JP2001284478A - Microwave circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microwave circuit device capable of mounting an electric component on a metal plate at a correct position, and lessening solder dispersion to the periphery. SOLUTION: In the microwave circuit device provided with the electric component 13 constituting a microwave circuit, and the metal plate whereupon the electric component 13 is soldered, grooves 12a-12d are formed on the face of the metal plate 11 of a part along the end edge of at least a part of the electric component 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit device having a structure in which an electric component is mounted on a metal plate.

[0002]

2. Description of the Related Art Conventionally, a microwave circuit device used for a mobile communication device such as a simple portable telephone (PHS) is required to have conditions such as small size, light weight, low cost, and excellent mass productivity. .

Here, a conventional microwave circuit device will be described with reference to a perspective view of FIG.

On a metal plate 71, a semiconductor chip or M
An electric component 72 such as an IC board or a capacitor is mounted, and these electric components 72 are
And the metal plate 71 are appropriately bonded.

[0005] Two layers of frames 73 and 74 are formed around the metal plate 71. For example, four connection patterns 75e to 75h are formed on the inner surface of the side wall portion B constituted by the frame 74. Also, the side wall portion A
Connection patterns 75e-
Four connection patterns are formed at positions corresponding to 75h. In FIG. 7, connection patterns 75e
Only ７５75 g is shown. The connection patterns 75e to 75h provided inside the frame 73 are signal terminals connecting the inside and outside of the frames 73 and 74. The openings above the frames 73 and 74 are covered with a lid (not shown) in which the surface of the dielectric substrate is plated, or a lid (not shown) formed of a metal plate, etc., to constitute a microwave circuit device. You.

[0006]

A conventional microwave circuit device is required to be small, light, low in cost, and mass-producible. For this reason, when mounting an electric component such as a semiconductor chip, the mounting is performed by reflow, and an auto bonder is used for bonding. When an auto bonder is used, it is required that electrical components such as semiconductor chips be accurately mounted at correct positions.

[0007] In the case of the conventional microwave circuit device, there is no target for mounting the electric component on the metal plate surface on which the electric component is mounted. For this reason, it is difficult to mount the electric component at a correct position. In addition, if the amount of solder for fixing the electric component is large, the electric component floats and may be displaced. Further, the solder may flow out to an unnecessary area on the metal plate, and the flowed solder may interfere with bonding of the electric component to the metal plate.

An object of the present invention is to solve the above-mentioned drawbacks, and an object of the present invention is to provide a microwave circuit device capable of mounting an electric component at a correct position on a metal plate and reducing the spread of solder to the periphery. .

[0009]

SUMMARY OF THE INVENTION The present invention relates to a microwave circuit device comprising an electric component constituting a microwave circuit and a metal plate to which the electric component is soldered, wherein at least a part of the electric component is provided. A groove is formed on a surface of the metal plate at a portion along an edge of the metal plate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the perspective view of FIG. Part of the metal plate 11,
For example, an L-shaped groove 12 is formed in a portion corresponding to four rectangular corners.
a to 12d are formed. In this case, when the electric component 13 such as a semiconductor chip having a quadrangular shape is mounted on the metal plate 11, the outer edge of the electric component 13 is arranged so as to coincide with, for example, the inner edge of the grooves 12a to 12d. By targeting the plurality of grooves 12a to 12d in this way, the electric component 13 can be mounted at a correct position. In this state, the electric components 13 are soldered, and thereafter, the electric components 13 are bonded to each other or between the electric components 13 and the metal plate 11.

At the periphery of the metal plate 11, frames 14 and 15 are formed in two layers. For example, four connection patterns 16e to 16h are formed on the inner surface of the side wall portion B of the frame 14. Four connection patterns are also formed on the inner surface of the side wall portion A at positions corresponding to the connection patterns 16e to 16h. In this case, only the connection patterns 16e to 16g are shown because of the drawing.

The connection patterns 16e to 16h provided inside the frame 14 are signal terminals connecting the inside and outside of the frames 14 and 15. Frame 14,
The upper opening 15 is covered with a lid (not shown) in which the surface of the dielectric substrate is plated or a lid (not shown) made of a metal plate to constitute a microwave circuit device.

Here, the grooves formed on the metal plate will be described with reference to FIG. For example, L-shaped grooves 21a to 21d are formed at portions corresponding to four corners of a rectangle, and along the inner edges of these grooves 21a to 21d, for example,
An electric component is mounted in a region 22 indicated by oblique lines.

Next, another shape of the groove will be described with reference to FIG. In this example, the groove 31 has a rectangular width. Then, the electric component is mounted in the hatched area 32 inside the groove 31. In this configuration,
Since the entire periphery of the electric component is surrounded by the groove 31, the outflow of solder is prevented.

Next, another shape of the groove will be described with reference to FIG. In this example, a square groove 41 having a small area is provided at two diagonal positions among four corners of a rectangle.
a and 41b are formed, and the electric components are mounted in the shaded area 42. Also in the case of this configuration, the grooves 41a, 4
1b suppresses the flow of the solder.

According to the above configuration, the electric component can be mounted at a correct position, targeting the groove formed on the metal plate surface. In addition, the flow of the solder is suppressed by the groove, the displacement of the electric component is reduced, and there is no hindrance to the bonding between the electric component and the metal plate.

When a groove is formed on the surface of the metal plate, the groove may be singular or plural, but providing a plurality of grooves for one electric component facilitates positioning. Moreover, the shape of the groove can be aimed at a corner having a corner such as a triangle or a quadrangle, so that the positioning of the electric component becomes easy.

The above embodiment has been described with reference to an example in which a frame is formed around a metal plate on which electric components are mounted. However, the present invention can also be applied to a metal plate having no peripheral frame, such as a carrier plate.

Here, as another embodiment of the present invention, FIG. 5 shows a case of a metal plate having no frame around it.
This will be described with reference to the plan view of FIG.

On the surface of the metal plate 51, for example, four grooves 521 to 524 formed substantially in a U shape are formed. Two pairs of L-shaped grooves 53 and 54 are formed in the center of the metal plate 51. The L-shaped grooves 53 and 54 are respectively provided with the longer straight portions 53a and 5a.
4a are formed in parallel, and the shorter straight portions 53b, 54
b are formed so as to approach each other. Further, two through holes 55 and 56 for attaching the metal plate 51 are provided at both ends of the metal plate 51.

The grooves 521 to 524, 53, 54 and the through holes 55, 56 are formed by a photolithography method or the like. For example, a photoresist layer is formed on the metal plate 51,
After that, the grooves 521 to 524, 53, 54 and the through holes 55,
The photoresist layer at the portion corresponding to 56 is removed, and the metal plate 51 is etched.

In this case, the groove 521 on the metal plate 51
To 524, 53 and 54 are, for example, metal plates 51
Are formed at the same time in an etching step of forming through holes 55 and 56 for attaching the holes. Therefore, the grooves 521 to 52
Even if 4, 53 and 54 are provided, the number of steps does not increase.

Next, a method of fixing electric components constituting a microwave circuit such as a field effect transistor, a resistor, and a capacitor on the metal plate 51 having the above configuration will be described with reference to FIG. 6, parts corresponding to those in FIG. 5 are denoted by the same reference numerals, and duplicate description will be partially omitted.

Electric components constituting the microwave circuit, for example, chip capacitors 61 to 64 are arranged such that the three edges thereof are along the inner edges of U-shaped grooves 521 to 524, and are placed on the metal plate 61. Solder. Also, other electric components constituting the microwave circuit, for example, a package component 6 in which a microwave circuit portion is housed in a package.
5 and 66 are arranged so as to be sandwiched inside the L-shaped grooves 53 and 54, and soldered on the metal plate 51.

According to the above configuration, the metal plate 51
Grooves 521 to 524, 53, 54 are formed thereon.
Therefore, when electric components such as the chip capacitors 61 to 64 and the package components 65 and 66 are arranged on the metal carrier plate 51, the edge of each electric component is formed in the groove 52.
By arranging them along 1 to 524, 53, 54, the electric components can be arranged at the correct positions of the metal plate 51.

When the electric component is soldered on the metal carrier plate 51 by using a solder such as gold tin, even if the solder flows, the solder is stopped by the grooves 521 to 524, 53, 54, and the peripheral parts are stopped. The spread of solder is prevented.

In the embodiment shown in FIG. 6, the case where the electrical components constituting the microwave circuit are chip capacitors and package components has been described. However, the invention is equally applicable to other electrical components.

[0028]

According to the present invention, an electric component can be arranged at a correct position on a metal plate, and a microwave circuit device in which the spread of solder to the periphery can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a diagram illustrating the shape of a groove used in the present invention.

FIG. 3 is a diagram illustrating another shape of a groove used in the present invention.

FIG. 4 is a diagram illustrating another shape of a groove used in the present invention.

FIG. 5 is a schematic structural diagram for explaining another embodiment of the present invention.

FIG. 6 is a schematic structural diagram for explaining another embodiment of the present invention, and is a diagram for explaining a method of arranging electric components on a metal plate.

FIG. 7 is a perspective view showing a conventional example.

[Explanation of symbols]

 11: Metal plate 12a to 12d: Groove formed on the metal plate surface 13: Electric component 14, 15: Frame 16e to 16g: Connection pattern

Claims (4)

[Claims] An electric component constituting a microwave circuit,
In a microwave circuit device comprising a metal plate to which the electric component is soldered, a groove is formed on a surface of the metal plate at a portion along an edge of at least a part of the electric component. Microwave circuit device. 2. The microwave circuit device according to claim 1, wherein a through hole for mounting the metal plate is provided in the metal plate. 3. The microwave circuit device according to claim 1, wherein the groove is formed by photolithography. 4. The microwave circuit device according to claim 2, wherein the grooves and the through holes are formed by a photolithography method.