825,174 priority patent/US20020022440A1/en
Priority to KR1020010018052A priority patent/KR20010098453A/ko
Priority to CN01110439A priority patent/CN1316768A/zh
Priority to GB0108751A priority patent/GB2363350A/en
Publication of JP2001287154A publication Critical patent/JP2001287154A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000104579A 2000-04-06 2000-04-06 研磨装置および研磨方法 Pending JP2001287154A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000104579A JP2001287154A (ja) 2000-04-06 2000-04-06 研磨装置および研磨方法
US09/825,174 US20020022440A1 (en) 2000-04-06 2001-04-03 Supply of controlled amount of polishing slurry to semiconductor wafers
KR1020010018052A KR20010098453A (ko) 2000-04-06 2001-04-04 반도체웨이퍼의 연마방법 및 그 장치
CN01110439A CN1316768A (zh) 2000-04-06 2001-04-06 半导体晶片抛光浆料供应量的控制
GB0108751A GB2363350A (en) 2000-04-06 2001-04-06 Slurry feed for wafer polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000104579A JP2001287154A (ja) 2000-04-06 2000-04-06 研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
JP2001287154A true JP2001287154A (ja) 2001-10-16

Family

ID=18618096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000104579A Pending JP2001287154A (ja) 2000-04-06 2000-04-06 研磨装置および研磨方法

Country Status (5)

Country Link
US (1) US20020022440A1 (zh)
JP (1) JP2001287154A (zh)
KR (1) KR20010098453A (zh)
CN (1) CN1316768A (zh)
GB (1) GB2363350A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010240752A (ja) * 2009-04-01 2010-10-28 Ebara Corp 研磨装置及び研磨方法
JP2015061739A (ja) * 2013-10-31 2015-04-02 株式会社荏原製作所 研磨方法及び研磨装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6953391B1 (en) * 2002-03-30 2005-10-11 Lam Research Corporation Methods for reducing slurry usage in a linear chemical mechanical planarization system
US20040214508A1 (en) * 2002-06-28 2004-10-28 Lam Research Corporation Apparatus and method for controlling film thickness in a chemical mechanical planarization system
CN1305115C (zh) * 2002-09-29 2007-03-14 台湾积体电路制造股份有限公司 利用复合控制模式的研浆流量控制方法及系统
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US20040162007A1 (en) * 2003-02-19 2004-08-19 Ky Phan Chemical mechanical polishing atomizing rinse system
US6872128B1 (en) * 2003-09-30 2005-03-29 Lam Research Corporation System, method and apparatus for applying liquid to a CMP polishing pad
US6929533B2 (en) * 2003-10-08 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Methods for enhancing within-wafer CMP uniformity
JP2005262406A (ja) * 2004-03-19 2005-09-29 Toshiba Corp 研磨装置および半導体装置の製造方法
US7770535B2 (en) * 2005-06-10 2010-08-10 Semiconductor Energy Laboratory Co., Ltd. Chemical solution application apparatus and chemical solution application method
KR102333209B1 (ko) * 2015-04-28 2021-12-01 삼성디스플레이 주식회사 기판 연마 장치
KR102493016B1 (ko) * 2015-12-31 2023-01-31 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
JP7116371B2 (ja) * 2019-04-01 2022-08-10 株式会社村田製作所 研磨剤供給装置、研磨装置及び研磨剤供給方法
KR20210081898A (ko) * 2019-12-24 2021-07-02 에스케이하이닉스 주식회사 화학적 기계적 연마 장비 및 그 구동 방법
CN115890456A (zh) * 2022-12-29 2023-04-04 西安奕斯伟材料科技有限公司 抛光液提供装置、抛光设备和抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3334139B2 (ja) * 1991-07-01 2002-10-15 ソニー株式会社 研磨装置
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
JP3734289B2 (ja) * 1995-01-24 2006-01-11 株式会社荏原製作所 ポリッシング装置
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
EP1095734B1 (en) * 1997-12-26 2009-10-07 Ebara Corporation Polishing machine
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010240752A (ja) * 2009-04-01 2010-10-28 Ebara Corp 研磨装置及び研磨方法
JP2015061739A (ja) * 2013-10-31 2015-04-02 株式会社荏原製作所 研磨方法及び研磨装置

Also Published As

Publication number Publication date
US20020022440A1 (en) 2002-02-21
KR20010098453A (ko) 2001-11-08
CN1316768A (zh) 2001-10-10
GB0108751D0 (en) 2001-05-30
GB2363350A (en) 2001-12-19

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