JP2001284587A5 - - Google Patents
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- JP2001284587A5 JP2001284587A5 JP2000089736A JP2000089736A JP2001284587A5 JP 2001284587 A5 JP2001284587 A5 JP 2001284587A5 JP 2000089736 A JP2000089736 A JP 2000089736A JP 2000089736 A JP2000089736 A JP 2000089736A JP 2001284587 A5 JP2001284587 A5 JP 2001284587A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000089736A JP2001284587A (ja) | 2000-03-28 | 2000-03-28 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000089736A JP2001284587A (ja) | 2000-03-28 | 2000-03-28 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001284587A JP2001284587A (ja) | 2001-10-12 |
| JP2001284587A5 true JP2001284587A5 (xx) | 2007-03-22 |
Family
ID=18605450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000089736A Pending JP2001284587A (ja) | 2000-03-28 | 2000-03-28 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001284587A (xx) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3405697B2 (ja) | 1999-09-20 | 2003-05-12 | ローム株式会社 | 半導体チップ |
| JP3715971B2 (ja) | 2003-04-02 | 2005-11-16 | ローム株式会社 | 半導体装置 |
| US7582931B2 (en) | 2004-06-04 | 2009-09-01 | Samsung Electronics Co., Ltd. | Recessed gate electrodes having covered layer interfaces and methods of forming the same |
| JP2007180310A (ja) | 2005-12-28 | 2007-07-12 | Toshiba Corp | 半導体装置 |
| JP5122762B2 (ja) * | 2006-03-07 | 2013-01-16 | 株式会社東芝 | 電力用半導体素子、その製造方法及びその駆動方法 |
| JP5587535B2 (ja) | 2007-11-14 | 2014-09-10 | ローム株式会社 | 半導体装置 |
| JP2013004636A (ja) * | 2011-06-15 | 2013-01-07 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置およびその製造方法 |
| JP5831526B2 (ja) | 2013-01-17 | 2015-12-09 | 株式会社デンソー | 半導体装置およびその製造方法 |
| EP3671860A1 (en) | 2018-12-20 | 2020-06-24 | Infineon Technologies Austria AG | Semiconductor transistor device and method of manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05315620A (ja) * | 1992-05-08 | 1993-11-26 | Rohm Co Ltd | 半導体装置およびその製造法 |
| JP3209064B2 (ja) * | 1995-02-07 | 2001-09-17 | ソニー株式会社 | 電界効果型半導体装置の製造方法 |
| JP3206726B2 (ja) * | 1995-12-07 | 2001-09-10 | 富士電機株式会社 | Ｍｏｓ型半導体装置の製造方法 |
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2000
- 2000-03-28 JP JP2000089736A patent/JP2001284587A/ja active Pending