JP2001217533A - Soldering method for article - Google Patents

Soldering method for article

Info

Publication number
JP2001217533A
JP2001217533A JP2000030209A JP2000030209A JP2001217533A JP 2001217533 A JP2001217533 A JP 2001217533A JP 2000030209 A JP2000030209 A JP 2000030209A JP 2000030209 A JP2000030209 A JP 2000030209A JP 2001217533 A JP2001217533 A JP 2001217533A
Authority
JP
Japan
Prior art keywords
lead
component
land
soldering
reflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000030209A
Other languages
Japanese (ja)
Inventor
Kazutoshi Suzuki
和年 鈴木
Yasuhiko Endo
康彦 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000030209A priority Critical patent/JP2001217533A/en
Publication of JP2001217533A publication Critical patent/JP2001217533A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To decrease the number of soldering processes for connecting a component which has both leads for reflow and manual fitting to a printed wiring board. SOLUTION: A land is formed where leads of a component having the lead side for manual fitting mounted on the printed board are inserted and an insertion hole in through-hole structure where the land and leads are inserted is covered with solder paste.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、部品をプリント配
線基板に半田付けする方法に関する物である。
The present invention relates to a method for soldering a component to a printed circuit board.

【0002】[0002]

【従来の技術】部品の半田付け作業の工数削減とコスト
低減を図る方法としては特開昭62−132397号に
開示されされており、公知である。
2. Description of the Related Art A method for reducing the number of steps and cost for soldering components is disclosed in Japanese Patent Application Laid-Open No. 62-13297 and is well known.

【0003】プリント配線基板の半田付け方法において
は、高密度実装を実現するために半田漕にプリント配線
基板を浸漬するフロー工法に代わり、プリント配線基板
に半田ペーストを印刷し、部品を実装後、プリント配線
基板をリフロー炉の中に入れて半田ペーストを溶かして
部品を半田付けするリフロー工法が盛んに利用されてい
る。ところがリフロー工法を用いて実装するリードを有
し、従来の挿入孔に挿入するリードも有する部品がある
場合にはリフロー工法による半田付けの他に、手付けに
よる半田付けにより行うのが一般的である。
In the method of soldering a printed wiring board, instead of a flow method in which the printed wiring board is immersed in a solder bath in order to achieve high-density mounting, a solder paste is printed on the printed wiring board, and after components are mounted, 2. Description of the Related Art A reflow method in which a printed wiring board is put in a reflow furnace to melt a solder paste and solder components is widely used. However, when there is a component that has a lead to be mounted using the reflow method and also has a lead to be inserted into the conventional insertion hole, it is general to perform the soldering by hand in addition to the soldering by the reflow method. .

【0004】[0004]

【発明が解決しようとする課題】近年、ビデオカメラな
どの民生機器、携帯電話などの通信機器に採用されるプ
リント配線基板の半田付け方法においても高密度実装を
実現するために、使用する部品の小形、軽量化に伴い、
半田付けの工法としてリフロー工法がよく用いられてい
る、しかしながら、リフロー工法を用いて実装するリー
ドを有し、従来の挿入項孔に挿入するリードも有する部
品がある場合には、リフロー工法による半田付けのみで
は実装はできず、リフロー工法による半田付けと手付け
による半田付けの2つの工程の半田付けを行わなければ
ならないため工数が増える問題があった。
In recent years, even in a method of soldering a printed wiring board employed in a consumer device such as a video camera and a communication device such as a mobile phone, a component used for realizing high-density mounting has been developed. With small size and light weight,
The reflow method is often used as a soldering method.However, if there is a component that has a lead to be mounted using the reflow method and also has a lead to be inserted into the conventional insertion hole, the solder by the reflow method is used. Since mounting cannot be performed only by attaching, soldering in two steps of soldering by reflow method and soldering by hand must be performed, so that there is a problem that the number of steps increases.

【0005】本発明の目的は、上記問題を解決し、半田
付け工程の工数を減らすことができる部品の半田付け方
法を提供することにある。
It is an object of the present invention to provide a method for soldering parts which solves the above-mentioned problem and can reduce the number of steps in the soldering process.

【0006】[0006]

【課題を解決するための手段】上記目的は、プリント基
板上に実装される部品のリードが挿入される箇所にラン
ドを形成し、ランドとリードが挿入されるスルーホール
構造からなる挿入孔を半田ペーストにて覆ったことによ
り達成される。
SUMMARY OF THE INVENTION It is an object of the present invention to form a land at a position where a lead of a component mounted on a printed circuit board is inserted, and to insert an insertion hole having a through hole structure into which the land and the lead are inserted. Achieved by covering with paste.

【0007】[0007]

【発明の実施の形態】以下、本発明を図1、図2、図
3、図4に示した実施例により説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. 1, 2, 3, and 4. FIG.

【0008】図1、図2は、本発明の一実施例に係り、
部品を取り付けるための半田ペースト印刷後を示すもの
であり、図1、図2において1はプリント基板、2は電
極、3は部品のリードを挿入させスルーホール構造とし
た孔4を有するランド、5、6は半田ペーストであり、
プリント基板1の表面に銅箔などにより電極2、ランド
3、配線パターン7を形成し、その表面に半田ペースト
5、6が印刷塗布されている。
FIGS. 1 and 2 relate to an embodiment of the present invention.
1 and 2, reference numeral 1 denotes a printed circuit board, reference numeral 2 denotes an electrode, reference numeral 3 denotes a land having a hole 4 into which a lead of the component is inserted and which has a through-hole structure. , 6 are solder pastes,
Electrodes 2, lands 3, and wiring patterns 7 are formed on the surface of a printed circuit board 1 by copper foil or the like, and solder pastes 5 and 6 are printed and applied to the surfaces.

【0009】次に上記実施例を用いてプリント基板1に
部品を半田付けする方法について説明する。
Next, a method of soldering components to the printed circuit board 1 using the above embodiment will be described.

【0010】図3、図4は本実施例の半田付けを示す要
部概略図であり、図3はプリント基板1上の電極2、ラ
ンド3の表面に半田ペースト5、6を印刷塗布し、電極
2に接続するためのリード8と孔4に挿入し接続するた
めのリード9を有する部品7を搭載した断面図であり、
部品10を搭載すると、リード8が半田ペースト5上に
載り、リード9は孔4に挿入され、ランド3上に印刷塗
布された半田ペースト6の一部が孔4の内部に押し込ま
れる。
FIG. 3 and FIG. 4 are schematic views of a main part showing the soldering of the present embodiment. FIG. 3 shows the application of solder pastes 5 and 6 on the surfaces of the electrodes 2 and lands 3 on the printed circuit board 1 by printing. FIG. 6 is a cross-sectional view in which a component 7 having a lead 8 for connecting to the electrode 2 and a lead 9 for inserting and connecting to the hole 4 is mounted.
When the component 10 is mounted, the lead 8 is placed on the solder paste 5, the lead 9 is inserted into the hole 4, and a part of the solder paste 6 printed and applied on the land 3 is pushed into the hole 4.

【0011】図4はリフロー後を示したものであり、リ
フロー工程にて高温(240℃)の雰囲気中で半田ペー
スト5、6を溶かし、部品10のリード8と電極2及び
リード9とスルーホール構造とした孔4を有するランド
3が一括で半田付けされる。
FIG. 4 shows a state after the reflow. In the reflow step, the solder pastes 5 and 6 are melted in a high-temperature (240 ° C.) atmosphere, and the leads 8 and the electrodes 2 and the leads 9 of the component 10 and the through holes are formed. The lands 3 having the structured holes 4 are collectively soldered.

【0012】この時、溶かされた半田ペースト6は孔4
に入り込み、孔4の内部でもスルーホールとリード9が
半田付けにて接続される。
At this time, the melted solder paste 6
The through hole and the lead 9 are connected by soldering even inside the hole 4.

【0013】これにより、プリント基板上の電極に接続
するものと孔に挿入し半田付けするリード両方を持つ部
品を1回の工程で半田付けすることができる。
[0013] This makes it possible to solder a component having both a component to be connected to the electrode on the printed circuit board and a lead to be inserted into the hole and soldered in one step.

【0014】[0014]

【発明の効果】以上のように本発明によれば、プリント
基板とリフロー用のリードと手付け用のリードを有する
部品の接続においてリフロー1回の工程で半田付けする
ことができ、工数を減らせるので原価低減を図ることが
できる。
As described above, according to the present invention, soldering can be performed in one step of reflow in connecting a printed circuit board, a component having a reflow lead and a hand lead, thereby reducing man-hours. Therefore, cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例に係る、部品を取り付けるた
めの半田ペースト印刷後の平面図である。
FIG. 1 is a plan view after printing a solder paste for attaching a component according to an embodiment of the present invention.

【図2】本発明の一実施例に係る、部品を取り付けるた
めの半田ペースト印刷後の断面図である。
FIG. 2 is a cross-sectional view after printing a solder paste for attaching a component according to an embodiment of the present invention.

【図3】本発明の一実施例の部品搭載後の断面図であ
る。
FIG. 3 is a cross-sectional view after mounting components according to one embodiment of the present invention.

【図4】本発明の一実施例のリフロー後の断面図であ
る。
FIG. 4 is a cross-sectional view after reflow of an embodiment of the present invention.

【符号の説明】 1…プリント基板、2…電極、3…ランド、4…孔、5
・6…半田ペースト、7…配線パターン、8・9…リー
ド、10…部品。
[Description of Signs] 1 ... Printed circuit board, 2 ... Electrode, 3 ... Land, 4 ... Hole, 5
6 solder paste, 7 wiring pattern, 8.9 lead, 10 parts.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 プリント配線基板上にランド1を形成し
実装される部品のリード1と該プリント配線基板に実装
される部品のリード2が挿入される挿入孔を形成し実装
される部品のランド2を設け実装される部品であって、
該プリント配線基板上のランド1とランド2と反対側に
設けたランド3に印刷された半田ペーストに熱を加えて
半田付けする方法において、リード1と半田付けされる
べきランド1と、該挿入孔をスルーホール構造としラン
ド3と該挿入孔に挿入されるリード2の該挿入孔を半田
ペーストにより覆ったことを特徴とする部品の半田付け
方法。
1. A land for forming and mounting a land on a printed wiring board and a lead for forming and mounting a lead for a component mounted on the printed wiring board and a lead for forming a lead for the component mounted on the printed wiring board. 2 is a component to be mounted and mounted,
In a method of applying heat to a solder paste printed on a land 3 provided on the opposite side of the land 1 and the land 2 on the printed wiring board and soldering, the land 1 to be soldered to the lead 1 and the insertion A method of soldering a component, wherein the holes have a through-hole structure, and the land 3 and the insertion hole of the lead 2 inserted into the insertion hole are covered with a solder paste.
JP2000030209A 2000-02-02 2000-02-02 Soldering method for article Pending JP2001217533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000030209A JP2001217533A (en) 2000-02-02 2000-02-02 Soldering method for article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000030209A JP2001217533A (en) 2000-02-02 2000-02-02 Soldering method for article

Publications (1)

Publication Number Publication Date
JP2001217533A true JP2001217533A (en) 2001-08-10

Family

ID=18555252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000030209A Pending JP2001217533A (en) 2000-02-02 2000-02-02 Soldering method for article

Country Status (1)

Country Link
JP (1) JP2001217533A (en)

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