JP2001196829A - Antenna device for transmission/reception module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transmission/reception module on which an antenna device, an RF transceiver, etc., which are small in size, stable in characteristic and can deal with short-range radio communication, are mounted. SOLUTION: The conductor layer patterns of the conductors of pair constitution are arranged adjacent along two side edges of a center part between rectangular module substrates consisting of plural layers of dielectric plates to constituted the module for short range radio mounting an incorporated large-scale integrated circuit such as the RF transceiver in a center part. In order to reduce a thickness, the recess and the through hole part and formed at need to arrange the large scale integrated circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna used for a short-range wireless device, and more particularly to an antenna device of a transmitting / receiving module which is modularized with a circuit having an RF transceiver.

[0002]

2. Description of the Related Art In general, antennas used in conventional portable radio equipment include a whip antenna and a helical antenna projecting out of a housing, and an inverted F-type antenna and a chip antenna incorporated therein.

As shown in FIG. 8, (COMDEX / Fal
(Digitalswer A / S exhibition at 1'99, or described in Nikkei Electronics No. 12-13, 1999), an antenna device of a transmitting / receiving module in which an inverted F-shaped antenna or an L-shaped antenna is formed on a resin substrate 1 by a conductor layer pattern 2 There is. Since the ground base plate 3 is required, there is a limit to downsizing, and the characteristics become unstable when the ground base plate has a small area.

[0004] When used in portable radio equipment, the above-mentioned conventional antenna has a large change in gain, directivity and fractional bandwidth depending on whether or not a human body approaches. The smaller the helical antenna or the chip antenna, the lower the gain and the smaller the specific bandwidth. Further, the width of the directional characteristics is insufficient for use in portable wireless devices or the like limited to transmission and reception within a certain distance.

Further, when a transmitting / receiving module is built in, such as a portable notebook personal computer or a digital still camera, an antenna that can be used in a metal housing without protruding is required, but the conventional antenna cannot cope with it.

[0006]

There is a need for a small, thin module that integrates an RF transceiver and antenna that can also be used in portable radio equipment. In addition, the gain is high, the relative bandwidth and the directional characteristics are wide, the influence of the proximity of the human body is small, and a metal housing can be built in and used.

[0007]

According to the present invention, there is provided an antenna apparatus for a transmission / reception module in which a dipole antenna is formed by a pair of conductor wires having a feed end at the center for stable antenna characteristics. The lines are formed in a conductor layer pattern to be disposed between the multiple dielectric plates constituting the module substrate.

When the size of the module substrate is reduced, a large-scale integrated circuit containing at least the circuit of the RF transceiver is arranged at the center of the module substrate. The main object is to mount one chip of a large-scale integrated circuit. However, even in the case of two chips, the conductor layer pattern forming the antenna of the dipole configuration is arranged at the center and the side of the large-scale integrated circuit and the module substrate Place between

The paired conductor wires are closely covered with a multi-layered dielectric plate having a high relative permittivity, and the length of the antenna composed of the paired conductor wires is physically shortened in free space. .

For the purpose of widening the directivity characteristics of the antenna and reducing the size of the module substrate, the conductor layer pattern of the paired conductor wires is placed at a position between the large-scale integrated circuit and the side of the rectangular module substrate. Then, they are arranged close to each other along two sides of the corner.

In order to reduce the antenna loss, two pairs of antennas having a dipole configuration for transmission and reception are used, and two pairs of conductor wires having a pair configuration are provided for the purpose of reducing the difference between the directional characteristics of the antennas and the size of the module substrate. Are arranged close to each other along two sides of two corners of a rectangular diagonal arrangement.

The conductor layer pattern of the pair of conductor wires is made linear or meandering. Any one may be selected to reduce the size of the module substrate. Helical selection is also possible if necessary.

In order to shorten the antenna length and reduce the size of the module substrate, a plurality of dielectric plates sandwiching a conductor layer pattern of a pair of conductor wires are used as general-purpose ceramics having a relative permittivity of about 9.0. And the thickness of each of the alumina plates is preferably about 0.5 to 0.9 mm.

An RF transceiver for a large-scale integrated circuit is provided to reduce the efficiency of a dipole antenna composed of a pair of conductor wires arranged at an angle of about 90 degrees along the sides of the module substrate and to prevent reflection from the antenna. Are arranged in a non-parallel manner from the power supply end connected to the terminal.

The two terminals of the RF transceiver connected to the feeding ends of the paired conductor lines are arranged at symmetrical positions on two sides of the corner of the large-scale integrated circuit, and the paired conductor lines are connected from these terminals. By connecting to the power feeding end of the, the length of the connection is shortened and the symmetry of the arrangement is ensured.

A plurality of conductor layer patterns continuous from the terminals of the large-scale integrated circuit are arranged to intersect with each other via a dielectric plate in order to separate the conductor layer patterns of a pair of conductor wires forming a dipole antenna. I do.

In order to reduce the overall thickness, a bare chip of a large-scale integrated circuit is fixed to a concave portion provided on a module substrate made of a multi-layered dielectric plate, and a terminal on the periphery of the chip of the large-scale integrated circuit is fixed. The conductor wire is short-circuited to the terminal provided on the surface of the module substrate by wire bonding.

Alternatively, in order to make the whole thin, a bare chip of a large-scale integrated circuit is arranged in a through hole formed in a module substrate made of a multi-layer dielectric plate, and a terminal at a peripheral portion of the chip of the large-scale integrated circuit is provided. Then, the conductive wire is short-circuited to the terminal provided on the surface of the module substrate by wire bonding.

In order to join to an external substrate or the like, a plurality of joining terminals continuous from the terminals of the large-scale integrated circuit are provided on the side of the module substrate. Alternatively, for the purpose of reducing the influence on the antenna characteristics, a bonding terminal is provided on a side of the dielectric under the module substrate composed of a multilayer dielectric plate.

In order to reduce the influence on the antenna, the joining terminal of a plurality of conductive layer patterns continuous from the terminal of the large-scale integrated circuit is connected to the module substrate on the side opposite to the surface on which the large-scale integrated circuit is provided. The surface may be formed by adding a solder bump.

For the purpose of reducing the overall size, solder bumps are formed on a large-scale integrated circuit fixed or arranged in a concave portion or through-hole portion of the module substrate on the same surface of the module substrate on which terminals are short-circuited by conductive wires. Form the added joint terminals.

For the purpose of simplifying the whole structure, a large-scale integrated circuit of resin mold is arranged in the through hole of the module substrate, and the outwardly extending terminals are directly joined to the terminals provided on the surface of the module substrate. Further, the terminal protruding outward is referred to as a joining terminal.

When a wireless module is mounted on a portable computer or digital still camera having a metal housing as a mobile wireless device, a dipole formed by forming a pair of conductor wires by forming an opening in a part of the metal housing. A module substrate having an antenna having the above configuration is arranged inside the opening and parallel to the surface of the housing.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described based on examples with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an antenna device 4 of a transmitting / receiving module according to the present invention. A pair of conductor wires, which are dipole antennas, are formed by conductor layer patterns 5 and 6 and are arranged between multiple layers of dielectric plates 7 and 8. The conductor layer patterns 5 and 6 of the pair of conductor lines are indicated by broken lines because they are covered with the dielectric plates 7 and 8. The conductor layer patterns 5 and 6 of the paired conductor wires are arranged at an angle of about 90 degrees, respectively, and the two sides 10 of the corner of a rectangular module substrate 9 composed of a plurality of dielectric plates 7 and 8 are provided. ,
11 are arranged close to each other.

The short-range wireless circuit of the Bluetooth standard is composed of circuits such as baseband processing and an RF transceiver. Since the minimum receiving sensitivity is set as high as -70 dBm with a small output, it can be constituted by one large-scale integrated circuit chip. In the embodiment shown in FIG. 1, a large-scale integrated circuit 12 of one chip is mounted on a module substrate 9.

The reason why the conductor layer patterns 5 and 6 of the paired conductor wires are used to form a dipole antenna is that the dipole antenna is a complete antenna, so that no other configuration such as a ground plane is required. A wide ratio bandwidth and stable characteristics can be obtained. Since the antenna device 4 of the transmission / reception module of the present invention is intended to be used also for an antenna of a mobile phone or a portable digital device, it is important that the characteristic change of the antenna due to the presence or absence of a human body is small. When large reflections from an antenna on the RF transceiver occur, the large integrated circuit 12
Stable operation is hindered. Further, in order to reduce the size of the module substrate 9, it is necessary to eliminate the ground plate.

By covering the whole of the conductor layer patterns 5 and 6 of the paired conductor wires with the dielectric plates 7 and 8 having a high relative permittivity, the antenna length can be shortened as compared with free space. Simply, the physical length, which is the antenna length of the conductor line patterns 5 and 6, is inversely proportional to the half power of the relative permittivity, but a difference in the degree of shortening also occurs due to the thickness of the dielectric plates 7 and 8. .

A plurality of dielectric plates 7 and 8 in which the module substrate 9 is formed and the conductor layer patterns 5 and 6 of the paired conductor wires are arranged in the middle may be formed of an alumina plate which is a kind of ceramic. This is because alumina has a relative dielectric constant of about 9.0, and the value of the relative dielectric constant can be specified by selecting a composition, the dispersion of the relative dielectric constant is small, and the loss coefficient is small. A small variation in the relative permittivity has a small shift in the frequency band of the antenna, and a small loss coefficient is advantageous for the antenna efficiency. Alumina is used as a general-purpose product in ceramics, and has a higher relative dielectric constant and less variation than resin materials. In addition, the heat resistance is excellent, and the occurrence of defects at the terminal junction due to thermal stress when attaching the chip to the large-scale integrated circuit 12 is small.

The conductor patterns 5 and 6 of the pair of conductor wires are set to 9
Arranging at an angle of about 0 degrees can reduce the size of the module substrate 9 as compared with a dipole-structured antenna in which the conductor wires of the pair are arranged on the same straight line, and at the same time increase the directivity to some extent. It is advantageous. This is because narrow directionality is a problem when a direction and a position cannot be specified as in the case of a portable wireless device and an application range of wireless communication is limited.

As shown in the embodiment of FIG. 1, the conductor layer patterns 5, 6 of the paired conductor wires are arranged in the middle of the plurality of dielectric plates 7, 8, and at the same time, the large-scale integrated circuit 12 By arranging the module substrate 9 in a relatively narrow range between the two sides 10 and 11, the area and dimensions of the module substrate 9 can be reduced. Conductor layer pattern 5 of a pair of conductor wires,
6 is formed substantially linearly.

As shown in the perspective view of the embodiment of the antenna device 13 of the transmitting / receiving module of the present invention shown in FIG. 2, the meandering conductor patterns 14 and 15 of the paired conductor wires are composed of the large-scale integrated circuit 16 and the module substrate 17. When formed in the range between the side edges 18 and 19, it is advantageous for shortening the antenna length, but the width becomes large. Which of the conductor layer patterns should be selected may be determined based on the balance between the characteristics of the antenna and the dimensions of the module substrate. The use of a helical shape for the pair of conductor wires is also included in the range of the antenna device of the transmitting / receiving module of the present invention, but the process load formed by the multilayer dielectric plate is large, so the adoption or rejection can be determined in consideration of the overall balance. I just need.

As shown in the embodiments of FIGS. 1 and 2, conductor layer patterns 5, 6 of a pair of conductor lines forming a dipole antenna to be connected to the circuits of the RF transceivers of large scale integrated circuits 12 and 16. And 14 and 15 are arranged so as to extend non-parallel from the feeding ends 20, 21 and 22, 23. It may be spread in a straight line or in an arc. This is because, if simply formed in parallel, the bent portion becomes an acute angle and reflection is likely to occur, and the parallel portion does not contribute to radiation at all. Here, forming parallel means that a part of the shape of the conductor pattern is arranged in the corner direction along the diagonal line.

Further, the power supply portions 20, 21 and 2 of the conductor layer patterns 5, 6 and 14, 15 of the paired conductor wires
Outgoing terminals 24 from the circuits of the large scale integrated circuits 12 and 16 RF transceivers connected to 2, 23;
25 and 26, 27 are corner sides 28, 29 and 3
By symmetrically arranging 0 and 31, the length required for connection can be shortened, and symmetry can be maintained. If it cannot be arranged symmetrically at the corner, it is advisable to arrange it adjacent to the vicinity of the corner.

Another embodiment of the antenna device of the transmitting / receiving module of the present invention is shown in the perspective view of FIG. In FIG. 3A, a conductor layer pattern 32 of two pairs of conductor wires forming an antenna having a transmission and reception dipole configuration at an angle of about 90 degrees,
33, 34, and 35, and are disposed close to each other along two sides 37, 38, 39, and 40 of two corners of the diagonal arrangement of the module substrate 36. A resin-molded large-scale integrated circuit 42 having terminals 41 extending outward is disposed at the center of the module substrate 36. Conductor layer patterns 32, 33 and 34, 35 of paired conductor wires
Is the side 3 of the large-scale integrated circuit 42 and the module substrate 36
Arranged between 7, 38 and 39, 40, the module substrate 36 is reduced in size.

Conductor layer patterns 32, 3 of paired conductor wires
3 and 34 and 35 are arranged between the multilayer dielectric plates 43 and 44. In addition, the conductor layer pattern 3 of the pair of conductor wires
2, 33 and 34 and 35 are feeding ends 45, 46 and 4
7 is formed so as to extend in a non-parallel manner from a feeding end not shown and not shown, and is connected to the output terminals 48 and 49 and the input terminal 50 of the RF transceiver of the large scale integrated circuit 42 and other input terminals not shown hidden and shown. Is done. The output terminals 48 and 49, the input terminal 50, and the other input terminals are connected to the large scale integrated circuit 42.
It may be arranged symmetrically on the sides 51, 52 and 53, 54 of the two corners. Terminal 4 extending out of large-scale integrated circuit 42
Bonding terminals 55 for connecting the conductor layer pattern continuous from 1 to the outside are formed on the sides 37, 38 and 39, 40 of the module substrate 36.

In FIG. 3B, a large-scale integrated circuit 56 which is resin-molded and has terminals on the lower surface is mounted on the module substrate 5.
7 is located at the center. Two pairs of conductor wires 58,
59 and 60 and 61 are arranged between the large-scale integrated circuit 56 and the sides 62, 63 and 64 and 65 of the module substrate 57. Since no terminals are exposed outside from the side of the large-scale integrated circuit 56, the module substrate 57 can be easily reduced in size to some extent. However, it is assumed that a dipole antenna composed of the paired conductor wires 58, 59 and 60, 61 is shortened by a plurality of dielectric plates 66, 67 in a corresponding frequency band.

FIG. 4 is a sectional view of the embodiment of the present invention shown in FIG. In FIG. 4A, a plurality of conductor layer patterns 73 and 74 continuous from terminals 69 and 70 extending outward from a large-scale integrated circuit 68 via via holes 71 and 72 are used to connect two sets of dipole antennas. The conductor layer patterns 75 and 76, which are one of the paired conductor wires to be formed, are arranged to intersect with a lower dielectric plate 77 interposed therebetween. Conductive layer patterns 75, 7 forming part of a dipole antenna
The antenna length of the lower dielectric plate 77 and the upper dielectric plate 7
8 and shortened. Outer terminal 69,
Joint terminals 79 and 80 of a plurality of conductor layer patterns 73 and 74 continuing from 70 are provided on the side of the module substrate 81. Outer terminals 69 and 70 are connected to module substrate 8.
1 are connected to the terminals 82 and 83 provided on the first terminal.

In FIG. 4B, the joining terminals 84 and 85 are provided on the side of the dielectric plate 87 below the module substrate 86. In FIG. 4C, bonding terminals 90 and 91 are formed on a surface of the module substrate 89 opposite to the surface on which the large-scale integrated circuit 88 is provided. In order to reduce the influence on the antenna characteristics, FIGS.
In the order of (c), one conductor wire pattern 75, 76, and 9 of the paired conductor wire that is the dipole antenna.
2, 93 and 94, 95, large-scale integrated circuits 68, 9
Outer terminals 69, 70 and 9 of 6 and 88
A plurality of conductor layer patterns 73, 74 and 102, 103 and joining terminals 79, 80, 84, 85, and 90, 91 that are continuous from 8, 99, 100, and 101 are kept away from each other to reduce the opposing portions.

One of the conductor layer patterns 75, 76 and 92, 93 and 94, 95 of the pair of conductor wires is
Provided between the large-scale integrated circuits 68, 96 and 88 and the sides 104 of the module substrates 81, 86 and 89, the module substrate can be reduced in size and the multilayer dielectric plates 77 and 78 can be provided.
Similarly, the antenna length is reduced between the antennas 87, 105 and 106, 107.

FIG. 5 is a sectional view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention. This is to reduce the overall thickness including the large-scale integrated circuit. In FIG. 5A, the dielectric plate 1 above the multilayer dielectric plates 108 and 109 is shown.
08 is provided with an opening so that the module substrate 110
A concave portion 111 is formed in the central portion of. The bare chip of the large-scale integrated circuit 112 is fixed in the concave portion 111, and the terminals 113 and 114 of the large-scale integrated circuit 112 and the module substrate 110 are fixed.
The conductive wires 117 and 118 are short-circuited to the terminals 115 and 116 by wire bonding.

Also, one conductor layer pattern 119, 1 of a pair of conductor wires of a dipole antenna connected to an RF transceiver built in the large-scale integrated circuit 112.
Reference numeral 20 is disposed between the dielectric layers 108 and 109 having a plurality of layers. Vias from terminals 115 and 116 to via holes 121 and 122
The bonding terminals 123 and 124 that are electrically continuous through the module substrate 110 are formed on the lower surface of the module substrate 110. Solder balls 125 and 126 are provided and joined to another substrate or the like. Since the large-scale integrated circuit 112 is in a bare chip state, the large-scale integrated circuit 112 includes the conductive wires 117 and 118 and is covered and sealed with a resin material. One of the conductor layer patterns 119 and 120 of the two pairs of conductor wires is arranged between the large-scale integrated circuit 112 and the side of the module substrate 110 and is closely arranged along the side as shown in FIG. The same applies to a). Next Figure 5
The same applies to (b).

In FIG. 5B, a multi-layer dielectric plate 127,
An opening is provided in the dielectric plate 128 below the module substrate 129 formed by 128, and a recess 130 is formed. The bare chip of the large-scale integrated circuit 131 is fixed in the concave portion 130, and the terminals 132 and 133 of the large-scale integrated circuit 131 and the terminals 134 and 135 of the module substrate 129 are short-circuited by the conductive wires 136 and 137. One of the conductor layer patterns 138 and 139 of the two pairs of conductor wires is arranged between the multilayer dielectric plates 127 and 128. Since the joining terminal is also used as the terminals 134 and 135, the number of layers forming the terminal is small, and the connecting via hole is not required except for connecting to the conductor pattern of the pair of conductor wires.
The configuration is simpler than that of the module substrate 110 of FIG. The large-scale integrated circuit 131 is in a bare chip state,
After being covered with a resin material, bonding may be performed with solder balls 140 and 141 provided on bonding terminals that also serve as terminals 134 and 135, or after bonding, a resin material may be permeated and sealed.

In FIG. 5, the concave portions 111 and 130 are provided in the module substrates 110 and 129. However, as shown in FIG.
When the bare chip is arranged, it is not always necessary to provide the concave portion 111. However, when the bare chip of the large-scale integrated circuit 131 is arranged on the same side as the joint terminals serving also as the terminals 134 and 135 as shown in FIG.
It is necessary to provide 30. 5A and 5B, the thickness can be as thin as about 2 mm.

FIG. 6 is a sectional view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention. Similarly, the overall thickness including the large-scale integrated circuit is reduced. FIG.
(A) shows a terminal 14 which is resin-molded and extends outward.
A large-scale integrated circuit 144 having 2,143 is used. A through hole 148 is formed in a module substrate 147 composed of a plurality of dielectric plates 145 and 146. This through hole 1
48, a large-scale integrated circuit 144 is arranged, and a plurality of terminals 151, 15 of a module substrate 147 partially continuous with one conductor layer pattern 149, 150 of two pairs of conductor wires.
2, a terminal 142 extending outward from the large-scale integrated circuit 144;
143 is directly bonded and fixed. One conductor layer pattern 1 of two pairs of conductor wires of a dipole antenna
Reference numerals 49 and 150 are disposed so as to be covered between the dielectric plates 145 and 146 having a plurality of layers. The terminals 142 and 143 protruding outward from the large-scale integrated circuit 144 also serve as bonding terminals for bonding to another substrate or the like.

The fact that the number of via holes and conductor layer patterns can be reduced and the length can be reduced is that one of the conductor layer patterns 149, 1
The influence on the antenna characteristics of an antenna having a dipole configuration composed of 50 or the like can be reduced. Module board 147 on which large-scale integrated circuit 144 of general shape is mounted
It is also advantageous in terms of its own reliability and cost. However,
It is likely that the dimensions will be slightly larger than those of bare chips.

In FIG. 6B, a large-scale integrated circuit 153 of a bare chip is used. A through hole 157 is formed in a module substrate 156 composed of a plurality of dielectric plates 154 and 155. The large-scale integrated circuit 153 is disposed in the through hole 157, and the terminals 158 and 159 of the large-scale integrated circuit 153 and the terminals 160 and 161 of the module substrate 156 are short-circuited by the conductive wires 162 and 163. One conductor layer pattern 1 of two pairs of conductor wires of a dipole antenna
The reference numerals 64 and 165 are disposed so as to be covered between the dielectric layers 154 and 155 of the multilayer structure. Terminal 16 of module substrate 156
Reference numerals 0 and 161 also serve as bonding terminals for bonding to another substrate or the like.
At the time of joining, the terminals 160 of the module substrate 156,
161 are provided with solder balls 166 and 167.

Since the large-scale integrated circuit 153 is used as a bare chip, the size of the module substrate can be reduced. However, one of the conductor layer patterns 164 and 165 constituting two sets of dipole antennas is shortened by the dielectric plates 154 and 155. It is also determined by the degree that can be made. The thickness can be as thin as 2 millimeters. The sealing resin may be injected from the through hole 157.

6A and 6B, the conductor layer patterns of the paired conductors constituting the dipole antenna are large scale integrated circuits 144 and 153 and module substrates 147 and 156. Are similarly arranged along the individual sides between the sides. Further, as is common to the antenna device of the transmitting / receiving module of the present invention, when forming the module substrate, the thickness of the conductor layer pattern of the pair of conductor wires forming the dipole antenna is made as large as possible. In addition, by reducing the resistance, it is possible to increase the specific bandwidth of the antenna characteristics and improve the efficiency. For example,
The conductor layer may be formed by printing a plurality of times, or a step such as plating may be added in some cases.

The antenna device of the transmission / reception module of the present invention is a balanced system because it is a dipole antenna.
Also, select the antenna length to resonate at half wavelength,
Make the impedance about 50 ohms. In order to reduce the reflection and improve the antenna efficiency, it is necessary to interpose a balanced-unbalanced converter and use a balanced-unbalanced converter having an impedance conversion ratio of 1: 1. The incorporation of a balanced-unbalanced converter in a large-scale integrated circuit having a built-in RF transceiver circuit or the like is advantageous in reducing the size of the module substrate and reducing the mounting process load. If not, it is necessary to arrange and connect a balun chip, which is a parallel-unbalanced converter, between the large-scale integrated circuit and the feeding end of the dipole antenna.

When the antenna device of the transmitting / receiving module of the present invention is applied to the 2.4 GHz band, which is the Bluetooth standard for short-range communication, a bandwidth of about 5% can be obtained, and the requirement of about 3.3% is satisfied. Can respond. In addition, since the conductor wires of the pair configuration of the dipole antenna are arranged at an angle of about 90 degrees, compared with the dipole configuration of the dipole configuration arranged in parallel, the directional characteristics of the eyebrows are broader. Become.

The antenna device of the transmission / reception module of the present invention was incorporated in a digital device, and the case where the head, head and hand, or the hand was approached or gripped was compared with the case of the free state. When the changes in the fractional bandwidth and its center frequency are measured, they all fall within a small change within 1%. The antenna device of the present invention has a practically stable frequency band and a wide fractional bandwidth.

In the Bluetooth standard for short-range wireless communication, it is necessary to reduce transmission power as much as possible, and an efficient antenna device is required. If the efficiency is good, the output can naturally be suppressed. Since the antenna device of the transmitting / receiving module of the present invention has a dipole antenna, the antenna length is shortened, and the efficiency is relatively high even if the paired conductor wires are arranged non-parallel. Further, as shown in the embodiment of the present invention, by using two transmission and reception antennas exclusively, a transmission / reception module with low loss can be realized.

The Bluetooth standard includes portable digital devices. Some current portable computers and digital still cameras use a metal housing. Alternatively, a metal-plated resin may be used. In that case, the antenna device cannot simply be built in the housing. In addition, it is considered that there is no effective method other than taking out the conventional antenna device. The antenna device of the transmission / reception module of the present invention can be configured to be able to cope with a metal housing without deteriorating antenna characteristics and without protruding from the housing.

FIG. 7 shows a state where the antenna device of the transmitting / receiving module of the present invention is mounted on a metal casing. When a digital device using the metal housing 168 incorporates the antenna device 169 of the transmission / reception module of the present invention and is used, the housing 168 is provided with an opening 170. The two antennas having the dipole configuration constituted by the conductor layer patterns 171, 172 and 173, 174 of the conductor wires of the pair configuration have the opening 1.
70 and are arranged without protruding parallel to the surface of the metal housing 168. When measuring the influence of the metal housing 168 as a 2.4 GHz band antenna device, the conductor layer pattern 1 of the conductor wire paired with the edge 175 of the opening 170 is shown.
With a spacing of 3 millimeters from the outside edges of 71, 172 and 173, 174, the shift of the center frequency is within 50 MHz. If possible, the change can be suppressed by not disposing the conductor layer patterns 171, 172 and 173, 174 of the paired conductor wires and the edge 175 of the metal housing 168 in parallel.

[0055]

Since the antenna device of the present invention is configured as described above, it has the following advantages.

A small-sized module on which a large-scale integrated circuit including an antenna device, an RF transceiver circuit, and the like is mounted can be provided. Further, the thickness can be reduced to about 2 mm.

A module having an antenna device having a relatively wide specific bandwidth and directivity, not requiring a ground plane, and having stable characteristics is possible.

An antenna device that can support short-range wireless communication such as the Bluetooth standard and does not protrude even with a metal housing is possible.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an antenna device of a transmission / reception module of the present invention.

FIG. 2 is a perspective view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 3 is a perspective view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 4 is a sectional view of an embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 5 is a sectional view of another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 6 is a sectional view of another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 7 is an example of mounting the transmitting / receiving module of the present invention on a metal housing of the antenna device.

FIG. 8 shows a conventional antenna device formed with a conductor pattern on a resin substrate.

[Explanation of symbols]

4, 13, 169 Antenna device of transmitting / receiving module 5, 6, 32, 33, 34, 35, 58, 59, 60,
61, 75, 76, 92, 93, 94, 95, 119,
120, 138, 139, 149, 150, 164, 1
65, 171, 172, 173, 174 pairs of conductor layer patterns of conductor lines 7, 8, 43, 44, 66, 67, 77, 78, 87,
105, 106, 107, 108, 109, 127, 1
28, 145, 146, 154, 155 Dielectric plate 9, 17, 36, 57, 81, 86, 89, 110, 1
29, 147, 156 module board 10, 11, 18, 19, 37, 38, 39, 40, 6
2, 63, 64, 65, 104 Sides 12, 16, 42, 56, 68, 88, 96, 112,
131, 144, 153 Large-scale integrated circuits 14, 15 Conductor layer patterns 20, 23, 45, 46, 47 of meander-shaped pairs of conductor wires Feeding ends 24, 25, 26, 27, 41, 69 , 70, 98, 9
9, 100, 101, 142, 143 Outwardly extending terminals 28, 29, 30, 31, 51, 52, 53, 54
Side 48, 49 Output terminal 50 Input terminal 55, 79, 80, 84, 85, 90, 91, 123,
124 Joint terminals 71, 72121, 122 Via holes 73, 74, 102, 103 Plural conductor layer patterns 111, 130 Recesses 113, 114, 132, 133, 158, 159
Terminals of large scale integrated circuit 115, 116, 134, 135, 151, 152, 1
Terminals of module boards 60, 161 117, 118, 136, 137, 162, 163
Conductive wires 125, 126, 166, 167 Solder balls 148, 157 Through holes 168 Metal casing

Continued on the front page F term (reference) 5J046 AA03 AA07 AA12 AB07 PA04 PA07 QA02 5J047 AA03 AA07 AA12 AB07 FD01 FD06 5K011 AA01 AA06 BA10 DA02 JA01 JA03 JA12 KA18

Claims (16)

[Claims] 1. An antenna used for wireless communication, wherein a dipole antenna is formed by a pair of conductor wires having a feed end in the center, and a rectangular module substrate on which a large-scale integrated circuit having a built-in RF transceiver is mounted. Using a multi-layer dielectric plate, the conductor layer pattern of the paired conductor lines is positioned between two sides of a rectangular corner between the multi-layer dielectric plate and the large-scale integrated circuit. An antenna device for a transmission / reception module, wherein the antenna device is arranged close to two side edges. 2. An antenna used for wireless communication, wherein said conductor layer patterns of two pairs of said conductor wires, which are antennas of a transmission and reception dipole configuration, are arranged in a diagonal arrangement of said rectangular module substrate. 2. The antenna device for a transmission / reception module according to claim 1, wherein the antenna device is arranged so as to be closely arranged along two sides of each of the corner portions. 3. The antenna device for a transmission / reception module according to claim 1, wherein in the antenna used for wireless communication, the pair of conductor lines is formed by a linear conductor layer pattern. 4. The antenna device for a transmission / reception module according to claim 1, wherein in the antenna used for wireless communication, the pair of conductor wires is formed by a meander-shaped conductor layer pattern. 5. The antenna device for a transmission / reception module according to claim 1, wherein an alumina plate is used as the dielectric plate in an antenna used for wireless communication. 6. An antenna for a transmission / reception module according to claim 1, wherein an antenna used for wireless communication has a configuration in which the vicinity of a feeding end of said pair of conductor wires is extended in a non-parallel manner. apparatus. 7. An antenna used for wireless communication, wherein two terminals of symmetrically arranged two sides of a corner of the large-scale integrated circuit are connected to a feeding end of the pair of conductor wires. The antenna device for a transmission / reception module according to claim 1, wherein: 8. An antenna used for wireless communication, wherein a plurality of conductor layer patterns continuous from terminals of the large-scale integrated circuit intersect with the conductor patterns of the paired conductor lines via the dielectric plate. The antenna device for a transmission / reception module according to claim 1, wherein the antenna device is arranged. 9. An antenna used for wireless communication, wherein the large-scale integrated circuit is fixed to a concave portion provided on the module substrate made of a multilayer dielectric plate, and a terminal of the large-scale integrated circuit is connected to the module substrate. 8. The antenna device for a transmission / reception module according to claim 1, wherein a conductive wire is short-circuited to a terminal provided on the surface of the transmission / reception module. 10. An antenna used for wireless communication, wherein the large-scale integrated circuit is disposed in a through hole formed in the module substrate, and a terminal of the large-scale integrated circuit is connected to a terminal provided on a surface of the module substrate. The antenna device for a transmission / reception module according to claim 1, wherein the conductive wire is configured to be short-circuited. 11. An antenna used for wireless communication, wherein joint terminals for connecting to the outside of a plurality of the conductor layer patterns continuous from terminals of the large-scale integrated circuit are provided on a side of the module substrate. Claims 8 and 9
11. The antenna device of the transmitting / receiving module according to claim 10. 12. An antenna used for wireless communication, wherein a joint terminal for connecting to the outside of the plurality of conductor layer patterns continuous from a terminal of the large-scale integrated circuit is provided on a side of the dielectric plate below the module substrate. The antenna device of the transmission / reception module according to claim 8, wherein the antenna device is provided in the antenna. 13. An antenna used for wireless communication, wherein a plurality of conductor layer patterns continuous from terminals of the large-scale integrated circuit are provided on a surface of the module substrate opposite to a surface on which the large-scale integrated circuit is provided, 11. The antenna device for a transmitting / receiving module according to claim 8, wherein a bonding terminal of a solder bump is provided. 14. The transmission / reception according to claim 9, wherein in the antenna used for wireless communication, a plurality of bonding terminals of solder bumps are provided on a surface of the module substrate having the terminals to be wire-bonded. Module antenna device. 15. An antenna used for wireless communication, wherein the large-scale integrated circuit is disposed in a through hole formed in the module substrate, and the large-scale integrated circuit is disposed on a surface of the module substrate that is continuous with a feed end of the pair of conductor wires. The provided terminal and a part of the terminal protruding outward of the large-scale integrated circuit with the resin-molded outward protruding terminal are directly joined, and the terminal protruding outward is further joined to the joining terminal. The antenna device for a transmission / reception module according to claim 1, wherein: 16. An antenna used for wireless communication, wherein an opening is formed in a part of a metal housing, and the pair of conductor wires are substantially parallel to a surface of the housing inside the opening. The antenna device for a transmission / reception module according to any one of claims 1 to 15, wherein: