JP2001244038A - Socket for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device, which permits surface mounting to a board and proper evaluation of the semiconductor device, independently of whether the semiconductor device is structured or laid out to be attached to the socket. SOLUTION: The socket comprises a box-shaped body 2, and a cover for opening/closing the body 2 through hinges. Connection terminals 6 are arranged on the body 2 at locations corresponding to the leads 4 of an IC package 3, respectively. Each terminal 6 is L-shaped to be fitted along the bottom and lateral wall of the body 2. A rounded protuberance is formed on a surface of each terminal 6, the surface being on the inner side of the body 2 for contact with the corresponding lead 4. A wedge-shaped guide 2' is arranged between every two adjacent terminals 6 and at each corner inside the body 2. Presser pins 5 are arranged on the cover whereby the respective leads 4 can be pressed when the IC package 3 is accommodated in the body 2 and the cover is then closed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for mounting a semiconductor device on a substrate, and more particularly to a semiconductor device socket suitable for a high-frequency semiconductor device.

[0002]

2. Description of the Related Art In recent years, wireless communication technologies such as portable communication have been rapidly developed. Above all, SS (spread spectrum) wireless LAN technology is strong against noise, jamming waves, multipath fading, excellent in confidentiality and confidentiality, has no influence on peripheral devices, and can cover the target communication area to every corner. This is one of the most promising technologies.

[0003] In such wireless communication, a high-frequency RF-IC, which is an integrated circuit for a radio frequency band, is indispensable, and the demand for it is greatly increasing. This RF-I
Since C is a product characterized by high-mix low-volume production, the labor and cost required for testing are high in the entire production process and production costs. Therefore, in order to increase the production efficiency of the RF-IC and reduce the production cost, it is necessary to improve the efficiency of the test and reduce the cost.

[0004] This test is performed by replacing an IC with a socket on a test board. Here, a general IC socket has a terminal provided by inserting a pin provided in a socket body into a through hole formed in a printed wiring board and soldering a pin protruding from the back surface of the board. It is. However, in such a socket, since the pin is interposed between the IC and the printed wiring, the parasitic inductance becomes remarkable.
It cannot be used for evaluating high-frequency characteristics for F-ICs.

In order to cope with this, there has been proposed a socket capable of minimizing a parasitic component such as a parasitic inductance and measuring the high frequency characteristics of an RF-IC. For example, the socket disclosed in Japanese Patent Application Laid-Open No. 11-183566 is a low frequency general-purpose socket improved for high frequency. However, this socket has a structural problem of the existing technology that the wiring distance becomes longer due to the interposition of pins between the leads of the IC and the printed wiring.

In addition, a socket for connecting an IC to a test board used in a measuring apparatus is disclosed in Japanese Patent Laid-Open No. 5-7 / 1993.
No. 4892, JP-A-7-27821, JP-A-8-86
No. 832 and JP-A-9-264922. These are intended to reduce the wiring distance between the IC lead and the printed wiring. For example, a hole for embedding a socket is formed on a test board, and a terminal pin is provided on a test board. For example, it is necessary to form a dedicated structure for mounting a socket on the test board side.

[0007] Further, a socket has been proposed which enables a socket to be surface-mounted on a substrate, thereby shortening a wiring distance between an IC lead and a printed wiring, and which can be used even in a high frequency range up to the GHz band. . For example, J
Ohntech International Gi
ga3 (product name) is surface-mounted on a substrate by a large frame-shaped main body provided around the IC. And the connection between the IC lead and the printed wiring is
This is done via an S-shaped contact. That is, the S-shaped contact arranged in an inclined manner is elastically supported by an elastomer or the like, and the lower end of the contact comes into contact with the printed wiring, while the lead of the IC is pressed against the upper end of the contact. And the printed wiring are electrically connected.

Although the structure of the contact portion is different from that of the above-mentioned Giga3, a technology using a frame-shaped main body as a socket capable of surface mounting is disclosed in Japanese Patent Application Laid-Open No. H10-2202.
No. 4.

[0009]

By the way, SS radio L
In the case of a substrate of an AN product, when a defect occurs in a used RF-IC after shipping the product, it is necessary to replace the IC with a sample subjected to various reliability tests and examine the influence on the product characteristics.

However, in the socket for a test board described above, it is necessary to form a special structure for mounting the socket on the board side. Further, even a surface mount type socket has a large frame-shaped main body around the IC, and thus occupies several to several tens of times the area of the IC.

For this reason, it is necessary to design the layout on the board on the premise that the socket is mounted, and it is impossible to mount the socket at a place where the mounting of the socket was not planned. Therefore, in reality, how the variation in the characteristics of the RF-IC affects the characteristics of the product will be described.
It could not be evaluated by actual measurement.

The present invention has been proposed in order to solve the problems of the prior art as described above.
It is an object of the present invention to provide a semiconductor element socket which can be surface-mounted on a substrate and can accurately evaluate a large number of semiconductor elements regardless of a structure or a layout supposing socket mounting.

[0013]

In order to achieve the above-mentioned object, the present invention provides a box-shaped main body capable of accommodating a semiconductor element, and electrically connecting a lead of the semiconductor element to a wiring on a substrate. The semiconductor device socket provided with the connection terminals described above has the following technical features.

That is, the invention according to claim 1 is characterized in that a part of the connection terminal is provided on an outer peripheral surface of the main body so as to be surface mountable on the substrate. According to the first aspect of the present invention, since the main body is placed on the substrate and the connection terminals are directly soldered to the wiring on the substrate, the main body can be surface-mounted on the substrate. A special board structure and layout are not required, and the wiring distance is shortened.

According to a second aspect of the present invention, in the semiconductor device socket according to the first aspect, the connection terminal is formed in an L shape so as to match a corner between a bottom surface and an outer peripheral surface of the main body. It is characterized by being. Claim 2 as described above
In the described invention, since the connection terminals are L-shaped so as to match the corners between the bottom surface and the outer peripheral surface, more reliable connection can be made when soldered to the wiring on the board.

According to a third aspect of the present invention, in the semiconductor device socket according to the first or second aspect, there is provided a lid for covering the main body, wherein the lid is in contact with the connection terminal. An urging portion for urging the lead of the semiconductor element toward the connection terminal is provided. According to the third aspect of the present invention, since the lead of the semiconductor element is pressed against the connection terminal by the urging portion, the contact resistance can be reduced.

According to a fourth aspect of the present invention, in the semiconductor device socket according to the third aspect, a contact portion of the connection terminal with the lead of the semiconductor element protrudes or protrudes toward the lead of the semiconductor element. It is characterized by. According to the fourth aspect of the present invention, the contact portion of the connection terminal with the lead is raised or protruded, so that the contact resistance can be further reduced and stabilized.

According to a fifth aspect of the present invention, in the semiconductor device socket according to any one of the first to fourth aspects, a guide portion for guiding movement of a lead is provided between the connection terminals in the main body portion. Is provided. According to the fifth aspect of the present invention, when the semiconductor element is housed in the main body, the leads are guided by the guides, so that the positioning with respect to the connection terminals can be easily performed. In addition, since the guide portion is provided, the mechanical strength of the main body increases.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a socket for a semiconductor device according to the present invention will be described below with reference to FIGS. (1) Configuration of Embodiment In this embodiment, as shown in FIG. 1, a box-shaped main body 2 made of an insulating material and a hinge are provided on the main body 2 via a hinge. It is constituted by a lid (not shown). As shown in FIG. 2, the main body 2 is provided so as to be able to accommodate the IC package 3. The size of the main body 2 is slightly larger than the ends of the leads 4 of the IC package 3.

The main body 2 includes an IC package 3
At a position corresponding to the plurality of leads 4, thin connection terminals 6 each made of a conductive material are provided. As shown in FIGS. 1 and 2, the connection terminal 6 has an L-shape corresponding to a corner formed by the bottom surface and the side surface of the main body 2, and is exposed inside and outside the main body 2. As shown in FIG. 3, a round protrusion is formed on a surface of the connection terminal 6 on the inner surface side with which the lead 4 contacts.

A wedge-shaped guide portion 2 ′ is formed between the connection terminals 6 and at the corners on the inner side surface of the main body 2. On the other hand, the IC package 3 is attached to the main body 2 in the lid.
A holding pin 5 for holding the lead 4 when housed inside and closed is provided. When the socket is not used, the footprint pattern 8 on the substrate 1 is
The footprint pattern 8 to which the lead 4 is directly soldered can be used as it is.

(2) Operation of the Embodiment The procedure of mounting the socket of the embodiment having the above configuration on the surface of the substrate 1 and mounting an IC on the socket will be described below. That is, as shown in FIGS. 2 and 3, the main body 2 is placed on the substrate 1 such that the connection terminals 6 match the footprint pattern 8 of the substrate 1. Then, the main body 2 is surface-mounted on the substrate 1 by soldering the connection terminals 6 and the footprint pattern 8. Note that reference numeral 7 shown in FIGS. 2 and 3 denotes solder.

Next, the IC package 3 is housed in the main body 2 so that the leads 4 are mounted on the connection terminals 6.
At this time, the lead 4 is guided by the guide portion 2 '. When the lid is closed, the lead 4 is pressed against the connection terminal 6 by the holding pin 5 provided on the lid. As a result, the leads 4 of the IC are electrically connected to the footprint pattern 8.

(3) Effects of the Embodiment The effects of the present embodiment as described above are as follows. That is, the socket can be surface-mounted on the board 1 without the need for a special board structure or layout on the premise of mounting the socket, and with the footprint pattern 8 to which the IC is directly soldered. To evaluate a large number of ICs.

The leads 4 of the IC and the footprint pattern 8 are connected so as to sandwich the thin plate-like connection terminal 6 from above and below, and the connection terminal 6 and the footprint pattern 8 are directly soldered. Therefore, the wiring distance is greatly reduced, and parasitic components such as parasitic inductance can be significantly reduced. In particular, even when a high-frequency element such as an RF-IC is targeted, accurate evaluation can be performed without deteriorating high-frequency characteristics.

Further, by evaluating a high-frequency semiconductor device such as an RF-IC using the present invention, it is possible to effectively develop and design a high-frequency circuit such as a GHz band, which is increasingly required in the future. Parts evaluation becomes possible.

Further, since the connection terminal 6 is L-shaped, soldering can be easily performed from the side surface side, connection with the footprint pattern 8 can be ensured on the bottom side, and the strength of the connection portion is increased. .

Further, since the lead 4 is pressed against the connection terminal 6 by the pressing pin 5, the contact resistance can be reduced. In particular, since the contact surface of the connection terminal 6 with the lead 4 is round and protruded, the contact resistance can be stably reduced.

Further, since the guide portion 2 'is provided in the main body portion 2, the lead 4 can be securely fitted to the connection terminal 6, and the mechanical strength of the bottom portion and the side portion of the main body portion 2 is improved. I do.

(4) Other Embodiments The present invention is not limited to the above embodiments. For example, the materials, sizes, shapes, numbers, and the like of the main body, the connection terminals, and the guides can be freely changed at the design stage. For example, the connection terminal is made of a material mainly composed of copper,
In particular, it is conceivable to use beryllium copper or the like,
It is not limited to this. Various insulating materials such as ceramics and resin can also be used for the main body and the guide, and are not limited to specific materials. Furthermore, if the inside of the main body and the guide are made of a material having a smooth surface, the alignment of the leads can be performed more smoothly.

The lid may have any structure. For example, any structure may be used, such as a structure provided with a hinge so as to be openable and closable with the main body, a structure provided detachably from the main body, and a structure integrally formed with the main body and closable.

Further, the urging portion is not limited to the holding pin. For example, a configuration may be employed in which the leads are pressed by raising the ceiling surface on the lid side into a specific shape. Further, the urging portion may be made of an elastic body. The protrusion or protrusion of the connection terminal is not limited to the shape shown in the drawings. And it is also possible to omit the guide part of the main body part and the protrusion or protrusion of the connection terminal. Further, the present invention provides a high-frequency semiconductor device, RF-
Although suitable for IC, it can be widely applied to other semiconductor devices.

[0033]

As described above, according to the present invention,
It is possible to provide a semiconductor element socket that can be surface-mounted on a substrate and can accurately evaluate a large number of semiconductor elements regardless of a structure or a layout that presupposes socket mounting.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main body in one embodiment of a semiconductor element socket of the present invention.

FIG. 2 is a longitudinal sectional view showing a connection structure between a connection terminal, a lead, and a footprint pattern in the embodiment of FIG. 1;

FIG. 3 is a sectional view taken along line XX ′ of FIG. 2;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Board 2 ... Body part 2 '... Guide part 3 ... IC package 4 ... Lead 5 ... Holding pin 6 ... Connection terminal 7 ... Solder 8 ... Footprint pattern

Claims (5)

[Claims] 1. A semiconductor element socket comprising: a box-shaped main body capable of accommodating a semiconductor element; and a connection terminal for electrically connecting a lead of the semiconductor element to a wiring on a substrate. A part of which is provided on an outer peripheral surface of the main body so as to be surface mountable on the substrate. 2. The semiconductor device socket according to claim 1, wherein the connection terminal is formed in an L shape so as to match a corner between a bottom surface and an outer peripheral surface of the main body. 3. A lid for covering the main body, wherein the lid is provided with an urging portion for urging a lead of the semiconductor element in contact with the connection terminal toward the connection terminal. The socket for a semiconductor device according to claim 1, wherein: 4. The semiconductor element socket according to claim 3, wherein a contact portion of the connection terminal with the lead of the semiconductor element is raised or protruded toward the lead of the semiconductor element. 5. The semiconductor device according to claim 1, wherein a guide portion for guiding the movement of the lead is provided between the connection terminals in the main body. Socket.