JP2001217533A - Soldering method for article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the number of soldering processes for connecting a component which has both leads for reflow and manual fitting to a printed wiring board. SOLUTION: A land is formed where leads of a component having the lead side for manual fitting mounted on the printed board are inserted and an insertion hole in through-hole structure where the land and leads are inserted is covered with solder paste.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for soldering a component to a printed circuit board.

[0002]

2. Description of the Related Art A method for reducing the number of steps and cost for soldering components is disclosed in Japanese Patent Application Laid-Open No. 62-13297 and is well known.

In the method of soldering a printed wiring board, instead of a flow method in which the printed wiring board is immersed in a solder bath in order to achieve high-density mounting, a solder paste is printed on the printed wiring board, and after components are mounted, 2. Description of the Related Art A reflow method in which a printed wiring board is put in a reflow furnace to melt a solder paste and solder components is widely used. However, when there is a component that has a lead to be mounted using the reflow method and also has a lead to be inserted into the conventional insertion hole, it is general to perform the soldering by hand in addition to the soldering by the reflow method. .

[0004]

In recent years, even in a method of soldering a printed wiring board employed in a consumer device such as a video camera and a communication device such as a mobile phone, a component used for realizing high-density mounting has been developed. With small size and light weight,
The reflow method is often used as a soldering method.However, if there is a component that has a lead to be mounted using the reflow method and also has a lead to be inserted into the conventional insertion hole, the solder by the reflow method is used. Since mounting cannot be performed only by attaching, soldering in two steps of soldering by reflow method and soldering by hand must be performed, so that there is a problem that the number of steps increases.

It is an object of the present invention to provide a method for soldering parts which solves the above-mentioned problem and can reduce the number of steps in the soldering process.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to form a land at a position where a lead of a component mounted on a printed circuit board is inserted, and to insert an insertion hole having a through hole structure into which the land and the lead are inserted. Achieved by covering with paste.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. 1, 2, 3, and 4. FIG.

FIGS. 1 and 2 relate to an embodiment of the present invention.
1 and 2, reference numeral 1 denotes a printed circuit board, reference numeral 2 denotes an electrode, reference numeral 3 denotes a land having a hole 4 into which a lead of the component is inserted and which has a through-hole structure. , 6 are solder pastes,
Electrodes 2, lands 3, and wiring patterns 7 are formed on the surface of a printed circuit board 1 by copper foil or the like, and solder pastes 5 and 6 are printed and applied to the surfaces.

Next, a method of soldering components to the printed circuit board 1 using the above embodiment will be described.

FIG. 3 and FIG. 4 are schematic views of a main part showing the soldering of the present embodiment. FIG. 3 shows the application of solder pastes 5 and 6 on the surfaces of the electrodes 2 and lands 3 on the printed circuit board 1 by printing. FIG. 6 is a cross-sectional view in which a component 7 having a lead 8 for connecting to the electrode 2 and a lead 9 for inserting and connecting to the hole 4 is mounted.
When the component 10 is mounted, the lead 8 is placed on the solder paste 5, the lead 9 is inserted into the hole 4, and a part of the solder paste 6 printed and applied on the land 3 is pushed into the hole 4.

FIG. 4 shows a state after the reflow. In the reflow step, the solder pastes 5 and 6 are melted in a high-temperature (240 ° C.) atmosphere, and the leads 8 and the electrodes 2 and the leads 9 of the component 10 and the through holes are formed. The lands 3 having the structured holes 4 are collectively soldered.

At this time, the melted solder paste 6
The through hole and the lead 9 are connected by soldering even inside the hole 4.

[0013] This makes it possible to solder a component having both a component to be connected to the electrode on the printed circuit board and a lead to be inserted into the hole and soldered in one step.

[0014]

As described above, according to the present invention, soldering can be performed in one step of reflow in connecting a printed circuit board, a component having a reflow lead and a hand lead, thereby reducing man-hours. Therefore, cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view after printing a solder paste for attaching a component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view after printing a solder paste for attaching a component according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view after mounting components according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view after reflow of an embodiment of the present invention.

[Description of Signs] 1 ... Printed circuit board, 2 ... Electrode, 3 ... Land, 4 ... Hole, 5
6 solder paste, 7 wiring pattern, 8.9 lead, 10 parts.

Claims (1)

[Claims] 1. A land for forming and mounting a land on a printed wiring board and a lead for forming and mounting a lead for a component mounted on the printed wiring board and a lead for forming a lead for the component mounted on the printed wiring board. 2 is a component to be mounted and mounted,
In a method of applying heat to a solder paste printed on a land 3 provided on the opposite side of the land 1 and the land 2 on the printed wiring board and soldering, the land 1 to be soldered to the lead 1 and the insertion A method of soldering a component, wherein the holes have a through-hole structure, and the land 3 and the insertion hole of the lead 2 inserted into the insertion hole are covered with a solder paste.