KR100719258B1 - An installing structure of integrated circuit - Google Patents

An installing structure of integrated circuit Download PDF

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Publication number
KR100719258B1
KR100719258B1 KR1020050117786A KR20050117786A KR100719258B1 KR 100719258 B1 KR100719258 B1 KR 100719258B1 KR 1020050117786 A KR1020050117786 A KR 1020050117786A KR 20050117786 A KR20050117786 A KR 20050117786A KR 100719258 B1 KR100719258 B1 KR 100719258B1
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South Korea
Prior art keywords
integrated circuit
adapter
circuit board
printed circuit
leg
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KR1020050117786A
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Korean (ko)
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박홍식
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주식회사 대우일렉트로닉스
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 집적회로의 장착구조에 관한 것으로서, 보다 자세하게는 인쇄회로기판에 형성된 각 장착홈에 납땜되는 레그가 측면에 형성되며 열전도성이 높은 재질을 사용하여 성형되는 어댑터와; 상기 어댑터에 안착되며 각 레그와 접촉하는 리드를 4측면에 구비하는 집적회로를 통해, 인쇄회로기판에 전기신호의 전송이 가능하도록 어댑터가 장착되고, 상기 어댑터에 집적회로가 전기신호의 전송이 가능하도록 설치됨으로써, 상기 어댑터를 통해 방열이 가능할 뿐만 아니라, 납땜 작업 없이 집적회로의 설치가 가능하여 집적회로의 반복 설치도 가능해진다.The present invention relates to a mounting structure of an integrated circuit, and more specifically, the adapter is formed on the side of the leg is soldered to each mounting groove formed in the printed circuit board and formed using a high thermal conductivity material; The adapter is mounted to the printed circuit board to transmit an electrical signal through an integrated circuit mounted on the adapter and provided with four sides of the leads in contact with each leg, and the integrated circuit may transmit the electrical signal to the adapter. By being installed so that the heat dissipation is possible through the adapter, it is possible to install the integrated circuit without soldering operation, thereby enabling the repeated installation of the integrated circuit.

집적회로, 인쇄회로기판, 교환, 납땜, 방열 Integrated Circuit, Printed Circuit Board, Exchange, Soldering, Heat Dissipation

Description

집적회로의 장착구조{AN INSTALLING STRUCTURE OF INTEGRATED CIRCUIT}INSTALLING STRUCTURE OF INTEGRATED CIRCUIT}

도 1은 종래 큐에프피 타입 집적회로와 인쇄회로기판의 결합 관계를 나타내는 도면.1 is a view showing a coupling relationship between a conventional CFP type integrated circuit and a printed circuit board.

도 2는 본 발명에 따른 집적회로의 설치 상태를 나타내는 분해 사시도.2 is an exploded perspective view showing an installation state of an integrated circuit according to the present invention;

*도면의 주요부분에 대한 부호의 설명** Explanation of symbols for main parts of drawings *

30 : 어댑터 31 : 방열판30: adapter 31: heat sink

32 : 방열홀 33 : 격벽32: heat dissipation hole 33: partition wall

34 : 레그 35 : 접촉홈34: leg 35: contact groove

36 : 가이드홈 40 : 덮개36: guide groove 40: cover

41 : 후크41: hook

본 발명은 인쇄회로기판에 어댑터가 장착되고, 상기 어댑터에 집적회로가 안 착되되, 상기 어댑터를 매개로 전자 신호가 전송되어 집적회로가 작동할 뿐만 아니라 방열이 가능한 것을 특징으로 하는 집적회로 장착구조에 관한 것이다.The present invention is an integrated circuit mounting structure, characterized in that the adapter is mounted on a printed circuit board, the integrated circuit is mounted on the adapter, the electronic signal is transmitted through the adapter to not only operate the integrated circuit but also heat dissipation. It is about.

일반적으로 집적회로(集積回路;integrated circuit)는 많은 전자회로 소자가 하나의 기판(基板:substrate) 위 또는 기판 자체에 분리가 불가능한 상태로 결합되어 있는 초소형 구조의 기능적인 복합적 전자소자 또는 시스템을 말한다.In general, an integrated circuit refers to a functional complex electronic device or system having a micro structure in which many electronic circuit devices are inseparably coupled onto a substrate or to the substrate itself. .

상기한 집적회로 중에서 큐에프피(QFP;quad flat package) 타입은 사각 형상의 판 4측면에 리드가 돌출 형성된다.Among the integrated circuits, a QF (quad flat package) type has a lead protruding from four sides of a rectangular plate.

따라서, 상기한 큐에프피 방식의 집적회로는 인두를 사용하여 각 리드를 인쇄회로기판에 접합하게 된다.Therefore, in the above KUF-type integrated circuit, each lead is bonded to the printed circuit board using a soldering iron.

도 1은 종래 큐에프피 타입 집적회로와 인쇄회로기판의 결합 관계를 나타내는 도면이다.1 is a view showing a coupling relationship between a conventional CFP type integrated circuit and a printed circuit board.

도시된 바와 같이, 큐에프피 방식의 집적회로(10)는 평평한 사각 형상의 몸체(11) 각 측면에 리드(12)가 돌출 형성된다.As illustrated, in the QP-type integrated circuit 10, the leads 12 protrude from each side of the flat square body 11.

그리고, 인쇄회로기판(13)에는 상기 집적회로(10)가 장착되는데, 상기 각 리드(12)가 납땜되기 위한 장착홈(14)이 형성된다.The integrated circuit 10 is mounted on the printed circuit board 13, and mounting grooves 14 for soldering the leads 12 to each other are formed.

따라서, 상기 인쇄회로기판의 장착홈(14)에 집적회로(10)의 각 리드(12)을 꽂은 다음, 인두를 사용하여 납땜한다.Therefore, each lead 12 of the integrated circuit 10 is plugged into the mounting groove 14 of the printed circuit board, and then soldered using a soldering iron.

상기 장착홈(14)에는 전기적 신호가 이동하기 위한 재질로 성형된다.The mounting groove 14 is formed of a material for moving an electrical signal.

그러나, 상기한 집적회로는 자체 발열양이 크기 때문에, 열을 방출하기 위한 별도의 방열핀이나 방열팬이 상기 집적회로에 추가로 장착되어야 하는 문제점이 있 다.However, since the integrated circuit has a large self-heating amount, there is a problem that a separate radiating fin or a radiating fan for dissipating heat is additionally mounted to the integrated circuit.

그리고, 상기 집적회로의 본체 각 측면에 형성되는 리드의 개수가 많기 때문에, 각 리드를 납땜하는데 많은 작업시간이 소요되는 문제점이 있다.In addition, since the number of leads formed on each side of the main body of the integrated circuit is large, there is a problem in that it takes a long time to solder each lead.

이에 본 발명은 상기와 같은 문제점들을 해소하기 위해 안출된 것으로서, 본 발명은 큐에프피 방식의 집적회로의 열을 방출하면서 상기 집적회로의 각 리드와 연결되는 어댑터가 인쇄회로기판의 장착홈에 전기적으로 연결되도록 함을 목적으로 한다.Accordingly, the present invention has been made to solve the above problems, the present invention is an adapter connected to each of the leads of the integrated circuit while dissipating the heat of the cuppy integrated circuit is electrically connected to the mounting groove of the printed circuit board It is intended to be connected to.

상기와 같은 목적을 달성하기 위한 본 발명은 인쇄회로기판에 형성된 각 장착홈에 납땜되는 레그가 측면에 형성되며 열전도성이 높은 재질을 사용하여 성형되는 어댑터와; 상기 어댑터에 안착되며 각 레그와 접촉하는 리드를 4측면에 구비하는 집적회로를 포함하는 것을 특징으로 하는 집적회로의 장착 구조를 제공한다.The present invention for achieving the above object is an adapter is formed on the side of the leg is soldered to each mounting groove formed in the printed circuit board and molded using a high thermal conductivity material; Provided is an integrated circuit mounting structure comprising an integrated circuit mounted on the adapter and having leads on four sides in contact with each leg.

상기한 장착구조는 인쇄회로기판에 전기신호의 전송이 가능하도록 어댑터가 장착되고, 상기 어댑터에 집적회로가 전기신호의 전송이 가능하도록 설치됨으로써, 상기 어댑터를 통해 방열이 가능할 뿐만 아니라, 납땜 작업 없이 집적회로의 설치가 가능하여 집적회로의 반복 설치도 가능해진다.The mounting structure is an adapter is mounted on the printed circuit board to transmit the electrical signal, the integrated circuit is installed in the adapter to transmit the electrical signal, not only heat dissipation through the adapter, but also without soldering work Since the integrated circuit can be installed, the integrated circuit can be repeatedly installed.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명한다.Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

또한, 본 실시예는 본 발명의 권리범위를 한정하는 것이 아니라 단지 예시로 제시된 것이며, 종래 구성과 동일한 부분은 동일한 부호 또는 명칭을 사용한다.In addition, this embodiment is presented by way of example only, not limiting the scope of the present invention, the same parts as the conventional configuration uses the same reference numerals or names.

도 2는 본 발명에 따른 집적회로의 설치 상태를 나타내는 분해 사시도이다.2 is an exploded perspective view showing an installation state of an integrated circuit according to the present invention.

도시한 바와 같이, 본 발명은 큐에프피 방식의 집적회로(10)에 관한 것인바, 인쇄회로기판(20)에는 사방면으로 다수의 장착홈(21)이 형성된다.As shown in the drawing, the present invention relates to an integrated circuit 10 of a CFP type, and a plurality of mounting grooves 21 are formed in four directions on a printed circuit board 20.

그리고, 상기 인쇄회로기판(20)의 상측에 열전도성이 뛰어난 재질로 성형된 어댑터(30)가 위치한다.In addition, the adapter 30 formed of a material having excellent thermal conductivity is positioned above the printed circuit board 20.

상기 어댑터(30)는 인쇄회로기판(20)의 각 장착홈(21)에 납땜되기 위해 측면에 복수의 레그(34)가 형성되며, 집적회로(10)는 상기 어댑터(30)에 안착되며, 각 레그(34)와 접촉하기 위해 4측면에 복수의 리드(12)가 형성된다.The adapter 30 is formed with a plurality of legs 34 on the side to be soldered to each mounting groove 21 of the printed circuit board 20, the integrated circuit 10 is seated on the adapter 30, A plurality of leads 12 are formed on four sides to contact each leg 34.

상기 어댑터(30)에 대한 실시예로서, 방열판(31), 격벽(33) 및 레그(34)로 이루어진다.As an embodiment of the adapter 30, it consists of a heat sink 31, partition 33 and leg 34.

상기 방열판(31)은 인쇄회로기판(20)에 안착되는 4각 평판 형상으로 이루어지고, 다수의 방열홀(32)이 형성된다.The heat dissipation plate 31 has a quadrangular flat plate shape seated on the printed circuit board 20, and a plurality of heat dissipation holes 32 are formed.

상기 격벽(33)은 방열판(31)의 각 측면에서 상방으로 연장 형성된다.The partition 33 extends upward from each side surface of the heat sink 31.

상기 레그(34)는 각 격벽(33)에 내장되고 전기적 신호가 전송될 수 있는 재질로 성형되는데, 상기 격벽(33)에 내장된 레그(34)의 외측은 연장되어 인쇄회로기판(20)의 장착홈(21)에 각각 납땜되며, 내측은 집적회로(10)의 리드(12)에 각각 접촉되기 위한 접촉홈(35)이 형성된다.The legs 34 are formed of a material that is embedded in each partition 33 and to which an electrical signal can be transmitted, and the outside of the legs 34 embedded in the partition 33 extends to form the printed circuit board 20. The contact grooves 35 are respectively soldered to the mounting grooves 21, and the inner side thereof is in contact with the leads 12 of the integrated circuit 10.

이때, 상기 각 격벽(33)의 내측에는 집적회로(10)의 리드(12)를 레그(34)의 접촉홈(35)으로 안내하기 위한 가이드홈(36)이 형성된다.At this time, a guide groove 36 for guiding the lead 12 of the integrated circuit 10 to the contact groove 35 of the leg 34 is formed inside each of the partition walls 33.

한편, 상기 방열판(31)을 커버하면서 집적회로(10)의 이탈 방지 및 리드(12)가 레그(34)의 접촉홈(35)에 안정적으로 위치하도록, 덮개(40)가 설치된다.On the other hand, the cover 40 is installed so as to cover the heat sink 31 and prevent the separation of the integrated circuit 10 and the lead 12 is stably positioned in the contact groove 35 of the leg 34.

상기 덮개(40)의 외주면은 방열판(31)과 같거나 작은 면적을 가지도록 설계하고, 외주면에는 다수의 후크(41)가 돌출 형성된다.The outer circumferential surface of the cover 40 is designed to have an area equal to or smaller than that of the heat sink 31, and a plurality of hooks 41 protrude from the outer circumferential surface.

그리고, 상기 후크(41)가 걸림 고정되도록, 상기 격벽(33)에는 후크(41)에 대응하는 고정홀(42)이 형성된다.In addition, a fixing hole 42 corresponding to the hook 41 is formed in the partition 33 so that the hook 41 is locked.

상기와 같은 구조로 이루어진 본 발명의 작용 및 효과는 다음과 같다.The action and effect of the present invention made of the above structure is as follows.

장착홈(21)이 형성된 인쇄회로기판(20)에 어댑터(30)의 레그(34)를 각각 납땜함으로써, 상기 어댑터(30)는 집적회로(10)와 인쇄회로기판(20)을 전기적으로 연결시켜주는 매개체가 될 뿐만 아니라, 집적회로(10)의 방열을 가능케 한다.By soldering the legs 34 of the adapter 30 to the printed circuit board 20 on which the mounting grooves 21 are formed, the adapter 30 electrically connects the integrated circuit 10 and the printed circuit board 20. In addition to being a mediator, the heat dissipation of the integrated circuit 10 is possible.

즉, 어댑터(30)가 인쇄회로기판(20)에 장착된 상태에서, 집적회로(10)를 방열판(21)에 안착시키면서 리드(12)가 레그(34)의 접촉홈(35)에 접촉하도록 하면, 집적회로(10)와 인쇄회로기판(20)은 레그(34)에 의해 전기적으로 연결된다.That is, while the adapter 30 is mounted on the printed circuit board 20, the lead 12 contacts the contact groove 35 of the leg 34 while seating the integrated circuit 10 on the heat sink 21. The integrated circuit 10 and the printed circuit board 20 are electrically connected by legs 34.

그리고, 상기 집적회로(10)가 구동하여 열이 발생하면, 열전도성이 높은 어댑터(30)로 인해 집적회로(10)의 냉각이 가능한데, 상기 방열판(31)의 방열홀(32)은 열 배출 및 공기의 유동으로 집적회로(10)의 냉각을 가능케 한다.In addition, when the integrated circuit 10 is driven to generate heat, the integrated circuit 10 may be cooled by the adapter 30 having high thermal conductivity, and the heat dissipation hole 32 of the heat sink 31 may discharge heat. And the flow of air enables cooling of the integrated circuit 10.

이때, 상기 어댑터(30)의 격벽(33) 내측에는 가이드홈(36)이 형성됨으로써, 집적회로(10)의 리드(12)는 가이드홈(36)에 의해 접촉홈(35)으로 안내된다.At this time, the guide groove 36 is formed inside the partition 33 of the adapter 30, so that the lead 12 of the integrated circuit 10 is guided to the contact groove 35 by the guide groove 36.

한편, 상기 접촉홈(35)과 접촉하는 집적회로(10)의 리드(12)는 외부 충격에 의해 접촉이 안정적으로 이루어지지 않을 수 있는바, 덮개(40)의 외주면에 형성된 후크(41)가 격벽(33)에 형성된 고정홀(42)에 걸림 고정되도록 한다.On the other hand, the lead 12 of the integrated circuit 10 in contact with the contact groove 35 may not be stable contact due to external impact, the hook 41 formed on the outer peripheral surface of the cover 40 It is to be fixed to the fixing hole 42 formed in the partition 33.

그리하면, 상기 덮개(40)의 저면이 집적회로(10)의 상측을 지지하고, 상기 집적회로(10)의 몸체(11) 저면은 방열판(31)에 밀착됨으로써, 외부 충격이 발생하더라도 집적회로(10)의 리드(12)는 격벽(33)에 형성된 레그(34)의 접촉홈(35)에서 이탈되지 않고 안정적으로 접촉된 상태를 유지하게 된다.Then, the bottom surface of the cover 40 supports the upper side of the integrated circuit 10, the bottom surface of the body 11 of the integrated circuit 10 is in close contact with the heat sink 31, even if an external impact occurs, the integrated circuit The lid 12 of 10 may remain in a stable contact state without being separated from the contact groove 35 of the leg 34 formed in the partition 33.

상기한 바와 같이 본 발명에 따른 집적회로의 장착구조는 열전도성이 뛰어난 어댑터가 인쇄회로기판에 장착되고, 상기 어댑터를 매개로 집적회로가 장착되어 기능을 수행함으로써, 별도의 방열부품을 설치하지 않더라도 집적회로의 방열이 가능한 효과가 있다.As described above, the mounting structure of the integrated circuit according to the present invention has an adapter having excellent thermal conductivity mounted on a printed circuit board, and the integrated circuit is mounted through the adapter to perform a function, even if a separate heat dissipation component is not installed. The heat radiation of the integrated circuit is possible.

그리고, 상기 집적회로가 어댑터에서 탈부착이 용이하게 이루어지기 때문에, 집적회로의 테스트 비용을 절감하는 이점이 있다.In addition, since the integrated circuit is easily detachable from the adapter, there is an advantage of reducing the test cost of the integrated circuit.

Claims (4)

삭제delete 인쇄회로기판에 안착되며 다수의 방열홀이 형성되는 사각형상의 방열판과; 상기 방열판의 각 측면에서 상방으로 연장 형성되는 격벽과; 상기 각 격벽에 내장되되, 외측은 연장되어 인쇄회로기판의 장착홈에 납땜되는 레그가 구비되는 어댑터와;A rectangular heat sink mounted on the printed circuit board and having a plurality of heat dissipation holes formed therein; Partition walls extending upward from each side surface of the heat sink; An adapter having a leg embedded in each of the partition walls, the outer side of which is extended to be soldered to the mounting groove of the printed circuit board; 상기 어댑터에 안착되며 각 레그와 접촉하는 리드를 4측면에 구비하는 집적회로를 포함하는 것을 특징으로 하는 집적회로의 장착 구조.And an integrated circuit mounted on the adapter and having leads on four sides contacting each leg. 제 2항에 있어서, 상기 각 격벽의 내측에는 집적회로의 리드를 레그의 접촉홈으로 안내하기 위한 가이드홈이 형성되는 것을 특징으로 하는 집적회로의 장착 구조.3. The mounting structure of the integrated circuit according to claim 2, wherein a guide groove for guiding the leads of the integrated circuit to the contact grooves of the legs is formed inside each of the partition walls. 제 2항에 있어서, 상기 각 격벽에는 고정홀이 형성되고, According to claim 2, wherein each of the partition wall is formed with a fixing hole, 상기 방열판을 커버하는 덮개는 각 측면에 후크가 형성되어 상기 고정홀에 걸림 고정되는 것을 특징으로 하는 집적회로의 장착 구조.The cover for covering the heat sink is a hook structure formed on each side is characterized in that the mounting structure of the integrated circuit is fixed to the fixing hole.
KR1020050117786A 2005-12-05 2005-12-05 An installing structure of integrated circuit KR100719258B1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326091A (en) * 1992-05-25 1993-12-10 Matsushita Electric Ind Co Ltd Ic socket and multilayer printed board provided with heat radiating mechanism
JPH0817533A (en) * 1994-06-29 1996-01-19 Fuji Electric Co Ltd Socket with radiating function for ic package
US5588847A (en) * 1995-04-13 1996-12-31 Tate; John O. Chip carrier mounting system
JP2001244038A (en) 2000-02-29 2001-09-07 Clarion Co Ltd Socket for semiconductor device
KR20040009667A (en) * 2002-07-24 2004-01-31 미래산업 주식회사 Carrier Module for Semiconductor Test Handler

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326091A (en) * 1992-05-25 1993-12-10 Matsushita Electric Ind Co Ltd Ic socket and multilayer printed board provided with heat radiating mechanism
JPH0817533A (en) * 1994-06-29 1996-01-19 Fuji Electric Co Ltd Socket with radiating function for ic package
US5588847A (en) * 1995-04-13 1996-12-31 Tate; John O. Chip carrier mounting system
JP2001244038A (en) 2000-02-29 2001-09-07 Clarion Co Ltd Socket for semiconductor device
KR20040009667A (en) * 2002-07-24 2004-01-31 미래산업 주식회사 Carrier Module for Semiconductor Test Handler

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