JP2001255504A - Method for cutting light-transmissive substrate of liquid crystal display panel - Google Patents
Method for cutting light-transmissive substrate of liquid crystal display panelInfo
- Publication number
- JP2001255504A JP2001255504A JP2000070035A JP2000070035A JP2001255504A JP 2001255504 A JP2001255504 A JP 2001255504A JP 2000070035 A JP2000070035 A JP 2000070035A JP 2000070035 A JP2000070035 A JP 2000070035A JP 2001255504 A JP2001255504 A JP 2001255504A
- Authority
- JP
- Japan
- Prior art keywords
- light
- transmitting substrate
- substrate
- cutting
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は液晶表示パネルの透
光性基板の切断方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a transparent substrate of a liquid crystal display panel.
【０００２】[0002]
【従来の技術】以下に、従来の液晶表示パネルの製造工
程における透光性基板の切断方法について説明する。図
２は従来の切断方法を示す模式図を示す。2. Description of the Related Art A conventional method for cutting a light-transmitting substrate in a manufacturing process of a liquid crystal display panel will be described below. FIG. 2 is a schematic view showing a conventional cutting method.
【０００３】透光性基板を切断する場合、基板欠切工程
では、透光性基板の片面側に、その透光性基板の一端面
から他方端面に欠切部を設けていた。欠切部は欠切手段
で加工される。欠切部の加工は、透光性基板の端面から
始められ、他方端面まで加工されて、両方の端面には欠
切部の断面部分が露出するような加工されていた。そし
て、つぎに透光性基板の欠切部を設けた面の反対面側か
らの力学的応力の変化で、溝状に設けられた欠切部部分
に亀裂を生じさせて透光性基板を切断するようにしてい
た。このような基板の切断方法は、透光性基板の割断ま
たは基板割断方法と呼称されることもある。In the case of cutting a light-transmitting substrate, in the substrate cutting step, a notch is provided on one side of the light-transmitting substrate from one end surface to the other end surface of the light-transmitting substrate. The notched portion is processed by the notching means. The processing of the notch was started from the end face of the translucent substrate, and was processed to the other end face so that the cross section of the notch was exposed on both end faces. Then, a change in mechanical stress from the side opposite to the surface on which the cutout portion of the light-transmitting substrate is provided causes a crack to occur in the cutout portion provided in a groove shape, thereby forming the light-transmitting substrate. I was trying to cut it. Such a method of cutting the substrate may be referred to as a light-transmitting substrate cutting method or a substrate cutting method.
【０００４】具体的な例として、透光性基板の一例とし
てガラス基板を用いた場合を説明する。欠切手段には欠
切加工用の刃先を有したカッターを用いた。まず、カッ
ターをガラス基板１の表面の高さより下に固定しある一
定の圧力をかける。カッターの刃先部をガラス基板１を
切断する位置のガラス端面７に対して突入させ、ガラス
基板１の切断する位置に沿ってカッターをある速度で移
動させ、カッターの刃先部は突入したガラス端面７の反
対のガラス端面８を貫通させるように移動させる。図3
に示すように上記の方法によって、ガラス基板１の切断
位置部分に欠切部４が形成される。その後、図4に示す
ように、ガラス基板１の裏面であるガラス基板２からガ
ラス基板１上に形成された欠切部４の全体に対して、あ
る一定の圧力、及び速度で上方から圧力をかけることに
より、欠切部４の力学的応力の変化で欠切部４の位置の
ガラス基板の厚み方向に亀裂が生じてガラス基板１が割
断できる。このように、２枚の貼り合せた基板の一部を
切断するようにしていた。As a specific example, a case where a glass substrate is used as an example of a light-transmitting substrate will be described. As the notch means, a cutter having a notch for cutting was used. First, the cutter is fixed below the surface of the glass substrate 1 and a certain pressure is applied. The blade edge of the cutter is projected into the glass end face 7 at the position where the glass substrate 1 is cut, and the cutter is moved at a certain speed along the position where the glass substrate 1 is cut. Is moved so as to penetrate the opposite glass end face 8. Figure 3
As shown in FIG. 5, the cutout 4 is formed at the cutting position of the glass substrate 1 by the above method. Thereafter, as shown in FIG. 4, a pressure is applied from above to the entire notch 4 formed on the glass substrate 1 from the glass substrate 2 which is the back surface of the glass substrate 1 at a certain pressure and at a constant speed. By the application, a crack is generated in the thickness direction of the glass substrate at the position of the notch 4 due to a change in the mechanical stress of the notch 4, and the glass substrate 1 can be cut. In this manner, a part of the two bonded substrates is cut.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
方法では、欠切部の加工は、透光性基板の端面から始め
られるので、透光性基板の端面部分の欠切部の形状に不
具合が生じ易く、不具合を低減する物理的加工条件を得
ることも困難な面があった。However, in the conventional method, the processing of the notch can be started from the end face of the light-transmitting substrate, so that the shape of the notch at the end face of the light-transmitting substrate has a problem. In some cases, it is easy to occur, and it is difficult to obtain physical processing conditions for reducing defects.
【０００６】具体的には、液晶パネルのガラス基板の割
断部分の端面で欠切部の形状に不具合生じると、液晶パ
ネルの配線パターンの不具合や、アライメントパターン
の不具合が液晶パネルの製造工程の不具合につながり、
さらには液晶パネルの生産数量の歩留まりを低下させ
る。これらの点で、液晶表示パネルの透光性基板の切断
で生じる透光性基板の端面部分の欠切部の形状の不具合
の低減が課題となっていた。More specifically, if a defect occurs in the shape of the notch at the end face of the cut portion of the glass substrate of the liquid crystal panel, a defect in the wiring pattern of the liquid crystal panel or a defect in the alignment pattern causes a defect in the manufacturing process of the liquid crystal panel. Leads to
Further, the yield of liquid crystal panel production is reduced. In these respects, it has been a problem to reduce the problem of the shape of the cutout at the end face of the light-transmitting substrate caused by cutting the light-transmitting substrate of the liquid crystal display panel.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明は、第１の透光性基板と第２の透光性基板とを
相対するように備え、上記第１の透光性基板と上記第２
の透光性基板と相対する面には間隙を有し、この間隙に
液晶材料を備えた液晶表示パネルの第１の透光性基板ま
たは第２の透光性基板のいずれかを切断する切断方法
が、液晶表示パネルの表面の第１の透光性基板または第
２の透光性基板のいずれかに透光性基板の板厚方向に欠
切部を線状に設ける基板欠切工程と、透光性基板の欠切
部を設けた面の反対面側から欠切部に相対する部分に力
学的応力の変化を与えることで欠切部を有した透光性基
板の欠切部の線状の部分の板厚方向に亀裂を設けて割断
させる基板割断工程とからなる液晶表示パネルの透光性
基板の切断方法で、線状に設けられる欠切部は透光性基
板の一方端面の内側部から他方端面の内側部までの範囲
である。欠切部は透光性基板の端面に欠切部の断面があ
らわれないように設ける。In order to solve the above-mentioned problems, the present invention comprises a first light-transmitting substrate and a second light-transmitting substrate which are opposed to each other, and wherein the first light-transmitting substrate is provided. The substrate and the second
Has a gap on the surface facing the light-transmitting substrate, and cuts either the first light-transmitting substrate or the second light-transmitting substrate of the liquid crystal display panel provided with the liquid crystal material in the gap. A substrate cutting step of forming a linear cutout in the thickness direction of the light-transmitting substrate on either the first light-transmitting substrate or the second light-transmitting substrate on the surface of the liquid crystal display panel; The notch of the translucent substrate having the notch by applying a change in mechanical stress to the portion opposite to the notch from the side opposite to the surface on which the notch of the translucent substrate is provided. In a method of cutting a light-transmitting substrate of a liquid crystal display panel, comprising a substrate cutting step of forming a crack in a thickness direction of a linear portion and cutting the same, a notch provided in a linear shape is one end face of the light-transmitting substrate. From the inside to the inside of the other end face. The notch is provided so that the cross section of the notch does not appear on the end surface of the translucent substrate.
【０００８】また、本発明は、第１の透光性基板と第２
の透光性基板とを相対するように備え、上記第１の透光
性基板と上記第２の透光性基板と相対する面には間隙を
有し、この間隙にシール材を備えるパネルの第１の透光
性基板または第２の透光性基板のいずれかを切断する切
断方法が、パネルの表面の第１の透光性基板または第２
の透光性基板のいずれかに透光性基板の板厚方向に欠切
部を線状に設ける基板欠切工程と、パネルの表面の欠切
部を設けた面の反対面側から欠切部に相対する部分に力
学的応力の変化を与えることで欠切部を有した透光性基
板の欠切部の線状の部分の板厚方向に亀裂を設けて割断
させる基板割断工程とからなる液晶表示パネルの透光性
基板の切断方法で、線状に設けられる欠切部は透光性基
板の一方端面の内側部から他方端面の内側部までの範囲
である。欠切部は透光性基板の端面に欠切部の断面があ
らわれないように設ける。Further, the present invention provides a first light-transmitting substrate and a second light-transmitting substrate.
The first light-transmitting substrate and the second light-transmitting substrate are provided with a gap therebetween, and a gap is provided between the first and second light-transmitting substrates. The cutting method for cutting either the first light-transmitting substrate or the second light-transmitting substrate is performed by the first light-transmitting substrate or the second light-transmitting substrate on the surface of the panel.
A substrate cutting step of linearly forming a cutout in the thickness direction of the light-transmitting substrate on one of the light-transmitting substrates, and cutting off from the surface of the panel opposite to the surface on which the cutout is provided. From the substrate cutting step of providing a crack in the thickness direction of the linear portion of the cutout portion of the translucent substrate having the cutout by applying a change in mechanical stress to the portion opposite to the portion, In the method for cutting a light-transmitting substrate of a liquid crystal display panel, the cutout portion provided linearly extends from the inside of one end surface to the inside of the other end surface of the light-transmitting substrate. The notch is provided so that the cross section of the notch does not appear on the end surface of the translucent substrate.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら説明する。透光性基板の一例とし
てガラス基板を用いた場合を説明する。欠切手段には欠
切加工用の刃先を有したカッターを用いた。Embodiments of the present invention will be described below with reference to the drawings. A case where a glass substrate is used as an example of a light-transmitting substrate will be described. As the notch means, a cutter having a notch for cutting was used.
【００１０】図１は本発明の実施の形態におけるカッタ
ーの通過経路を表した模式図であり、１は２枚貼り合わ
せたガラス基板であり、２はカッターの通過経路であ
り、７はガラス基板端面の一端側であり、８は前述の反
対側のガラス基板端面の他端側である。ガラス基板の厚
みは通常０．５ｍｍから１．１ｍｍ程度のものが用いら
れる。まずカッターを２枚貼り合わせたガラス基板１の
端面内側０．５ｍｍの位置に下ろし、カッターに対し１
ｋｇ／ｃｍ2の圧力をかけながら、２５０ｍｍ／ｓｅｃ
の速度で反対の端面に向かい移動させる。その後、上記
反対端面の内側０．５ｍｍの位置でカッターを２枚貼り
合わせたガラス基板１から引き離す。上記の方法で従来
方法と同様にガラス基板１上に図２のような切込み３が
形成される。その後、従来の方法と同様にガラス基板２
の表面にガラス基板１に形成された切り込み３に沿っ
て、１ｋｇ／ｃｍ2の圧力（力学的応力の変化）をかけ
ることにより、ガラスの亀裂６を発生させ、ガラスの割
断を行う。本発明によれば、ガラス基板端面の欠けは
０．２ｍｍ以下の形状寸法とすることができる。ガラス
基板端面の欠けが０．２ｍｍ以下であれば、ガラス基板
の端面部分の欠切部の形状の不具合とされることはな
く、液晶パネルの配線パターンの不具合や、アライメン
トパターンの不具合が液晶パネルの製造工程の不具合等
の低減がはかれる。FIG. 1 is a schematic view showing a passage path of a cutter according to an embodiment of the present invention, where 1 is a glass substrate bonded to two sheets, 2 is a passage path of the cutter, and 7 is a glass substrate. One end of the end face, and 8 is the other end of the opposite end face of the glass substrate. The thickness of the glass substrate is usually about 0.5 mm to 1.1 mm. First, the cutter is lowered to a position 0.5 mm inside the end face of the glass substrate 1 on which two sheets of the cutter are bonded.
250 mm / sec while applying pressure of kg / cm 2
At the same speed toward the opposite end face. Thereafter, the cutter is separated from the glass substrate 1 on which the two cutters are bonded at a position 0.5 mm inside the opposite end face. With the above-described method, a cut 3 as shown in FIG. 2 is formed on the glass substrate 1 as in the conventional method. Then, as in the conventional method, the glass substrate 2
By applying a pressure of 1 kg / cm 2 (change in mechanical stress) along the cuts 3 formed in the glass substrate 1 on the surface of the glass substrate 1, a glass crack 6 is generated and the glass is cleaved. According to the present invention, the shape of the chip at the end face of the glass substrate can be 0.2 mm or less. If the edge of the glass substrate is not more than 0.2 mm, the defect of the shape of the notch at the edge of the glass substrate is not regarded as a defect. Of the manufacturing process of the present invention can be reduced.
【００１１】このように、図１におけるガラス基板端面
７および、ガラス基板端面８にはカッターの突入、また
は引き離しによる欠けを低減することができる。As described above, the chipping of the glass substrate end surface 7 and the glass substrate end surface 8 in FIG.
【００１２】このようにして、欠切部の加工は、透光性
基板の一方端面の内側部から他方端面の内側部までの範
囲なので、透光性基板の端面部分の欠切部の形状に不具
合が生じることを低減できるようになる。In this manner, since the notch is processed in a range from the inside of one end face to the inside of the other end face of the light-transmitting substrate, the shape of the notch at the end face of the light-transmitting substrate is changed. Problems can be reduced.
【００１３】なお、上記の実施の形態では、ガラス基板
を用いたが、樹脂基板等の他の透光性基板を用いてもよ
い。In the above embodiment, a glass substrate is used, but another translucent substrate such as a resin substrate may be used.
【００１４】また、欠切手段には欠切加工用の刃先を有
したカッターを用いたが、他の欠切手段を用いてもよ
い。Although a cutter having a cutting edge for cutting is used as the cutting means, other cutting means may be used.
【００１５】[0015]
【発明の効果】以上の記載から明らかなように本発明に
よれば、透光性基板の欠切部の加工による、透光性基板
の端面の形状的不具合を低減することができるので、透
光性基板の端面の形状的不具合による液晶パネルの配線
パターンの不具合の低減や、アライメントパターンの不
具合が液晶パネルの製造工程の不具合の低減ができ、さ
らには液晶パネルの生産数量の歩留まりをより向上させ
ることができる。このように産業的的価値が大である。As is apparent from the above description, according to the present invention, it is possible to reduce the shape defect of the end face of the light-transmitting substrate due to the processing of the cutout of the light-transmitting substrate. The defects in the wiring pattern of the liquid crystal panel due to the shape defect of the end surface of the optical substrate can be reduced, and the defects in the alignment pattern can reduce the defects in the manufacturing process of the liquid crystal panel, and the production yield of the liquid crystal panel can be further improved. Can be done. Thus, the industrial value is great.
【図１】本発明の実施の形態におけるガラス基板切断に
おけるカッターの通過経路を表した模式図FIG. 1 is a schematic diagram illustrating a passage path of a cutter in cutting a glass substrate according to an embodiment of the present invention.
【図２】従来のガラス基板切断におけるカッターの通過
経路を表した模式図FIG. 2 is a schematic view illustrating a passage path of a cutter in cutting a conventional glass substrate.
【図３】ガラス基板上に形成される切り込みを表した断
面図FIG. 3 is a sectional view showing a cut formed on a glass substrate.
【図４】ガラス基板の切断方法を表した断面図FIG. 4 is a cross-sectional view illustrating a method of cutting a glass substrate.
１ ガラス基板（第１の透光性基板） ２ ガラス基板（第２の透光性基板） ３ カッターの通過経路 ４ 欠切部（切り込み） ５ シール材 ６ ガラスの亀裂（ガラスの割れ） ７ ガラス基板端面（一方端面） ８ ガラス基板端面（他方端面） ９ 圧力（力学的応力の変化） DESCRIPTION OF SYMBOLS 1 Glass substrate (1st translucent substrate) 2 Glass substrate (2nd translucent substrate) 3 Passage path of cutter 4 Notch (cut) 5 Sealing material 6 Glass crack (glass crack) 7 Glass Substrate end surface (one end surface) 8 Glass substrate end surface (other end surface) 9 Pressure (change in mechanical stress)
Claims (2)
を相対するように備え、前記第１の透光性基板と前記第
２の透光性基板と相対する面には間隙を有し、前記間隙
に液晶材料を備えた液晶表示パネルの、前記液晶表示パ
ネルの前記第１の透光性基板または前記第２の透光性基
板のいずれかを切断する切断方法は、前記液晶表示パネ
ルの表面の第１の透光性基板または第２の透光性基板の
いずれかに透光性基板の板厚方向に欠切部を線状に設け
る基板欠切工程と、透光性基板の前記欠切部を設けた面
の反対面側から前記欠切部に相対する部分に力学的応力
の変化を与えることで前記欠切部を有した透光性基板の
欠切部の線状の部分の板厚方向に亀裂を設けて割断させ
る基板割断工程とからなる液晶表示パネルの透光性基板
の切断方法であって、線状に設けられる前記欠切部は透
光性基板の一方端面の内側部から他方端面の内側部まで
の範囲であることを特徴とする液晶表示パネルの透光性
基板の切断方法。A first light-transmitting substrate and a second light-transmitting substrate provided so as to face each other, and a first light-transmitting substrate and a second light-transmitting substrate facing each other; Has a gap, and the cutting method for cutting either the first light-transmitting substrate or the second light-transmitting substrate of the liquid crystal display panel of the liquid crystal display panel having the liquid crystal material in the gap is A substrate cutting step of forming a linear cutout in the thickness direction of the light-transmitting substrate on either the first light-transmitting substrate or the second light-transmitting substrate on the surface of the liquid crystal display panel; Notch of the light-transmitting substrate having the notch by applying a change in mechanical stress to a portion of the light-transmitting substrate opposite to the surface on which the notch is provided; Cutting a transparent substrate of a liquid crystal display panel, comprising a step of providing a crack in a thickness direction of a linear portion of the portion and cutting the substrate. Wherein the notch provided in a linear shape extends from the inside of one end surface of the light-transmitting substrate to the inside of the other end surface of the light-transmitting substrate.
を相対するように備え、前記第１の透光性基板と前記第
２の透光性基板と相対する面には間隙を有し、前記間隙
にシール材を備えるパネルの、前記パネルの前記第１の
透光性基板または前記第２の透光性基板のいずれかを切
断する切断方法は、前記パネルの表面の第１の透光性基
板または第２の透光性基板のいずれかに透光性基板の板
厚方向に欠切部を線状に設ける基板欠切工程と、前記パ
ネルの表面の前記欠切部を設けた面の反対面側から前記
欠切部に相対する部分に力学的応力の変化を与えること
で前記欠切部を有した透光性基板の欠切部の線状の部分
の板厚方向に亀裂を設けて割断させる基板割断工程とか
らなる液晶表示パネルの透光性基板の切断方法であっ
て、線状に設けられる前記欠切部は透光性基板の一方端
面の内側部から他方端面の内側部までの範囲であること
を特徴とする液晶表示パネルの透光性基板の切断方法。2. A first light-transmitting substrate and a second light-transmitting substrate are provided so as to face each other, and a first light-transmitting substrate and a surface facing the second light-transmitting substrate are provided. The method for cutting a panel having a gap and having a sealing material in the gap, wherein the cutting method cuts either the first light-transmitting substrate or the second light-transmitting substrate of the panel, comprises: A step of linearly forming a notch in the thickness direction of the light-transmitting substrate on either the first light-transmitting substrate or the second light-transmitting substrate; By applying a change in mechanical stress to a portion facing the notch from the side opposite to the surface provided with the notch, the linear portion of the notch of the light-transmitting substrate having the notch A method for cutting a light-transmitting substrate of a liquid crystal display panel, comprising: a substrate cutting step of forming a crack in a plate thickness direction to cut the substrate. The method of cutting a light-transmitting substrate of a liquid crystal display panel, wherein the cutout portion extends from an inner portion of one end surface of the light-transmitting substrate to an inner portion of the other end surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000070035A JP2001255504A (en) | 2000-03-14 | 2000-03-14 | Method for cutting light-transmissive substrate of liquid crystal display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000070035A JP2001255504A (en) | 2000-03-14 | 2000-03-14 | Method for cutting light-transmissive substrate of liquid crystal display panel |
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| Publication Number | Publication Date |
|---|---|
| JP2001255504A true JP2001255504A (en) | 2001-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000070035A Pending JP2001255504A (en) | 2000-03-14 | 2000-03-14 | Method for cutting light-transmissive substrate of liquid crystal display panel |
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| JP (1) | JP2001255504A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100808330B1 (en) * | 2003-09-05 | 2008-02-27 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | Method of manufacturing display device |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
| JP2012000792A (en) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | Method for scribing brittle material substrate |
| JP2013536147A (en) * | 2010-07-16 | 2013-09-19 | コーニング インコーポレイテッド | Method for scoring and dividing tempered glass substrates |
| US9802854B2 (en) | 2010-03-19 | 2017-10-31 | Corning Incorporated | Mechanical scoring and separation of strengthened glass |
| US10351460B2 (en) | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
-
2000
- 2000-03-14 JP JP2000070035A patent/JP2001255504A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100808330B1 (en) * | 2003-09-05 | 2008-02-27 | 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 | Method of manufacturing display device |
| US9802854B2 (en) | 2010-03-19 | 2017-10-31 | Corning Incorporated | Mechanical scoring and separation of strengthened glass |
| CN102275229A (en) * | 2010-06-14 | 2011-12-14 | 三星钻石工业股份有限公司 | Cutting method of fragile material base plate |
| JP2012000792A (en) * | 2010-06-14 | 2012-01-05 | Mitsuboshi Diamond Industrial Co Ltd | Method for scribing brittle material substrate |
| JP2013536147A (en) * | 2010-07-16 | 2013-09-19 | コーニング インコーポレイテッド | Method for scoring and dividing tempered glass substrates |
| KR101543930B1 (en) | 2010-07-16 | 2015-08-11 | 코닝 인코포레이티드 | Methods for scribing and separating strengthened glass substrates |
| US9611167B2 (en) | 2010-07-16 | 2017-04-04 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
| US10351460B2 (en) | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
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