CN211128747U - Heat extraction structure and electronic equipment - Google Patents
Heat extraction structure and electronic equipment Download PDFInfo
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- CN211128747U CN211128747U CN201921878576.2U CN201921878576U CN211128747U CN 211128747 U CN211128747 U CN 211128747U CN 201921878576 U CN201921878576 U CN 201921878576U CN 211128747 U CN211128747 U CN 211128747U
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Abstract
The utility model relates to a heat extraction structure and electronic equipment, it saves the space on the base plate and obtains higher cooling effect. This heat extraction structure includes: a first integrated circuit (20) that is disposed outside a frame (9) of an electronic device (1) and generates heat; a first heat sink (30) which is disposed outside the frame (9) and which dissipates heat generated in the first integrated circuit (20); a first heat discharge flow path (40) which is formed outside the frame (9) and through which air heated by the first integrated circuit (20) that generates heat flows; and an exhaust fan (80) that exhausts air from the inside to the outside of the frame (9), wherein the exhaust fan (80) is disposed near the downstream end of the first exhaust heat flow path (40), and when the exhaust fan (80) is in operation, the air flowing out from the downstream end of the first exhaust heat flow path (40) flows in a direction away from the frame (9).
Description
Technical Field
The utility model relates to a heat extraction structure and electronic equipment.
Background
It is known that electronic components such as a control circuit mounted on a substrate of an electronic device generate heat and have a heat dissipation structure (see, for example, patent document 1). In the technique described in patent document 1, a heat radiating member to which a plurality of heat generating components are fixed is fixed in a frame.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2002-141451
SUMMERY OF THE UTILITY MODEL
Problem to be solved by the utility model
With the development of higher functions of electronic devices, space saving of components disposed on a substrate is desired. In addition, for example, when a heat dissipation member such as a heat sink is disposed inside the frame, heat may be accumulated inside the frame. Therefore, in order to maintain the cooling effect of the electronic component, it is desirable that the heat dissipation member be appropriately cooled.
The present invention has been made in view of the above problems, and an object of the present invention is to save space on a substrate and obtain a higher cooling effect.
Means for solving the problems
In order to solve the above problems and achieve the object, the present invention relates to a heat extraction structure, which is characterized by comprising: a first electronic component which is arranged outside a frame of the electronic device and generates heat; a first heat dissipation member disposed outside the frame and configured to dissipate heat generated in the first electronic component; a first heat discharge flow path formed outside the frame and configured to discharge air heated by the first electronic component that generates heat; and an exhaust fan that exhausts air from an inside of the frame to an outside, the exhaust fan being disposed close to a downstream end of the first exhaust flow path, and the air flowing out from the downstream end of the first exhaust flow path flows in a direction away from the frame when the exhaust fan is operated.
In order to solve the above problems and achieve the object, the present invention relates to an electronic device, comprising: the heat exhaust structure; and a substrate on which the electronic component is mounted.
Effect of the utility model
According to the utility model discloses, play and to save the space on the base plate and obtain the effect of higher cooling effect.
Drawings
Fig. 1 is a perspective view showing an electronic device having a heat dissipation structure according to a first embodiment;
fig. 2 is an exploded perspective view of the heat exhausting structure according to the first embodiment;
fig. 3 is a perspective view showing a first heat sink according to the first embodiment;
fig. 4 is a sectional view showing a heat exhausting structure according to the first embodiment;
fig. 5 is a perspective view showing an electronic device having a heat dissipation structure according to a second embodiment;
fig. 6 is an exploded perspective view of a heat exhaust structure according to a second embodiment;
fig. 7 is a perspective view showing a first heat sink according to a second embodiment;
fig. 8 is a sectional view showing a heat exhausting structure according to a second embodiment;
fig. 9 is a cross-sectional view showing an example of a conventional heat release structure.
Detailed Description
Hereinafter, an embodiment of an electronic device 1 including the heat radiation structure 10 according to the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.
First embodiment
Fig. 1 is a perspective view showing an electronic device having a heat dissipation structure according to a first embodiment. Fig. 2 is an exploded perspective view of the heat release structure according to the first embodiment. Fig. 3 is a perspective view showing a first heat sink according to the first embodiment. Fig. 4 is a sectional view showing the heat exhausting structure according to the first embodiment. The electronic device 1 is, for example, an AV integrated car navigation system, a car audio system, or the like. The electronic apparatus 1 includes a first substrate (substrate) 2, a second substrate 3, a frame 9, and a heat exhausting structure 10.
The first substrate 2 is a plate-shaped printed substrate. More specifically, the first substrate 2 is configured by electrically connecting electronic components such as a first Integrated Circuit (IC) 20, a resistor, a capacitor, and a transistor, which are disposed on a plate material made of an insulator. The first substrate 2 outputs control signals to each part of the electronic apparatus 1. The first substrate 2 is formed with through holes, not shown, into which terminals of the first integrated circuits 20 are inserted. The portion of the first substrate 2 where the through-hole is formed is exposed outside the frame 9. The first substrate 2 is mounted with, for example, electronic components constituting a circuit for controlling the power supply voltage of the electronic device 1. In the present embodiment, the first substrate 2 is disposed below the electronic device 1.
The second substrate 3 is a plate-shaped printed substrate. More specifically, the second substrate 3 is configured by electrically connecting electronic components such as a second integrated circuit (second electronic component) 50, a resistor, a capacitor, and a transistor, for example, which are disposed on a plate material made of an insulator. The second substrate 3 outputs control signals to each part of the electronic apparatus 1. The second substrate 3 is formed with through holes, not shown, into which terminals of the second integrated circuits 50 are inserted. The second substrate 3 is mounted with, for example, electronic components constituting a circuit for controlling each function of the electronic apparatus 1. On the second substrate 3, heat generating components including the second integrated circuit 50 and semiconductors such as a flash memory having low heat resistance coexist. In the present embodiment, the second substrate 3 is disposed above the first substrate 2.
The frame 9 covers the outer periphery of the electronic apparatus 1. The frame 9 has a panel 91 as a back panel. A bracket 25 covering the first integrated circuit 20 is mounted on the panel 91. The first heat sink 30 of the heat dissipation structure 10 is mounted on the panel 91 so as to face the first integrated circuit 20.
The heat exhaust structure 10 exhausts heat generated in the electronic apparatus 1. The heat dissipation structure 10 includes a first integrated circuit 20, a first heat sink (heat dissipation member) 30, a second integrated circuit 50, a second heat sink (second heat dissipation member) 60, and an exhaust fan 80.
The first integrated circuit 20 is a power supply IC that supplies a power supply voltage. The first integrated circuit 20 is disposed outside the frame 9, and generates heat by the operation of the electronic apparatus 1. The first integrated circuit 20 is disposed on the first substrate 2. Since the first integrated circuit 20 has the highest temperature in the electronic device 1, it is arranged outside the frame 9, and it is difficult to accumulate heat inside the frame 9. The first integrated circuit 20 has a substrate on which heat-generating electronic components are mounted, housed in a thin rectangular parallelepiped box-shaped case 21. In the first integrated circuit 20, the case 21 is heated to a high temperature by heat generated by the electronic components mounted thereon.
The case 21 has a main surface 21a and a main surface 21b opposite to the main surface 21 a. The housing 21 has holding portions 22 and 23 formed at both ends of the housing 21 in the lateral width direction. The holding portions 22 and 23 are formed in the center in the height direction of the housing 21. The holding portions 22 and 23 are formed so that the housing 21 is recessed inward in the lateral width direction. The holding portion 22 is formed slightly larger than the outer periphery of the shaft portion of the first fastening member S1. The holding portion 23 is formed slightly larger than the outer periphery of the shaft portion of the second fastening member S2. The shaft portion of the first fastening member S1 is inserted into the holding portion 22. The shaft portion of the second fastening member S2 is inserted into the holding portion 23. The plurality of terminals 24 protrude downward from the lower portion of the housing 21. The terminal 24 outputs an electrical signal generated on the substrate within the first integrated circuit 20. The terminals 24 are inserted and soldered in the through holes of the first substrate 2.
The bracket 25 is a frame supported on the outside of the frame 9 in a state of covering the first integrated circuit 20. The bracket 25 is formed by bending a sheet material. The bracket 25 and the main surface 21b of the housing 21 are in close contact with each other on the surfaces. The bracket 25 is made of a material having lower thermal conductivity than the case 21 of the first integrated circuit 20 and the first heat sink 30. The heat generated in the first integrated circuit 20 is difficult to be conducted to the bracket 25.
The first heat sink 30 radiates heat generated in the first integrated circuit 20. The first heat sink 30 is disposed outside the frame 9. In other words, the first heat sink 30 is exposed to the outside of the frame 9. The first heat sink 30 is disposed along the panel 91 of the frame 9. The first heat sink 30 is made of a material having higher thermal conductivity than the case 21, the bracket 25, and the frame 9 of the first integrated circuit 20. The first heat sink 30 is formed of, for example, an aluminum material. In the case where the temperature of the first heat sink 30 is lower than the temperature of the case 21, heat generated in the first integrated circuit 20 is conducted to the first heat sink 30. Since the first heat sink 30 is always cooled by the air outside the frame 9 when the temperature of the first heat sink 30 is higher than the temperature of the air outside the frame 9, heat is hardly transferred to the bracket 25 and the frame 9 even when the temperature of the first heat sink 30 is higher than the temperature of the bracket 25 and the frame 9.
The first heat sink 30 is formed to have a U-shaped cross-sectional shape in plan view. In more detail, the first heat sink 30 includes: a wall portion 31; a wall portion 32 disposed in a plane orthogonal to the wall portion 31 from one end portion in the lateral width direction of the wall portion 31; a wall portion 33 disposed opposite to the wall portion 32 and disposed in a plane orthogonal to the wall portion 31 from the other end portion in the lateral width direction of the wall portion 31; a contact portion 34 in contact with the panel 91; and a cutout portion 35. The wall portion 31, the wall portion 32, the wall portion 33, and the contact portion 34 are formed integrally.
The wall portion 31 is formed in a rectangular shape having a larger area than the bracket 25. The wall 31 is disposed parallel to the panel 91 of the frame 9. The outer periphery of the wall portion 31 is exposed to the outside of the frame 9. The wall 31 and the main surface 21a of the first integrated circuit 20 accommodated in the bracket 25 are in close contact with each other on the surfaces. The wall portion 31 conducts heat from the main surface 21a of the first integrated circuit 20 when the temperature is lower than the temperature of the main surface 21a of the first integrated circuit 20. The heat conducted to the wall portion 31 is conducted to the wall portion 32, the wall portion 33, and the contact portion 34.
The wall portion 32 is disposed separately from the bracket 25. The outer periphery of the wall portion 32 is exposed to the outside of the frame 9.
The wall portion 33 is disposed separately from the bracket 25. The outer periphery of the wall portion 33 is exposed to the outside of the frame 9.
The contact portion 34 is disposed opposite to the upper portion of the wall portion 31. The height-direction length of the contact portion 34 is shorter than the wall portion 31. The contact portion 34 connects an upper portion of the wall portion 32 and an upper portion of the wall portion 33. The contact portion 34, the upper portion of the wall portion 31, the upper portion of the wall portion 32, and the upper portion of the wall portion 33 are arranged in a cylindrical shape. The first integrated circuit 20 is disposed below the contact portion 34. The contact portion 34 and the face plate 91 of the frame 9 are in close contact with each other on the surface. When the temperature of the contact portion 34 is higher than the temperature of the panel 91, heat is transmitted to the frame 9.
The notch 35 is formed by cutting a lower portion of the wall 31 into a rectangular shape. The notch 35 communicates the outside and the inside of the first radiator 30. The notch 35 is an inlet through which air flows from the outside to the inside of the first radiator 30.
The first heat sink 30 thus configured is assembled outside the frame 9 by the first fastening part S1 and the second fastening part S2.
Here, the first fastening member S1 and the second fastening member S2 will be explained. The first fastening part S1 and the second fastening part S2 are fastened on the panel 91 of the frame 9 in a state where the first heat sink 30 covers the first integrated circuit 20. The first fastening member S1 is inserted into the fastening hole 38 formed in the first heat sink 30, the holding portion 22 of the case 21 of the first integrated circuit 20, and an unillustrated female screw formed in the bracket 25 assembled to the frame 9. At this time, the fastening hole 38 of the first radiator 30, the holding portion 22, and the female screw of the bracket 25 are coaxially overlapped.
The second fastening member S2 is inserted into the fastening hole 39 formed in the first heat sink 30, the holding portion 23 of the case 21 of the first integrated circuit 20, and an unillustrated female screw formed in the bracket 25 assembled to the frame 9. At this time, the fastening hole 39 of the first radiator 30, the holding portion 23, and the female screw of the bracket 25 are coaxially overlapped.
The first fastening member S1 and the second fastening member S2 are assembled with the first heat sink 30 on the panel 91 of the frame 9 in a state where the main surface 21a of the case 21 of the first integrated circuit 20 and the surface of the wall portion 31 of the first heat sink 30 are in close contact with each other and the main surface 21b of the case 21 and the surface of the bracket 25 are in close contact with each other.
The first radiator 30 assembled to the frame 9 in this way forms a tubular first exhaust heat flow path 40 between the wall portion 31, the wall portion 32, the wall portion 33, and the contact portion 34. The first radiator 30 is cooled by the air flowing through the first exhaust flow path 40 when the temperature is higher than the air flowing through the first exhaust flow path 40.
The first heat sink 30 conducts heat of the air flowing through the first heat exhaust flow path 40 when the temperature of the air is lower than the temperature of the air flowing through the first heat exhaust flow path 40.
The first heat release flow path 40 allows air heated by the first integrated circuit 20 that generates heat to flow out. The first heat exhaust flow path 40 is a flow path through which air heated by heat generated in the first integrated circuit 20 flows. The first heat exhaust flow path 40 exhausts heat generated in the first integrated circuit 20. The first exhaust heat flow path 40 is a space formed between the wall 31, the wall 32, the wall 33, and the contact portion 34. The first heat exhaust flow path 40 is formed outside the frame 9. The first heat release flow path 40 extends in the vertical direction, and air flows in a convection manner from the lower side to the upper side. More specifically, air flows into the first heat sink 30 from the cutout portion 35 at the lower end portion. Then, the inflowing air is heated by the heat generated in the first integrated circuit 20. Then, the heated air is convected from the lower side to the upper side in the first heat exhaust flow path 40, and flows out from the opening at the upper end of the first heat exhaust flow path 40.
The second integrated circuit 50 is an SoC (System On Chip) that controls each function of the vehicle. The second integrated circuit 50 is disposed inside the frame 9 and generates heat. The second integrated circuit 50 is disposed on the second substrate 3. Since heat generating components including the second integrated circuits 50 and semiconductors having low heat resistance coexist on the second substrate 3, the second integrated circuits 50 are forcibly cooled by directly discharging air by the exhaust fan 80. The second integrated circuit 50 has a substrate on which heat-generating electronic components are mounted, housed in a thin rectangular parallelepiped box-shaped case 51. In the second integrated circuit 50, the case 51 is heated to a high temperature by heat generated by electronic components mounted thereon.
The case 51 has a main surface 51a and a main surface 51b opposite to the main surface 51 a. A plurality of terminals, not shown, project downward from the main surface 51b of the housing 51. The terminals output electrical signals generated on the substrate within the second integrated circuit 50. The terminals are inserted and soldered in the through holes of the second substrate 3.
The second heat sink 60 radiates heat generated in the second integrated circuit 50. The second heat sink 60 is disposed inside the frame 9. The second heat sink 60 extends from the vicinity of the second integrated circuit 50 toward the panel 91 of the frame 9. The second heat sink 60 is made of a material having higher thermal conductivity than the case 51 and the frame 9 of the second integrated circuit 50. The second heat sink 60 is formed of, for example, an aluminum material. In the case where the second heat sink 60 is cooler than the case 51, heat generated in the second integrated circuit 50 is conducted to the second heat sink 60. Since the thermal conductivity of the second heat sink 60 is higher than the thermal conductivity of the case 51 and the frame 9, even in the case of a higher temperature than the case 51 and the frame 9, the heat is hardly conducted to the case 51 and the frame 9. The second heat sink 60 includes a wall portion 61, a wall portion 62 extending obliquely upward from one end portion of the wall portion 61, and a wall portion 63 extending from an upper end portion of the wall portion 62.
The wall portion 61 is formed in a rectangular shape having a larger area than the case 51 of the second integrated circuit 50. The wall portion 61 is arranged parallel to the second substrate 3. The wall portion 61 and the main surface 51a of the second integrated circuit 50 are in close contact with each other on the surface. The wall portion 61 conducts heat from the main surface 51a of the second integrated circuit 50 when the temperature is lower than the main surface 51a of the second integrated circuit 50. The heat conducted to wall portion 61 is conducted to wall portion 62 and wall portion 63.
The wall portion 62 is disposed obliquely to the second substrate 3. The wall portion 62 is spaced apart from the wall portion 61 and is disposed away from the second substrate 3.
The wall 63 is disposed parallel to the second substrate 3. The wall portion 63 is disposed farther from the second substrate 3 than the wall portion 61.
The second heat sink 60 configured as described above forms a cylindrical second exhaust heat flow path 70 between the wall 61, the wall 62, the wall 63, and the surface 3a of the second substrate 3. The second radiator 60 conducts heat of the air flowing through the second heat exhaust flow path 70 when the temperature is lower than the temperature of the air flowing through the second heat exhaust flow path 70. The second radiator 60 is cooled by the air flowing through the second heat exhaust flow path 70 when the temperature is higher than the temperature of the air flowing through the second heat exhaust flow path 70.
The second heat discharge flow path 70 discharges the air heated by the second integrated circuit 50 that generates heat. The second heat exhaust flow path 70 is a flow path through which air heated by heat generated in the second integrated circuit 50 flows. The second heat exhaust flow path 70 exhausts heat generated in the second integrated circuit 50. The second exhaust heat flow path 70 is a space formed between the wall 61, the wall 62, the wall 63, and the surface 3a of the second substrate 3. The cross-sectional area of the second exhaust heat flow path 70 increases from the second integrated circuit 50 side toward the exhaust fan 80 side. In the second exhaust heat flow path 70, when the exhaust fan 80 is operated, air flows from the second integrated circuit 50 side to the exhaust fan 80 side. The air in the second heat exhaust flow path 70 is heated by the heat generated in the first integrated circuit 20. Then, the heated air is discharged to the outside of the frame 9 by the exhaust fan 80.
The exhaust fan 80 exhausts air from the inside of the frame 9 to the outside when the electronic apparatus 1 is operated. The exhaust fan 80 is disposed inside the frame 9. The exhaust fan 80 is disposed in the vicinity of the first radiator 30 and the second radiator 60. More specifically, the exhaust fan 80 is disposed above the first radiator 30. In other words, the exhaust fan 80 is disposed at the downstream end of the first exhaust heat flow path 40, in other words, in the vicinity of the upper end of the first exhaust heat flow path 40. The exhaust fan 80 is disposed downstream of the second radiator 60. In other words, the exhaust fan 80 is disposed in the vicinity of the downstream end of the second exhaust heat flow path 70.
When the exhaust fan 80 configured as described above operates, air heated by heat generated in the second integrated circuit 50 passes through the second exhaust heat flow path 70 and is exhausted to the outside of the frame 9. When the exhaust fan 80 is operated, the air heated by the heat generated in the first integrated circuit 20 flows out from the upper end of the first exhaust heat flow path 40, and then flows in a direction away from the frame 9 with the flow of the air from the inside of the frame 9 to the outside.
The exhaust fan 80 may control the start and stop of the operation based on the temperature inside the frame 9 detected by the temperature sensor, the temperature of the first radiator 30, or the temperature of the second radiator 60. For example, the exhaust fan 80 starts to operate when any one of the temperatures is equal to or higher than the threshold value. For example, the exhaust fan 80 stops operating when any temperature is less than the threshold value.
Next, the operation of the heat release structure 10 of the electronic device 1 configured as described above will be described.
The wall portion 31 of the first heat sink 30 and the main surface 21a of the case 21 of the first integrated circuit 20 are in close contact with each other on the surfaces. The first heat sink 30 is made of a material having higher thermal conductivity than the case 21. In the case where the first heat sink 30 is cooler than the case 21, heat generated in the first integrated circuit 20 is conducted to the first heat sink 30 via the case 21.
The first heat sink 30 is disposed outside the frame 9. When the first heat sink 30 has a higher temperature than the air outside the frame 9, heat is discharged. The first radiator 30 is always cooled by the air outside the frame 9 regardless of the operating state of the exhaust fan 80.
An exhaust fan 80 is disposed near the upper end of the first exhaust heat flow path 40. When the electronic apparatus 1 operates, the exhaust fan 80 exhausts air from the inside to the outside of the frame 9. The air below the first heat release flow path 40 is heated by the heat generated in the first integrated circuit 20 and rises. The rising air flows into the first heat release flow path 40, and flows in a convection from the lower side to the upper side in the first heat release flow path 40. When the exhaust fan 80 is operated, the air flowing out from the upper end of the first exhaust heat flow path 40 flows in a direction away from the frame 9. When the temperature of the first radiator 30 is higher than the temperature of the air flowing through the first heat release flow path 40, heat is released. The first radiator 30 is forcibly cooled by the air flowing through the first heat exhaust flow path 40.
The second integrated circuit 50 and the second heat sink 60 are flush with each other on the face. The second heat sink 60 is made of a material having higher thermal conductivity than the case 51 of the second integrated circuit 50. In the case where the second heat sink 60 is cooler than the case 51, heat generated in the second integrated circuit 50 is conducted to the second heat sink 60.
An exhaust fan 80 is disposed near the downstream end of the second exhaust heat flow path 70. When the exhaust fan 80 is operated, the air in the second exhaust heat flow path 70 flows from the second integrated circuit 50 side to the exhaust fan 80 side. The second radiator 60 discharges heat at a temperature higher than the temperature of the air flowing through the second heat discharge flow path 70. The second radiator 60 is forcibly cooled by the air flowing through the second heat exhaust flow path 70.
In this way, the heat generated in the first integrated circuit 20 is discharged by the first heat sink 30, and the first integrated circuit 20 is cooled. In addition, the heat generated in the second integrated circuit 50 is discharged by the second heat sink 60, and the second integrated circuit 50 is cooled.
As described above, in the present embodiment, the wall portion 31 of the first heat sink 30 and the main surface 21a of the case 21 of the first integrated circuit 20 are in close contact with each other on the surface. In the present embodiment, the first heat sink 30 is higher in thermal conductivity than the case 21. According to the present embodiment, in the case where the first heat sink 30 is lower in temperature than the case 21, the heat generated in the first integrated circuit 20 can be conducted to the first heat sink 30 through the case 21.
In the present embodiment, the first heat sink 30 is disposed outside the frame 9. In the present embodiment, the first heat sink 30 can discharge heat when the temperature is higher than the air temperature outside the frame 9. According to the present embodiment, the first radiator 30 can be cooled by the air outside the frame 9 at all times regardless of the operating state of the exhaust fan 80.
In the present embodiment, the exhaust fan 80 is disposed near the upper end of the first exhaust heat flow path 40. In the present embodiment, the exhaust fan 80 exhausts air from the inside to the outside of the frame 9 when the electronic apparatus 1 is operated. In the present embodiment, the air on the lower side of the first exhaust heat flow path 40 is heated by the heat generated in the first integrated circuit 20 and rises. In the present embodiment, the rising air flows into the first heat release flow path 40, and flows in a convection manner from the lower side to the upper side in the first heat release flow path 40. According to the present embodiment, when the exhaust fan 80 is operated, the air flowing out from the upper end of the first exhaust heat flow path 40 can be made to flow in a direction away from the frame 9. According to the present embodiment, the first heat sink 30 can discharge heat when the temperature is higher than the temperature of the air convected in the first exhaust heat flow path 40. In this way, the present embodiment can forcibly cool the first radiator 30 by the air flowing through the first exhaust flow path 40.
In this way, the present embodiment can forcibly cool the heat of the first radiator 30 by the flow of air generated by the operation of the exhaust fan 80. In the present embodiment, when the exhaust fan 80 is stopped, the air outside the frame 9 can be naturally cooled. In this way, the present embodiment improves the heat radiation effect of the first heat sink 30, and therefore can obtain a higher cooling effect. This embodiment can reduce the size of the first heat sink 30. Further, the present embodiment can suppress heat of the first heat sink 30 from being accumulated inside the frame 9.
In the present embodiment, the first heat sink 30 is disposed outside the frame 9. According to the present embodiment, the installation space of the first substrate 2 inside the frame 9 can be enlarged.
In the present embodiment, the bracket 25 and the main surface 21b of the case 21 of the first integrated circuit 20 are in close contact with each other on the surfaces. In the present embodiment, the bracket 25 is less thermally conductive than the case 21. According to the present embodiment, even when the temperature of the bracket 25 is lower than the temperature of the case 21, heat generated in the first integrated circuit 20 can be suppressed from being conducted to the bracket 25.
In the present embodiment, the contact portion 34 of the first heat sink 30 and the panel 91 of the frame 9 are in close contact with each other on the surface. In the present embodiment, the frame 9 is lower in thermal conductivity than the first heat sink 30. According to the present embodiment, even when the temperature of the panel 91 is lower than the temperature of the first heat sink 30, the heat conducted to the first heat sink 30 can be suppressed from being conducted to the frame 9.
In the present embodiment, the second integrated circuit 50 and the second heat sink 60 are in close contact with each other on the surface. In the present embodiment, the second heat sink 60 has higher thermal conductivity than the case 51 of the second integrated circuit 50. According to the present embodiment, when the temperature of the second heat sink 60 is lower than that of the case 51, the heat generated in the second integrated circuit 50 can be conducted to the second heat sink 60.
In the present embodiment, the exhaust fan 80 is disposed facing the downstream end of the second exhaust heat flow path 70.
Here, for comparison, exhaust fan 80Z in conventional heat exhaust structure 10Z will be described with reference to fig. 9. Fig. 9 is a cross-sectional view showing an example of a conventional heat release structure. The first heat sink 30Z is disposed inside the frame 9. The exhaust fan 80Z is disposed outside the frame 9. Inside the frame 9, in other words, upstream of the exhaust fan 80Z, the first exhaust heat flow path 40Z merges with the second exhaust heat flow path 70Z. The exhaust fan 80Z exhausts the air flowing through the first exhaust heat flow path 40Z and the air flowing through the second exhaust heat flow path 70Z from the inside to the outside of the frame 9. The total air volume of the air flowing through the first exhaust heat flow path 40Z and the air flowing through the second exhaust heat flow path 70Z is the air volume of the exhaust fan 80Z.
In contrast, in the present embodiment, the exhaust fan 80 exhausts only the air flowing through the second exhaust heat flow path 70. Therefore, even with the exhaust fan 80 having the same air volume as the conventional one, the air volume of the air flowing through the second exhaust heat flow path 70 can be increased compared to the conventional one. According to the present embodiment, the second exhaust heat flow path 70 can be exhausted at a higher speed, and the second integrated circuits 50 can be cooled more efficiently.
In the present embodiment, the second radiator 60 can be forcibly cooled by the air flowing through the second heat exhaust flow path 70. According to the present embodiment, the second radiator 60 can discharge heat when the temperature is higher than the temperature of the air flowing through the second exhaust heat flow path 70.
In this way, the present embodiment can cool the first integrated circuit 20 by discharging heat generated in the first integrated circuit 20. This embodiment can cool the second integrated circuit 50 by discharging heat generated in the second integrated circuit 50.
Second embodiment
The heat exhaust structure according to the present embodiment will be described with reference to fig. 5 to 8. Fig. 5 is a perspective view showing an electronic device having a heat dissipation structure according to a second embodiment. Fig. 6 is an exploded perspective view of the heat release structure according to the second embodiment. Fig. 7 is a perspective view showing a first heat sink according to a second embodiment. Fig. 8 is a sectional view showing a heat radiation structure according to a second embodiment. The heat radiation structure 10A of the present embodiment differs from the first embodiment in the configuration of the first heat sink 30A. The other structure is the same as the heat exhausting structure 10 of the first embodiment. In the following description, the same components as those of the heat discharging structure 10 will not be described in detail.
The first heat sink 30A includes a wall portion 31A, a wall portion 32A, a wall portion 33A, a contact portion 34A, a cutout portion 35A, an extension portion 36A, and a vent portion (vent hole) 37A. Wall portion 31A, wall portion 32A, wall portion 33A, contact portion 34A, and extension portion 36A are integrally formed.
The vent hole portion 37A is formed in the extension portion 36A. The vent 37A is disposed at a position to which air discharged from the exhaust fan 80 is blown. The shape, size, and number of the vent holes 37A are set so as not to impair the heat radiation effect of the first radiator 30A and not to reduce the air volume of the exhaust fan 80.
Next, the operation of heat release structure 10A of electronic device 1A configured as described above will be described.
When the exhaust fan 80 is operated, the air discharged from the exhaust fan 80 is blown to the extension portion 36A of the first radiator 30A. The first radiator 30A is cooled by the air discharged from the exhaust fan 80 via the extension portion 36A. The first radiator 30A discharges heat at a temperature higher than the temperature of the air discharged from the exhaust fan 80.
As described above, in the present embodiment, when the exhaust fan 80 is operated, the air discharged from the exhaust fan 80 is blown to the extension portion 36A of the first radiator 30A. According to the present embodiment, the first radiator 30A can discharge heat at a temperature higher than the temperature of the air discharged from the exhaust fan 80. According to the present embodiment, the first radiator 30A can be cooled efficiently.
In the present embodiment, extension portion 36A of first radiator 30A is disposed to face exhaust fan 80. According to the present embodiment, when the electronic apparatus 1 is mounted on a vehicle, the exhaust fan 80 can be restricted from being entangled with wires.
The heat radiation structure 10 and the electronic device 1 of the present invention have been described so far, but may be implemented in various different ways other than the above-described embodiments. The above-described configuration of the heat radiation structure 10 is merely an example, and is not limited thereto.
The configuration of the first heat sink 30 described in the above embodiment is merely an example, and the first heat sink 30 may be configured to discharge heat generated in the first integrated circuit 20.
In the second embodiment, the case where the extension portion 36A is disposed separately from the exhaust fan 80 has been described, but the present invention is not limited thereto. The extension portion 36A may extend upward from the upper end of the contact portion 34A. In this case, the extension portion 36A is disposed close to the exhaust fan 80. This enables the first radiator 30A to be cooled efficiently.
Description of the symbols
1 electronic device
2 first base plate (base plate)
3 second substrate
9 frame
10 heat exhausting structure
20 first integrated circuit (electronic component)
30 first radiator (Heat radiating component)
40 first heat removal flow path (heat removal flow path)
50 second integrated circuit (second electronic component)
60 second radiator (second radiator part)
70 first heat discharge flow path
80 exhaust fan
Claims (7)
1. A heat removal structure, comprising:
a first electronic component that is disposed outside a frame of an electronic apparatus and generates heat;
a first heat dissipation member that is disposed outside the frame and dissipates heat generated by the first electronic component;
a first heat discharge flow path formed outside the frame and configured to flow out air heated by the first electronic component that generates heat; and
an exhaust fan discharging air from an inner side to an outer side of the frame,
wherein the exhaust fan is disposed near a downstream end of the first exhaust heat flow path,
when the exhaust fan is operated, the air flowing out from the downstream end of the first exhaust flow path flows in a direction away from the frame.
2. The heat exhausting structure of claim 1,
the first heat radiating member has an extension portion facing the exhaust fan on a downstream side of the first exhaust heat flow path.
3. The heat exhausting structure of claim 2,
the extension has at least one vent opening.
4. The heat exhausting structure of claim 2 or 3,
the extension portion is disposed separately from the exhaust fan.
5. The heat exhausting structure of claim 2 or 3,
the extension is disposed adjacent to the exhaust fan.
6. The heat exhausting structure of any one of claims 1 to 3, comprising:
a second electronic component that is disposed inside the frame and generates heat;
a second heat dissipating member that is disposed inside the frame and dissipates heat generated by the second electronic component; and
a second heat discharge flow path formed inside the frame and configured to flow out air heated by the second electronic component that generates heat,
the exhaust fan is disposed close to a downstream end of the second exhaust heat flow path,
when the exhaust fan is operated, the air in the second exhaust heat flow path flows to the exhaust fan.
7. An electronic device, comprising:
the heat removal structure of any one of claims 1 to 6; and
and a substrate on which the electronic component is mounted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-011150 | 2019-01-25 | ||
| JP2019011150A JP7211107B2 (en) | 2019-01-25 | 2019-01-25 | Exhaust heat structure and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN211128747U true CN211128747U (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921878576.2U Active CN211128747U (en) | 2019-01-25 | 2019-11-01 | Heat extraction structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7211107B2 (en) |
| CN (1) | CN211128747U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020120033A (en) * | 2019-01-25 | 2020-08-06 | 株式会社Ｊｖｃケンウッド | Heat exhaust structure and electronic apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4628992A (en) * | 1984-01-23 | 1986-12-16 | At&T Information Systems | Induced flow heat exchanger |
| JPH062315Y2 (en) * | 1986-01-23 | 1994-01-19 | 富士電機株式会社 | Inverter device |
| US7418995B2 (en) * | 2004-01-14 | 2008-09-02 | Vanner, Inc. | System for cooling environmentally sealed enclosures |
| JP2005301905A (en) * | 2004-04-15 | 2005-10-27 | Sony Corp | Information processor |
| CN205052033U (en) * | 2015-06-10 | 2016-02-24 | 普罗旺斯科技（深圳）有限公司 | Heat dissipation system |
| JP7211107B2 (en) * | 2019-01-25 | 2023-01-24 | 株式会社Ｊｖｃケンウッド | Exhaust heat structure and electronic equipment |
-
2019
- 2019-01-25 JP JP2019011150A patent/JP7211107B2/en active Active
- 2019-11-01 CN CN201921878576.2U patent/CN211128747U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020120033A (en) * | 2019-01-25 | 2020-08-06 | 株式会社Ｊｖｃケンウッド | Heat exhaust structure and electronic apparatus |
| JP7211107B2 (en) | 2019-01-25 | 2023-01-24 | 株式会社Ｊｖｃケンウッド | Exhaust heat structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020120033A (en) | 2020-08-06 |
| JP7211107B2 (en) | 2023-01-24 |
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