JP2001250872A - Semiconductor device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device intended to rise the entire device temperature up to a melting temperature of solder balls for a comparatively short time to thereby improve the efficiency mounting for a device substrate. SOLUTION: The semiconductor device has an IC chip 1 and a wiring layer 2 both mounted on one surface of a heat sink plate 3, and a plurality of solder balls 4 attached to specified spots on the wiring layer 2. A black ink 7 is applied to the other surface of the heat sink plate 3, i.e., the outer surface thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to a BGA (Ball Grid Arr).
ay) A package type semiconductor device and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the response speed of semiconductor devices has recently been particularly increased with the background thereof, and the integration of semiconductor devices has been advanced with the aim of increasing the number of functions. Along with this, the power consumption of many semiconductor devices tends to increase, and at the same time, the calorific value also increases. For this reason, in a package type semiconductor device for high-speed and highly integrated LSI, a large heat spreader (radiator plate) is provided on the back surface of the IC chip in order to efficiently diffuse heat generated on the IC chip.
Are often used.

FIGS. 3A and 3B show a conventional example of the above semiconductor device. In FIGS. 3A and 3B, reference numeral 51 indicates
Denotes an IC chip, and reference numeral 52 denotes a wiring layer. This I
The C chip 51 and the wiring layer 52 are fixed to one surface 53A of the heat sink 53 via an insulating layer and with an adhesive or the like. A plurality of solder balls 54 connected to an external circuit board are provided at predetermined positions (input / output terminal portions with respect to the circuit board) of the wiring layer 52.
A package (PKG) type semiconductor device having a structure is configured.

Here, reference numeral 55 denotes a bonding wire. This bonding wire 55 is connected to the IC chip 51.
This is for connecting the bonding pad on the side and the terminal on the wiring layer 52 side. Reference numeral 56 denotes the above-described IC.
The resin coated over the entire wire bonding area between the IC chip 51 including the chip 51 and the wiring layer 52 is shown.

The heat sink 53 is made of a copper alloy (Cu alloy) in consideration of both thermal conductivity and cost, and is often plated with nickel (Ni) on its upper surface. ing. For this reason, most of the PKG type semiconductor devices have a silver color peculiar to Ni plating on the upper surface.

[0006]

At present, when mounting a PKG type semiconductor device on a device substrate, an infrared reflow device is mainly used in many cases, and its ratio reaches about 50% as a whole. I have. On the other hand, if infrared reflow (a method of heating the whole using infrared rays) is used when mounting the semiconductor device on the device substrate, the above-mentioned PKG type semiconductor device having a silver upper surface reflects infrared light. In addition, it takes time for the temperature of the PKG type semiconductor device to rise to a temperature required for mounting, which causes a disadvantage that the production efficiency is reduced as a whole.

[0007] In addition, a black P P
If a KG type semiconductor device and a PKG type semiconductor device having a silver upper surface are to be mixedly mounted on a device substrate, a PKG having a silver upper surface is to be mounted.
The time required for the semiconductor device to rise to the temperature required for mounting is longer than that of the semiconductor device having a black upper surface, and there is a disadvantage that the semiconductor device cannot be substantially mixedly mounted.

[0008]

SUMMARY OF THE INVENTION The object of the present invention is to improve the disadvantages of the prior art and, in particular, to raise the temperature of the entire device to the melting temperature of the solder balls in a relatively short time, thereby improving the efficiency of the mounting operation on the device substrate. It is an object of the present invention to provide an improved semiconductor device and a method of manufacturing the same.

[0009]

In order to achieve the above object, in each of the first to seventh aspects of the present invention, an IC chip and a wiring layer are mounted on one surface of a heat radiating plate, and the IC chip and the wiring layer are provided at predetermined positions of the wiring layer. In a semiconductor device provided with a plurality of solder balls connected to an external circuit board, a common basic configuration is to apply black ink to the other surface, which is the outer surface of the heat sink described above. It is adopted as a configuration.

Therefore, according to each of the first to seventh aspects of the present invention, when mounting on a circuit board via a solder ball portion, the temperature of the entire apparatus is increased in a relatively short time by infrared reflow. Can be done. That is, each solder ball rises in temperature and melts in a shorter time due to the endothermic effect of the black ink compared to the conventional example, so that the semiconductor device can be quickly and reliably mounted on the device substrate (circuit board). .

Here, the area to be coated with the black ink is the entire area of the other surface excluding the above-described stamped area at the center of the other surface, or the peripheral edge (entire edge) on the other surface. The whole area of the other surface excluding the stamp area at the center may be used.

In this case, in addition to the function substantially the same as that of the above-described basic configuration, a relatively large marking area can be obtained at the center, so that the device identification number and the like are marked relatively large and clear. It becomes possible, and even if the peripheral end abuts against external foreign matter by removing the peripheral end,
Since the black ink is not applied to the edge, it is possible to effectively avoid the occurrence of an accident such as peeling of the black ink.

Further, the above-mentioned black ink may be an ink having a good heat absorption color such as black or brown. Even in this case, in addition to having substantially the same function as that of the above-described basic configuration, at the time of infrared reflow performed at the time of mounting the entire apparatus, the temperature of the entire apparatus is set to a predetermined temperature by the action of the ink of a good heat absorption color. Can be assuredly raised in a relatively short time.

[0014] The area of the black ink applied to the other surface of the heat sink may be about 80% or more of the area of the other surface of the heat sink. Furthermore,
The heat radiating plate may be made of metal and the other surface of the heat radiating plate may be plated with nickel. Even in this case, it is possible to obtain almost the same function as in the case of the above-described basic configuration.

In each of the eighth to eleventh aspects of the present invention, an IC
A first step of mounting the chip and the wiring layer on one surface of the heat sink, a second step of wire bonding the bonding pad on the IC chip side and the terminal on the wiring layer side,
A third step of coating the entire wire bonding region between the IC chip including the IC chip and the wiring layer with a predetermined resin, and applying predetermined solder balls to a plurality of input / output terminal regions provided at predetermined positions of the wiring layer. In the method of manufacturing a semiconductor device, comprising a fourth step of mounting and a fifth step of imprinting a product name, a rod number, and the like on the other surface of the heat sink, the fourth and fifth steps described above. And an ink application step of applying black ink to the other surface of the heat radiating plate is adopted as a common basic configuration.

For this reason, in each of the inventions according to claims 8 to 11, the ink application step is set at the end.
The inconvenience of the black ink being partially peeled off from the radiator plate due to impact during handling or transportation, or during contact with foreign matter during the manufacturing process can be reliably avoided. This is advantageous in that a clear state can be maintained without deteriorating quality.

Here, in the stamping operation of the product name and the rod number in the fourth step, white or silver ink may be used. Even in this case, in addition to having substantially the same function as the case of the basic configuration described above,
Since the white or silver product name and the rod number are stamped on the surface to which the black ink is applied, the discriminating power can be clearly exerted to the outside.

When marking the product name and rod number in the fourth step, a laser oscillator and a laser output controller for controlling the operation of the laser oscillator are prepared in advance, and the laser output is output from the laser oscillator. The stamping process may be executed by controlling the scanning of the laser beam to be performed. Even in this case, in addition to having substantially the same function as in the case of the above-described basic configuration, it is possible to quickly and accurately perform marking of the product name and the rod number.

Further, the above-described ink application step is performed except for the central area and the peripheral end area of the other surface of the heat sink, and the seal such as the product name and the rod number in the fourth step is printed on the heat sink. May be configured to be executed in the central region of the other surface.

[0020] Even in this case, in addition to having substantially the same function as that of the above-described basic configuration, the ink application process is performed except for the central area and the peripheral end area of the other surface of the heat sink. Not only can the consumption of ink be reduced, but the coating area can be small,
The time required for the ink application process can be shortened, and the product name and rod number can be stamped in the central area of the other surface of the heat sink. It can be stamped and the alignment is relatively easy.

In each of the inventions according to claims 12 and 13,
A first method of mounting the C chip and the wiring layer on one surface of the heat sink
And a second step of wire-bonding the bonding pads on the IC chip side to the terminals on the wiring layer side, and the entire wire bonding area between the IC chip including the IC chip and the wiring layer is made of a predetermined resin. A third step of coating, a fourth step of mounting predetermined solder balls on a plurality of input / output terminal areas provided at predetermined positions of the wiring layer, and a product name and a rod number on the other surface of the heat sink. And a fifth step of imprinting, for example, the step of imprinting the product name and the rod number in the fifth step described above, simultaneously with or before or after the operation of imprinting the other side of the heat sink. A common basic configuration employs a configuration in which an ink application step of applying black ink on the surface and fixing the ink by heating is provided.

Therefore, each of the inventions according to the twelfth and thirteenth aspects has functions equivalent to those of the above-described eighth aspect, and further includes a step of stamping a product name, a rod number, and the like, and the other side of the heat sink. The step of applying black ink to the surface can be performed simultaneously, the number of manufacturing steps is reduced, and the overall working time can be shortened. In this respect, the workability is greatly improved. There is.

Here, the same ink as that used in the above-described ink application step may be used for marking the product name and the rod number in the above-described fifth step. This makes it possible to execute the stamping process such as the product name and the rod number in the same process as the ink application process, and in this regard, it is possible to reduce the time and improve the workability in the manufacturing process of the PKG type semiconductor device. it can.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 (A) and 1 (B). First, FIG.
1A and 1B, reference numeral 1 denotes an IC chip, and reference numeral 2 denotes a wiring layer for the IC chip 1. The IC chip 1 and the wiring layer 2 are fixed to one surface (the lower end surface in FIG. 1) of the heat sink 3 via an insulating layer and an adhesive or the like. The wiring layer 2 is provided with a through-hole 2A for disposing the IC chip 1 at the center thereof.

The above-described wiring layer 2 has a through hole 2A.
The heat sink 3 described above together with the IC chip 1 disposed in the portion
To be mounted almost simultaneously on one side of the camera.
A plurality of solder balls 4 connected to the external circuit board (device board) are attached to a predetermined portion of the wiring layer 2 (input / output terminal portion with respect to the external circuit board), thereby providing a BGA structure. A package (PKG) type semiconductor device is configured.

Here, as a material of the radiator plate 3, a copper alloy (Cu alloy) having good thermal conductivity is used as in the case of the above-described conventional example, and Ni plating is applied to the upper surface thereof. . Therefore, the heat radiating plate 3 has a silver color unique to Ni plating. A plurality of bonding pads on the IC chip 1 side and a plurality of terminals on the wiring layer 2 side are connected by bonding wires 5 for each corresponding wiring.

Further, as in the case of the above-described conventional example, I
The entire wire bonding area between the IC chip 1 including the C chip 1 and the wiring layer 2 is coated with the resin 6.

On the other surface of the heat sink 3, black ink 7
Is applied. In this case, as the black ink,
In the present embodiment, black or brown ink having a good heat absorption color is used. Further, after the black ink 7 on the surface of the heat radiating plate 3 is dried, a product name, a lot number and the like are stamped on the black ink 7 with white or silver ink as described later. ing. For this reason, since the lot number and the like are stamped on a black background with white or silver ink, the lot number and the like of the device are clearly displayed and displayed to the outside. It becomes good and is effective in preventing erroneous insertion during mounting. In this case, the marking of the product name, the lot number, and the like may be performed by a laser beam.

Since the semiconductor device according to the present embodiment is configured as described above, the mounting of the semiconductor device via the solder balls 4 can be performed in a relatively short time for the entire semiconductor device by infrared reflow. By raising the temperature, the entire solder balls can be melted at the same time. In addition, the heat absorption action of the black ink 7 causes each solder ball to rise in temperature and melt in a shorter time than in the conventional example. Can be quickly and reliably mounted on the device board (circuit board).

Further, the above-mentioned black ink 7 is used for the heat sink 3.
May be applied to the entire surface of the other surface of the heat sink 3, but in the present embodiment, as shown in FIG. It has been applied.

For this reason, the consumption of the paint can be reduced as compared with the case where the entire surface is solid-coated.
At the time of infrared reflow, the infrared light can be uniformly absorbed as a whole and the temperature of the entire device can be increased in a short time.
It can be executed even more quickly and reliably.

Further, since the black ink 7 is not applied to the periphery of the PKG (around the upper surface of the heat radiating plate), for example, the side of the device is gripped during the handling of the product before the marking baking (before the heating and drying work). However, there is also an advantage that the black ink 7 does not adhere and the work efficiency and the yield are improved in this respect.

Next, a method of manufacturing the semiconductor device according to the above embodiment will be described.

First, the IC chip 1 and the wiring layer 2 are mounted on one surface (the lower surface in FIG. 1) of the heat sink 3 (first step). At the time of this mounting, an adhesive is used via an insulating material as described above. Next, the bonding pads on the IC chip 1 side and the terminals on the wiring layer 2 side are wire-bonded (second step), and subsequently, the entire wire bonding region including the IC chip 1 and the wiring layer 2 between the IC chip 1 and the wiring layer 2 Is coated with a predetermined resin 6 (third step).
Subsequently, predetermined solder balls 4 are mounted on a plurality of input / output terminal regions provided at predetermined positions of the wiring layer 3 (fourth terminal).
Process).

Next, the process proceeds to the fifth step of imprinting the product name, the rod number, and the like on the other surface of the radiator plate 3 described above.
An ink application step of applying the black ink 7 to the other surface (the upper surface in FIG. 1) is provided. In this ink application step, as shown in FIG. 1A, the entire area except the entire edge 3a of the other surface of the heat sink 3 is solid-coated.

After the black ink 7 applied in this ink application step is dried (actually heated and dried), a fifth name for imprinting a product name, a rod number, and the like on the other surface of the radiator plate 3 described above. The process is performed.

Here, white or silver ink is used for marking the product name and the rod number in the fifth step. Thereby, since a white or silver product name or the like is given on a black background, identification of the product name and the rod number becomes very good. Also, when marking the product name and rod number in the fifth step, a laser light oscillator and a laser output controller for controlling the operation of the laser light oscillator are prepared in advance, and the laser output from the laser light oscillator is prepared. The scanning may be performed by controlling the light.

As described above, in the semiconductor device according to the present embodiment, the black ink 7 is applied to the other surface of the heat radiating plate 3. 3, heat can be effectively absorbed, and therefore, the entire semiconductor device can be uniformly and quickly raised to a predetermined temperature (the melting temperature of a handball). Efficiency can be greatly improved.

Further, even for a PKG (package) having a black upper surface in a molded PKG type semiconductor device, there is no difference in the time required for the temperature to rise to the temperature required for mounting. There is an advantage that conditions are relaxed and workability is remarkably improved.

Next, a second embodiment will be described with reference to FIG.

The second embodiment is characterized in that the application area of the black ink 7 in the first embodiment is further limited.

That is, in the second embodiment, the black ink 7 is applied except for the center of the other surface (the upper surface in FIG. 2) of the heat sink 3 and the entire edge of the other surface. It is characterized by the following points. In this case, the ratio of the entire black ink region is preferably 80% or more of the entire area of the other surface of the heat sink 3.

Reference numeral 3b denotes a central portion of the other surface (the upper surface in FIG. 2) where black ink is not applied (ink-non-applied region). The non-ink-applied area 3b at the center is
In the present embodiment, it is formed in a square shape, but may be circular or elliptical. The product name and rod number of the semiconductor device are stamped on the non-ink-applied area 3b on the heat sink 3.

For this reason, in this embodiment, a relatively large stamping area can be obtained at the center, so that the name of the device,
The identification number and the like can be marked relatively large and clear, and in this respect, the identification of the device is improved, which is effective in preventing erroneous mounting during mounting.

For the marking of the product name and the rod number, the same ink as the above-described black ink is used. For this reason, in the present embodiment, it is possible to execute the stamping process such as the product name and the rod number in the same process as the ink application process.
It is possible to shorten the time and improve the workability in the manufacturing process of the die semiconductor device, and it is possible to significantly improve the productivity and reduce the cost. Other configurations are the same as those of the embodiment of FIG. 1 described above.

Even in this case, the operation and effect can be obtained substantially the same as those of the first embodiment described above. In particular, even in the case of infrared reflow performed at the time of mounting on a circuit board, the effect can be obtained. Functions and effects substantially the same as those of the first embodiment can be obtained.

Further, in the manufacturing process of the semiconductor device according to the second embodiment, the ink application process according to the first embodiment described above and the fifth step of imprinting the product name and the rod number are performed.
Is simultaneously performed. For this reason, the ink application step and the step of stamping the product name and the rod number etc. can be performed in one step, so that the manufacturing process can be shortened, and the product name and the rod number of the black ink on the silver surface can be obtained. , The product name and the rod number can be clearly and freely stamped. Note that the above-described black ink application range may be the entire area excluding only the central marking area on the heat sink 3.

[0048]

According to the present invention, the present invention is constructed and functions as described above. According to this, in the infrared reflow performed when the entire device is mounted on the circuit board, the infrared absorption by the black ink is sufficiently absorbed. Then, it becomes possible to surely raise the temperature of the entire apparatus to a predetermined temperature in a short time, and thereby the solder balls can be quickly and reliably melted. For this reason, it has become possible to significantly improve the efficiency of the mounting operation on the device substrate.

Further, since the black ink is applied to the outer surface of the heat radiating plate, a difference in time required to raise the temperature to a required temperature as compared with an apparatus having a black package (molded with a black resin). Therefore, when mounted on a circuit board, these components can be mixed and mounted, and in this respect, the restriction at the time of infrared reflow is greatly relaxed, and workability at the time of mixed mounting is greatly improved as a whole.

Further, when applying black ink,
Since it is performed at the final stage of the manufacturing process, it is ensured that the black ink is partially peeled off from the heat sink due to impact during handling or transport during the manufacturing process, or due to foreign matter during the manufacturing process. It is possible to provide an unprecedented superior semiconductor device capable of maintaining a clear state without deteriorating the quality of marking such as a product name and a rod number in such a point, and a method of manufacturing the same. it can.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of the present invention, FIG. 1 (A) is a perspective view, and FIG. 1 (B) is a longitudinal sectional view including an IC chip portion in FIG. 1 (A).

FIG. 2 is a perspective view showing another embodiment of the present invention.

3 (A) is a perspective view, and FIG. 3 (B) is a longitudinal sectional view including an IC chip portion in FIG. 3 (A).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC chip 2 Wiring layer 3 Heat sink 3a The whole edge part (ink-free area) 3b Ink-free area 4 Solder ball 5 Bonding wire 6 Resin 7 Black ink

Claims (13)

[Claims] 1. A semiconductor device comprising: an IC chip and a wiring layer mounted on one surface of a heat sink, and a plurality of solder balls connected to an external circuit board attached to predetermined portions of the wiring layer. A semiconductor device, wherein a black ink is applied to the other surface which is the outer surface of the heat sink. 2. A semiconductor device comprising: an IC chip and a wiring layer mounted on one surface of a heat sink, and a plurality of solder balls connected to an external circuit board attached to predetermined portions of the wiring layer. A semiconductor device, wherein black ink is applied to the other surface, which is the outer surface of the heat sink, except for the entire edge on the other surface. 3. A semiconductor device in which an IC chip and a wiring layer are mounted on one surface of a heat sink, and a plurality of solder balls connected to an external circuit board are attached to predetermined portions of the wiring layer. A semiconductor device, characterized in that black ink is applied to the other surface, which is the outer surface of the heat sink, except for a marking area at the center of the other surface. 4. A semiconductor device in which an IC chip and a wiring layer are mounted on one surface of a heat sink, and a plurality of solder balls connected to an external circuit board are provided at predetermined positions of the wiring layer. A semiconductor device, wherein black ink is applied to the other surface, which is the outer surface of the heat radiating plate, except for a marking area at the center of the other surface and the entire edge on the same surface. 5. The semiconductor device according to claim 1, wherein the black ink is an ink having a good heat absorption color such as black or brown. 6. The application area of the black ink applied to the other surface of the radiator plate is about 80% or more of the area of the other surface of the radiator plate. 6. The semiconductor device according to 1, 2, 3, 4 or 5. 7. The heat radiating plate is made of metal and the other surface is plated with nickel. Or the semiconductor device according to 6. 8. A first step of mounting an IC chip and a wiring layer on one surface of a heat sink, and a second step of wire bonding a bonding pad on the IC chip and a terminal on the wiring layer. A third step of coating the entire wire bonding region between the IC chip including the IC chip and the wiring layer with a predetermined resin, and forming a plurality of input / output terminal regions provided at predetermined positions of the wiring layer on a predetermined position. A method of manufacturing a semiconductor device, comprising: a fourth step of mounting a solder ball; and a fifth step of imprinting a product name, a rod number, and the like on the other surface of the heat sink, wherein the fourth step and the fourth step A method of manufacturing a semiconductor device, comprising an ink application step of applying black ink to the other surface, which is the outer surface of the heat radiating plate, between the steps of Step 5 and Step 5. 9. The method of manufacturing a semiconductor device according to claim 8, wherein white or silver ink is used for marking a product name and a rod number in the fifth step. 10. A laser light oscillator and a laser output controller for controlling the operation of the laser light oscillator are prepared in advance when marking the product name and the rod number in the fifth step. 9. The method for manufacturing a semiconductor device according to claim 8, wherein the scanning is performed by controlling the laser beam to be performed. 11. The ink application step is performed except for a central area and a peripheral end area of the other surface of the heat sink, and a seal such as a product name and a rod number in the fifth step is a mark of the heat sink. 9. The method of manufacturing a semiconductor device according to claim 8, wherein the method is performed in a central region of the other surface. 12. A first step of mounting an IC chip and a wiring layer on one surface of a heat sink, and a second step of wire bonding a bonding pad on the IC chip and a terminal on the wiring layer. A third step of coating the entire wire bonding area between the IC chip including the IC chip and the wiring layer with a predetermined resin, and providing a plurality of input / output terminal areas provided at predetermined locations of the wiring layer with a predetermined A method of manufacturing a semiconductor device, comprising: a fourth step of mounting a solder ball; and a fifth step of imprinting a product name and a rod number on the other surface of the heat sink, wherein the product name in the fifth step is provided. And a step of applying a black ink to the other surface of the heat sink at the same time as or before or after the marking operation of the rod number and the like. . 13. The method of manufacturing a semiconductor device according to claim 8, wherein the same ink as that used in the ink application step is used for marking the product name and the rod number in the fifth step. Method.