JP2001226795A5 - - Google Patents

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Publication number
JP2001226795A5
JP2001226795A5 JP2000124637A JP2000124637A JP2001226795A5 JP 2001226795 A5 JP2001226795 A5 JP 2001226795A5 JP 2000124637 A JP2000124637 A JP 2000124637A JP 2000124637 A JP2000124637 A JP 2000124637A JP 2001226795 A5 JP2001226795 A5 JP 2001226795A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000124637A
Other languages
Japanese (ja)
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JP3949871B2 (ja
JP2001226795A (ja
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Publication date
Application filed filed Critical
Priority to JP2000124637A priority Critical patent/JP3949871B2/ja
Priority claimed from JP2000124637A external-priority patent/JP3949871B2/ja
Priority to TW90109580A priority patent/TW499508B/zh
Priority to US09/838,228 priority patent/US6497806B1/en
Priority claimed from US09/838,228 external-priority patent/US6497806B1/en
Publication of JP2001226795A publication Critical patent/JP2001226795A/ja
Publication of JP2001226795A5 publication Critical patent/JP2001226795A5/ja
Application granted granted Critical
Publication of JP3949871B2 publication Critical patent/JP3949871B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000124637A 1999-12-10 2000-04-25 粗化処理銅箔及びその製造方法 Expired - Lifetime JP3949871B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000124637A JP3949871B2 (ja) 1999-12-10 2000-04-25 粗化処理銅箔及びその製造方法
TW90109580A TW499508B (en) 1999-12-10 2001-04-20 Roughening treated copper foil and producing method therefor
US09/838,228 US6497806B1 (en) 2000-04-25 2001-04-20 Method of producing a roughening-treated copper foil

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP35159299 1999-12-10
JP11-351592 1999-12-10
JP2000124637A JP3949871B2 (ja) 1999-12-10 2000-04-25 粗化処理銅箔及びその製造方法
US09/838,228 US6497806B1 (en) 2000-04-25 2001-04-20 Method of producing a roughening-treated copper foil

Publications (3)

Publication Number Publication Date
JP2001226795A JP2001226795A (ja) 2001-08-21
JP2001226795A5 true JP2001226795A5 (pt) 2005-11-04
JP3949871B2 JP3949871B2 (ja) 2007-07-25

Family

ID=27341387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000124637A Expired - Lifetime JP3949871B2 (ja) 1999-12-10 2000-04-25 粗化処理銅箔及びその製造方法

Country Status (1)

Country Link
JP (1) JP3949871B2 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100579411B1 (ko) * 2001-08-21 2006-05-12 주식회사 포스코 아연-니켈-텅스텐 합금전기도금용액 및 이 용액을 이용한 아연-니켈-텅스텐 합금 전기도금강판의 제조방법
JP2003286596A (ja) * 2002-03-29 2003-10-10 Nippon Denkai Kk レーザー穴明けに適した銅箔とその製造方法
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board
KR100622742B1 (ko) 2005-04-26 2006-09-19 엘에스전선 주식회사 통전롤 표면에 대한 구리도금 현상을 방지할 수 있는전해동박 도금방법 및 이를 위한 도금장치
JP4833692B2 (ja) * 2006-03-06 2011-12-07 古河電気工業株式会社 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
WO2012039285A1 (ja) 2010-09-24 2012-03-29 Jx日鉱日石金属株式会社 プリント配線板用銅箔の製造方法及びプリント配線板用銅箔
CN103857833B (zh) 2011-09-30 2018-09-07 Jx日矿日石金属株式会社 与树脂粘着性优良的铜箔、其制造方法以及使用该电解铜箔的印刷布线板或电池用负极材料
JP6023366B1 (ja) * 2015-06-17 2016-11-09 Jx金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Jx金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR20170038969A (ko) * 2015-09-30 2017-04-10 일진머티리얼즈 주식회사 표면처리동박 및 그의 제조방법
JP6623941B2 (ja) * 2016-06-09 2019-12-25 株式会社デンソー 多層基板の製造方法
JP7421208B2 (ja) 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708130B2 (ja) * 1989-06-19 1998-02-04 日本電解 株式会社 プリント回路用銅箔の粗面形成方法
JP2920083B2 (ja) * 1995-02-23 1999-07-19 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JPH09148508A (ja) * 1995-11-29 1997-06-06 Nippon Denkai Kk 半導体装置用リードフレーム及びこれを用いた樹脂封止型半導体装置
JP3739929B2 (ja) * 1998-03-09 2006-01-25 古河サーキットフォイル株式会社 プリント配線板用銅箔及びその製造方法

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