JP4423771B2 - Memory module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention consolidates information communication functions and storage functions in a small module. Memory module Removable ultra-compact for connecting a host device such as a personal computer, a mobile phone, a video device, an audio device and a network to a network. Memory module About.
[0002]
[Prior art]
In recent years, data such as music, voice, and images have been digitized and can be easily handled by personal computers and mobile computers. In addition, a band is compressed by an audio codec or an image codec, and an environment in which such data can be easily distributed using digital communication or digital broadcasting has been established.
[0003]
In audio-video (AV) data communication, it has become possible to transmit and receive outdoors using cellular phones, cordless phones, and the like, and various home networks have been proposed in the home.
[0004]
As a network for such communication, for example, a home network of 5 GHz band as proposed in IEEE802.11, a LAN of 2.45 GHz, a short-range communication called “Bluetooth”, a wireless communication system, etc. It has been advocated and is expected as a next-generation wireless network.
[0005]
In addition, by using these wireless networks at home and outdoors, various data can be exchanged seamlessly, the Internet can be accessed, and data can be transmitted and received on the Internet.
[0006]
However, in order to realize such an environment, a so-called AV device that plays and records music and video needs to be equipped with a communication function.
[0007]
On the other hand, the digitization of AV data means that recording and storage in a computer storage such as a hard disk, a magneto-optical (MO) disk, or a semiconductor memory is possible from the viewpoint of data recording and storage. However, it seems to replace the conventional analog recording system (for example, audio compact cassette, VHS system video cassette, so-called laser disk, etc.) each having its own format.
[0008]
In particular, semiconductor memory such as flash memory has a very small volume per recording capacity and has a unique interface as a removable memory module, such as digital still cameras, video cameras, portable audio equipment, and notebook computers. This memory module is used to move, transfer, record, and store data such as voice and images from device to device.
[0009]
[Problems to be solved by the invention]
As described above, an interface for connection to any network is also required for a personal AV device. For example, in a so-called mobile device made with emphasis on portability for personal use, Providing a plurality of communication ports or incorporating a plurality of communication hardware is very burdensome and hinders its spread.
[0010]
In addition, wearing various wireless communication means is very burdensome for portable devices, and in particular, simultaneous mounting of a plurality of different communication means using a wireless communication method can cause interference or mutual interference even in the same band or different bands. This may cause problems such as interference, and is not preferable.
[0011]
On the other hand, the above-mentioned memory module is usually moved and transplanted and stored by inserting and removing the module itself, but these operations are very complicated and an improvement is awaited.
[0012]
Accordingly, the present inventors have filed a patent application in 1999 for an ultra-small communication module that has a communication function in a so-called memory module and is detachable from the interface with the host AV device of the memory module. Proposed in No. 323453.
[0013]
By the way, in such an ultra-small communication module, an antenna having a smaller size and excellent characteristics is required in order to be able to mount an element for realizing a communication function in a narrow internal space.
[0014]
For this reason, this communication module has various types of antennas such as an inverted F type, a dipole type, and a patch type for inputting and outputting a high-frequency signal. Or a protrusion formed on the housing.
[0015]
For example, when an inverted F-type antenna is used, an antenna pattern 200 having a length of approximately λ / 4 is formed as a part of the casing or the dielectric substrate 201 as shown in FIGS. One end of which is formed at the ground point s. ₁ As shown, a ground wiring pattern (GND) (not shown) is grounded. Further, the antenna pattern 200 has a feeding point s at an intermediate point thereof. ₂ And this feed point s ₂ The RF signal is fed and distributed from the antenna to the antenna. Note that the other end of the antenna pattern 200 is an open point s. _Three It has become. FIG. 31 is a diagram schematically showing the inverted F-type antenna shown in FIG.
[0016]
In the case of such an inverted F-type antenna, when the length of the resonator of the antenna is approximately λ / 4, the frequency F corresponding to the wavelength λ. ₀ Resonance occurs and functions as an antenna.
[0017]
By the way, this resonance frequency F ₀ Is substantially determined by the length of the resonator of the antenna. For example, if an antenna that functions in the 2.45 GHz band is to be obtained, the wavelength λ in free space is about 120 mm, and the resonance of the antenna The length λ / 4 of the vessel is also as long as about 30 mm. For this reason, in order to reduce the size of the antenna described above, it is important to shorten the effective wavelength of the antenna.
[0018]
As a method of shortening the effective wavelength of such an antenna, that is, shortening the length of the resonator of the antenna, the relative dielectric constant ε of the dielectric substrate on which the antenna pattern is formed is described. _r It is conceivable to increase
[0019]
However, in this case, unless the dielectric substrate has a certain thickness (for example, about 1 mm or more), such an effect cannot be obtained. Therefore, it is not effective in reducing the size of the antenna. Also, a relatively high relative dielectric constant ε _r If a substrate having (around 100) is used, the effective wavelength of the antenna can be shortened. In this case, the substrate becomes a ceramic-based high dielectric constant substrate, compared with a substrate made of a general epoxy resin. This increases the cost.
[0020]
Therefore, the present invention has been proposed in view of such conventional circumstances, and the antenna element can be miniaturized by shortening the effective wavelength of the antenna element without incurring an increase in cost. extremely small Memory module The purpose is to provide.
[0021]
[Means for Solving the Problems]
A communication terminal device according to the present invention that achieves this object has a casing that has a rectangular shape with a thickness of 3.5 mm or less and has a connector portion that is detachably connected to a host device at one end. In the body, in order from the one end side, a storage function memory element, an element that performs baseband signal processing, an element that performs high-frequency signal processing, and an antenna element are arranged, Each of the elements is mounted on one surface of a flexible wiring board, an antenna pattern of the antenna element is formed on a part of the flexible wiring board, the element for performing the baseband signal processing, and the high-frequency signal processing A radio wave absorber is provided so as to fill the space between the element and the inside of the housing, and on the other surface of the flexible wiring board, at least a portion of the antenna pattern of the antenna element that becomes the resonator pattern. A ground pattern for adjusting the resonance frequency of the antenna element is provided at a position corresponding to an adjacent position, and a resonator pattern among the antenna patterns of the antenna element formed on one surface of the flexible wiring board A pattern extending from a portion to a portion to be a feeding point, and the flexible wiring board A microstrip line is formed so as to be opposed to the ground pattern formed on the other surface, and the antenna pattern of the antenna element includes a portion that becomes the resonator pattern, and the antenna pattern and the ground pattern. A capacitor that is connected and adjusts the resonance frequency of the antenna element, and a capacitor or a coil that is connected to the antenna pattern and the ground pattern is provided at a portion that serves as the feeding point, and one of the flexible wiring boards is provided. On the surface, an arrangement pattern is provided so as to be continuous with the antenna pattern, and the arrangement pattern is provided with a plurality of connection terminals along the antenna pattern. Or the above capacitor is installed in one or more places .
[0022]
this Memory module Then, since the capacitor is provided at least in the part that becomes the resonator pattern in the antenna pattern of the antenna element, the resonance frequency of the antenna element can be lowered, and the effective wavelength of the antenna element can be shortened. . Thereby, the length of the resonator pattern of the antenna element can be shortened, and the antenna element can be miniaturized. In addition, the radio wave absorber prevents unnecessary radiation of an element that performs high-frequency signal processing or suppresses spatial electromagnetic resonance called cavity resonance when a small casing is used.
[0023]
Note that the resonance frequency of the antenna element can be arbitrarily adjusted by changing the arrangement, number, capacity, and the like of the capacitor.
[0025]
this Memory module In the antenna pattern of the antenna element, adjacent to at least the part that becomes the resonator pattern At the position on the other side of the flexible wiring board corresponding to the position to be Since the ground pattern is provided, the resonance frequency of the antenna element can be lowered, and the effective wavelength of the antenna element can be shortened. Thereby, the length of the resonator pattern of the antenna element can be shortened, and the antenna element can be miniaturized. In addition, the radio wave absorber prevents unnecessary radiation of an element that performs high-frequency signal processing or suppresses spatial electromagnetic resonance called cavity resonance when a small casing is used.
[0026]
Note that the resonance frequency of the antenna element can be arbitrarily adjusted by changing the arrangement and size (area) of the ground pattern.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a communication terminal device (communication module) to which the present invention is applied will be described in detail with reference to the drawings.
[0028]
All the memory modules proposed so far have a thickness of 3.5 mm or less. On the other hand, the communication terminal device to which the present invention is applied integrates the information communication function and the storage function by mounting an element for realizing the communication function in such a microminiature memory module. This is an ultra-small communication module.
[0029]
Hereinafter, a specific structure will be described by taking as an example a communication module in which an element for realizing a storage function and a communication function is mounted in a housing similar to a so-called memory stick (trade name).
[0030]
The memory stick has an overall thickness of 2.8 mm, and a storage function memory is housed in a rectangular casing of 50.0 mm × 21.45 mm. The volume including the housing is 3 ml or less. The casing is made of a molded member such as ABS resin or liquid crystal polymer (LCP), and is divided into an upper lid and a lower lid.
[0031]
In this example, elements for adding a storage function and a communication function are mounted in such a limited space at high density.
[0032]
FIG. 1 shows the appearance of a communication module to which the present invention is applied. A terminal 2 serving as a connector portion for connection with a host device is provided on one end side of a rectangular casing 1. Yes.
[0033]
Therefore, the module to which the present invention is applied needs to have an input / output interface for exchanging data with the host device.
[0034]
Any input / output interface can be adopted, but as described above, the basic idea of the present invention is to consolidate communication functions in the memory modules proposed so far. In this case, the input / output interface of a commercially available memory module is used as it is. Therefore, in this example, the input / output interface of the memory stick is used as it is.
[0035]
Various elements having a communication function and a storage function are mounted in the casing 1, and these mounted states are shown in FIGS. The mounted elements are mainly a storage function memory element 3, an element (baseband LSI) 4 for performing baseband signal processing, an element (RF module) 5 for performing high-frequency signal processing, and an antenna element 6. .
[0036]
In this example, these elements are mounted on a flexible wiring board 7 having a thickness of 0.2 mm or less, and are housed in a limited space in the housing 1 having an overall thickness of 2.8 mm or less.
[0037]
A connection terminal portion 7 a is provided on one end side of the flexible wiring board 7 in correspondence with the terminal row 2 provided on the housing 1, and the connection terminal portion 7 a is electrically connected to the terminal row 2. Thus, data can be exchanged with the host device via the terminal row 2.
[0038]
Since the casing 1 is rectangular, in this example, the storage function memory element 3, the baseband LSI 4, the RF module 5, and the antenna element 6 are arranged in this order from the connection terminal portion 7a side.
[0039]
This is determined from the viewpoint of reducing the loss as much as possible. When the arrangement is changed, the wiring becomes complicated. As a result, the loss increases, the interference by the RF module 5, and the antenna element 6. Deterioration of function is a problem.
[0040]
Each element is a so-called chip component, and is mounted together with other general components 8 on a flexible wiring board 7 on which various wiring patterns and connection terminals are formed as shown in FIG.
[0041]
In addition, a radio wave absorber 9 is provided between the baseband LSI 4 and the RF module 5 and filling the space inside the housing 1.
[0042]
Next, the structure and function of each element will be described.
[0043]
First, the RF module 5 has a function of detecting and reproducing a high frequency signal input from the antenna element 6 and converting it into a baseband signal.
[0044]
Examples of the functional elements constituting the RF module include a resonator, a filter, a capacitor, an inductor, and the like. Usually, these are mounted as chip parts, but here they are accommodated in a limited space as described above. These are designed to be incorporated in a multilayer substrate and to reduce the thickness of the entire device as much as possible.
[0045]
FIG. 5 shows an example of the RF module 5. In the RF module 5, a resonator (filter) 52, a capacitor 53, an inductor 54, and the like are incorporated in a ceramic substrate (or organic substrate) 51 by using a multilayer technology. Each functional element is electrically connected by a wiring pattern, a through hole, or the like that connects them, and the ceramic substrate 51 itself operates as one functional component.
[0046]
The RF module 5 is configured as one chip component by mounting the other chip component 55 and the RF semiconductor LSI 56 on the ceramic substrate 51 in which these functional elements are built.
[0047]
Here, the RF semiconductor LSI 56 is mounted on the ceramic substrate 51 by flip-chip connection, and an increase in thickness due to connection is suppressed. The flip-chip connection is a mounting method in which bump electrodes called bumps are formed on the electrodes on the surface of the semiconductor chip, the electrodes of the wiring board and the bumps are aligned upside down and connected by so-called face-down bonding. Also in this example, bumps (for example, solder bumps) 57 are formed on the RF semiconductor LSI 56, are aligned with the electrodes of the ceramic substrate 51, and are heated and melted to perform face-down bonding. According to this flip-chip connection, for example, compared to wire bonding, a wire routing space is not required, and particularly the height dimension can be greatly reduced.
[0048]
The baseband LSI 4 is an LSI having a function for controlling an interface function when a communication signal processing and a controller for controlling a memory function to be described later, or a communication module is inserted into a host side interface. In some cases, by using the communication function installed in the communication module of this example, personal information and provider information when connecting to the Internet are stored, so that connection to a specific site can be performed semi-automatically. It also has a function that makes it possible to send and receive information.
[0049]
The baseband LSI 4 is ideal if it can be configured as a single LSI chip. However, since it is necessary to incorporate various functions, it is generally configured by combining a plurality of LSI chips.
[0050]
At this time, considering the space factor and the like, it is advantageous to have a vertically stacked structure using flip chip connection as in the case of the RF module 5 described above.
[0051]
FIG. 6 shows an example of a baseband LSI 4 in which two LSI chips are vertically stacked.
[0052]
In the baseband LSI 4, a second semiconductor LSI (for example, a flash ROM) 42 is mounted on the first semiconductor LSI 41, and these are further stacked on an intermediate substrate (interposer substrate) 43. It is configured as a chip size package.
[0053]
The first semiconductor LSI 41 and the second semiconductor LSI 42 are flip-chip connected and have a structure that suppresses the dimension in the height direction. Specifically, bumps 42 a are formed on the second semiconductor LSI 42, and are face-down bonded in alignment with the electrodes of the first semiconductor LSI 41.
[0054]
The first semiconductor LSI 41 on which the second semiconductor LSI 42 is mounted is further mounted on the intermediate substrate 43. In this case, the electrodes of the first semiconductor LSI 41 and the intermediate substrate 43 are electrically connected by wire bonding using the wires 44. Even when three or more semiconductor chips are stacked vertically, it is possible to electrically connect the flip chip connection and the wire bonding appropriately while suppressing the dimension in the height direction.
[0055]
The first semiconductor LSI 41 and the second semiconductor LSI 42 are molded and protected by a resin 45, and the intermediate substrate 43 is soldered using solder balls 46, so that the flexible wiring substrate 7 can be electrically and mechanically connected. Fixed.
[0056]
The storage function memory element 3 is a so-called semiconductor memory, and temporarily stores various data obtained through communication and temporarily stores music, sound, image data, etc. sent from the host device.
[0057]
The storage function memory element 3 can be increased in capacity three-dimensionally by connecting memory buses to each other via an interposer.
[0058]
FIG. 7 shows a configuration example of the memory element 3 for storage having a four-layer structure in which the capacity is increased.
[0059]
Each semiconductor memory chip 31 is flip-chip connected to an intermediate substrate (interposer substrate) 32 via bumps 31a, and is stacked in four stages. Connection between the intermediate substrates 32 and connection between the lowermost intermediate substrate 32 and the flexible wiring substrate 7 are performed by soldering using the solder holes 33.
[0060]
The semiconductor memory chip 31 is a chip thinned to, for example, about 100 μm or less by polishing or the like, and the overall thickness is suppressed. Further, a very thin flexible wiring board or the like is used for the intermediate board 32, and the overall thickness is also suppressed. As a result, the capacity can be increased without greatly increasing the overall thickness.
[0061]
As a matter of course, the antenna element 6 functions as an antenna. For example, various types such as an inverted F type, a dipole type, a bowtie (bow tie) type, a patch type, a microtrip type, and a monopole type are used. In addition, an antenna element formed by a modification thereof or a combination of a plurality of types thereof can be used. Here, an inverted F antenna is used as an example.
[0062]
The antenna element 6 is mounted on an end portion on the opposite side to the terminal row 2 serving as a connector with the host device. Further, the antenna element 6 is mounted adjacent to the RF module 5 as a structure for minimizing the loss of power supply / reception to the antenna element 6.
[0063]
Specifically, the inverted F-type antenna used as the antenna element 6 includes an antenna pattern 60 formed on the surface of the flexible wiring board 7 as shown in FIGS. The antenna pattern 60 includes a resonator pattern 61 having an effective length of approximately λ / 4, and a tip of a first pattern 62 that is bent at a substantially right angle at one end of the resonator pattern 61. The ground point S1, the first pattern 62, and the first pattern 62 are connected to the tip of the second pattern 63 that extends from the middle part of the resonator pattern 61 while being parallel to the ground pattern S1 and the first pattern 62. A feeding point S3 is provided at the tip of a third pattern 64 that extends from between the first pattern 62 and the second pattern 63 of the resonator pattern 61 while being in parallel with the second pattern 63. Yes. In the antenna pattern 60, the other end of the resonator pattern 61 is an open point S4. FIG. 9 is a diagram schematically showing the configuration of the antenna element 6 shown in FIG.
[0064]
In this antenna element 6, the ground points S 1 and S 2 of the antenna pattern 60 are grounded to a ground wiring pattern (GND) 70 formed on the back surface of the flexible wiring board 7, and this antenna is fed from the feeding point S 3 of the antenna pattern 60. Power supply / distribution of the RF signal to the element 6 is performed.
[0065]
On the other hand, the flexible wiring board 7 on which the antenna element 6 is mounted is made of, for example, an epoxy resin, and has a two-layer structure including a back layer composed of a solid ground wiring pattern 70 on the entire surface and a surface layer for routing signal lines ( A signal input / output from the RF module 5 is supplied to the antenna element 6 through an impedance-controlled line.
[0066]
Specifically, as shown in FIG. 8, the third pattern 64 of the antenna pattern 60 formed on the front surface of the flexible wiring board 7 and the part 70a of the ground wiring pattern 70 formed on the back surface thereof are opposed to each other. Arranged to form a so-called microstrip line. In this case, a line having a constant impedance can be formed according to the thickness and dielectric constant of the flexible wiring board 7, the width of the signal line, and the like.
[0067]
Note that such a high-frequency line is not limited to the microstrip line, and for example, a coplanar line or the like may be employed.
[0068]
Note that the ground wiring pattern 70 on the back surface is not formed up to the position where the antenna element 6 is mounted. If the ground wiring pattern 70 on the back surface is formed until it reaches the mounting position of the antenna element 6, the antenna element 6 may not function.
[0069]
By the way, as shown in FIGS. 8 and 9, the antenna element 6 is provided with a capacitor 65 in a portion of the antenna pattern 60 that becomes the second pattern 63.
[0070]
The capacitor 65 is a so-called chip capacitor, and the resonance frequency of the antenna element 6 can be arbitrarily adjusted by adjusting the arrangement, number, capacitance, and the like of the resonator pattern 61.
[0071]
More specifically, the length of the resonator pattern 61 in the antenna pattern 60 is set to a desired resonance frequency F before such a capacitor 65 is provided. ₀ Resonance at a higher frequency than the resonance frequency F ₀ Is shorter than λ corresponding to. On the other hand, in the present invention, by providing such a capacitor 65 at an arbitrary position of the resonator pattern 61, the resonance frequency of the antenna element 6 can be lowered, and the length of the resonator pattern 61 is shortened. Even so, it is possible to resonate at a lower frequency than in the prior art.
[0072]
10 and 11, the antenna element 6 may have a configuration in which a capacitor or a coil 66 is provided at the feeding point S3 of the third pattern 64 in the antenna pattern 60. The capacitors and coils 66 are so-called chip capacitors 66a and chip inductors 66b, and have one end grounded to a ground wiring pattern 70 formed on the back surface of the flexible wiring board 7 as a ground point S5. 11 is a diagram schematically showing the antenna element 6 shown in FIG. 10. FIG. 11A shows a configuration in which a chip capacitor 66a is provided at the feeding point S3, and FIG. A configuration in which a chip inductor 66b is provided at the feeding point S3 is shown.
[0073]
In this case, the antenna element 6 can arbitrarily control the impedance of the signal input / output from the RF module 5 by providing the chip capacitor 66a and the chip inductor 66b at the feeding point S3. Desired resonance frequency F ₀ And the band can be adjusted arbitrarily.
[0074]
Here, an example of tuning of the antenna element 6 is shown in FIG. Here, the length from the open point S4 of the resonator pattern 61 to the third pattern 64 provided with the capacitor or coil 66 is A, and the second pattern provided with the capacitor 65 is provided from the third pattern 64. When the length up to 63 is B, the return loss for each frequency band was measured while adjusting the ratio B / A between these A and B.
[0075]
FIG. 13 shows the results of measuring the relationship between each frequency band and return loss when B / A is adjusted. In FIG. 13, the graph L1 shows a case where the capacitor 65 is not provided in the second pattern 63 and the capacitor or coil 66 is not provided in the third pattern 64 for reference, and the graph L2 is the second pattern 63 Only the 0.5 pF chip capacitor 65 is provided and B / A 10/11 is shown, and the graph L3 shows that only the 0.5 pF chip capacitor 65 is provided in the second pattern 63 and B / A 4/11. The graph L4 shows a case where only the 0.5 pF chip capacitor 65 is provided in the second pattern 63 and is set to B / A 1/11, and the graph L5 shows 0. 0 in the second pattern 63. A case where a 5 pF chip capacitor 65 and a chip inductor 66 of 3.9 nH are provided at the feeding point S3 of the third pattern 64 and B / A 1/11 is shown.
[0076]
From the measurement result of FIG. 13, when the chip capacitor 65 is not provided in the second pattern 63 and the chip inductor 66 is not provided at the feeding point S3 of the third pattern 64 as in the conventional case (graph L1), it is desired. Resonance frequency F ₀ It can be seen that resonance occurs at a frequency higher than (in this case, the 2.45 GHz band is indicated).
[0077]
On the other hand, when the chip capacitor 65 is provided in the second pattern 63 (graphs L2, L3, L4, L5) as in the present invention, resonance occurs at a frequency lower than the frequency band shown in the graph L1. I can see that Of these, when B / A 1/11 is used as in graphs L4 and L5, it can be seen that resonance occurs in the desired approximately 2.45 GHz band.
[0078]
Further, it can be seen from the graph L5 that the return loss is larger than that of the graph L4 by providing the chip inductor 66 at the feeding point S3 of the third pattern 64.
[0079]
As described above, the chip capacitor 65 is provided in the second pattern 63, and the chip inductor 66 is provided in the feeding point S3 of the third pattern 64, and the resonance frequency of the antenna element 6 is lowered by adjusting the arrangement and capacitance thereof. Even when the length of the resonator pattern 61 is arbitrarily shortened, the resonator pattern 61 can be resonated at a frequency lower than that of the prior art. Moreover, the impedance control of the signal input / output from the RF module 5 can be arbitrarily performed, and the desired resonance frequency F described above. ₀ And the band can be adjusted arbitrarily.
[0080]
Therefore, in this communication module, even when the length of the resonator pattern 61 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. Become.
[0081]
In this communication module, the dielectric constant ε is used as the flexible wiring board 7 on which the antenna element 6 is mounted. _r The length of the resonator pattern 61 in the antenna element 6 can be shortened while using a generally used inexpensive epoxy resin substrate without using a large ceramic-based high dielectric constant substrate. The antenna element 6 can be downsized.
[0082]
Similarly, in this communication module, the length of the resonator pattern 61 in the antenna element 6 can be shortened without increasing the thickness of the flexible wiring board 7 which is a dielectric substrate. Can be realized.
[0083]
In the antenna element 6, in addition to the chip parts such as the capacitors and coils described above, for example, a shunt can be used as a series or a plurality of such chip parts can be provided. is there.
[0084]
Specifically, for example, as shown in FIG. 14, an arrangement pattern 71 for arranging chip capacitors is formed along the antenna pattern 61. The arrangement pattern 71 is provided continuously with the antenna pattern 61, and a plurality of connection terminals 72 are formed on the arrangement pattern 71 at a predetermined interval. Here, the interval between adjacent connection terminals 72 is, for example, 1 mm.
[0085]
In this case, in the antenna element 6, it is possible to arbitrarily adjust the above-described resonance frequency by attaching an arbitrary number of chip capacitors to arbitrary locations of the arrangement pattern 71.
[0086]
Moreover, on this arrangement pattern, in addition to the chip capacitor, a chip component such as a chip inductor or a resistor (0Ω˜), a short-circuit line with a copper foil tape, etc. may be arranged. Combinations are arbitrary.
[0087]
The above is the main component (element) that constitutes the communication module to which the present invention is applied. As described above, the space between the baseband LSI 4 and the RF module 5 and in the housing 1 is filled. In the form, a radio wave absorber 9 is provided.
[0088]
As shown in FIGS. 2 and 3, the radio wave absorber 9 is formed in a part of the wiring part or space, thereby preventing unnecessary radiation of the digital part (RF module 5) or a space called cavity resonance. Acts to suppress electromagnetic resonance.
[0089]
Among the radio wave absorbers 9, the radio wave absorber 9 disposed between the RF module 5 and the baseband LSI 4 is provided mainly for the purpose of preventing unnecessary radiation of the EF module 5 which is a digital unit. The radio wave absorber 9 installed in the space is provided for the purpose of suppressing spatial electromagnetic resonance.
[0090]
As the material of the electromagnetic wave absorber 9, a material obtained by pulverizing a magnetic material having a high magnetic permeability such as ferrite or metal and mixing it with an adhesive resin or the like is used. As in the case of the element, it is mounted in such a manner that it is mounted on the flexible wiring board 7.
[0091]
The radio wave absorber 9 is not limited to the above-described molded product, and any form such as a sheet or a paste can be used.
[0092]
In the example described above, each element is mounted on the flexible wiring board 7 and accommodated in the housing 1. However, as shown in FIG. 15, the wiring pattern P is formed on the inner wall surface of the lower lid of the housing 1. Here, the RF module 5, the baseband LSI 4, the memory element 3 for storage function, and other general components 8 may be directly mounted.
[0093]
However, in this case, the housing 1 needs to have heat resistance that can withstand a heat treatment step such as reflow, and it is preferable to use a liquid crystal polymer (LCP) or the like.
[0094]
Further, in the previous example, the radio wave absorber 9 has a configuration in which a molded body is disposed on the flexible wiring board 7, but as shown in FIGS. 16 and 17, the entire surface is filled with a paste-like material. It is good also as a form to do.
[0095]
In this case, by applying a paste-like radio wave absorber, covering the upper lid 1a on the lower lid 1b, which is the housing 1, and performing heat treatment, assembly and sealing of the housing 1 and formation of the radio wave absorber are performed at once. It is also possible to do this.
[0096]
Further, the RF module 5, the baseband LSI 4, the storage function memory element 3 and the like are also coated with the entire radio wave absorber, and in particular, the moisture resistance reliability and the electrostatic breakdown resistance can be improved.
[0097]
When filling the entire surface with the radio wave absorber, the antenna element 6 cannot be placed in the housing 1, and it is preferable to form the antenna pattern 60 of the antenna element 6 on the surface of the housing 1. In this case, it is necessary to connect the RF input / output terminal of the flexible wiring board 7 and the antenna element 6 with a coaxial cable or the like so that power can be supplied.
[0098]
Thus, the communication module to which the present invention is applied may have a configuration in which the antenna pattern 60 of the antenna element 6 is formed on the surface of the housing 1.
[0099]
Next, another configuration example of the communication module to which the present invention is applied will be described.
[0100]
In the following description, parts equivalent to those of the communication module are not described, and the same reference numerals are given in the drawings.
[0101]
As another configuration example of the communication module, the antenna element 6 shown in FIGS. 18 and 19 includes an antenna pattern 67 formed on the surface of the flexible wiring board 7. The antenna pattern 67 includes a resonator pattern 61 having an effective length of approximately λ / 4, and a tip of a first pattern 62 that is bent at a substantially right angle at one end of the resonator pattern 61. A grounding point S1 is provided at the part, and a feeding point S3 is provided at the tip of a third pattern 64 that extends from the middle part of the resonator pattern 61 in parallel with the first pattern. In this antenna pattern 67, the other end of the resonator pattern 61 is an open point S4. FIG. 19 is a diagram schematically showing the configuration of the antenna element 6 shown in FIG.
[0102]
The antenna element 6 is provided with a ground pattern 68 adjacent to a portion of the antenna pattern 67 that becomes the resonator pattern 61.
[0103]
Specifically, the ground pattern 68 has a length l from the position close to the third pattern 64 to the open point S4 of the resonator pattern 61 on the surface of the flexible wiring board 7, and close to the resonator pattern 61. From one position to a ground wiring pattern 70 formed on the back surface of the flexible wiring board 7, and one end of the ground wiring pattern 70 side is the ground point S6. The ground wiring pattern 70 is grounded.
[0104]
In this ground pattern 68, the resonance frequency of the antenna element 6 can be arbitrarily adjusted by adjusting the arrangement and size (area = 1 × m) with respect to the resonator pattern 61.
[0105]
More specifically, the length of the resonator pattern 61 in the antenna pattern 60 is the desired resonance frequency F before the ground pattern 68 is provided. ₀ Resonance at a higher frequency than the resonance frequency F ₀ Is shorter than λ corresponding to. On the other hand, in the present invention, by providing such a ground pattern 68 at an arbitrary position adjacent to the resonator pattern 61, the resonance frequency of the antenna element 6 can be reduced as in the case where the capacitor 65 is added. Even if the length of the resonator pattern 61 is shortened, the resonator pattern 61 can be resonated at a frequency lower than that of the prior art.
[0106]
20 and 21, the antenna element 6 may have a configuration in which a capacitor or a coil 66 is provided at the feeding point S3 of the third pattern 64 in the antenna pattern 67. The capacitors and coils 66 are so-called chip capacitors 66a and chip inductors 66b, and have one end grounded to a ground wiring pattern 70 formed on the back surface of the flexible wiring board 7 as a ground point S5. FIG. 21 is a diagram schematically showing the antenna element 6 shown in FIG. 20. FIG. 21A shows a configuration in which a chip capacitor 66a is provided at the feeding point S3, and FIG. A configuration in which a chip inductor 66b is provided at the feeding point S3 is shown.
[0107]
In this case, the antenna element 6 can arbitrarily control the impedance of the signal input / output from the RF module 5 by providing the chip capacitor 66a and the chip inductor 66b at the feeding point S3. Desired resonance frequency F ₀ And the band can be adjusted arbitrarily.
[0108]
Here, an example of tuning of the antenna element 6 is shown in FIG. Here, when the distance between the ground pattern 68 and the resonator pattern 61 is C and the distance between the ground pattern 68 and the third pattern 64 provided with the capacitor or coil 66 is D, The return loss for each frequency band was measured while adjusting the intervals C and D.
[0109]
FIG. 23 shows the result of measuring the relationship between each frequency band and the return loss when the distances C and D of the ground pattern 68 are adjusted. In FIG. 23, a graph L6 shows a case where the capacitor or coil 66 is not provided in the ground pattern 68 adjacent to the resonator pattern 61 or the third pattern 64 as a reference, and the graph L7 shows the resonator pattern 61. The graph L8 shows the case where only the ground pattern 68 close to the resonator pattern 61 is provided and C 0.5 mm and D 1 mm are provided. The graph L9 shows a case where a ground pattern 68 in the vicinity of the resonator pattern 61 and a chip inductor 66 of 3.3 nH are provided at the feeding point S3 of the third pattern 64 to have C 0.5 mm and D 1 mm. .
[0110]
From the measurement result shown in FIG. 23, when the chip inductor 66 is not provided in the ground pattern 68 close to the resonator pattern 61 or the feeding point S3 of the third pattern 64 as in the conventional case (graph L6), Desired resonance frequency F ₀ It can be seen that resonance occurs at a frequency higher than (in this case, the 2.45 GHz band is indicated).
[0111]
On the other hand, when the ground pattern 68 close to the resonator pattern 61 is provided as in the present invention (graphs L7, L8, L9), it resonates at a frequency lower than the frequency band shown in the graph L6. I can see that Of these, when C 0.5 mm and D 1 mm are used as in graphs L8 and L9, it can be seen that resonance occurs in a band close to the desired about 2.45 GHz.
[0112]
Further, it can be seen from the graph L9 that the return loss is larger than that of the graph L8 by providing the chip inductor 66 at the feeding point S3 of the third pattern 64.
[0113]
As described above, by providing the chip inductor 66 at the ground pattern 68 close to the resonator pattern 61 or the feeding point S3 of the third pattern 64, and adjusting the arrangement and capacitance thereof, the resonance frequency of the antenna element 6 can be adjusted. Even when the length of the resonator pattern 61 is arbitrarily shortened, the resonator pattern 61 can be resonated at a frequency lower than that of the prior art. Moreover, the impedance control of the signal input / output from the RF module 5 can be arbitrarily performed, and the desired resonance frequency F described above. ₀ And the band can be adjusted arbitrarily.
[0114]
Therefore, in this communication module, even when the length of the resonator pattern 61 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. Become.
[0115]
In this communication module, the dielectric constant ε is used as the flexible wiring board 7 on which the antenna element 6 is mounted. _r The length of the resonator pattern 61 in the antenna element 6 can be shortened while using a generally used inexpensive epoxy resin substrate without using a large ceramic-based high dielectric constant substrate. The antenna element 6 can be downsized.
[0116]
Similarly, in this communication module, the length of the resonator pattern 61 in the antenna element 6 can be shortened without increasing the thickness of the flexible wiring board 7 which is a dielectric substrate. Can be realized.
[0117]
In the antenna element 6, in addition to the chip parts such as the capacitors and coils described above, for example, a shunt can be used as a series, or a plurality of such chip parts can be provided. .
[0118]
In this case, the arrangement pattern 71 as shown in FIG. 14 described above may be formed along the antenna pattern 67. Then, by arranging chip components such as chip capacitors, chip inductors, resistors (0Ω˜), short-circuited lines with copper foil tape, etc. on such an arrangement pattern 17, the above-described resonance frequency can be arbitrarily set. It becomes possible to adjust to.
[0119]
Further, this communication module may be configured such that the antenna pattern 67 of the antenna element 6 is formed on the surface of the housing 1.
[0120]
The communication module to which the present invention is applied has been described above, but the present invention is not limited to these examples, and various modifications can be made.
[0121]
That is, in the above-described example, an inverted F-type antenna is used as the antenna element 6. However, as shown in FIGS. 24 and 25, for example, a dipole antenna of approximately λ / 2 is formed on the surface of the housing 1 or the flexible wiring board 7. May be formed.
[0122]
Specifically, the dipole antenna used as the antenna element 6 includes an antenna pattern 80 formed on the surface of the flexible wiring board 7 as shown in FIG. The antenna pattern 80 includes a resonator pattern 81 having an effective length of approximately λ / 2, and a tip portion of the first pattern 82 extending from a midway portion on one side of the resonator pattern 81. The ground point S8 and the first pattern 82 are connected to the tip of the second pattern 83 extending from the other halfway part of the resonator pattern 81 while being parallel to the ground point S7 and the first pattern 82. In addition, a feeding point S9 is provided at the tip of the third pattern 84 extending from between the first pattern 82 and the second pattern 83 of the resonator pattern 81 in parallel with the second pattern 83. is doing. In this antenna pattern 80, one end of the resonator pattern 81 is an open point S10.
[0123]
In this antenna element 6, the ground point S 7 and the ground point S 8 of the antenna pattern 80 are grounded to the ground wiring pattern (GND) 70 formed on the back surface of the flexible wiring board 7, and from the feeding point S 9 of the antenna pattern 80. Power supply / distribution of the RF signal to the antenna element 6 is performed.
[0124]
Further, the third pattern 84 of the antenna pattern 80 formed on the front surface of the flexible wiring board 7 and the part 70a of the ground wiring pattern 70 formed on the back surface thereof are arranged to face each other to form a so-called microstrip line. Has been.
[0125]
The antenna element 6 is provided with capacitors 85 at portions of the antenna pattern 80 where the first pattern 82 and the second pattern 83 are formed. The capacitor 85 is a so-called chip capacitor, and the resonance frequency of the antenna element 6 can be arbitrarily adjusted by adjusting the arrangement and capacitance of the capacitor 85 in the resonator pattern 81.
[0126]
Thereby, in this communication module, even when the length of the resonator pattern 81 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. It becomes.
[0127]
Further, the dipole antenna used as the antenna element 6 includes an antenna pattern 86 formed on the surface of the flexible wiring board 7 as shown in FIG. The antenna pattern 86 feeds power to a resonator pattern 81 having an effective length of approximately λ / 2 and a tip end portion of a third pattern 84 extending from a substantially central portion of the resonator pattern 81. And a point S9. In the antenna pattern 86, one end of the resonator pattern 81 is an open point S10.
[0128]
The antenna element 6 is provided with ground patterns 87 on both sides of the antenna pattern 86 on the both sides of the third pattern 84 and adjacent to the portions to be the resonator patterns 81, and one side surface of the ground pattern 87 is a ground point S11, 12, a ground wiring pattern 70 formed on the back surface of the flexible wiring board 7 is grounded. The ground pattern 87 can arbitrarily adjust the resonance frequency of the antenna element 6 by adjusting the arrangement and size of the ground pattern 87 with respect to the resonator pattern 81.
[0129]
Thereby, in this communication module, even when the length of the resonator pattern 81 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. It becomes.
[0130]
The antenna element 6 may be a case where a monopole antenna of approximately λ / 4 is formed on the surface of the housing 1 or the flexible wiring board 7 as shown in FIGS.
[0131]
Specifically, the monopole antenna used as the antenna element 6 includes an antenna pattern 90 formed on the surface of the flexible wiring board 7 as shown in FIG. The antenna pattern 90 includes a resonator pattern 91 having an effective length of approximately λ / 4, and a tip end portion of a first pattern 92 that is bent at a substantially right angle at one end of the resonator pattern 91. In addition, a feeding point S13 and a grounding point S14 are provided at the tip of a second pattern 93 that extends from the middle of the resonator pattern 91 in parallel with the first pattern 92. In this antenna pattern 90, the other end of the resonator pattern 91 is an open point S15.
[0132]
In this antenna element 6, the ground point S <b> 14 of the antenna pattern 90 is grounded to a ground wiring pattern (GND) 70 formed on the back surface of the flexible wiring board 7, and this antenna element is fed from the feeding point S <b> 13 of the antenna pattern 90. Power supply / distribution of an RF signal to 6 is performed.
[0133]
Further, the first pattern 92 of the antenna pattern 90 formed on the front surface of the flexible wiring board 7 and the part 70a of the ground wiring pattern 70 formed on the back surface thereof are arranged so as to form a so-called microstrip line. Has been.
[0134]
The antenna element 6 is provided with a capacitor 94 in a portion of the antenna pattern 90 that becomes the second pattern 93. The capacitor 94 is a so-called chip capacitor, and the resonance frequency of the antenna element 6 can be arbitrarily adjusted by adjusting the arrangement and capacitance of the capacitor 94 on the resonator pattern 91.
[0135]
Thereby, in this communication module, even when the length of the resonator pattern 91 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. It becomes.
[0136]
Further, the monopole antenna used as the antenna element 6 includes an antenna pattern 95 formed on the surface of the flexible wiring board 7 as shown in FIG. The antenna pattern 95 includes a resonator pattern 91 having an effective length of approximately λ / 4, and a front end portion of a first pattern 92 that is bent at a substantially right angle at one end portion of the resonator pattern 91. Has a feeding point S13. In the antenna pattern 95, one end of the resonator pattern 91 is an open point S15.
[0137]
The antenna element 6 is provided with a ground pattern 96 adjacent to the portion of the antenna pattern 95 that becomes the resonator pattern 91, and one side surface thereof is formed on the back surface of the flexible wiring board 7 as a ground point S <b> 16. The ground wiring pattern 70 is grounded. The ground pattern 96 can arbitrarily adjust the resonance frequency of the antenna element 6 by adjusting the arrangement and size of the ground pattern 96 with respect to the resonator pattern 91.
[0138]
Thereby, in this communication module, even when the length of the resonator pattern 91 of the antenna element 6 is shortened, it can be resonated at a frequency lower than the conventional one, and the antenna element 6 can be downsized. It becomes.
[0139]
As described above, an ultra-small communication module is formed, and its connector portion is inserted into the host side (for example, an AV device, a telephone, a personal computer, etc.), so that the Internet can be accessed using this communication function. On the other hand, music and image data can be imported from the Internet and temporarily stored in the module's internal memory, allowing all data and information communication and recording functions to be easily added to the host device. It becomes.
[0140]
In addition, personal information such as Internet provider account information and passwords, type phone PIN codes, etc., and frequently used Internet site information, etc. are stored in the flash ROM and EPROM of the baseband LSI. This makes it possible to acquire and send information intended by the user semi-automatically.
[0141]
Specifically, the communication module to which the present invention is applied is applied to, for example, a wireless local area network (LAN) system configured as shown in FIG.
[0142]
As shown in FIG. 28, in the wireless LAN system 101 connected to the public communication network 140, a communication device 102 (102a to 102e) serving as a gateway, a communication module 103, and a host device 104t to which the communication module 103 is mounted are connected. The Bluetooth system for realizing data communication is adopted.
[0143]
The Bluetooth system is a name for short-range wireless communication technology that five Japanese and European companies started standardization activities in May 1998. In this Bluetooth system, data communication is performed by constructing a short-range wireless communication network having a maximum data transmission rate of 1 Mbps (effectively 721 Kbps) and a maximum transmission distance of about 10 m. In this Bluetooth system, 79 channels with a bandwidth of 1 MHz are set in the 2.4 GHz band ISM (Industrial Scientific Medical) frequency band that can be used without permission, and spread spectrum using a frequency hopping system that switches channels 1600 times per second The technology is used to transmit and receive radio waves between the communication module 103 and the host device 104 (104a to 104d).
[0144]
For each host device 104 included in the short-range wireless communication network to which this Bluetooth method is applied, a slave master method is applied, and a master device that determines a frequency hopping pattern according to processing contents, and communication controlled by the master device. Divided into the other slave device. The master device can perform data communication simultaneously with seven slave devices at a time. A subnet composed of a total of eight devices including a master device and slave devices is called a “piconet”. The host device 104 that is a slave device included in the piconet, that is, included in the wireless LAN system 101 can simultaneously be a slave device of two or more piconets.
[0145]
The wireless LAN system 101 shown in FIG. 28 is connected to a communication device 102 (102a to 102e) that transmits / receives data to / from a public communication network 140 such as the Internet network, and a short-range wireless communication network 130 that is a short-range wireless communication network. Then, the communication module 103 that transmits / receives control packets including user data or the like by the Bluetooth method to / from the communication device 102, and the host device 104 that inputs / outputs control packets including user data to / from the communication module 103. (104a to 104e).
[0146]
The host device 104 is an electronic device that is mechanically connected to the communication module 103 and operated by a user. Examples of the host device 104 include a PDA (Personal Digital Assistant) 104a, a digital still camera 104b, a mail processing terminal 104c, and an EMD (Electronic Music Distribution) terminal 104d.
[0147]
The communication device 102 is connected to the communication module 103 via the short-range wireless communication network 130 and is connected to the public communication network 140 and is a gateway for connecting the communication module 103 and the public communication network 140. As the communication device 102, a personal computer 102a provided with a modem for connecting to the public communication network 140, for example, a cdmaOne (Code Division Multiple Access) method or a W-CDMA (Wide Band-Code Division Multiple Access) method is used. There is a semi-public system 102e such as a base station for connecting the adopted mobile phone 102b, TA / modem 102c, STB (Set Top Box) 102d, for example, the communication module 103 conforming to the Bluetooth system and the public communication network 140.
[0148]
The public communication network 140 is connected to, for example, the Internet network connected to the personal computer 102a through a telephone line, a mobile network connected to the mobile phone 102b, and the TA / modem 102c. There are ISDN, a satellite communication network (Broadcasting) connected to the STB 102d, a WLL (Wireless Local Loop) connected to the semi-public system 102d, and the like. An information providing server 141, a mail server 142, an EMD server 143, and a community server 144 are further connected to the Internet network included in the public communication network 140. The information providing server 141 receives a request from the host device 104 via the communication module 103 and the communication device 102 and transmits various types of information corresponding to the request to the host device 104. Further, the mail server 142 manages electronic mail and transmits / receives electronic mail to / from the host device 104 via the communication device 102 and the communication module 103. Further, the EMD server 143 manages the music providing service by transmitting music information to the EMD terminal 104d of the host device 104 via the communication device 102 and the communication module 103. Furthermore, the community server 144 provides, for example, street corner information and news information download services to the digital still camera 104b of the host device 104, and manages the uploading of information from the host device 4 and the like.
[0149]
The communication module 103 used in the above-described wireless LAN system is a communication module to which the present invention described above is applied, and has an internal configuration as shown in FIG. 29. These control systems constitute the communication module 103. The antenna element 6, the RF module 5, the baseband LSI 4, and the storage function memory element 3 are allocated and accommodated in a single casing 1. For example, the RF module 5 stores a switch unit (SW), a reception unit, a transmission unit, and a hopping synthesizer unit. The baseband LSI 4 includes a baseband control unit, an interface unit, a personal information storage unit, a network setting storage unit, a RAM (Random Access Memory), a wireless communication CPU (Central Processing Unit), a ROM (Read Only Memory), a memory The controller is stored.
[0150]
【The invention's effect】
As explained in detail above, according to the present invention Memory module Therefore, even when the length of the resonator pattern of the antenna element is shortened, the antenna element can be resonated at a frequency lower than that of the conventional antenna element, and the effective wavelength of the antenna element can be shortened. So this Memory module Thus, the antenna element can be reduced in size without increasing the cost.
[Brief description of the drawings]
FIG. 1 is a schematic plan view showing an example of a communication module to which the present invention is applied.
FIG. 2 is a schematic plan view showing an example of a mounted state of each element constituting the communication module.
FIG. 3 is a schematic cross-sectional view showing an example of a mounted state of each element constituting the communication module.
FIG. 4 is an exploded plan view showing a state in which elements are attached to a flexible wiring board.
FIG. 5 is a schematic diagram showing a cross-sectional structure of an RF module.
FIG. 6 is a schematic diagram showing a cross-sectional structure of a baseband LSI.
FIG. 7 is a schematic diagram showing a cross-sectional structure of a memory element for storage function.
FIG. 8 is a plan view of an essential part showing an example in which the present invention is applied to an inverted F-type antenna as an antenna element.
9 is a diagram schematically showing the inverted F-type antenna shown in FIG. 8. FIG.
10 is a plan view of a principal part showing a configuration in which a capacitor or a coil is provided at a feeding point of the inverted F-type antenna shown in FIG. 8. FIG.
11 is a diagram schematically showing the inverted F-type antenna shown in FIG. 10, in which (a) shows a configuration in which a chip capacitor is provided at the feeding point, and (b) shows the feeding point. A configuration when a chip inductor is provided is shown.
12 is a plan view of relevant parts showing an example of tuning of the antenna element shown in FIG. 10;
FIG. 13 is a characteristic diagram showing a relationship between each frequency band and return loss when adjusting B / A.
FIG. 14 is a plan view of a principal part showing a state in which an arrangement pattern is formed.
FIG. 15 is an exploded plan view showing a mounting state of the element when wiring is formed in the housing.
FIG. 16 is an exploded schematic view showing a mounting example covered with a radio wave absorber;
FIG. 17 is a schematic diagram showing a sealed state in an example of mounting covered with a radio wave absorber.
FIG. 18 is a plan view of an essential part showing another configuration example in which the present invention is applied to an inverted-F antenna as an antenna element.
19 is a diagram schematically showing the inverted F-type antenna shown in FIG.
20 is a plan view of a principal part showing a configuration in which a capacitor or a coil is provided at a feeding point of the inverted F-type antenna shown in FIG. 18;
FIG. 21 is a diagram schematically showing the inverted F-type antenna shown in FIG. 20, in which (a) shows a configuration in which a chip capacitor is provided at the feeding point, and (b) shows the configuration at the feeding point. A configuration when a chip inductor is provided is shown.
22 is a plan view of relevant parts showing an example of tuning of the antenna element shown in FIG. 20;
FIG. 23 is a characteristic diagram showing the relationship between each frequency band and return loss when the intervals C and D of the ground pattern are adjusted.
FIG. 24 is a plan view of an essential part showing an example in which the present invention is applied to a dipole antenna as an antenna element.
FIG. 25 is a plan view of a principal part showing another configuration example in which the present invention is applied to a dipole antenna as an antenna element.
FIG. 26 is a plan view of an essential part showing an example in which the present invention is applied to a monopole antenna as an antenna element.
FIG. 27 is a plan view of an essential part showing another configuration example in which the present invention is applied to a monopole antenna as an antenna element.
FIG. 28 is a diagram illustrating a network including a wireless LAN system.
FIG. 29 is a block diagram showing an internal configuration of a communication module.
FIG. 30 is a plan view of an essential part showing an example of a conventional inverted-F antenna.
31 is a diagram schematically showing the inverted F-type antenna shown in FIG. 30. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Case, 2 Connector part, 3 Memory element for storage functions, 4 Baseband LSI, 5 RF module, 6 Antenna element, 7 Flexible wiring board, 9 Radio wave absorber, 60 Antenna pattern, 61 Resonator pattern, 65 capacitor, 66a chip capacitor, 66b chip inductor, 68 ground pattern, 70 ground wiring pattern, 71 arrangement pattern

Claims (4)

A casing having a rectangular shape with a thickness of 3.5 mm or less and having a connector portion that is detachably connected to the host device on one end side,
In the housing, in order from the one end side, a storage function memory element, an element for performing baseband signal processing, an element for performing high-frequency signal processing, and an antenna element are arranged,
Each of the elements is mounted on one surface of the flexible wiring board, and an antenna pattern of the antenna element is formed on a part of the flexible wiring board.
A radio wave absorber is provided between the element that performs the baseband signal processing and the element that performs the high-frequency signal processing and so as to fill the inside of the housing.
On the other surface of the flexible wiring board, a ground for adjusting the resonance frequency of the antenna element to a position corresponding to at least a portion of the antenna pattern of the antenna element that is adjacent to the portion that becomes the resonator pattern. Pattern is provided,
Of the antenna pattern of the antenna element formed on one surface of the flexible wiring board, a pattern extending from a portion serving as a resonator pattern to a portion serving as a feeding point, and formed on the other surface of the flexible wiring substrate The microstrip line is formed by being arranged opposite to the ground pattern,
The antenna pattern of the antenna element, the portion serving as the resonator pattern, is connected to the said antenna pattern and the ground pattern, and a capacitor to adjust the resonance frequency of the antenna element, the portion serving as the feeding point, A capacitor or a coil connected to the antenna pattern and the ground pattern is provided,
On one surface of the flexible wiring board , an arrangement pattern is provided so as to be continuous with the antenna pattern,
A memory module , wherein the arrangement pattern is provided with a plurality of connection terminals along the antenna pattern, and the capacitor is attached to any one or more of the plurality of connection terminals. The flexible wiring board, a memory module according to claim 1, wherein an epoxy resin. The antenna elements are inverted F-type, dipole, bow-tie, patch type, of the planar antenna of monopole type, any one, or variations thereof, or claim 1 or consists in a combination thereof The memory module according to claim 2 . Among the plurality of connection terminals, more than any one place, capacitors, coils, resistors, short (0 .OMEGA) according to claim 1 to claim any one or more of the chip component selected from among resistance is attached 4. The memory module according to any one of 3 .

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