JP2001196827A - Antenna device for transmission/reception module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transmission/reception module on which an antenna device, an RF transceiver, etc., which are small is size, stable in characteristic and can deal with short-range radio communication, are mounted. SOLUTION: Conductors of pair constitution being the antenna of dipole configuration are formed with conductor layer patterns and arranged adjacently along two side edges of a rectangle on a module substrate consisting of a dielectric plate of a large dielectric constant to constituted the module for short range radio mounting an incorporated large scale integrated circuit such as the RF transceiver in a center part. In order to reduce a thickness, a through hole part is bored at the module substrate according to need to arrange the large scale integrated circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna used for a short-range wireless device, and more particularly to an antenna device of a transmitting / receiving module which is modularized with a circuit having an RF transceiver.

[0002]

2. Description of the Related Art In general, antennas used in conventional portable radio equipment include a whip antenna and a helical antenna projecting out of a housing, and an inverted F-type antenna and a chip antenna incorporated therein.

As shown in FIG. 9, (COMDEX / Fal
(Digitalswer A / S exhibition at 1'99, or described in Nikkei Electronics No. 12-13, 1999), an antenna device of a transmitting / receiving module in which an inverted F-shaped antenna or an L-shaped antenna is formed on a resin substrate 1 by a conductor layer pattern 2 There is. Since the ground base plate 3 is required, there is a limit to downsizing, and the characteristics become unstable when the ground base plate has a small area.

[0004] When used in portable radio equipment, the above-mentioned conventional antenna has a large change in gain, directivity and fractional bandwidth depending on whether or not a human body approaches. The smaller the helical antenna or the chip antenna, the lower the gain and the smaller the specific bandwidth. Further, the width of the directional characteristics is insufficient for use in portable wireless devices or the like limited to transmission and reception within a certain distance.

Further, when a transmitting / receiving module is built in, such as a portable notebook personal computer or a digital still camera, an antenna that can be used in a metal housing without protruding is required, but the conventional antenna cannot cope with it.

[0006]

There is a need for a small, thin module that integrates an RF transceiver and antenna that can also be used in portable radio equipment. In addition, the gain is high, the relative bandwidth and the directional characteristics are wide, the influence of the proximity of the human body is small, and a metal housing can be built in and used.

[0007]

According to the present invention, there is provided an antenna apparatus for a transmission / reception module in which a dipole antenna is formed by a pair of conductor wires having a feed end at the center for stable antenna characteristics. The lines are formed in a conductor layer pattern to be arranged on the dielectric plate constituting the module substrate.

When the size of the module substrate is reduced, a large-scale integrated circuit containing at least the circuit of the RF transceiver is arranged at the center of the module substrate. The main object is to mount one chip of a large-scale integrated circuit. However, even in the case of two chips, the conductor layer pattern forming the antenna of the dipole configuration is arranged at the center and the side of the large-scale integrated circuit and the module substrate Place between

A pair of conductor wires is formed in close contact with a dielectric plate having a large relative permittivity, and the length of the antenna composed of the pair of conductor wires is physically shortened in a free space. .

For the purpose of widening the directivity characteristics of the antenna and reducing the size of the module substrate, the conductor layer pattern of the paired conductor wires is placed at a position between the large-scale integrated circuit and the side of the rectangular module substrate. Then, they are arranged close to each other along two sides of the corner.

In order to reduce the antenna loss, two pairs of antennas having a dipole configuration for transmission and reception are used, and two pairs of conductor wires having a pair configuration are provided for the purpose of reducing the difference between the directional characteristics of the antennas and the size of the module substrate. Are arranged close to each other along two sides of two corners of a rectangular diagonal arrangement.

The conductor layer pattern of the pair of conductor wires is made linear or meandering. Any one may be selected to reduce the size of the module substrate.

In order to shorten the antenna length and reduce the size of the module substrate, a dielectric plate on which a conductor layer pattern of a pair of conductor wires is formed is made of a general-purpose ceramic having a relative dielectric constant of about 9.0. A plate is used, and the thickness of each of the alumina plates is preferably about 0.5 to 0.9 mm.

An RF transceiver for a large-scale integrated circuit is provided to reduce the efficiency of a dipole antenna composed of a pair of conductor wires arranged at an angle of about 90 degrees along the sides of the module substrate and to prevent reflection from the antenna. Are arranged in a non-parallel manner from the power supply end connected to the terminal.

The two terminals of the RF transceiver connected to the feeding ends of the paired conductor lines are arranged at symmetrical positions on two sides of the corner of the large-scale integrated circuit, and the paired conductor lines are connected from these terminals. By connecting to the power feeding end of the, the length of the connection is shortened and the symmetry of the arrangement is ensured.

A plurality of conductor layer patterns continuous from the terminals of the large-scale integrated circuit are arranged to intersect with each other via a dielectric plate in order to separate the conductor layer patterns of a pair of conductor wires forming a dipole antenna. I do.

In order to make the whole thin, a bare chip of a large-scale integrated circuit is arranged in a through-hole formed in a module substrate made of a dielectric plate having a large relative dielectric constant, and terminals at a peripheral portion of the chip of the large-scale integrated circuit are provided. Then, the conductive wire is short-circuited to the terminal provided on the surface of the module substrate by wire bonding.

In order to join to an external substrate or the like, a plurality of joining terminals continuous from the terminals of the large-scale integrated circuit are provided on the side of the module substrate. Alternatively, in order to reduce the effect on the antenna, solder the joint terminals of a plurality of conductor layer patterns that are continuous from the terminals of the large-scale integrated circuit to the surface of the module substrate opposite to the surface on which the large-scale integrated circuit is provided. It may be formed by adding a bump.

For the purpose of reducing the overall size, the terminals are short-circuited with conductive wires from a large-scale integrated circuit arranged in the through-hole portion of the module substrate to form a joint terminal with a solder bump added to the module substrate. .

For the purpose of simplifying the whole structure, a large-scale integrated circuit of resin mold is arranged in the through hole of the module substrate, and the outwardly extending terminals are directly joined to the terminals provided on the surface of the module substrate. Further, the terminal protruding outward is referred to as a joining terminal.

In order to consolidate into one module board having a small size, two large-scale integrated circuits having resin-molded outwardly-extending terminals are arranged in the through holes of the module board or at positions corresponding thereto. The terminals protruding outward are directly bonded to the terminals provided on both sides of the module substrate, and the terminals protruding outward on the lower surface of the module substrate are defined as bonding terminals.

For the same purpose, a large-scale integrated circuit of a bare chip is arranged in a through portion of the module substrate, and a large-scale integrated circuit having a resin-molded terminal extending outward is provided at a position corresponding to the through-hole portion. The terminal protruding outward is directly joined to the terminal on the upper surface of the module substrate, and the terminal of the bare chip and the terminal on the lower surface of the module substrate are short-circuited by a conductive wire.

In order to widen the relative bandwidth of antenna characteristics, solder metal is directly thickened on the conductor layer pattern of the pair of conductor wires provided in close contact with a dielectric plate having a large relative permittivity of the module substrate. .

When a wireless module is mounted on a portable computer or digital still camera having a metal housing as a mobile wireless device, a dipole formed with a pair of conductor wires by forming an opening in a part of the metal housing. A module substrate having an antenna having the above configuration is arranged inside the opening and parallel to the surface of the housing.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described based on examples with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an antenna device 4 of a transmitting / receiving module according to the present invention. A pair of conductor wires, which are dipole antennas, are formed by conductor layer patterns 5 and 6, and are arranged on a module substrate 7 composed of a dielectric plate having a large relative permittivity. The conductor layer patterns 5 and 6 of the paired conductor wires are arranged at an angle of about 90 degrees, and are arranged close to each other along the two sides 8 and 9 of the corners of the rectangular module substrate 7.

The short-range wireless circuit of the Bluetooth standard is composed of circuits such as baseband processing and an RF transceiver. Since the minimum receiving sensitivity is set as high as -70 dBm with a small output, it can be constituted by one large-scale integrated circuit chip. In the embodiment shown in FIG. 1, a large-scale integrated circuit 10 of one chip is mounted on a module substrate 7.

The reason why the conductor layer patterns 5 and 6 of the paired conductor wires are used to form a dipole antenna is that the dipole antenna is a complete antenna, and does not require any other configuration such as a ground plane. A wide ratio bandwidth and stable characteristics can be obtained. Since the antenna device 4 of the transmission / reception module of the present invention is intended to be used also for an antenna of a mobile phone or a portable digital device, it is important that the characteristic change of the antenna due to the presence or absence of a human body is small. When large reflections from the antenna on the RF transceiver occur, the large-scale integrated circuit 10
Stable operation is hindered. Further, in order to reduce the size of the module substrate, it is necessary to eliminate the ground plate.

The antenna length can be reduced as compared with free space by closely attaching the conductor layer patterns 5 and 6 of the paired conductor wires to the module substrate 7 of a dielectric plate having a large relative permittivity. When the whole is covered, the physical length, which is simply the antenna length of the conductor line patterns 5 and 6, is 2 as the relative permittivity.
Although it is inversely proportional to a power of one, only one side is in close contact with a dielectric plate having a large relative dielectric constant, and thus the degree of shortening is reduced. Further, there is a difference in the degree of shortening depending on the thickness of the dielectric plate. Therefore, in order to shorten the antenna length, a ceramic plate having a large relative dielectric constant is used instead of a resin substrate having a small relative dielectric constant.

It is preferable to use an alumina plate, which is a kind of ceramic, as the dielectric plate on which the module substrate 7 is formed and the conductor layer patterns 5 and 6 of the paired conductor wires are disposed thereon. Alumina has a relatively large relative dielectric constant of 9.0 and can be generally said of ceramics. However, if the composition is selected, the value of the relative dielectric constant can be specified, the variation in the relative dielectric constant is small, and the loss coefficient is small. A small variation in the relative permittivity has a small shift in the frequency band of the antenna, and a small loss coefficient is advantageous for the antenna efficiency. Alumina is used as a general-purpose product in ceramics, and has a higher relative dielectric constant and less variation than resin materials. In addition, it is excellent in heat resistance, and the occurrence of defects in the terminal junction due to thermal stress when attaching the chip of the large-scale integrated circuit 11 is small.

The conductor patterns 5 and 6 of the pair of conductor wires are set to 9
Arranging them at an angle of about 0 degrees can reduce the size of the module substrate 7 as compared with a dipole antenna in which the conductor wires of the pair are arranged on the same straight line, and at the same time increase the directivity to some extent. It is advantageous. This is because narrow directionality is a problem when a direction and a position cannot be specified as in the case of a portable wireless device and an application range of wireless communication is limited.

As shown in the embodiment of FIG. 1, the conductor layer patterns 5, 6 of the paired conductor wires are arranged on the module substrate 7 of the dielectric plate, and at the same time, the large-scale integrated circuit 10 is formed.
By arranging the module board 7 in a relatively narrow range between the two sides 8 and 9 of the module board 7, the area and dimensions of the module board 7 can be reduced. The conductor layer patterns 5, 6 of the pair of conductor wires are formed substantially linearly.

As shown in the perspective view of the embodiment of the antenna device 11 of the transmitting / receiving module of the present invention shown in FIG. 2, the meandering conductor patterns 12 and 13 of the paired conductor wires are composed of the large-scale integrated circuit 14 and the dielectric plate. Side 1 of module substrate 15
When formed in the range between 6 and 17, it is advantageous for shortening the antenna length, but the width becomes large. Which of the conductor layer patterns should be selected may be determined based on the balance between the characteristics of the antenna and the dimensions of the module substrate.

As shown in the embodiment of FIGS. 1 and 2, conductor layer patterns 5, 6 of a pair of conductor lines forming an antenna having a dipole structure connected to the circuits of the RF transceivers of the large scale integrated circuits 10 and 14. And 12 and 13 are arranged so as to extend non-parallel from the feeding ends 18 and 19 and 20 and 21. It may be spread in a straight line or in an arc. This is because, if simply formed in parallel, the bent portion becomes an acute angle and reflection is likely to occur, and the parallel portion does not contribute to radiation at all. Here, forming parallel means that a part of the shape of the conductor pattern is arranged in the corner direction along the diagonal line.

The feeding ends 18, 19 and 2 of the conductor layer patterns 5, 6 and 12, 13 of the paired conductor wires are also provided.
Outgoing terminals 22 from the circuits of the RF transceivers of the large scale integrated circuits 10 and 14 connected to 0, 21;
23 and 24, 25 are corner sides 26, 27 and 2
By disposing them symmetrically at 8, 29, the length required for connection can be shortened, and the symmetry can be maintained. If it cannot be arranged symmetrically at the corner, it is advisable to arrange it adjacent to the vicinity of the corner.

An electric circuit chip such as a capacitor or a balun chip other than the large scale integrated circuits 10 and 14 shown in FIGS. 1 and 2 on which only the RF transceiver circuit or a baseband processing circuit is mounted is mounted on the module substrates 7 and 15. May be arranged.

Another embodiment of the antenna device of the transmitting / receiving module of the present invention is shown in the perspective view of FIG. In FIG. 3A, a conductor layer pattern 30 of two pairs of conductor wires forming an antenna having a transmission and reception dipole configuration at an angle of about 90 degrees,
31 and 32, 33, each side 3 of two corners of the diagonal arrangement of the module substrate 34 of the dielectric plate.
5, 36 and 37, 38 are located close together. A resin-molded large-scale integrated circuit 40 having terminals 39 extending outward is disposed at the center of the module substrate 34. The conductor layer patterns 30, 31 and 32, 33 of the pair of conductor wires are composed of the large-scale integrated circuit 40 and the module substrate 3.
4 between the sides 35, 36 and 37, 38,
The module substrate 34 is reduced in size.

The conductor layer patterns 30, 3 of the pair of conductor wires
1 and 32 and 33 are arranged on a module substrate 34 of a dielectric plate. In addition, the conductor layer patterns 30, 31, 32, and 33 of the paired conductor wires are formed so as to be non-parallel to the power supply ends 41, 42, and 43 from the power supply ends, which are hidden and not shown, and form the large-scale integrated circuit 40. The output terminals 44 and 45 and the input terminal 46 of the RF transceiver are connected to other input terminals which are hidden and not shown. Output terminals 44, 4
5, an input terminal 46 and other input terminals are a large-scale integrated circuit 40.
Are preferably arranged symmetrically on the side portions 47, 48 and 49, 50 of the two corners. Bonding terminals 51 for connecting a plurality of continuous conductor layer patterns to the outside from a plurality of outwardly extending terminals 39 of the large-scale integrated circuit 40 are formed on the sides 35, 36 and 37, 38 of the module substrate 34. .

In FIG. 3B, a large-scale integrated circuit 52 which is resin-molded and has terminals on the lower surface is arranged at the center of a module substrate 53 of a dielectric plate. The two pairs of conductor wires 54, 55 and 56, 57 form a large scale integrated circuit 52.
And sides 58, 59 and 60, 6 of module substrate 53
1 between. Since no terminal is exposed outside from the side of the large-scale integrated circuit 52, the module substrate 53 can be easily reduced in size to some extent. However, the conductor wire 5 of the pair configuration
It is assumed that the antenna length is shortened by the dielectric plate having a large relative dielectric constant of the module substrate 53 in the frequency band corresponding to the dipole antenna composed of 4, 55, 56 and 57. Instead of being sealed in the large-scale integrated circuit 52 with resin, the bare chip may be bonded to terminals formed on the module substrate 53 by wire bonding or solder balls, and then sealed with resin.

The embodiment of the present invention shown in FIG. 2 is shown in a sectional view of FIG. In FIG. 4A, a plurality of conductor layer patterns 67, 68 continuous from terminals 63, 64 extending outward from a large-scale integrated circuit 62 via via holes 65, 66 are connected to two sets of dipole antennas. The conductor layer patterns 69 and 70 which are one of the paired conductor wires to be formed are arranged so as to intersect with each other with a module board 71 of a dielectric plate interposed therebetween.
The antenna length of the conductor layer patterns 69 and 70 forming a part of the dipole antenna is placed on the module substrate 71 of a dielectric plate having a large relative permittivity and is shortened.
The joining terminals 72, 73 of the plurality of conductor layer patterns 67, 68 continuing from the terminals 63, 64 extending outward are provided on the side of the module substrate 71. Outer terminal 63
64 denotes terminals 74, 75 provided on the module substrate 71.
Joined to.

In FIG. 4B, bonding terminals 78 and 79 are formed on the surface of the dielectric plate opposite to the surface on which the large-scale integrated circuit 76 is provided. In order to reduce the influence on the antenna characteristics, FIGS. 4 (a) and 4 (b)
, Conductor wire patterns 69, 70 and 80, 81 of one of the paired conductor wires, which is an antenna having a dipole structure.
Are connected to a plurality of conductor layer patterns 67, 68 and bonding terminals 72, 73, 78 continuous from the terminals 63, 64, 82, 83 extending outward from the large scale integrated circuits 62, 76.
79 are kept away from each other to reduce the opposing portions.

The conductor layer patterns 69, 70 and 80, 81 of one of the paired conductor wires are connected to the large-scale integrated circuit 6.
2, 76 and the module boards 71 and 77 are provided between the side faces of the module boards 71 and 77;
Similarly, the antenna length is shortened by disposing the module substrates 71 and 77 on a dielectric plate having a large relative permittivity.

FIG. 5 is a sectional view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention. This is to reduce the overall thickness including the large-scale integrated circuit. In FIG. 5A, a large-scale integrated circuit 86 having terminals 84 and 85 which are resin-molded and project outward is used. A through hole 88 is formed in a module substrate 87 made of a dielectric plate. A large-scale integrated circuit 86 is disposed in the through-hole portion 88, and the plurality of terminals 91 and 92 of the module substrate 87 partially connected to one of the conductor layer patterns 89 and 90 of the two pairs of conductor wires. The terminals 84 and 85 projecting outward from the scale integrated circuit 86 are directly joined and fixed. One of the conductor layer patterns 89, 90 of the two pairs of conductor wires of the dipole antenna is directly disposed on the module substrate 87 of a dielectric plate.
The terminals 84 and 85 protruding outward from the large-scale integrated circuit 86 also serve as bonding terminals for bonding to another substrate or the like.

The number of via holes and conductor layer patterns can be reduced and the length can be reduced, and the antenna characteristics of a dipole antenna composed of two conductor layer patterns 89 and 90 of two pairs of conductor wires can be reduced. The effect can be reduced. A resin-encapsulated terminal 84 extending outward,
By using a large-scale integrated circuit 86 having a general-purpose shape having 85, the configuration of the module substrate 87 is simple, and the joining is simplified, which is advantageous in reliability and cost. However, there is a high possibility that the size of the module substrate 87 is slightly larger than that of the bare chip.

In FIG. 5B, a large-scale integrated circuit 93 of a bare chip is used. A through-hole portion 95 is formed in a module substrate 94 made of a dielectric plate. The large-scale integrated circuit 93 is arranged in the through-hole 95, and the terminals 96 and 97 of the large-scale integrated circuit 93 and the terminals 98 and 99 of the module board 94 are short-circuited by the conductive wires 100 and 101. One of the conductor layer patterns 102 and 103 of the two pairs of conductor wires of the dipole antenna is a module board 9 of a dielectric plate.
4 above. Terminal 98 of module board 94,
From 99 via the via holes 104 and 105, the joining terminal 1
06 and 107 are continuously provided on the lower surface of the module substrate 94. When joining to another substrate or the like, solder balls 108 and 109 are formed on the joining terminals 106 and 107. After the joining, the large-scale integrated circuit 93 may be sealed with resin.

FIG. 5C also uses a large-scale integrated circuit 110 of a bare chip. However, the orientation of the large-scale integrated circuit 110 is reversed. A through hole 112 is formed in a module substrate 111 made of a dielectric plate. The large-scale integrated circuit 110 is arranged in the through-hole 112, and the terminals 113 and 114 of the large-scale integrated circuit 110 and the terminals 115 and 116 formed on the lower surface of the module substrate 111 are short-circuited by the conductive wires 117 and 118. I do. One conductor layer pattern 1 of two pairs of conductor wires of a dipole antenna
Reference numerals 19 and 120 are arranged on a module substrate 111 of a dielectric plate. The terminals 115 and 116 formed on the lower surface of the module substrate 111 also serve as bonding terminals for bonding to another substrate or the like. In joining, solder balls 121 and 122 are provided on terminals 115 and 116 on the lower surface. After the joining, the large-scale integrated circuit 110 is preferably sealed with resin from above.

In FIG. 5B and FIG. 5C, since the large-scale integrated circuits 93 and 110 are used as bare chips, the size of the module substrate can be reduced. The antenna length of one of the conductor layer patterns 102, 103 and 119, 120 of the conductor wire is changed to the dielectric substrate module substrate 94, 1 having a large relative permittivity.
11 can be shortened. The thickness can be as thin as 2 millimeters. FIG. 5 (a), FIG.
In both cases (b) and FIG. 5 (c), one of the conductor layer patterns 89, 90 and 102, 103, and 1 of the paired conductors constituting the dipole antenna.
19, 120 are large scale integrated circuits 86, 93 and 110
And the module substrates 87 and 94 and 111 are similarly arranged close to each other along the respective sides.

FIG. 6 is a sectional view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention. This is for putting together on a small-sized module substrate. The main circuits used in the Bluetooth standard, which is short-range wireless communication, are a baseband processing circuit and an RF transceiver circuit. Although it is possible to combine them on one chip, it may be separated into two large-scale integrated circuits when the transmission output is increased.

In FIG. 6 (a), terminals 125 and 12 which are resin-molded and extend outward are formed in or above through holes 124 formed in module substrate 123 of a dielectric plate.
Large scale integrated circuit 12 having 6 and 127, 128
9 and 130, and a plurality of outwardly extending terminals 125, 126 and 127, 128 are respectively connected to a plurality of terminals 131, 1, 1 provided on the lower and upper surfaces of the module substrate 123.
32 and 133, 134 directly. Terminals 125 and 126 protruding outward on the lower surface side of module substrate 123
Also serves as a joint terminal. A plurality of outwardly extending terminals 12 for connection to circuits outside the large scale integrated circuit 130
5 and 126 must be shared.

In FIG. 6B, terminals 138 that are resin-molded with bare-chip large-scale integrated circuits 137 are provided at or above the through holes 136 provided in the module substrate 135 of the dielectric plate. , 139 are arranged. Terminals 141 and 142 of large-scale integrated circuit 137 of bare chip and module substrate 135
The terminals 143 and 144 provided on the lower surface of the PDP are short-circuited by conductive wires 145 and 146. Outgoing terminal 13
8 and 139 are directly bonded to terminals 147 and 148 provided on the upper surface of the module substrate 135. Module board 1
It is preferable that the terminals 143 and 144 provided on the lower surface of 35 are used as joining terminals and the solder balls 149 and 150 are formed.

Similarly to the embodiment shown in FIG. 6, one of the conductor layer patterns 151, 152 or 153, 154 of the paired conductor lines forming the dipole antenna is connected to the module board 123 or 135 of the dielectric plate. Provided directly on the large-scale integrated circuit 129, 130 or 1
It is arranged between 37 and 140 and the side of the module substrate 123 or 135.

FIG. 7 shows another embodiment of the antenna device of the transmitting / receiving module of the present invention. The surface of the conductor layer patterns 155, 156 and 157, 158 of the paired conductor wires opposite to the module substrate 159 is directly thickened with solder metal. A plurality of outwardly extending terminals 1 of the large scale integrated circuit 160
It is effective if the thickness of the solder metal is increased in the same process as the solder reflow in joining the terminal 61 to the terminal of the module substrate 159. As is common to the antenna device of the transmitting and receiving module of the present invention, the thickness of the conductor layer pattern of the pair of conductor wires forming the dipole antenna is made as thick as possible, and by reducing the resistance value, It is possible to increase the specific bandwidth of the antenna characteristic and improve the efficiency.

The antenna device of the transmitting / receiving module of the present invention is a balanced system because it is an antenna having a dipole configuration.
Also, select the antenna length to resonate at half wavelength,
Make the impedance about 50 ohms. In order to reduce the reflection and improve the antenna efficiency, it is necessary to interpose a balanced-unbalanced converter and use a balanced-unbalanced converter having an impedance conversion ratio of 1: 1. The incorporation of a balanced-unbalanced converter in a large-scale integrated circuit having a built-in RF transceiver circuit or the like is advantageous in reducing the size of the module substrate and reducing the mounting process load. If not, it is necessary to arrange and connect a balun chip, which is a parallel-unbalanced converter, between the large-scale integrated circuit and the feeding end of the dipole antenna.

When the antenna device of the transmitting / receiving module of the present invention is applied to the 2.4 GHz band, which is the Bluetooth standard for short-range communication, a specific bandwidth of about 5% can be obtained, and the requirement of about 3.3% is achieved. Can respond. In addition, since the conductor wires of the pair configuration of the dipole antenna are arranged at an angle of about 90 degrees, compared with the dipole configuration of the dipole configuration arranged in parallel, the directional characteristics of the eyebrows are broader. Become.

The antenna device of the transmission / reception module of the present invention was incorporated in a digital device, and the case where the head, head and hand, or the hand was approached or gripped was compared with the case of the free state. When the changes in the fractional bandwidth and its center frequency are measured, they all fall within a small change within 1%. The antenna device of the present invention has a practically stable frequency band and a wide fractional bandwidth.

In the Bluetooth standard for short-range wireless communication, it is necessary to reduce transmission power as much as possible, and an efficient antenna device is required. If the efficiency is good, the output can naturally be suppressed. Since the antenna device of the transmitting / receiving module of the present invention has a dipole antenna, the antenna length is shortened, and the efficiency is relatively high even if the paired conductor wires are arranged non-parallel. Further, as shown in the embodiment of the present invention, by using two transmission and reception antennas exclusively, a transmission / reception module with low loss can be realized.

Also, the target of the Bluetooth standard is a portable digital device. Some current portable computers and digital still cameras use a metal housing. Alternatively, a metal-plated resin may be used. In that case, the antenna device cannot simply be built in the housing. In addition, it is considered that there is no effective method other than taking out the conventional antenna device. The antenna device of the transmission / reception module of the present invention can be configured to be able to cope with a metal housing without deteriorating antenna characteristics and without protruding from the housing.

FIG. 8 shows a state in which the antenna device of the transmitting / receiving module of the present invention is mounted on a metal casing. In a case where the antenna device 163 of the transmitting / receiving module of the present invention is incorporated in a digital device using the metal housing 162, the metal housing 162 is provided with an opening 164. Conductor layer patterns 165, 166 and 167, 168 of paired conductor wires
Are set to fit in the opening 164, and are arranged without protruding in parallel with the surface of the metal housing 162. When the influence of the metal housing 162 is measured as a 2.4 GHz band antenna device, the edge 169 of the opening 164 and the outer sides of the conductor layer patterns 165, 166 and 167, 168 of the paired conductor wires are measured. For a spacing of 3 millimeters, the shift of the center frequency is within 50 MHz. If possible, conductor layer patterns 165, 166 and 167, 168 of conductor wires in pairs
And the edge is not arranged in parallel with the edge 169 of the metal housing 162, the change can be suppressed to a small value.

[0058]

Since the antenna device of the present invention is configured as described above, it has the following advantages.

A small-sized module on which a large-scale integrated circuit including an antenna device, an RF transceiver circuit, and the like is mounted can be provided. Further, the thickness can be reduced to about 2 mm.

A module having an antenna device having a relatively wide specific bandwidth and directivity, requiring no ground plane, and having stable characteristics is possible.

An antenna device that can support short-range wireless communication such as the Bluetooth standard and does not protrude even with a metal housing is possible.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an antenna device of a transmission / reception module of the present invention.

FIG. 2 is a perspective view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 3 is a perspective view showing another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 4 is a sectional view of another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 5 is a sectional view of another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 6 is a sectional view of another embodiment of the antenna device of the transmitting / receiving module of the present invention.

FIG. 7 is a perspective view of another embodiment of the antenna device of the transmission / reception module of the present invention.

FIG. 8 is an example of mounting the transmitting / receiving module of the present invention on a metal housing of the antenna device.

FIG. 9 shows a conventional antenna device formed with a conductor pattern on a resin substrate.

[Explanation of symbols]

4, 11, 163 Antenna device of transmission / reception module 5, 6, 30, 31, 32, 33, 54, 55, 56,
57, 69, 70, 80, 81, 89, 90, 102,
103, 119, 120, 151, 152, 153, 1
54, 115, 156, 165, 166, 167, 16
Conductor layer pattern of conductor wire of 8 pairs configuration 7, 15, 32, 53, 71, 77, 87, 94, 11
1, 123, 135, 159 Module substrate of dielectric plate 8, 9, 16, 17, 35, 36, 58, 59 Side 10, 14, 40, 52, 62, 76, 86, 93, 1
29, 130, 137, 140, 160 Large-scale integrated circuit 12, 13 Meander-shaped conductor layer pattern 18, 19, 20, 21, 41, 42 Feeding end 22, 23, 24, 25, 63, 64, 82, 83 , 8
4, 85, 127, 128, 138, 139, 161
Outer terminals 26, 27, 28, 29, 47, 48, 49, 50
Side part 44, 45 Output terminal 46 Input terminal 72, 73, 78, 79, 106, 107 Joint terminal 65, 66 Via hole 67, 68 Plural conductor layer patterns 100, 101, 117, 118, 145, 146
Conductive wires 108, 109, 121, 122, 149, 150
Solder balls 88, 95, 112, 124, 136 Through hole 162 Metal casing

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04B 5/02 H04B 5/02 F term (Reference) 5J021 AA02 AA09 AA11 AB03 CA03 GA01 HA10 JA02 JA07 JA08 5J046 AA04 AA07 AB07 PA07 5J047 AA04 AA07 AB07 FD01 FD06 5K011 AA06 AA16 JA01 JA03 KA18 5K012 AA01 AA05 AA07 AB05 AC01 AC06 AC08 AC10 BA18

Claims (16)

[Claims] 1. An antenna used for wireless communication, wherein a dipole antenna is formed by a pair of conductor wires having a feed end in the center, and a rectangular module substrate on which a large-scale integrated circuit having a built-in RF transceiver is mounted. And a conductor layer pattern of the pair of conductor wires is formed on the dielectric plate at two positions between two sides of a rectangular corner and the large-scale integrated circuit. An antenna device for a transmission / reception module, wherein the antenna device is arranged close to a side. 2. An antenna used for wireless communication, wherein said conductor layer patterns of two pairs of said conductor wires, which are antennas of a transmission and reception dipole configuration, are arranged in a diagonal arrangement of said rectangular module substrate. 2. The antenna device for a transmission / reception module according to claim 1, wherein the antenna device is arranged so as to be closely arranged along two sides of each of the corner portions. 3. The antenna device for a transmission / reception module according to claim 1, wherein in the antenna used for wireless communication, the pair of conductor lines is formed by a linear conductor layer pattern. 4. The antenna device for a transmission / reception module according to claim 1, wherein in the antenna used for wireless communication, the pair of conductor wires is formed by a meander-shaped conductor layer pattern. 5. The antenna device for a transmission / reception module according to claim 1, wherein an alumina plate is used as the dielectric plate in an antenna used for wireless communication. 6. An antenna for a transmission / reception module according to claim 1, wherein an antenna used for wireless communication has a configuration in which the vicinity of a feeding end of said pair of conductor wires is extended in a non-parallel manner. apparatus. 7. An antenna used for wireless communication, wherein two terminals of symmetrically arranged two sides of a corner of the large-scale integrated circuit are connected to a feeding end of the pair of conductor wires. The antenna device for a transmission / reception module according to claim 1, wherein: 8. An antenna used for wireless communication, wherein a plurality of conductor layer patterns continuous from terminals of the large-scale integrated circuit intersect with the conductor patterns of the paired conductor lines via the dielectric plate. The antenna device for a transmission / reception module according to claim 1, wherein the antenna device is arranged. 9. An antenna used for wireless communication, wherein the large-scale integrated circuit is disposed in a through-hole formed in the module substrate, and a terminal of the large-scale integrated circuit is connected to a terminal provided on a surface of the module substrate. The antenna device for a transmission / reception module according to claim 1, wherein the conductive wire is configured to be short-circuited. 10. An antenna used for wireless communication, wherein joint terminals for connecting to the outside of the plurality of conductor layer patterns continuous from the terminals of the large-scale integrated circuit are provided on the sides of the module substrate. Claims 8 and 9
An antenna device of the transmitting / receiving module according to any one of the preceding claims. 11. An antenna used for wireless communication, wherein a plurality of conductor layer patterns continuous from terminals of the large-scale integrated circuit are provided on a surface of the module substrate opposite to a surface on which the large-scale integrated circuit is provided, 10. The antenna device for a transmission / reception module according to claim 8, further comprising a solder bump connection terminal. 12. The transmitting / receiving module according to claim 9, wherein in the antenna used for wireless communication, a plurality of bonding terminals of solder bumps are provided on a surface of the module substrate having the terminals having the conductive wires. Antenna device. 13. An antenna used for wireless communication, wherein the large-scale integrated circuit is disposed in a through hole formed in the module substrate, and the large-scale integrated circuit is disposed on a surface of the module substrate that is continuous with a feeding end of the pair of conductor wires. The provided terminal and a part of the plurality of outwardly projecting terminals of the resin-molded large-scale integrated circuit are directly joined, and the outwardly projecting terminal is used as a joining terminal. The antenna device for a transmission / reception module according to claim 1, wherein: 14. An antenna used for wireless communication, wherein a large-scale integrated circuit having a built-in RF transceiver and a large-sized circuit having no built-in RF transceiver are provided in a through hole formed in the module substrate or in a position corresponding to the through hole. A large-scale integrated circuit is provided, and terminals protruding outward are directly joined to terminals provided on the surface of the module substrate, and terminals provided on the surface of the large-scale integrated circuit are connected to terminals of the module substrate and conductive wires. 14. The antenna device for a transmission / reception module according to claim 1, wherein a short-circuit is provided to provide a bonding terminal on a lower surface or a side of the module substrate. 15. An antenna used for wireless communication, wherein a solder metal is directly thickened on the conductor layer pattern of the pair of conductor wires on the dielectric plate of the module substrate. The antenna device of the transmission / reception module according to claim 1. 16. An antenna used for wireless communication, wherein an opening is formed in a part of a metal housing, and the pair of conductor wires are substantially parallel to a surface of the housing inside the opening. The antenna device for a transmission / reception module according to any one of claims 1 to 15, wherein: