JP2001261785A - Epoxy resin composition and cured product thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide am epoxy resin composition excellent in quick curability, flowability, soldering reflowability, capable of giving cured products with high resistance and low hygroscopicity, flame retardancy, etc., and suitable for semiconductor element sealing use and the like. SOLUTION: This epoxy resin composition essentially comprises an epoxy resin and a polyhydroxy resin curing agent shown by the general formula (1) (wherein, A is a naphthalene skeleton; m is an integer of 1 or 2; and n as the average number of repetitions is 1-10); wherein this composition is characterized by that the naphthol monomer content of the polyhydroxy resin is <=0.8 wt.,% and the Gardner color scale of a 10 wt.% methyl ethyl ketone solution of the polyhydroxy resin is <=13. The other objective cured products are obtained by curing the above composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to encapsulation, coating materials, laminate materials, composites, etc. of electric and electronic parts typified by semiconductor elements which provide cured products having excellent curability and excellent moisture resistance and heat resistance. The present invention relates to an epoxy resin composition using a polyvalent hydroxy resin useful as a curing agent for materials and the like and a cured product thereof.

[0002]

2. Description of the Related Art Conventionally, epoxy resins have been industrially used for a wide range of applications, but their required performance has been increasingly sophisticated in recent years. For example, a semiconductor sealing material is a typical field of a resin composition containing an epoxy resin as a main component. In recent years, with an increase in the degree of integration of a semiconductor element, a package size has become larger and thinner, and packaging has been performed. As for the method, the shift to surface mounting is progressing, and the development of a material having more excellent solder heat resistance is desired.

[0003] In order to satisfy these requirements, it is desired that the epoxy resin and the curing agent as the main components have high heat resistance and low moisture absorption. Hitherto, phenol novolaks have been widely used as epoxy resin curing agents in electronic component sealing applications. Although the heat resistance is improved by using phenol novolak, there is a drawback that the water absorption is increased. Japanese Patent Publication No. 47-15111 proposes a phenol aralkyl resin as one having improved moisture resistance, but has a problem that heat resistance is reduced.

[0004] As satisfying heat resistance and moisture resistance,
Japanese Patent Application Laid-Open No. 3-90075 proposes a naphthol aralkyl resin. However, the naphthol aralkyl resin has a drawback that it is difficult to remove the naphthol monomer remaining in the resin due to the high boiling point and melting point of the naphthol in the production thereof, and usually contains about 1% by weight of the naphthol monomer. Since the naphthol monomer is monofunctional, it has a problem that curability and heat resistance are lowered as a curing agent for the epoxy resin. Although the use of a naphthol aralkyl resin improves the heat resistance and moisture resistance of the cured product, the naphthol aralkyl resin is inferior in curability and has a problem that moldability is reduced.

[0005] As a general fact so far, it has been known that when a naphthol aralkyl resin is used as a curing agent for an epoxy resin, the curability is inferior to that of a phenol aralkyl resin. By
It became clear that the curability of the naphthol aralkyl resin is greatly affected by the degree of oxidation of the naphthol aralkyl resin. That is, naphthol aralkyl resin is
In the production, in order to remove the remaining naphthol, a method such as vacuum distillation or steam distillation is usually employed. At this time, since naphthol has a high boiling point, the resin is easily oxidized by being exposed to a long-term heat history at a high temperature. In addition, naphthol aralkyl resins tend to be easily oxidized even during storage as compared with phenol aralkyl resins, and it has been difficult to obtain naphthol aralkyl resins with small oxidative deterioration. From the above, the content of naphthol monomer has been low so far,
A naphthol aralkyl resin having a small degree of oxidation has not been known.

[0006]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an epoxy resin composition using a polyvalent hydroxy resin which gives a cured product having excellent curability and excellent moisture resistance and heat resistance, and a cured product thereof. To provide.

[0007]

The present inventors have conducted intensive studies in view of the above problems, and as a result, have found that a polyvalent hydroxy resin having a low naphthol monomer content and a small degree of oxidation is used as a curing agent for an epoxy resin. The inventors have found that the above problems can be overcome by using the same, and have reached the present invention.

That is, the present invention relates to an epoxy resin composition comprising an epoxy resin and a polyvalent hydroxy resin curing agent represented by the following general formula (1) as an essential component, wherein the naphthol monomer in the polyvalent hydroxy resin is An epoxy resin composition having a content of 0.8% by weight or less, and a Gardner color number of a 10% by weight methyl ethyl ketone solution of the polyvalent hydroxy resin of 13 or less, and curing the same. Cured product.

Embedded image (In the formula, A represents a naphthalene skeleton, m is an integer of 1 or 2, and the average number of repetitions n is a number from 1 to 10.)

There is no particular limitation on the method for producing the polyvalent hydroxy resin used as the curing agent in the present invention. For example, it can be synthesized by reacting a mixture of naphthols and a condensing agent represented by the following general formula (2) in the presence of an acidic catalyst.

Embedded image (Wherein, R represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 or 2)

Here, naphthols include 1-naphthol and 2-naphthol, but may be a mixture thereof. Further, in some cases, a small amount of phenols other than naphthols may be contained.

Examples of phenols other than naphthols include phenols, benzene phenols such as o-cresol, m-cresol, p-cresol, 2,6-xylenol, catechol, resorcinol, hydroquinone, and 1,4-phenol. Naphthalene diol, 1,5-naphthalene diol, 1,6-naphthalene diol, 1,7-naphthalene diol, 2,6-naphthalene diol, 2,
Dihydroxynaphthalenes such as 7-naphthalenediol; and dihydroxybiphenyls such as 4,4′-dihydroxybiphenyl and 2,2′-dihydroxybiphenyl. The amount used is 3 with respect to naphthols.
It is good to keep it at 0% by weight or less, preferably at 10% by weight or less. If it is more than this, heat resistance, moisture resistance and thermal decomposition stability will be reduced.

The condensing agent includes those having a benzene skeleton and those having a biphenyl skeleton. The condensing agent having a benzene skeleton may be any of an o-form, an m-form and a p-form, but is preferably an m-form or a p-form. Specifically, p-xylylene glycol, α, α ′
-Dimethoxy-p-xylene, α, α'-diethoxy-
p-xylene, α, α′-diisopropyl-p-xylene, α, α′-dibutoxy-p-xylene, m-xylylene glycol, α, α′-dimethoxy-m-xylene, α, α′-diethoxy- m-xylene, α, α'-
Diisopropoxy-m-xylene, α, α′-dibutoxy-m-xylene and the like.

The condensing agent having a biphenyl skeleton includes 4,4′-dihydroxymethylbiphenyl,
4'-dihydroxymethylbiphenyl, 2,2'-dihydroxymethylbiphenyl, 4,4'-dimethoxymethylbiphenyl, 2,4'-dimethoxymethylbiphenyl, 2,2'-dimethoxymethylbiphenyl, 4,4 '
-Diisopropoxymethylbiphenyl, 2,4'-diisopropoxymethylbiphenyl, 2,2'-diisopropoxymethylbiphenyl, 4,4'-dibutoxymethylbiphenyl, 2,4'-dibutoxymethylbiphenyl,
2,2'-dibutoxymethylbiphenyl and the like. The substitution position of the functional group such as a methylol group with respect to biphenyl is 4,4′-position, 2,4′-position or 2,2′-position.
The preferred compound as the condensing agent is the 4,4′-isomer, and the total amount of the 4,4′-isomer is 50
Particularly preferred is one that is contained by weight percent or more. If the amount is less than this, there are disadvantages such as a decrease in curing speed when curing the epoxy resin and an obtained cured product becomes brittle.

In the reaction between the naphthols and the condensing agent, an excess amount of the naphthols relative to the condensing agent is used. The amount of the condensing agent used is 0.1 to 0.9 with respect to 1 mol of the naphthols.
Mole, preferably 0.2-0.7 mole. If the amount of the condensing agent is more than 0.9 mol, the softening point of the resin becomes high and the molding workability is hindered. If the amount is less than 0.1 mol, the amount of excess naphthols after removal of the reaction increases. ,
Industrially unfavorable.

Usually, this reaction is carried out in the presence of a known acid catalyst such as an inorganic acid or an organic acid. Examples of such an acid catalyst include mineral acids such as hydrochloric acid, sulfuric acid, and phosphoric acid; organic acids such as formic acid, oxalic acid, trifluoroacetic acid, p-toluenesulfonic acid, dimethyl sulfate, and diethyl sulfate; and zinc chloride. ,
Examples thereof include Lewis acids such as aluminum chloride, iron chloride, and boron trifluoride, and solid acids such as activated clay, silica-alumina, and zeolite.

Usually, this reaction is carried out at 10-250 ° C. for 1-2
Although it is performed for 0 hour, it is preferable to perform the process at a temperature of 180 ° C. or less within 10 hours after replacing with a gas not containing oxygen gas, for example, nitrogen gas, for the purpose of preventing oxidation of the synthesized polyhydroxy resin. Further, as a solvent at the time of the reaction, for example, alcohols such as methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, ethyl cellosolve, diglyme, triglyme, and aromatic compounds such as benzene, toluene, chlorobenzene, dichlorobenzene, etc. May be used.

After the completion of the reaction, the catalyst is optionally removed by a method such as neutralization or washing with water, and then the remaining unreacted naphthols are removed from the system. Although this method is not particularly limited, a method such as vacuum distillation or steam distillation is employed. Alternatively, a method of extracting a monomer by using a solvent such as warm water or alcohols may be used.

The amount of the naphthol monomer in the polyhydroxy resin used as a curing agent in the present invention is 0.8% by weight.
Or less, preferably 0.5% by weight or less. If more than this, the curability as a curing agent decreases,
The heat resistance of the obtained cured product also decreases. Here, the monomer amount refers to a column using a GPC measuring device, TSK-GEL2000 × 3 and TSK-GEL4000 × 1 (both manufactured by Tosoh Corporation),
Solvent: tetrahydrofuran, flow rate: 1 ml / min, temperature: 38
It is a value obtained under the conditions of ° C, detector: RI, and indicates the ratio of the naphthol peak area to the total peak area.

Further, the polyvalent hydroxy resin must have a Gardner color number of 13 or less when dissolved in methyl ethyl ketone to form a 10% by weight solution. The color tone of the polyvalent hydroxy resin is greatly affected by the color tone of naphthols such as 1-naphthol used during production. Therefore, the color tone of the naphthols used is preferably such that the Gardner color number in a 10% by weight methyl ethyl ketone solution is 5 or less, more preferably 3 or less. here,
The Gardner color number is a value measured according to JIS K0071.

The polyhydric hydroxy resin thus produced is represented by the above general formula (1). Preferably, A is an unsubstituted or methyl-substituted naphthalene ring, The average number of repetitions n is 1 to 10.

The polyvalent hydroxy resin used as a curing agent in the present invention takes a solid form at room temperature depending on the molecular weight, but preferably has a softening point of 70 to 130 ° C. If it is lower than this, the amount of the monomer remaining during the production of the polyvalent hydroxy resin increases, so that the productivity of the polyvalent hydroxy resin decreases and the heat resistance of the cured product decreases. On the other hand, if it is higher than this, the melt viscosity increases, and the handling workability decreases. Further, the polyvalent hydroxy resin, the amount of monomer in the resin, the Gardner color number and the like must be a specific number or less, these characteristics are used naphthols, condensing agent, raw materials such as condensation catalyst and solvent. And the reaction temperature, reaction time,
Appropriate selection of the production conditions, such as demonomerization and reaction atmosphere, can make the composition suitable for the present invention.

Since the obtained polyvalent hydroxy resin is easily affected by oxygen, it is preferable to store the polyvalent hydroxy resin in a tightly permeable container such as a metal laminate bag of aluminum or steel, a metal container, or the like. Storage temperature is 25 ℃
Or less, more preferably 10 ° C. or less.

As the epoxy resin used in the epoxy resin composition of the present invention, any ordinary epoxy resin having two or more epoxy groups in the molecule can be used. For example, bisphenol A, bisphenol F, 3,
3 ′, 5,5′-tetramethyl-bisphenol F,
Bisphenol S, fluorene bisphenol, 4,
4'-dihydroxydiphenyl ether, 4,4'-biphenol, 3,3 ', 5,5'-tetramethyl-4,
Divalent phenols such as 4'-biphenol, 2,2'-biphenol, hydroquinone, resorcin, or tris- (4-hydroxyphenyl) methane,
Trivalent or higher phenols such as 1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolak, o-cresol novolak, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, or tetrabromobisphenol A And the like, and glycidyl ether compounds derived from halogen-substituted phenols. These epoxy resins can be used alone or in combination of two or more. Novolak-based epoxy resins such as phenol novolak, o-cresol novolak, and phenol aralkyl resin are mentioned as one of preferable ones.

The curing agent used in the epoxy resin composition of the present invention may be a compound obtained by blending another curing agent, if necessary, in addition to the polyvalent hydroxy resin. As other curing agents, all those generally known as curing agents for epoxy resins can be used. In the case of blending another curing agent, the proportion of the polyvalent hydroxy resin in the total curing agent is usually 20% by weight or more, preferably 40% by weight or more, more preferably 6% by weight or more.
0% by weight or more, more preferably 80% by weight or more.
If the amount is less than this, the heat resistance, moisture resistance and flame retardancy, which are the characteristics of the present invention, decrease. In addition, when other curing agents are blended, the naphthols may be 0.8% as a whole curing agent.
% By weight and the Gardner color number is preferably 13 or less.

Examples of other curing agents include polyhydric phenols, acid anhydrides, dicyandiamide, aromatic and aliphatic amines, and the like.

Examples of polyhydric phenols include bisphenol A, bisphenol F, bisphenol S,
Fluorene bisphenol, 4,4'-biphenol,
Divalent phenols such as 2,2′-biphenol, hydroquinone, resorcinol, naphthalene diol, or tris- (4-hydroxyphenyl) methane;
Trivalent or higher phenols represented by 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolak, o-cresol novolak, naphthol novolak, polyvinylphenol, etc., and further phenols, naphthols or , Bisphenol A,
Bisphenol F, bisphenol S, fluorene bisphenol, 4,4'-biphenol, 2,2'-biphenol, hydroquinone, resorcinol, formaldehyde of divalent phenols such as naphthalene diol, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, p- Examples thereof include polyphenolic compounds synthesized with a condensing agent such as xylylene glycol. However, those containing 0.8% by weight or more of free naphthol are not used.

Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylhymic anhydride, dodecynylsuccinic anhydride, and nadic anhydride. And trimellitic anhydride.

Examples of the amines include aromatic amines such as 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenylsulfone, m-phenylenediamine and p-xylylenediamine. , Ethylenediamine, hexamethylenediamine,
There are aliphatic amines such as diethylenetriamine and triethylenetetramine. These curing agents may be used as needed.
Species or a mixture of two or more can be used.

Further, the epoxy resin composition of the present invention is appropriately blended with an oligomer or a high molecular compound such as polyester, polyamide, polyimide, polyether, polyurethane, petroleum resin, indene maron resin, and phenoxy resin. Is also good.

Further, the epoxy resin composition of the present invention comprises:
Additives such as inorganic fillers, pigments, refractory agents, thixotropic agents, coupling agents, flow improvers and the like can be added. Examples of the inorganic filler include spherical or crushed silica powder such as fused silica and crystalline silica, alumina powder, glass powder, mica, talc, calcium carbonate, alumina, and hydrated alumina. Examples of the pigment include an organic or inorganic extender, a scale pigment, and the like. Examples of the thixotropic agent include silicone, castor oil, aliphatic amide wax, oxidized polyethylene wax, and organic bentonite.

Further, a conventionally known curing accelerator can be used in the epoxy resin composition of the present invention, if necessary. Examples include amines, imidazoles,
Organic phosphines, Lewis acids and the like. The amount added is usually 0.2 parts by weight based on 100 parts by weight of the epoxy resin.
-5 parts by weight. Further, if necessary, the resin composition of the present invention may include a release agent such as carnauba wax and OP wax, a coupling agent such as γ-glycidoxypropyltrimethoxysilane, a coloring agent such as carbon black,
Flame retardants such as antimony trioxide, low stress agents such as silicone oil, lubricants such as calcium stearate, and the like can be used.

Further, the epoxy resin composition of the present invention can be dissolved in an organic solvent to form a varnish. Preferred organic solvents in this case include, for example, alcohols such as methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, ethyl cellosolve, diglyme, and triglyme, or esters thereof, benzene, toluene, chlorobenzene, and dichlorobenzene. Aromatic solvents such as acetone, methyl ethyl ketone, ketone solvents such as methyl isobutyl ketone, aprotic solvents such as N, N-dimethylformamide, N, N-dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone; These organic solvents may be used as a mixture of two or more.

The varnished epoxy resin composition can be applied or impregnated on a substrate, and then the organic solvent is removed to obtain a so-called B-stage prepreg. Examples of the base material in this case include, for example, film materials such as copper foil, stainless steel foil, polyester film, and polyimide film, glass fibers, aramid fibers, aramid nonwoven fabric, polyester fibers, and polyester fibrous materials. Can be

The epoxy resin cured product of the present invention can be obtained by heating the above-mentioned epoxy resin composition, which exhibits excellent effects such as low hygroscopicity and high solder heat resistance. Casting, injection,
Potting, dipping, drip coating,
Transfer molding, compression molding, press molding and the like are preferably used, and the temperature at that time is usually 100 ° C to 25 ° C.
It is in the range of 0 ° C.

[0035]

The present invention will be described more specifically with reference to Synthesis Examples, Examples and Comparative Examples. The Gardner color number of the raw material and the product was measured as a 10% by weight methyl ethyl ketone solution.

Synthesis Example 1 In a four-necked flask, 1152 g (8.0 mol) of 1-naphthol having a Gardner color number of 3, 464.8 g (2.8 mol) of p-xylylene glycol dimethyl ether and 0.4% of 48% sulfuric acid. 8 g was charged and reacted at 180 ° C. for 2 hours while stirring under a nitrogen stream. Methanol generated during this time was removed from the system. Thereafter, sulfuric acid was removed by washing with water. Further, unreacted 1-naphthol was removed by vacuum distillation to obtain 946 g of a polyvalent hydroxy resin.
The OH equivalent of the obtained resin is 208, the softening point is 85 ° C.,
The melt viscosity at 50 ° C. was 0.22 Pa · s.
In addition, the residual monomer amount was 1.4% by weight, and the Gardner color number was 6.

Synthesis Example 2 Using 600 g of the polyvalent hydroxy resin obtained in Synthesis Example 1, steam distillation was further performed to remove unreacted 1-naphthol to obtain 586 g of a polyvalent hydroxy resin. The obtained resin has an OH equivalent of 210 and a softening point of 88.
The melt viscosity at 150C and 150C was 0.25 Pa.s. The amount of the residual monomer was 0.4% by weight, and the Gardner color number was 8.

Synthesis Example 3 664 g of p-xylylene glycol dimethyl ether
(4.0 mol), and the reaction was carried out in the same manner as in Synthesis Example 1 except that 0.8 g of 48% sulfuric acid was used.
4 g were obtained. The OH equivalent of the obtained resin is 223, the softening point is 116 ° C., and the melt viscosity at 150 ° C. is 4.2 Pa ·
s. The amount of the residual monomer was 0.2% by weight, and the Gardner color number was 11.

Synthesis Example 4 A reaction was carried out in the same manner as in Synthesis Example 1 using 1-naphthol having a Gardner color number of 7, followed by steam distillation to remove unreacted 1-naphthol. 470 g of hydroxy resin was obtained. The OH equivalent of the obtained resin is 2
11. The softening point was 87 ° C, and the melt viscosity at 150 ° C was 0.24 Pa · s. The amount of the residual monomer was 0.3% by weight, and the Gardner color number was 14.

Synthesis Example 5 200 g of the polyvalent hydroxy resin obtained in Synthesis Example 2 was added to 40
It was left for 1 day in a warm air dryer at ℃. O of the obtained resin
The H equivalent was 211, the softening point was 88 ° C., the melt viscosity at 150 ° C. was 0.24 Pa · s, and the Gardner color number was 12.

Reference Example 6 200 g of the polyhydroxy resin obtained in Reference Example 2 was added to 40
It was left in a hot air drier at 7 ° C. for 7 days. O of the obtained resin
The H equivalent is 214, the softening point is 89 ° C., the melt viscosity at 150 ° C. is 0.26 Pa · s, and the Gardner color number is 1
It was 7.

Examples 1 to 3 and Comparative Examples 1 to 4 In order to evaluate the properties as an epoxy resin composition for use in electronic parts and the like, the following evaluations were made by formulating and evaluating an electronic part sealing material. Was done. As an epoxy resin component, o-cresol novolak type epoxy resin (EC
N: Nippon Kayaku, EOCN-1020-80; epoxy equivalent 20
0, hydrolyzable chlorine 400 ppm, softening point 80 ° C.), and as a curing agent, a naphtho-aralkyl-type polyvalent hydroxy resin and a phenol-aralkyl-type polyvalent hydroxy resin of Synthesis Examples 1 to 6 (PA: manufactured by Mitsui Chemicals, Inc.) , Millex XL
-225-L; OH equivalent 180, softening point 85 ° C, 150 ° C melt viscosity 0.9 Pa · s) was used. Further, spherical silica (average particle size: 18 μm) as a filler, triphenylphosphine as a curing accelerator, carbon black as a coloring agent,
Carnauba wax was used as a release agent and kneaded with the composition shown in Table 1 to obtain an epoxy resin composition. In Table 1, ECN is o-cresol novolak type epoxy resin, Synthesis Examples 1 to 6 are naphtho aralkyl type polyhydroxy resins of Synthesis Examples 1 to 6, and PA is phenol aralkyl type polyhydroxy resin. The numbers shown are the amounts (parts by weight).

175 ° C. using this epoxy resin composition
, And post-cured at 175 ° C. for 12 hours to obtain a cured product test piece, which was then subjected to various physical property measurements. Table 2 shows the results. The various physical property measurements in Table 2 are based on the following evaluation methods. (Hardness under heating) Hardness under heating was measured by a Barcol hardness tester on a test piece molded at 175 ° C. for 90 seconds. (Glass transition point) The glass transition point was determined by a thermomechanical measuring apparatus at a temperature rising rate of 10 ° C./min. (Water absorption) The water absorption was measured using the epoxy resin composition of 5%.
A 0mmφ × 3mm disk is formed and post-cured at 85 ℃
This is when moisture is absorbed for 100 hours under the condition of 85% RH. (Flame Retardancy) Flame retardancy was evaluated by molding a test piece having a thickness of 1/16 inch according to UL94V-0 standard. Quantitatively, the total framing time in the test of n = 5 was shown as an index. (Crack occurrence rate) The crack occurrence rate was QFP-80p
In (14 × 20 × 2.5 mm), after post-curing, after absorbing moisture for 85 hours at 85 ° C. and 85% RH under the same conditions as water absorption, immersed in a 260 ° C. solder bath for 10 seconds And the state of the package was observed and determined.

[0044]

[Table 1]

[0045]

[Table 2]

[0046]

The epoxy resin composition of the present invention is excellent in rapid curability and fluidity, and exhibits excellent moldability since it gives a cured product having a high hardness when heated. In addition, it gives a cured product with excellent heat resistance, low moisture absorption, solder reflowability, flame retardancy, etc., especially when applied to encapsulation of electronic components such as surface mount type semiconductor elements or printed circuit boards, etc. It has excellent heat resistance, low moisture absorption, solder reflowability, and flame retardancy.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J036 AA01 AE05 AF06 AF08 DB06 DB21 DB22 DC06 DC10 FB06 FB07 FB08 JA07 JA08 4M109 AA01 BA01 BA03 BA05 CA01 CA02 CA04 CA05 CA07 CA21 CA22 EA03 EB02 EB04 EB06 EB07 EB13 EB09 EB09 EC05 EC20

Claims (2)

[Claims] 1. An epoxy resin composition comprising an epoxy resin and a polyvalent hydroxy resin curing agent represented by the following general formula (1) as an essential component, wherein the content of the naphthol monomer in the polyvalent hydroxy resin is zero. An epoxy resin composition, wherein the epoxy resin composition has a Gardner color number of not more than 0.8% by weight and a 10% by weight solution of the polyvalent hydroxy resin in methyl ethyl ketone being 13 or less. Embedded image (However, A represents a naphthalene skeleton, m is an integer of 1 or 2, and the average number of repetitions n is a number from 1 to 10.) 2. A cured product obtained by curing the epoxy resin composition according to claim 1.