JP2001215899A - Luminous display device and method for manufacturing the same - Google Patents
Luminous display device and method for manufacturing the sameInfo
- Publication number
- JP2001215899A JP2001215899A JP2000022825A JP2000022825A JP2001215899A JP 2001215899 A JP2001215899 A JP 2001215899A JP 2000022825 A JP2000022825 A JP 2000022825A JP 2000022825 A JP2000022825 A JP 2000022825A JP 2001215899 A JP2001215899 A JP 2001215899A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- substrate
- shielding wall
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3023—Segmented electronic displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、たとえば自動販売
機の金額表示などに用いられる、LEDチップなどの発
光素子を用いて、7セグメントやドットマトリクス構造
の数字や文字などのキャラクタを表示する発光表示装置
およびその製法に関する。さらに詳しくは、表面実装を
することができるように、電極端子が形成された基板に
発光部を形成しながら、回路基板などとハンダ付けする
電極端子に樹脂などが付着せず実装しやすい構造の発光
表示装置およびその製法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device for displaying characters such as numbers and characters having a seven-segment or dot matrix structure by using a light emitting element such as an LED chip, which is used, for example, for displaying the amount of money in a vending machine. The present invention relates to a display device and a manufacturing method thereof. More specifically, while forming the light-emitting part on the substrate on which the electrode terminals are formed so that it can be surface-mounted, the electrode terminals soldered to the circuit board etc. have a structure that is easy to mount without resin etc. adhering to the electrode terminals. The present invention relates to a light emitting display device and a manufacturing method thereof.
【0002】[0002]
【従来の技術】従来の7セグメント構造の発光表示装置
は、たとえば図5に示されるような構造になっている。
すなわち、ケース3に7セグメントを構成する導光部が
形成され、各セグメントごとに図示しない発光素子(以
下、LEDチップという)がリードにダイボンディング
およびワイヤボンディングされてその導光部内に透光性
樹脂4が充填されることにより形成されている。LED
チップは、陽極と陰極とを有し、各セグメントごとに2
本のリードが必要となるが、陽極か陰極の一方のリード
は、各セグメントで共通にすることができ、1桁の数字
に対してリードとしては8〜10本で形成され(小数点
の表示用もある)、たとえば数字の横側から導出されて
いる。2. Description of the Related Art A conventional light-emitting display device having a seven-segment structure has a structure as shown in FIG.
That is, a light guide portion that forms seven segments is formed in the case 3, and a light emitting element (hereinafter, referred to as an LED chip) (not shown) is die-bonded and wire-bonded to a lead for each segment, and a light-transmitting portion is formed in the light guide portion. It is formed by filling the resin 4. LED
The chip has an anode and a cathode, two for each segment.
Although one lead is required, one lead of the anode or the cathode can be common to each segment, and 8 to 10 leads are formed for a single digit number (for displaying a decimal point). ), For example, from the side of the number.
【0003】この数字などを表示する発光表示装置は、
同じものを横に数個並べて桁数の多い表示がなされる。
そのため、横には隙間なく並べる必要があり、前述の横
方向に導出されているリードの先端を外側に折り曲げ
る、いわゆるガルウィング形状にして表面実装をするこ
とができない。そのため、この種の発光表示装置は、図
5に示されるように、各リードがストレートに延ばさ
れ、回路基板などに設けられるスルーホールに差し込ん
でハンダ付けすることにより、電気的接続と固定がなさ
れるリードディップ形状になっている。この際、ケース
3の4隅に脚部31が設けられ、高さの位置決めがなさ
れている。そのため、自動機による自動装着とリフロー
ハンダによる実装をすることができず、組立工数がかか
る。[0003] A light-emitting display device for displaying such numbers and the like includes:
A number of the same items are displayed side by side and displayed with a large number of digits.
Therefore, it is necessary to arrange the leads laterally without any gap, and it is not possible to form the so-called gull-wing shape by bending the leading ends of the leads led out in the lateral direction outward, and to perform surface mounting. Therefore, in this type of light emitting display device, as shown in FIG. 5, each lead is extended straight and inserted into a through hole provided on a circuit board or the like and soldered, so that electrical connection and fixation are achieved. It has a lead dip shape to be made. At this time, the legs 31 are provided at the four corners of the case 3 to determine the height. Therefore, automatic mounting by an automatic machine and mounting by reflow soldering cannot be performed, and assembling man-hours are required.
【0004】一方、表面実装をすることができるタイプ
として、たとえば特開平11−135839号公報に示
されるように、リードフレームを使用しないで、絶縁基
板上にLEDチップを搭載する構造が開示されている。
すなわち、図6にその斜視図および断面図が示されるよ
うに、複数のLEDチップ62が搭載された絶縁基板6
1と表面に表示パターン(セグメントなどの表示画像の
一部をそれぞれ構成する部分)を有する表示板63とが
透光性で熱硬化性の充填樹脂64を用いて接着されるこ
とにより形成されている。なお、図6において、65は
電極端子部でスルーホールの内面に金メッキなどの導電
体パターン66が形成されている。また、67は、前述
の透光性樹脂が表示板63の外面を覆うように形成され
た被覆体であり、68は、絶縁基板61に設けられたス
ルーホールで、その一部に透光性の充填樹脂64が流れ
込んでいる。On the other hand, as a type capable of surface mounting, for example, as shown in Japanese Patent Application Laid-Open No. 11-135839, a structure in which an LED chip is mounted on an insulating substrate without using a lead frame has been disclosed. I have.
That is, as shown in a perspective view and a sectional view of FIG. 6, an insulating substrate 6 on which a plurality of LED chips 62 are mounted
1 and a display plate 63 having a display pattern (a part constituting a part of a display image such as a segment) on the surface thereof are formed by bonding using a translucent thermosetting filler resin 64. I have. In FIG. 6, reference numeral 65 denotes an electrode terminal portion, and a conductor pattern 66 such as gold plating is formed on the inner surface of the through hole. Reference numeral 67 denotes a cover formed by covering the outer surface of the display panel 63 with the above-described light-transmitting resin. Reference numeral 68 denotes a through-hole provided in the insulating substrate 61, and a part of the through-hole is provided with a light-transmitting resin. Of the filling resin 64 is flowing.
【0005】[0005]
【発明が解決しようとする課題】前述のような絶縁基板
を用いた面実装型の発光表示装置では、電極端子部65
に樹脂などが付着しないで清浄になっていないと、回路
基板などへのリフローなどによるハンダ付けの信頼性が
得られない。しかし、図6に示されるような構造では、
絶縁基板61と表示板63とを液状の透光性樹脂64を
用いて接着する構造になっており、その樹脂が導電体パ
ターンの間隙を通って流れ出し、電極端子部65にも流
れて付着しやすいという問題がある。このような液状樹
脂を充填して表示板63を接着しながら、被覆体67を
形成する構造では、樹脂が染み出しやすく、その樹脂を
いかに電極端子部に付着させなくするかが課題となって
いる。In the surface mount type light-emitting display device using the insulating substrate as described above, the electrode terminal portion 65 is used.
If the resin is not cleaned without adhering to the resin, the reliability of soldering by reflow to a circuit board or the like cannot be obtained. However, in the structure as shown in FIG.
The insulating substrate 61 and the display panel 63 are bonded to each other by using a liquid translucent resin 64. The resin flows out through the gaps between the conductor patterns, and also flows to and adheres to the electrode terminal portions 65. There is a problem that it is easy. In such a structure in which the cover 67 is formed while filling the liquid crystal resin and bonding the display panel 63, the resin easily leaks out, and it is an issue how to prevent the resin from adhering to the electrode terminal portions. I have.
【0006】本発明は、このような問題を解決するため
になされたもので、絶縁基板を用いて表面実装型の発光
表示装置としながら、回路基板などにハンダ付けするた
めの電極端子部に樹脂などが付着しにくい構造の発光表
示装置およびその製法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. A surface mount type light-emitting display device using an insulating substrate and a resin terminal portion for soldering to a circuit board or the like are provided. It is an object of the present invention to provide a light-emitting display device having a structure to which it is difficult to adhere, and a method for manufacturing the same.
【0007】[0007]
【課題を解決するための手段】本発明による発光表示装
置は、表示画像の一部をそれぞれ構成する複数の発光部
を形成し得るように配線パターンが形成された基板と、
前記複数の発光部をそれぞれ区画し、該複数の発光部上
が導光部となり、隣接する発光部間で相互に遮光するよ
うに、前記基板上に接着して設けられる遮光壁と、該導
光部内のそれぞれの前記配線パターン上にボンディング
される発光素子と、前記導光部内のそれぞれの少なくと
も一部に充填される透光性樹脂とからなっている。According to the present invention, there is provided a light emitting display device, comprising: a substrate on which a wiring pattern is formed so as to form a plurality of light emitting portions each constituting a part of a display image;
A light-shielding wall provided on the substrate so as to partition the plurality of light-emitting portions and to provide a light-guiding portion on the plurality of light-emitting portions and to mutually shield light between adjacent light-emitting portions; A light emitting element is bonded to each of the wiring patterns in the light portion, and a light transmitting resin is filled in at least a part of each of the light guide portions.
【0008】ここに表示画像とは、数字や文字、キャラ
クタなどの表示状態を変化させ得る画像を意味し、表示
画像の一部とは、たとえば数字を7セグメントにより表
示する場合の1セグメントなどを意味する。[0008] Here, the display image means an image that can change the display state of numbers, characters, characters, and the like. A part of the display image is, for example, one segment when a number is displayed in seven segments. means.
【0009】この構造にすることによって、パターンが
形成された絶縁基板上の各発光部を独立した導光部とす
る遮光壁が、たとえば射出成形などにより絶縁基板と接
着して設けられているため、遮光壁(反射ケース)と基
板とを樹脂により一体化する必要がなく、導光部のみに
透光性樹脂が充填されればよい。しかも、この樹脂の充
填は、導光部内に完全に隅々まで充填される必要はな
く、光を拡散できる程度に充填されておればよいため、
半中空状態でもよい。その結果、樹脂が溢れるほど多め
に充填する必要はなく、少なめでよいため、溢れた樹脂
が電極端子部に染み出すことはない。According to this structure, the light-shielding wall which makes each light-emitting portion on the insulating substrate on which the pattern is formed an independent light guide is provided by being bonded to the insulating substrate by, for example, injection molding. There is no need to integrate the light-shielding wall (reflection case) and the substrate with a resin, and only the light-guiding portion needs to be filled with the translucent resin. Moreover, the filling of the resin does not need to be completely filled in the light guide portion to every corner, and it is sufficient that the resin is filled to the extent that light can be diffused.
It may be in a semi-hollow state. As a result, it is not necessary to fill as much as the resin overflows, and it is possible to reduce the amount, so that the overflowed resin does not seep into the electrode terminal portions.
【0010】この樹脂の充填は、たとえばディスペンサ
により1個1個の導光部内に滴下してもよいし、透光性
ケース内に液状樹脂を少なめに入れておいて、その中に
遮光壁部を逆さにして挿入し硬化させることにより、該
透光性ケースと前記遮光壁との間隙部に前記透光性樹脂
が充填される構造にすることもできる。この場合、前記
透光性ケースと遮光壁との間に樹脂逃げ部が形成されて
おれば、たとえ透光性樹脂が溢れても、電極端子側に流
れることはない。The filling of the resin may be performed, for example, by dropping the resin into each light guide part by a dispenser, or by placing a small amount of liquid resin in a light-transmitting case and placing a light shielding wall part therein. May be inverted and inserted and cured to fill the gap between the translucent case and the light-shielding wall with the translucent resin. In this case, if a resin escape portion is formed between the translucent case and the light shielding wall, even if the translucent resin overflows, the resin does not flow to the electrode terminal side.
【0011】ここに樹脂逃げ部とは、たとえば図4に示
されるように、透光性ケースと遮光壁との間に間隙部3
6を形成したり、遮光壁に凹部35を形成しておいた
り、透光性ケースの側壁部に基板との間に間隙部を形成
するように肉厚部7aを設けることにより、樹脂が溜ま
りやすくして遠くまで流れないような構造にしたり、透
光性ケースの側壁を浅くして遮光壁の側壁との間に樹脂
だまりを形成しやすくしたり、透光性ケースの外周壁を
2重壁にして樹脂だまりを形成しやすくすることなどに
より、樹脂が電極端子部の方に流れにくくすることを意
味する。Here, the resin escape portion is, for example, as shown in FIG. 4, a gap 3 between the light-transmitting case and the light-shielding wall.
6 or a concave portion 35 is formed in the light-shielding wall, or a thick portion 7a is formed in the side wall of the light-transmitting case so as to form a gap between the resin and the substrate. The light-transmitting case has a shallow side wall so that a resin pool can be easily formed between the light-shielding wall and the outer wall of the light-transmitting case. This means that the resin is less likely to flow toward the electrode terminal portion by making it easy to form a resin puddle on a wall.
【0012】本発明による発光表示装置の製法は、
(a)表示画像の一部をそれぞれ構成する複数の発光部
を形成し得るように配線パターンを設けた基板を形成す
る工程と、(b)前記複数の発光部をそれぞれ内包し得
る導光部を設けると共に、隣接する発光部間を遮光する
遮光壁を前記基板上に形成する工程と、(c)前記導光
部内の配線パターン上に発光素子をダイボンディングお
よびワイヤボンディングする工程と、(d)前記導光部
内の少なくとも一部に透光性樹脂を充填する工程、とを
有することを特徴とする。A method for manufacturing a light emitting display device according to the present invention is as follows.
(A) a step of forming a substrate provided with a wiring pattern so as to form a plurality of light-emitting portions each forming a part of a display image; and (b) a light-guiding portion capable of including each of the plurality of light-emitting portions. (C) forming a light-shielding wall for shielding light between adjacent light-emitting portions on the substrate; (c) die-bonding and wire-bonding a light-emitting element on a wiring pattern in the light-guiding portion; And a step of filling at least a part of the light guide portion with a translucent resin.
【0013】前記(d)の透光性樹脂の充填工程は、前
記導光部の1個づつに透光性樹脂を順次注入することに
より行うこともできるし、透光性樹脂を入れた透光性ケ
ース内に前記遮光壁部を挿入して固着することにより行
うこともできる。The step (d) of filling the light-transmitting resin can be performed by sequentially injecting the light-transmitting resin into each of the light guide portions, or the light-transmitting resin filled with the light-transmitting resin can be used. It can also be performed by inserting and fixing the light-shielding wall in the light case.
【0014】[0014]
【発明の実施の形態】つぎに、本発明の発光表示装置お
よびその製法について、図面を参照しながら説明をす
る。本発明による発光表示装置は、その一実施形態の斜
視および断面の説明図が図1に示されるように、たとえ
ば数字の各セグメントなどの表示画像の一部をそれぞれ
構成する複数の発光部を形成し得るように配線パターン
11が基板1に形成されている。その基板1上に、前記
複数の発光部をそれぞれ区画し、その複数の発光部上が
導光部32となり、隣接する発光部間で相互に遮光する
ように、遮光壁3が基板1と接着して設けられている。
そして、その導光部32内のそれぞれの配線パターン1
1上に発光素子(LEDチップ)2がボンディングされ
ている。この導光部32内のそれぞれの少なくとも一部
には、透光性樹脂4が充填されている。すなわち、完全
に充填されていないで、半中空の状態でもよく、少なめ
の充填となっている。Next, a light emitting display device of the present invention and a method of manufacturing the same will be described with reference to the drawings. The light-emitting display device according to the present invention is formed with a plurality of light-emitting portions each forming a part of a display image such as each segment of a number as shown in FIG. The wiring pattern 11 is formed on the substrate 1 so that the wiring pattern can be formed. The plurality of light emitting portions are partitioned on the substrate 1, and the light emitting portions 32 are formed on the plurality of light emitting portions, and the light shielding wall 3 is bonded to the substrate 1 so that adjacent light emitting portions mutually shield light. It is provided.
Then, each wiring pattern 1 in the light guide portion 32
A light emitting element (LED chip) 2 is bonded on 1. At least a part of each of the light guide portions 32 is filled with the light transmitting resin 4. In other words, it may not be completely filled and may be in a semi-hollow state.
【0015】基板1は、たとえばガラスエポキシなどか
らなるプリント基板などが用いられる。耐熱性で絶縁性
があり、その表面に配線パターンを形成することができ
るものであればよい。立体的形状にする必要は余りない
が、絶縁性のプラスティック成形品に配線パターンが形
成されたMID(Molded Interconect Device)を用い
れば、配線パターンを有しながら、基板の形状を立体的
に自由な形状にすることもできる。As the substrate 1, for example, a printed substrate made of glass epoxy or the like is used. Any material may be used as long as it has heat resistance and insulation properties and can form a wiring pattern on its surface. It is not necessary to have a three-dimensional shape. However, if an MID (Molded Interconect Device) in which a wiring pattern is formed on an insulating plastic molded product is used, the shape of the substrate can be three-dimensionally controlled while having the wiring pattern. It can also be shaped.
【0016】配線パターン11は、印刷法、または蒸着
とパターニングによる方法などを用いて、たとえばリー
ドフレームにより製造する場合のリードフレームの形状
と同様のパターンに形成され、表示画像の一部である、
たとえば7セグメントの各セグメントの位置に発光部が
形成されるようにパターニングされている。また、その
配線パターン11の端部は、それぞれ基板1の側面また
はスルーホールを経て基板1の裏面に導出され、電気的
に接続された電極端子12が形成されている。すなわ
ち、回路基板などに実装する場合、この電極端子12部
でハンダ付けされることにより表面実装をできる構造に
なっている。この基板1の側面への導電体膜の形成は、
大きな基板の状態で形成する場合には、大きな基板の、
各表示装置の境界部にスルーホールを形成してその内面
に導電体を付着させ、その境界部で切断することにより
形成することもできる。The wiring pattern 11 is formed into a pattern similar to the shape of a lead frame when it is manufactured using a lead frame, for example, by a printing method or a method of vapor deposition and patterning, and is a part of a display image.
For example, patterning is performed so that a light emitting portion is formed at the position of each of the seven segments. The ends of the wiring pattern 11 are led out to the back surface of the substrate 1 through the side surfaces of the substrate 1 or through holes, respectively, and electrically connected electrode terminals 12 are formed. That is, when mounted on a circuit board or the like, the structure is such that surface mounting can be performed by soldering at the electrode terminals 12. The formation of the conductor film on the side surface of the substrate 1
When forming in the state of a large substrate,
It can also be formed by forming a through hole at the boundary of each display device, attaching a conductor to the inner surface thereof, and cutting at the boundary.
【0017】この各セグメントを構成する各発光部の周
囲に遮光壁3が形成されるように、たとえば金型で挟み
つけて、樹脂を注入する射出成形により基板1上に直接
遮光壁3が形成されている。このように射出成形により
形成されることにより、基板1上に直接接着して設けら
れる。しかし、予め各発光部を囲んで、導光部が設けら
れるように遮光壁3を形成しておき、その遮光壁3を接
着剤などにより基板1上に接着する方法を用いてもよ
い。要は、透光性樹脂4により基板1との接着をしなく
てもよいように、基板1上に直接遮光壁3が予め接着さ
れておればよい。この遮光壁3は、たとえば液晶ポリマ
ー、ポリカーボネート、ABSなどの耐熱性の熱可塑性
樹脂により形成される。そして、その表示面側には、見
栄えをよくするため、黒色塗装が施されている。The light-shielding walls 3 are formed directly on the substrate 1 by injection molding in which a resin is injected, for example, by sandwiching them with a mold so that the light-shielding walls 3 are formed around each light-emitting portion constituting each segment. Have been. By being formed by injection molding in this way, it is provided directly adhered on the substrate 1. However, a method may be used in which the light-shielding wall 3 is formed in advance so as to surround the light-emitting portions and the light-guiding portion is provided, and the light-shielding wall 3 is adhered to the substrate 1 with an adhesive or the like. In short, the light-shielding wall 3 may be directly bonded on the substrate 1 in advance so that the light-transmitting resin 4 does not need to be bonded to the substrate 1. The light-shielding wall 3 is formed of a heat-resistant thermoplastic resin such as a liquid crystal polymer, polycarbonate, and ABS. The display surface is painted with black to improve the appearance.
【0018】この遮光壁3により囲まれた導光部32内
の配線パターン11上にLEDチップ2がダイボンディ
ングされ、さらに他方の電極が金線21などのワイヤに
より接続されるワイヤボンディングがなされることによ
り、各セグメントごとに発光部が形成されている。この
発光部の形成は、従来と同様に行われる。The LED chip 2 is die-bonded on the wiring pattern 11 in the light guide 32 surrounded by the light-shielding wall 3, and the other electrode is connected by wire bonding such as a gold wire 21. Thus, a light emitting section is formed for each segment. The formation of the light emitting section is performed in the same manner as in the related art.
【0019】このLEDチップがボンディングされた各
導光部32内に、たとえばシリコーン樹脂やエポキシ樹
脂などの透光性樹脂4が充填されている。この透光性樹
脂4は、透明である必要はなく、LEDチップ2で発光
する光を透過させればよく、たとえば赤色発光のLED
チップ2であれば赤色の染料が混入された樹脂でも、赤
色の光を遮ることはなく、表示しないときに外部から見
ても赤色の表示装置であることがすぐ分り、好都合であ
る。Each light guide 32 to which the LED chip is bonded is filled with a translucent resin 4 such as a silicone resin or an epoxy resin. The translucent resin 4 does not need to be transparent, and may transmit light emitted from the LED chip 2.
In the case of the chip 2, even if the resin mixed with the red dye does not block the red light, it can be easily understood that the display device is a red display device when viewed from the outside when no display is performed.
【0020】この透光性樹脂4の充填は、たとえばディ
スペンサにより各導光部32ごとに注入(ポッティン
グ)することにより行われるが、ポッティング量は少な
めにして、溢れないようにする。この透光性樹脂4が多
すぎて溢れると、遮光壁3の外周に伝わり、電極端子1
2部に流れるため、好ましくない。一方、少なすぎて
も、導光部32内の一部に充填されておれば、発光部か
らの光は、その透光性樹脂4により拡散されて導光部3
2内の全体で発光するように見え、1つのセグメントを
発光させることができる。そのため、この樹脂の充填
は、少なめにポッティングされる。ディスペンサにより
注入する場合、1個の発光部(導光部)は、その深さが
たとえば2mm程度で、長さも4mm程度と非常に小さ
く、1滴でも多すぎるくらいであるため、導光部32の
壁にディスペンサの先をつけて半滴ぐらいを滴下するこ
とにより、良好に充填することができる。The light-transmitting resin 4 is filled by, for example, injecting (potting) each light guide portion 32 with a dispenser, but the amount of potting is made small so as not to overflow. If the translucent resin 4 is too much and overflows, it is transmitted to the outer periphery of the light-shielding wall 3 and the electrode terminal 1
It is not preferable because it flows into two parts. On the other hand, even if the amount is too small, the light from the light emitting unit is diffused by the light transmitting resin 4 and is partially diffused by the light transmitting unit 3 if it is partially filled in the light guiding unit 32.
The whole of 2 appears to emit light, and one segment can emit light. Therefore, the filling of the resin is less potted. When injecting with a dispenser, one light emitting portion (light guiding portion) has a depth of, for example, about 2 mm and a length of about 4 mm, which is very small, and even a single drop is too large. By filling the wall of the dispenser with a tip of a dispenser and dropping about half a drop, it is possible to fill well.
【0021】この発光表示装置を製造するには、図2
(a)に示されるように、まず、たとえばプリント基板
1などに、7セグメントのそれぞれを構成する複数の発
光部を形成し得るように配線パターン11、およびその
端部を基板1の裏面に導出させ電極端子12を形成する
ことにより、配線パターン11が形成された基板1を準
備する。つぎに、図2(b)に示されるように、たとえ
ば射出成形により、各発光部間を遮光し、各発光部上に
導光部が形成されるように遮光壁3を形成する。この遮
光壁3の表示面側には、黒色塗装を施しておく。そし
て、図2(c)に示されるように、各導光部32内の配
線パターン11上にLEDチップ2をダイボンディング
し、さらに金線21などによりワイヤボンディングをす
る。そして、各導光部32内に透光性樹脂4を注入する
ことにより図1に示される発光表示装置が得られる。To manufacture this light emitting display, FIG.
As shown in (a), first, the wiring pattern 11 and its end are led out to the back surface of the substrate 1 so that a plurality of light-emitting portions constituting each of the seven segments can be formed on the printed circuit board 1 or the like. By forming the electrode terminals 12, the substrate 1 on which the wiring patterns 11 are formed is prepared. Next, as shown in FIG. 2B, light-shielding walls 3 are formed by, for example, injection molding so as to shield between the light-emitting portions and form a light-guiding portion on each light-emitting portion. The display surface side of the light shielding wall 3 is painted black. Then, as shown in FIG. 2C, the LED chip 2 is die-bonded on the wiring pattern 11 in each light guide portion 32, and further wire-bonded with the gold wire 21 or the like. Then, the light-emitting display device shown in FIG. 1 is obtained by injecting the light-transmitting resin 4 into each light guide portion 32.
【0022】本発明の発光表示装置によれば、絶縁性の
基板を用い、その基板に設けられた電極端子により回路
基板などに表面実装することができる構造でありなが
ら、各セグメントなどの発光部を区画する遮光壁は、予
め基板と接着されているため、透光性樹脂により接着す
る必要がなく、発光部内に充填される透光性樹脂は、少
なくてすむ。そのため、発光部内に充填する樹脂が溢れ
て電極端子部の方に流れ出すことはなく、ハンダ付けす
る電極端子部が樹脂などにより汚染されることがない。
その結果、表面実装により非常に簡単にハンダ付けを行
うことができながら、ハンダ付けの信頼性をよくするこ
とができ、非常に実装が簡単になる。According to the light-emitting display device of the present invention, a light-emitting portion such as each segment has a structure in which an insulating substrate is used and the electrode terminals provided on the substrate can be surface-mounted on a circuit board or the like. Since the light-shielding wall for partitioning is previously bonded to the substrate, it is not necessary to bond the light-shielding resin with the light-transmitting resin, and the light-transmitting resin to be filled in the light emitting unit is small. Therefore, the resin filling the light emitting portion does not overflow and flow toward the electrode terminal portion, and the electrode terminal portion to be soldered is not contaminated by the resin or the like.
As a result, while the soldering can be performed very easily by surface mounting, the reliability of the soldering can be improved, and the mounting becomes very simple.
【0023】前述の例では、導光部内に透光性樹脂を注
入する例であったが、要は、溢れない程度の量の透光性
樹脂が、それぞれの導光部内の少なくとも一部に充填さ
れればよいのであって、充填の仕方は注入法でなくても
よい。この充填方法の他の例が、図3に図2と同様の製
造工程図により示されている。In the above-described example, the light-transmitting resin is injected into the light guide. However, the point is that the light-transmitting resin in such an amount that it does not overflow is applied to at least a part of each light guide. What is necessary is just to fill, and the filling method does not need to be an injection method. Another example of this filling method is shown in FIG. 3 by the same manufacturing process diagram as FIG.
【0024】まず図2(a)〜(c)の例と同様に、プ
リント基板1などに、配線パターン11および電極端子
12を形成し、射出成形などにより遮光壁3を形成す
る。そして、各導光部32内の配線パターン11上にL
EDチップ2をダイボンディングし、さらに金線21な
どによりワイヤボンディングをする。First, as in the examples shown in FIGS. 2A to 2C, a wiring pattern 11 and electrode terminals 12 are formed on a printed circuit board 1 and the like, and a light-shielding wall 3 is formed by injection molding or the like. Then, L is printed on the wiring pattern 11 in each light guide portion 32.
The ED chip 2 is die-bonded, and further wire-bonded with a gold wire 21 or the like.
【0025】その後、内周が遮光壁3の外周より大き
く、内側の高さが遮光壁3の高さより低い、液晶ポリマ
ーなどからなる透光性ケース7に液状の透光性樹脂4を
入れておき、図3(a)に示されるように、前述のLE
Dチップ2がボンディングされた基板1を逆さにして、
遮光壁3部分を透光性ケース7内に入れる。その結果、
透光性ケース7内の液状の透光性樹脂4は、導光部32
内に入り、透光性樹脂4を硬化させることにより、図3
(b)に示されるように、透光性ケース7が遮光壁3に
接着され、透光性樹脂4は導光部32内で硬化する。こ
の際、透光性樹脂4の量を少なめにしておくことによ
り、図3(b)に示されるように、導光部32内に完全
には透光性樹脂4が充填されない場合もあるが、前述の
例のように、導光部32内には、完全には樹脂を充填す
る必要はなく、電極端子12側に樹脂が溢れ出ることが
なく好ましい。After that, the liquid translucent resin 4 is put into a translucent case 7 made of a liquid crystal polymer or the like in which the inner circumference is larger than the outer circumference of the light shielding wall 3 and the inner height is lower than the height of the light shielding wall 3. In addition, as shown in FIG.
The substrate 1 to which the D chip 2 is bonded is turned upside down,
The light shielding wall 3 is put in the translucent case 7. as a result,
The liquid light transmitting resin 4 in the light transmitting case 7 is
By entering the inside and curing the translucent resin 4, FIG.
As shown in (b), the translucent case 7 is adhered to the light shielding wall 3, and the translucent resin 4 is cured in the light guide 32. At this time, if the amount of the light transmitting resin 4 is set to be small, the light transmitting portion 32 may not be completely filled with the light transmitting resin 4 as shown in FIG. As in the above-described example, it is not necessary to completely fill the inside of the light guide portion 32 with the resin, and it is preferable that the resin does not overflow to the electrode terminal 12 side.
【0026】図3に示されるように、透光性ケース7内
に液状の樹脂を入れておいて、LEDチップ2がボンデ
ィングされた基板1の遮光壁部を挿入して製造する場合
には、透光性樹脂4の量が多すぎると、透光性ケース7
から溢れ出て電極端子12の方に流れる危険性がある。
このような危険性を回避する構造が図4に示されてい
る。すなわち、図4(a)に示される例は、遮光壁3の
一部に凹部35を形成しておき、溢れる樹脂をその凹部
35により吸収したり、透光性ケース7の内周を遮光壁
3の外周より大きめにしておき、その間隙部36で溢れ
る樹脂を吸収できるようにしたものである。As shown in FIG. 3, when a liquid resin is put in the translucent case 7 and the light-shielding wall of the substrate 1 to which the LED chip 2 is bonded is inserted and manufactured, If the amount of the translucent resin 4 is too large, the translucent case 7
There is a risk of overflowing from the electrode terminal and flowing toward the electrode terminal 12.
A structure for avoiding such a danger is shown in FIG. That is, in the example shown in FIG. 4A, the concave portion 35 is formed in a part of the light shielding wall 3, and the overflowing resin is absorbed by the concave portion 35, and the inner periphery of the translucent case 7 is covered with the light shielding wall. 3 is made larger than the outer periphery of the gap 3 so that the resin overflowing in the gap 36 can be absorbed.
【0027】図4(b)に示される例は、透光性ケース
7の側壁部に基板1との間で間隙部が形成されるように
肉厚部7aが形成されたものである。このような構造に
することにより、透光性樹脂4が多すぎて、透光性ケー
ス7の外側まで溢れ出ても、透光性ケース7の肉厚部7
aと基板1との間隙部に透光性樹脂4が保持され、電極
端子部12の方には流れなくなる。In the example shown in FIG. 4B, a thick portion 7a is formed on the side wall of the translucent case 7 so that a gap is formed between the transparent case 7 and the substrate 1. With such a structure, even if the amount of the translucent resin 4 is too large and overflows to the outside of the translucent case 7, the thick portion 7 of the translucent case 7 can be formed.
The translucent resin 4 is held in the gap between the a and the substrate 1 and does not flow toward the electrode terminal portion 12.
【0028】また、図4(c)に示される例は、透光性
ケース7の深さを浅くしたもので、このように浅くする
ことにより、たとえ透光性樹脂4が溢れ出ても、遮光壁
3の側壁と透光性ケース7の側壁端部との間で、透光性
樹脂4が保持され、基板1上を伝わることはなくなる。
さらに、図4(d)に示される例は、透光性ケース7の
深さを浅くすると共に、その外周の側壁を2重壁7bに
したもので、溢れ出る樹脂の量が多く、図4(c)に示
される遮光壁3の側壁と透光性ケース7の端部との間だ
けでは吸収できない場合でも、2重壁7bの間隙部に毛
細管現象により樹脂が流れ込むため、基板1側に樹脂が
垂れることはなくなる。In the example shown in FIG. 4 (c), the depth of the translucent case 7 is reduced. By making the depth so small, even if the translucent resin 4 overflows, The translucent resin 4 is held between the side wall of the light shielding wall 3 and the end of the side wall of the translucent case 7, and does not transmit on the substrate 1.
Further, in the example shown in FIG. 4D, the depth of the translucent case 7 is reduced and the outer peripheral side wall is formed as a double wall 7b, so that a large amount of resin overflows. Even if the light cannot be absorbed only between the side wall of the light-shielding wall 3 and the end of the translucent case 7 shown in FIG. 3C, the resin flows into the gap between the double walls 7b by capillary action, so that the resin flows toward the substrate 1 side. The resin will not drip.
【0029】前述の各例では、基板にプリント基板を用
いたが、配線パターンを形成し得るプラスティック成形
品であるMIDを使用することもできる。また、遮光壁
を射出成形により、直接基板上に成形したが、予め形成
しておいた遮光壁を基板1上に接着してもよい。また、
図4の構造にする場合、各例をそれぞれ複合で採用する
ことにより、一層その効果が大きくなる。In each of the above-described examples, a printed circuit board is used as the substrate. However, an MID which is a plastic molded product capable of forming a wiring pattern may be used. Further, the light shielding wall is formed directly on the substrate by injection molding, but a light shielding wall formed in advance may be adhered to the substrate 1. Also,
In the case of the structure shown in FIG. 4, the effect is further enhanced by adopting each example in combination.
【0030】[0030]
【発明の効果】本発明によれば、絶縁基板を用いて、表
面実装型の発光表示装置を構成する場合でも、表示画像
の一部を構成する発光部同士の遮光を基板と接着した遮
光壁を用いているため、透光性樹脂により接着する必要
がなく、透光性樹脂の量を非常に少なくすることができ
る。その結果、透光性樹脂が溢れ出て、基板にハンダ付
け用として設けられる電極端子部に流れ出ることがな
く、非常に信頼性の高い発光表示装置が安価に得られ
る。According to the present invention, even when a surface mount type light emitting display device is formed using an insulating substrate, a light shielding wall in which light emitting portions forming a part of a display image are shielded from each other is adhered to the substrate. Since it is used, there is no need to adhere with a translucent resin, and the amount of the translucent resin can be extremely reduced. As a result, the translucent resin does not overflow and does not flow out to the electrode terminal portion provided for soldering on the substrate, so that a very reliable light emitting display device can be obtained at low cost.
【図1】本発明による発光表示装置の一実施形態を説明
する図である。FIG. 1 is a diagram illustrating one embodiment of a light emitting display device according to the present invention.
【図2】図1に示される表示装置の製造工程を示す説明
図である。FIG. 2 is an explanatory diagram showing a manufacturing process of the display device shown in FIG.
【図3】本発明の発光表示装置における他の実施形態の
製造工程を示す図である。FIG. 3 is a view showing a manufacturing process of another embodiment of the light emitting display device of the present invention.
【図4】図3に示される例の変形例を示す断面説明図で
ある。FIG. 4 is an explanatory sectional view showing a modified example of the example shown in FIG. 3;
【図5】従来の発光表示装置のリードフレームを用いた
例を説明する斜視図である。FIG. 5 is a perspective view illustrating an example using a lead frame of a conventional light emitting display device.
【図6】従来の発光表示装置の絶縁基板を用いた例を説
明する図である。FIG. 6 is a diagram illustrating an example of a conventional light emitting display device using an insulating substrate.
1 基板 2 LEDチップ 3 遮光壁 4 透光性樹脂 12 電極端子 32 導光部 DESCRIPTION OF SYMBOLS 1 Substrate 2 LED chip 3 Shield wall 4 Translucent resin 12 Electrode terminal 32 Light guide part
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 33/00 H01L 33/00 N ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 33/00 H01L 33/00 N
Claims (6)
の発光部を形成し得るように配線パターンが形成された
基板と、前記複数の発光部をそれぞれ区画し、該複数の
発光部上が導光部となり、隣接する発光部間で相互に遮
光するように、前記基板上に接着して設けられる遮光壁
と、該導光部内のそれぞれの前記配線パターン上にボン
ディングされる発光素子と、前記導光部内のそれぞれの
少なくとも一部に充填される透光性樹脂とからなる発光
表示装置。1. A substrate on which a wiring pattern is formed so as to form a plurality of light-emitting portions each constituting a part of a display image, and the plurality of light-emitting portions are partitioned, and the plurality of light-emitting portions are separated from each other. A light-shielding wall provided on the substrate so as to be a light-guiding portion and mutually shield light between adjacent light-emitting portions, and a light-emitting element bonded to each of the wiring patterns in the light-guiding portion; A light-emitting display device comprising a light-transmitting resin that fills at least a part of each of the light guides.
性ケースが設けられ、該透光性ケースと前記遮光壁との
間隙部に前記透光性樹脂が充填されてなる請求項1記載
の発光表示装置。2. A light-transmitting case is provided at least on a display surface side of the light-shielding wall, and a gap between the light-transmitting case and the light-shielding wall is filled with the light-transmitting resin. Light-emitting display device.
逃げ部が形成されてなる請求項2記載の発光表示装置。3. The light-emitting display device according to claim 2, wherein a resin escape portion is formed between the translucent case and the light-shielding wall.
る複数の発光部を形成し得るように配線パターンを設け
た基板を形成する工程と、(b)前記複数の発光部をそ
れぞれ内包し得る導光部を設けると共に、隣接する発光
部間を遮光する遮光壁を前記基板上に形成する工程と、
(c)前記導光部内の配線パターン上に発光素子をダイ
ボンディングおよびワイヤボンディングする工程と、
(d)前記導光部内の少なくとも一部に透光性樹脂を充
填する工程、とを有することを特徴とする発光表示装置
の製法。4. A step of forming a substrate on which a wiring pattern is provided so as to form a plurality of light emitting portions each forming a part of a display image, and (b) including each of the plurality of light emitting portions. Forming a light-shielding wall for shielding light between adjacent light-emitting portions on the substrate,
(C) a step of die-bonding and wire-bonding a light-emitting element on a wiring pattern in the light guide section;
(D) a step of filling at least a part of the light guide portion with a translucent resin.
前記導光部の1個づつに透光性樹脂を順次注入すること
により行う請求項4記載の製法。5. The step (d) of filling a translucent resin,
5. The method according to claim 4, wherein the step is performed by sequentially injecting a translucent resin into each of the light guides.
透光性樹脂を入れた透光性ケース内に前記遮光壁部を挿
入して固着することにより行う請求項4記載の製法。6. The step (d) of filling a translucent resin,
5. The method according to claim 4, wherein the light shielding wall is inserted and fixed in a light transmitting case containing a light transmitting resin.
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JP2000022825A JP3802724B2 (en) | 2000-01-31 | 2000-01-31 | Luminescent display device and manufacturing method thereof |
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JP2007036238A (en) * | 2005-07-22 | 2007-02-08 | Samsung Electro-Mechanics Co Ltd | Side surface type light emitting diode with improved arrangement structure of protection element |
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