JP2001268190A - Communication terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a communication terminal in a narrow internal space of which a radio wave absorbing body to absorb an unnecessary radio wave is efficiently arranged. SOLUTION: The radio wave absorbing body is arranged in a case of the communication terminal, which has a connector connected removably to a host device and where an antenna element, an element for high frequency signal processing, an element for base band signal processing and a memory element for a storage function are mounted in the case whose thickness is 3.5 mm or below.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a communication terminal device in which an information communication function and a storage function are integrated in a small module, for example, a host device such as a personal computer, a mobile phone, a video device, an audio device and a network. The present invention relates to a detachable ultra-small communication terminal device for connecting to a communication terminal.

[0002]

2. Description of the Related Art In recent years, data such as music, voice, and images has been digitized and can be easily handled by personal computers and mobile computers. Also, the band is compressed by audio codec and image codec,
An environment has been established in which such data can be easily distributed using digital communication and digital broadcasting.

[0003] In communication of such audio-video (AV) data, it has become possible to transmit and receive data outdoors by using a cellular phone, a cordless phone, or the like, and various home networks have been proposed even at home.

[0004] As a network for such communication, for example, a home network in the 5 GHz band as proposed in IEEE802.11, an L network of 2.45 GHz, etc.
AN, and short-range communication called "Bluetooth"
Wireless communication systems and the like have been proposed, and are expected as next-generation wireless networks.

By using these wireless networks at home or outdoors, it becomes possible to seamlessly exchange various data, access the Internet, transmit and receive data on the Internet, and the like.

[0006] However, in order to realize such an environment, it is necessary to attach a communication function to an apparatus for reproducing and recording music and video, that is, an AV apparatus.

On the other hand, the digitization of AV data enables recording and accumulation in a computer storage such as a hard disk, a magneto-optical (MO) disk, or a semiconductor memory from the viewpoint of data recording and accumulation. This means that the conventional analog recording system (for example, audio compact cassette, VHS system video cassette, so-called laser disk (registered trademark), etc.) having its own format can be replaced.

In particular, a semiconductor memory such as a flash memory has a very small volume per recording capacity, and has a unique interface as a detachable memory module. However, a digital still camera, a video camera, a portable audio device, It has begun to be used in notebook personal computers and the like, and the use of this memory module has been used to transfer, transplant, record, and accumulate data such as voice and images from device to device.

[0009]

As described above, personal AV devices are required to have an interface for connection to various networks, but for example, emphasis is placed on portability for individuals. In the so-called mobile devices that are made, it is very burdensome to provide multiple communication ports and incorporate multiple communication hardware,
It is an obstacle to its spread.

[0010] In addition, it is very burdensome to mount various wireless communication means on a portable device. In particular, simultaneous mounting of a plurality of different communication means using a wireless communication method requires the same band or different bands. This may cause problems such as interference and mutual interference, which is not preferable.

[0011] The present inventors have developed a miniature communication module in which a communication function is mounted in a so-called memory module and which is detachable from an interface of the memory module with a host-side AV device.
It was proposed in one year patent application No. 323453.

By the way, in such a communication module, it is necessary to stabilize the function by absorbing external radio waves which are disturbances and radio waves leaking from the inside to prevent noise and radio interference. For example, it is necessary to take measures such as unnecessary radiation leaking from the inside of the communication module, coupling between the antenna element and the element performing each signal processing, and spatial electromagnetic resonance called cavity resonance.

As a solution to this, it is conceivable to review wiring inside the communication module. However, such an ultra-small communication module has a low degree of freedom in design change in terms of space, and it is difficult to change the design in a short time from the viewpoint of cost, and this is not an effective solution.

On the other hand, a radio wave absorber for absorbing unnecessary radio waves may be provided inside the communication module. However, in a very small communication module having little space for disposing such a radio wave absorber, there is a problem of how to efficiently arrange the radio wave absorber.

Therefore, the present invention has been proposed in view of such conventional circumstances, and it has become possible to efficiently arrange a radio wave absorber for absorbing unnecessary radio waves in a narrow internal space. It is an object of the present invention to provide a miniaturized communication terminal device.

[0016]

According to the present invention, there is provided a communication terminal apparatus having a connector portion detachably connected to a host device, an antenna element, an element for performing high-frequency signal processing, 3.5 mm thick element for baseband signal processing and memory element for storage function
In the following communication terminal device mounted on a housing, a radio wave absorber is provided in the housing.

In this communication terminal device, since the radio wave absorber is disposed in the housing, even if the internal space is small, the radio wave absorber can be optimally arranged, and unnecessary radio waves can be efficiently transmitted. It becomes possible to absorb well.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a communication terminal device (communication module) to which the present invention is applied will be described in detail with reference to the drawings.

All of the memory modules proposed so far have a thickness of 3.5 mm or less. On the other hand, a communication terminal device to which the present invention is applied integrates an information communication function and a storage function by mounting an element for realizing a communication function in such an ultra-small memory module, and a completely new type. This is a micro communication module.

Hereinafter, a specific structure of a communication module in which elements for realizing a storage function and a communication function are mounted in a housing similar to a so-called memory stick (trade name) will be described.

The total thickness of the memory stick is 2.
8mm, memory for storage function is 50.0m
It is housed in a rectangular housing of mx 21.45 mm. The volume including the housing is 3 ml or less. The housing is A
It is made of a molded member such as a BS resin or a liquid crystal polymer (LCP), and is divided into an upper lid and a lower lid.

In this example, in such a limited space,
Elements for adding a storage function and a communication function are mounted at high density.

FIG. 1 shows the appearance of a communication module to which the present invention is applied. A terminal 2 serving as a connector for connecting to a host device is provided at one end of a rectangular casing 1. Is provided.

Therefore, it is necessary that the module to which the present invention is applied has an input / output interface for exchanging data with the host device.

Although any input / output interface can be adopted, as described above, the present invention is basically based on integrating communication functions into the memory modules proposed so far. Because it ’s an idea,
In this case, the input / output interface of a commercially available memory module is used as it is. Therefore, in this example,
The input / output interface of the Memory Stick is used as it is.

Various elements having a communication function and a storage function are mounted in the housing 1, and FIGS. 2 and 3 show the mounted state. The mounted elements are
Mainly, memory element 3 for storage function and element for performing baseband signal processing (baseband LSI)
4, an element (RF module) for performing high-frequency signal processing 5,
The antenna element 6.

These elements have a thickness of 0.2 m in this example.
m and is accommodated in a limited space in the housing 1 having an overall thickness of 2.8 mm or less.

At one end of the flexible wiring board 7, a connection terminal portion 7a is provided corresponding to the terminal row 2 provided on the housing 1, and the connection terminal section 7a is electrically connected to the terminal row 2. With the connection, data can be exchanged with the host device via the terminal array 2.

Since the housing 1 is rectangular, in this example, the storage function memory device 3, the baseband LSI 4, the RF module 5, and the antenna device 6 are arranged in this order from the connection terminal portion 7a side.

This is determined from the viewpoint of minimizing the loss. If the arrangement is changed, the wiring becomes complicated, and as a result, the loss increases, and the interference by the RF module 5 and the antenna The function of the element 6 may be deteriorated.

Each element is a so-called chip component, and is mounted together with other general components 8 on a flexible wiring board 7 on which various wiring patterns and connection terminals are formed as shown in FIG.

Next, the structure and function of each element will be described.

First, the RF module 5 has a function of detecting and reproducing a high-frequency signal input from the antenna element 6 and converting it into a baseband signal.

The functional elements constituting the RF module include a resonator, a filter, a capacitor, an inductor, and the like. Usually, these are mounted as chip components, but here, in a limited space as described above. In order to accommodate them, they are designed to be built in a multilayer substrate so as to minimize the thickness of the entire device.

FIG. 5 shows an example of the RF module 5. In the RF module 5, a resonator (filter) 52, a capacitor 53, and an inductor 54 are provided in an inner layer or an outer layer of a ceramic substrate (or an organic substrate) 51.
And the like are incorporated and built-in by a multi-layer technology.
The functional elements are electrically connected by wiring patterns, through holes, and the like that connect them, and the ceramic substrate 51 itself operates as one functional component.

The RF module 5 is formed as one chip component by mounting another chip component 55 and an RF semiconductor LSI 56 on the ceramic substrate 51 in which these functional elements are built.

Here, the RF semiconductor LSI 56 is mounted on the ceramic substrate 51 by flip-chip connection, and an increase in thickness due to the connection is suppressed. Flip chip connection is a mounting method in which a protruding electrode called a bump is formed on an electrode on the surface of a semiconductor chip, and the electrodes of the wiring board and the bump are turned upside down and connected by so-called face-down bonding. In this example, RF
Bump (for example, solder bump) 5 on semiconductor LSI 56
7 is aligned with the electrodes of the ceramic substrate 51, and is heated and melted for face-down bonding. According to the flip-chip connection, for example, a wire routing space is not required as compared with, for example, wire bonding, and the dimension in the height direction can be significantly reduced.

The baseband LSI 4 is an LSI having a controller for controlling communication signal processing and a memory function described later, or a function for controlling an interface function when a communication module is inserted into a host-side interface. In some cases, by using the communication function mounted on the communication module of this example, by storing personal information and provider information when an Internet connection is established, connection to a specific site can be semi-automatically performed. It also has a function to enable transmission and reception of information.

The baseband LSI 4 has a single LS
It is ideal if it can be configured as an I chip, but since it is necessary to incorporate various functions, it is usually configured by combining a plurality of LSI chips.

At this time, in consideration of a space factor and the like, it is advantageous to adopt a vertical stacking structure using flip-chip connection as in the case of the RF module 5 described above.

FIG. 6 shows an example of a baseband LSI 4 in which two LSI chips are stacked vertically.

The baseband LSI 4 has a vertical structure in which a second semiconductor LSI (for example, a flash ROM) 42 is mounted on a first semiconductor LSI 41 and further mounted on an intermediate substrate (interposer substrate) 43. It is configured as a stacked chip size package.

The first semiconductor LSI 41 and the second semiconductor LSI 42 are flip-chip connected to each other, and have a structure for suppressing the dimension in the height direction. In particular,
A bump 42a is formed on the second semiconductor LSI 42, and is face-down bonded in alignment with the electrode of the first semiconductor LSI 41.

The first semiconductor LSI 41 on which the second semiconductor LSI 42 is mounted is further mounted on the intermediate substrate 43. In this case, the first semiconductor LSI 41 and the intermediate substrate 43 are electrically connected between the electrodes by wire bonding using the wires 44. Even when three or more semiconductor chips are stacked vertically, electrical connection can be achieved while suppressing the dimension in the height direction by appropriately combining flip chip connection and wire bonding.

Then, the first semiconductor LSI 41,
The second semiconductor LSI 42 is molded and protected by a resin 45, and is electrically and mechanically fixed to the flexible wiring board 7 by soldering the intermediate substrate 43 using solder balls 46.

The storage function memory element 3 is a so-called semiconductor memory, and temporarily stores various data obtained through communication, and temporarily stores music, voice, image data, and the like sent from the host device.

This memory element 3 for storage function
By connecting memory buses via an interposer, the capacity can be increased three-dimensionally.

FIG. 7 shows an example of the configuration of the storage memory element 3 in which the capacity is increased as a four-layer structure.

Each semiconductor memory chip 31 is flip-chip connected to an intermediate substrate (interposer substrate) 32 via a bump 31a, and these are stacked in four stages. The connection between the intermediate substrates 32 and the connection between the lowermost intermediate substrate 32 and the flexible wiring board 7 are performed by soldering using the solder holes 33.

As the semiconductor memory chip 31, a chip thinned to, for example, about 100 μm or less by polishing or the like is used to suppress the overall thickness. Also, a very thin flexible wiring board or the like is used for the intermediate substrate 32, and the overall thickness is also reduced. Thus, the capacity can be increased without greatly increasing the overall thickness.

The antenna element 6 naturally functions as an antenna, and various types can be used. Here, a chip antenna is used.

The chip antenna has a so-called multilayer structure in which vias are formed by punching or the like on a green sheet made of an oxide such as alumina or a vitreous simple substance such as SiO ₂ , or a mixture, and then laminated and fired. It can be manufactured by the simultaneous firing process, and the dielectric constant of the material is 5
It can be set relatively freely from about 300 to about 300. Therefore, the effective wavelength of the antenna element 6 is
This can be shortened by the so-called “factor of root ε”, which is very effective for downsizing the antenna.

FIG. 8 shows an outline of the structure of the chip antenna and how power is supplied from the flexible wiring board 7.

The antenna element (chip antenna) 6 is mounted on the end opposite to the terminal row 2 serving as a connector for a host device. Further, the antenna element 6 is mounted adjacent to the RF module 5 as a structure for minimizing the loss of the power supply to the antenna element 6.

Here, the chip antenna used as the antenna element 6 has a so-called inverted-F structure, has a chip antenna internal wiring having an effective length of λ / 4, and one end thereof is flexible. It is structured to be short-circuited to the ground (ground) wiring pattern 71 on the surface of the wiring board 7. Further, the antenna element 6 has a feeding point 61 at an intermediate point thereof, from which feeding and power distribution of the RF signal to the internal wiring of the chip antenna are performed.

As shown in FIG. 9, the antenna element 6 may be provided with a capacitive stub (metal strip pattern) 62 at the tip of the inverted-F structure, so that the effective length of the antenna element can be further reduced. Become.

The flexible wiring board 7 on which the antenna element 6 is mounted has a two-layer structure (double-sided structure) of a back surface composed entirely of a solid ground wiring pattern 72 and a surface layer for routing signal lines. A signal input / output from the RF module 5 is supplied to the antenna element 6 through a line whose impedance is controlled.

More specifically, as shown in FIG. 8, the signal lines 73 to the RF module 5 provided on the surface layer are placed on both sides in the gap formed in the ground wiring pattern 71 formed on the same plane. It is wired to the ground wiring pattern 71 via a gap at equal intervals, and forms a so-called coplanar line. The high-frequency line is not limited to the coplanar line, but may be, for example, a microstrip line.

The ground wiring pattern 71 on the surface layer side
Are electrically connected to the ground wiring pattern 72 on the back side by, for example, via holes 74 and the like, so as to reliably fulfill the function as ground.

The ground wiring pattern 72 on the back surface
Are not formed up to the position where the antenna element 6 is mounted. If the ground wiring pattern 72 on the back surface is formed up to the position where the antenna element 6 is mounted, the antenna element 6 may not function.

FIGS. 10 and 11 show examples of the high-frequency line of the flexible wiring board 7. FIG.

In the communication module to which the present invention is applied, almost the entire surface needs to be grounded except for the surface on which the antenna element 6 is actually formed (mounted) in order to exhibit the function as an antenna. In consideration of this, it is necessary to configure the high-frequency line.

FIG. 10 shows a so-called grounded planar line, in which ground wiring patterns 71 and 72 are formed on the back and front surfaces of the base material 7b, respectively, and signal lines are provided between the ground wiring patterns 71 on the front surface. 7
3 are formed with predetermined gaps G1 and G2.

By adopting such a configuration, for example, the thickness H and the dielectric constant of the base 7b, the width W of the signal line 73,
By setting the two gaps G1 and G2, a line having a constant impedance can be manufactured in an infinite combination.

The other is a microstrip line shown in FIG. The microstrip line includes a ground wiring pattern 72 on the back surface of the base 7b,
The signal line 73 is provided on the surface. In this case, the substrate 7
A line having a constant impedance can be manufactured by the thickness H, the dielectric constant, and the width W of the signal line 73.

As described above, in order to realize a very small communication module, a wiring board having at least two wiring layers of a substantially solid ground layer and a signal layer is required. Not limited to this, various types of multilayer wiring boards, wiring boards using other types of materials such as ceramics as base materials, and the like can also be sufficiently used.

In the case of a multilayer wiring board, for example, the ground wiring pattern does not necessarily need to be exposed on the back surface, but can be formed in an inner layer or the like.

Further, instead of providing a ground wiring pattern on the flexible wiring board 7 itself, it is also possible to form a ground surface on the inner surface of the housing 1 facing the flexible wiring board 7, for example.

By the way, this communication module includes FIG.
As shown in (1), a housing 1 is provided with a radio wave absorber 9. More specifically, in this communication module, a sheet-shaped radio wave absorber 9 is provided on the inner surface of the housing 1 facing the baseband LSI 4 and the RF module 5.

This radio wave absorber 9 is for preventing unnecessary radiation of the digital part (RF module 5) and for suppressing spatial electromagnetic resonance called cavity resonance, and is used for magnetic permeability of ferrite, metal or the like. The soft magnetic material having a high particle size is pulverized and dispersed in an organic binding material such as an adhesive resin at a high concentration and a high concentration.

As the radio wave absorber 9, it is preferable to use a radio wave absorber adjusted so as to maximize radio wave absorption in a target frequency band. For example, a rubber carbon radio wave absorber, a metal fiber-containing radio wave absorber , A ferrite-based radio wave absorber, a carbonyl iron-based radio wave absorber, a disc-shaped soft magnetic metal-resin composite, a thin film radio wave absorber, a multi-layer radio wave absorber, and the like.

For example, in a radio wave absorber in which a disk-shaped metal magnetic substance is dispersed in a resin material, the frequency limit can be increased to a high frequency band of several GHz or more by making the magnetic particles substantially disk-shaped. High permeability characteristics can be obtained at a high frequency.

Specifically, to manufacture this disk-shaped metal magnetic material, first, an atomizing method or a chemical deposition method is used.
For example, substantially spherical magnetic particles made of iron are formed.

In the atomization method, molten metal is dropped or blown out from a nozzle into a high-speed fluid, and fine particles are formed by the fluid during a cooling process. In this case, the particle size of the magnetic particles can be freely changed by adjusting conditions such as the flow velocity and the amount of blown-out metal. On the other hand, in the chemical precipitation method, a metal salt of iron is reduced to precipitate fine particles of iron. Also in this case, the particle size of the magnetic particles can be freely changed by adjusting the precipitation conditions.

Next, the substantially spherical magnetic particles are crushed by applying a physical force using a rolling roll or a stamp mill to obtain a substantially disk-shaped metal magnetic material. Then, a radio wave absorber can be manufactured by mixing the disc-shaped metal magnetic material with a resin material.

In addition, examples of the material of such a metallic magnetic material include iron nitride, permendur, silicon steel, cobalt, permalloy, nickel, sendust and the like in addition to iron described above. In addition to these, Fe, Co,
A soft magnetic metal material containing at least one ferromagnetic element of Ni can be used. Cu ₂ MnAl, M
A Heusler alloy or the like which does not contain a ferromagnetic element but exhibits properties as a ferromagnetic material, such as an nAl alloy, can be used.

In order to use the soft magnetic metal material for absorbing electromagnetic waves, it is necessary to form a composite using an organic bonding material. In general, if it is a simple metal, the radio wave is completely reflected and functions as a shielding material instead of an absorber. In the radio wave absorber, by combining a soft magnetic metal material with an appropriate organic bonding material, the dielectric constant becomes about 50 to 200, and it is possible to exhibit a radio wave absorption effect while suppressing radio wave reflection. .

Further, as such an organic binding material,
For example, polyester resin, polyvinyl chloride resin,
Known resin materials such as polyurethane resin, cellulose resin, butadiene rubber-based, epoxy-based resin, phenol-based resin, amide-based resin, and imide-based resin can be used, and can be appropriately selected according to the purpose or object to be used. Can be used. The radio wave absorber to be manufactured can be formed into a paste or a sheet depending on the selection of the organic bonding material, the forming conditions, the mixing conditions, and the like.

Further, as a method of forming the radio wave absorber 9 on the housing 1, a method of attaching the sheet-shaped radio wave absorber 9 to the housing 1 can be used. Specifically, as shown in FIG. 12, a sheet-shaped radio wave absorber 9 having a thickness of, for example, about 50 μm to 500 μm is prepared, and an adhesive layer 10 is formed as a thin film on one main surface of the radio wave absorber 9. Then, this is cut out into a size corresponding to the baseband LSI 4 and the RF module 5 and attached to the inner surface of the housing 1 facing the above-described baseband LSI 4 and the RF module 5.

As a result, the radio wave absorber 9 can be efficiently disposed in a limited space in the housing 1 to prevent unnecessary radiation of the digital section (RF module 5), and to reduce the space called cavity resonance. And electromagnetic resonance can be suppressed.

As a method of forming the radio wave absorber 9 on the housing 1, as shown in FIG. 13, a paste-like radio wave absorber 9 is applied on the housing 1, and the radio wave absorber 9 is formed. A method in which the brush 11 is used to apply lightly to a target area on the housing 1 is used. Further, as shown in FIG. 14, a method of spraying a liquid electromagnetic wave absorber 9 onto a target area on the housing 1 by a spray 12 may be used. Further, as shown in FIG. 15, a mask 13 having an opening corresponding to the radio wave absorber 9 formed on the housing 1 is arranged, and the radio wave absorber 9 in the form of a paste is applied thereon. A method called so-called screen printing may be used in which the mask 13 is removed from above the housing 1 after being thinly stretched by a spatula called a squeegee 14.

In any of these forming methods, the housing 1 facing the baseband LSI 4 and the RF module 5 is used.
The radio wave absorber 9 can be formed thin on the inner surface of the. Accordingly, the radio wave absorber 9 can be efficiently disposed in a limited space in the housing 1, preventing unnecessary radiation of the digital unit (RF module 5), and a spatial electromagnetic wave called cavity resonance. Resonance can be suppressed.

In this communication module, the radio wave absorber 9 is composed of the baseband LSI 4 and the RF module 5
Although it is configured to be provided on the inner surface of the housing 1 opposed to the above, the configuration is not necessarily limited to such a configuration.

For example, as shown in FIG. 16, the sheet-shaped radio wave absorbers 9a and 9b are connected to the baseband LSI 4 and the RF
It is good also as a structure located separately in the inner surface of the housing | casing 1 facing the module 5, respectively. Further, as shown in FIG. 17, the radio wave absorber 9 may be coated over the entire inner surface of the housing 1. Further, in the communication module to which the present invention is applied, it is possible to adopt a configuration in which the radio wave absorber 9 is provided on the outer surface of the housing.

As shown in FIG. 18, a concave portion may be formed on the inner surface and / or outer surface side of the housing 1, and a radio wave absorber may be embedded in the concave portion.

In this case, the radio wave absorber 9 can be disposed without using the limited space in the housing 1, and the radio wave absorber 9 can be disposed more efficiently. When the radio wave absorber is embedded in the concave portion, the above-described method of forming the radio wave absorber 9 in the housing 1 is applicable.

Further, as shown in FIG. 19, a configuration may be adopted in which a radio wave absorber 9 is provided inside a member to be the housing 1. In order to dispose the radio wave absorber 9 inside the member to be the housing 1, a so-called injection method of injecting the radio wave absorber 9 into the member to be the housing 1 is simple. Alternatively, a space is previously provided in a member to be the housing 1,
A simple method is to attach or attach a radio wave absorber 9 having a dimension substantially matching the gap.

Also in this case, the radio wave absorber 9 can be provided without using the limited space in the housing 1,
This radio wave absorber 9 can be more efficiently arranged.

Further, as shown in FIG. 20, the radio wave absorber 1 may constitute at least a part of the housing 1.

The above configuration is desirably designed in consideration of the radio wave absorption effect when the radio wave absorber 9 is provided in the housing 1, the design, the strength, and the like.

Here, the radio wave absorption effect when the radio wave absorber 9 was provided in the housing 1 was measured. As a comparison, a communication module without the radio wave absorber 9 was also measured, and noise in each frequency band generated when the communication module was actually operated was measured by a spectrum analyzer. FIG. 21 is a characteristic diagram showing the relationship between each frequency band and noise. Note that FIG.
In FIG. 1, a thin line indicates a case where the radio wave absorber 9 is provided in the housing 1, and a thick line indicates a case where the radio wave absorber 9 is not provided in the housing 1.

As shown in FIG. 21, when the radio wave absorber 9 was provided in the housing 1, a reduction in noise of about 3 to 4 dB was confirmed in a frequency band around about 2450 MHz. Providing the radio wave absorber 9 in the housing 1 as described above is very effective in preventing unnecessary radiation of the above-described digital unit (RF module 5) and suppressing spatial electromagnetic resonance called cavity resonance. It is.

As described above, in the communication module to which the present invention is applied, since the radio wave absorber 9 is provided in the housing 1, the radio wave absorber 9 is provided in a limited space in the housing 1.
Optimum arrangement is possible, and unnecessary radio waves can be efficiently absorbed. Therefore, in this communication module, it is possible to reduce the size and thickness of the module itself without incurring a burden on shape, weight, and cost.

In the communication module, as shown in FIGS. 22 and 23, the space between the baseband LSI 4 and the RF module 5 and the space in the housing 1 are filled.
A configuration in which the radio wave absorber 9 is provided may be adopted. Here, like the other elements, the element molded into a predetermined shape is attached in such a manner as to be mounted on the flexible wiring board 7. Of the radio wave absorbers 9 shown in FIG. 22 and FIG. 23, the radio wave absorber 9 disposed between the RF module 5 and the baseband LSI 4 is mainly for preventing unnecessary radiation of the RF module 5 which is a digital part. Is provided. The radio wave absorber 9 installed in the space is provided for the purpose of suppressing spatial electromagnetic resonance.

As shown in FIG. 24, in a place where the radio wave absorber 9 cannot be easily formed, such as a corner portion in the housing 1, the paste-like radio wave absorber 9 is provided inside the housing 1 by a syringe 13 or the like. Is effective.

[0096] Although an example of the communication module to which the present invention is applied has been described above, the present invention is not limited to this example, and various modifications can be made.

For example, in the above example, each element is mounted on the flexible wiring board 7 and accommodated in the housing 1.
As shown in FIG. 25, a wiring pattern P is formed on the inner wall surface of the lower lid of the housing 1, and the RF module 5, the baseband LSI 4, the storage function memory element 3, and other general parts 8 are directly formed on the wiring pattern P. You may implement it.

However, in this case, the housing 1 needs to have heat resistance enough to withstand a heat treatment step such as reflow, and it is preferable to use a liquid crystal polymer (LCP) or the like.

Further, the antenna element 6 is also a chip antenna in the above example, but as shown in FIG.
MID (Molded Interconnect Device)
The dipole antenna DP of, for example, λ / 2 may be formed by forming a plating pattern using a two-stage forming method such as e) (when the entire surface is filled with the radio wave absorber as in the above example, The antenna element 6 cannot be placed in the housing 1, and the combination with the antenna formation as in this example is preferable.)

When the antenna element is formed on the surface of the housing 1, the flexible wiring board 7 is connected by a coaxial cable or the like.
It is necessary to connect between the RF input / output terminal and the dipole antenna DP so that power can be supplied.

Alternatively, the antenna element can be formed on the protrusion 1c provided on the housing 1.

FIG. 27 shows a projection 1 which projects from the host device body when the communication module is inserted into the host device.
This is an example in which a is provided in the housing 1 and a dipole antenna DP is formed here.

The antenna element is not limited to the above-described dipole antenna. For example, as shown in FIG.
It is also possible to use a tie antenna BT. Others
It is also possible to form a known antenna such as an inverted F antenna, a patch antenna, or the like, and it is also possible to mount a chip antenna in this portion.

Thus, the radiated electromagnetic field from the antenna is not confined in the host device, and the radiation characteristics of the antenna body can be obtained.

As described above, by forming an ultra-small communication module and inserting its connector into the host (for example, AV equipment, telephone, personal computer, etc.), the Internet can be accessed using the communication function. On the other hand, music and image data can be taken from the Internet and temporarily stored in the module's internal memory, so that all data and information communication and recording functions can be easily provided to the host device. It becomes possible.

Further, the flash R of the baseband LSI
OM, EPROM, etc., user's personal information, for example,
Write account information and password of Internet provider, PIN code of mobile phone, etc.
By inserting frequently used site information on the Internet, it is possible to semi-automatically acquire and transmit information intended by the user.

Specifically, the communication module to which the present invention is applied is, for example, a wireless L configured as shown in FIG.
It is applied to an AN (Local Area Network) system.

As shown in FIG. 29, in the wireless LAN system 101 connected to the public communication network 140, communication devices 102 (102a to 102e) serving as gateways,
A Bluetooth system for realizing data communication between the communication module 103 and the host device 104t to which the communication module 103 is mounted is adopted.

[0109] This Bluetooth system is used by 19 companies in Japan and Europe.
It is a name for short-range wireless communication technology that started standardization activities in May 1998. In this Bluetooth system, data communication is performed by constructing a short-range wireless communication network having a maximum data transmission rate of 1 Mbps (effectively 721 Kbps) and a maximum transmission distance of about 10 m. In this Bluetooth system, 2.4 GHz band ISM (Industrial Scien
communication module 103 and host device 104 using frequency hopping spread spectrum technology in which 79 channels with a bandwidth of 1 MHz are set in the frequency band and the channels are switched 1600 times per second.
(104a-104d).

Each host device 104 included in the short-distance wireless communication network to which the Bluetooth system is applied adopts a slave master system, and controls a master device that determines a frequency hopping pattern according to processing contents and a master device. Communication with the slave device of the communication partner. The master device can simultaneously perform data communication with seven slave devices at a time. A subnet consisting of a total of eight devices, including a master device and a slave device,
It is called "piconet". The host device 104, which is a slave device included in the wireless LAN system 101 in the piconet, that is,
It can be one or more piconet slave devices.

The wireless LAN system 101 shown in FIG.
Is a communication device 102 (102a to 102) that transmits and receives data to and from a public communication network 140 such as the Internet network.
e) and a short-range wireless communication network 13 which is a short-range wireless communication network.
0, a communication module 103 for transmitting and receiving control packets including user data and the like to and from the communication device 102 in the Bluetooth system, and input and output of control packets including user data to and from the communication module 103. It is composed of host devices 104 (104a to 104e).

The host device 104 is connected to the communication module 10
3 is an electronic device mechanically connected to and operated by a user. As the host device 104, for example, P
DA (Personal Digital Assistant) 104a, digital still camera 104b, mail processing terminal 104c, E
MD (Electoronic Music Distribution) terminal 104d
Etc.

The communication device 102 is a short-range wireless communication network 13
The communication module 103 is connected to the public communication network 140 via a control packet and is connected to the public communication network 140 via the communication module 103. As the communication device 102, a personal computer 102a having a modem or the like for connecting to a public communication network 140, such as a cdmaOne (registered trademark) (Code Division Multiple Access) system or a W-
CDMA (Wide Band-Code Division Multiple Acces)
s) Mobile phone 102b adopting the method, TA / modem 1
02c, STB (Set Top Box) 102d, for example, Bluet
Communication module 103 and public communication network 1 based on the ooth system
Quasi-public system 10 such as a base station for connecting
2e.

The public communication network 140 includes, for example, an Internet network connected to the personal computer 102a via a telephone line, a mobile communication network (Mobile Network) connected to the mobile phone 102b, and a TA / modem 102c. ISDN connected, satellite communication network (Broadcasting) connected to STB 102d, WLL (Wireless Local Loo) connected to semi-public system 102d
p) etc. An information providing server 141, a mail server 142, an EMD server 143, and a community server 144 are further connected to the Internet network included in the public communication network 140. The information providing server 141 receives a request from the host device 104 via the communication module 103 and the communication device 102, and transmits various information corresponding to the request to the host device 104. Also, the mail server 142
Then, the e-mail is managed, and the e-mail is transmitted / received to / from the host device 104 via the communication device 102 and the communication module 103. Further, in the EMD server 143,
The music information is transmitted to the EMD terminal 104d of the host device 104 via the communication device 102 and the communication module 103 to manage the music providing service. Further, the community server 144 provides, for example, a street corner information and news information download service to the digital still camera 104b of the host device 104, and manages uploading of information from the host device 4, for example.

The communication module 103 used in the above-described wireless LAN system is a communication module to which the present invention described above is applied, and has an internal configuration as shown in FIG.
03, antenna element 6, RF module 5, baseband LSI 4, memory element 3 for storage function
And housed in a single housing 1. For example, the RF module 5 stores a switch unit (SW), a receiving unit, a transmitting unit, and a hopping synthesizer unit. The baseband LSI 4 includes a baseband control unit, an interface unit, a personal information storage unit, a network setting storage unit, a RAM (Random Access Memory), a wireless communication CPU (Central Processing Unit), and a ROM (R
ead Only Memory) and a memory controller.

[0116]

As described above in detail, according to the communication terminal device of the present invention, since the radio wave absorber is provided in the housing, the radio wave absorber is provided in a limited space in the housing. Optimum arrangement becomes possible, and unnecessary radio waves can be efficiently absorbed. Therefore, it is possible to reduce the size and thickness of the module itself without incurring a burden on shape, weight, and cost.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an example of a communication module to which the present invention is applied.

FIG. 2 is a schematic plan view showing an example of a mounting state of each element constituting the communication module.

FIG. 3 is a schematic cross-sectional view showing an example of a mounting state of each element constituting the communication module.

FIG. 4 is an exploded plan view showing a mounting state of an element on a flexible wiring board.

FIG. 5 is a schematic diagram illustrating a cross-sectional structure of an RF module.

FIG. 6 is a schematic diagram illustrating a cross-sectional structure of a baseband LSI.

FIG. 7 is a schematic diagram showing a cross-sectional structure of a storage function memory element.

FIG. 8 is a schematic perspective view showing a partially cutaway mounting structure of the chip antenna to the flexible wiring board.

FIG. 9 is a schematic perspective view showing an example of a chip antenna provided with a capacitive stub.

FIG. 10 is a schematic cross-sectional view of a main part showing an example of a wiring board having a grounded coplanar structure.

FIG. 11 is a schematic cross-sectional view of a main part showing an example of a wiring board having a microstrip structure.

FIG. 12 is a diagram for explaining a method of forming a radio wave absorber on a housing, and is an enlarged sectional view of a main part showing a state where a sheet-shaped radio wave absorber is attached.

FIG. 13 is a diagram for explaining a method of forming the radio wave absorber on the housing, and is an enlarged sectional view of a main part showing a state where the radio wave absorber in a paste state is applied with a brush.

FIG. 14 is a diagram for explaining a method of forming a radio wave absorber on a housing, and is an enlarged view of a main part showing a state where a liquid radio wave absorber is sprayed by spraying.

FIG. 15 is a diagram for explaining a method of forming a radio wave absorber on a housing, and is an enlarged view of a main part showing a state where the radio wave absorber is formed by screen printing.

FIG. 16 is a schematic cross-sectional view showing an example in which a radio wave absorber is provided separately on the inner surface of a housing facing a baseband LSI and an RF module.

FIG. 17 is a schematic cross-sectional view showing an example in which a radio wave absorber is coated over the entire inner surface of the housing.

FIG. 18 is an enlarged sectional view of a main part showing an example in which a radio wave absorber is embedded and formed in a housing.

FIG. 19 is an enlarged sectional view of a main part showing an example in which the radio wave absorber 9 is provided inside a member serving as a housing.

FIG. 20 is an enlarged sectional view of a main part showing an example in which a radio wave absorber forms at least a part of a housing.

FIG. 21 is a characteristic diagram showing a relationship between each frequency band and noise.

FIG. 22 is a schematic plan view showing an example in which a radio wave absorber is provided so as to fill a space between a baseband LSI and an RF module and a space in a housing.

FIG. 23 is a schematic cross-sectional view showing an example in which a radio wave absorber is provided so as to fill a space between a baseband LSI and an RF module and a space in a housing.

FIG. 24 is a schematic cross-sectional view showing a state where a paste-like radio wave absorber is filled in a housing with a syringe.

FIG. 25 is an exploded plan view showing an attached state of elements when wiring is formed on a housing.

FIG. 26 is a schematic plan view showing an example in which an antenna element is formed on a housing.

FIG. 27 is a schematic plan view showing an example in which a dipole antenna is formed on a protruding portion of a housing.

FIG. 28 is a schematic plan view showing an example in which a bow-tie antenna is formed on a protruding portion of a housing.

FIG. 29 is a diagram showing a network including a wireless LAN system.

FIG. 30 is a block diagram illustrating an internal configuration of a communication module.

[Explanation of symbols]

Reference Signs List 1 housing, 2 connector section, memory element for storage function, 4 baseband LSI, 5 RF module, 6 antenna element, 9 radio wave absorber

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Bin Iwashita 4-1-1 Kita Shinagawa, Shinagawa-ku, Tokyo Master Engineering Co., Ltd. F-term (reference) 5J020 EA02 EA04 EA07 EA10 5K023 AA07 BB28 LL05 MM25 NN06 QQ00 RR06 5K027 AA11 BB07 CC08

Claims (9)

[Claims] An antenna element, an element for performing high-frequency signal processing, an element for performing baseband signal processing, and a memory element for a storage function have a thickness. A communication terminal device mounted in a housing of 3.5 mm or less, wherein a radio wave absorber is disposed in the housing. 2. The communication terminal device according to claim 1, wherein the radio wave absorber is disposed on an inner surface of the housing. 3. The communication terminal device according to claim 1, wherein the radio wave absorber is disposed on an outer surface of the housing. 4. The communication terminal device according to claim 1, wherein the radio wave absorber is disposed inside a member serving as the housing. 5. The communication terminal device according to claim 1, wherein the radio wave absorber forms at least a part of the housing. 6. The radio wave absorber, wherein a sheet-like member is attached to the housing.
The communication terminal device according to claim 1. 7. The communication terminal device according to claim 1, wherein the radio wave absorber is formed by applying a paste-like material to the housing. 8. The communication terminal device according to claim 1, wherein the radio wave absorber is formed on the housing by printing. 9. The communication terminal device according to claim 1, wherein the radio wave absorber has a recess formed in a part of the housing and is embedded in the recess.