JP2000012576A - Luminous display unit and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a survival of bubbles to a light guide part, reduce a brightness unevenness of a luminous display unit, and enhance reliability and an external appearance. SOLUTION: In a method for manufacturing a luminous display unit, in a first step, on a side of an LED(light emitting diode) chip 23 of a printed wiring board 25 on which the LED chip 23 is wire-bonded, a case 27 is disposed so that the LED chip 23 is disposed inside an insertion hole 26. In a second step, a resin 31 is injected from an opening part opened on an opposite side to the printed wiring board 25 of the insertion hole 26, namely an injection hole. Air bubbles 32 included in the resin 31 are exhausted from an insertion hole 29 provided in a base body 22 of the printed wiring board 25. In a third step, the injected resin 31 is cured to form a resin member. As the air bubbles 32 injected along with the resin 31 are exhausted from the insertion hole 29 different from the injection hole, the air bubbles 32 can certainly be exhausted from a light guide part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a light-emitting display device using a light-emitting element such as an LED (light-emitting diode) and a method for manufacturing the same.

[0002]

2. Description of the Related Art Light-emitting display devices using a plurality of LEDs include, for example, a seven-segment light-emitting device and a dot-matrix light-emitting display device. FIG.
It is sectional drawing which shows the light emitting display device 1 which is a prior art. The light-emitting display device 1 is a display device of a 7-segment type, which is disclosed in, for example, Japanese Utility Model Laid-Open No. 6-13162.

A printed wiring board 5 provided in the light emitting display device 1 includes an LED chip 3 bonded to one surface of a base material 2 by wires 4. On one surface of the printed wiring board 5 on the LED chip 3 side, a case 7 having an insertion hole 6 is provided with an LED chip 3 and a wire 4.
It is arranged so that it may cover. Specifically, the case 7 is attached to one surface of the substrate 2 such that the LED chip 3 and the wire 4 are arranged inside the insertion hole 6 of the case 7. A mold 8 is arranged on the side of the case 7 opposite to the printed wiring board 5 to cover an opening of the insertion hole 6 on the side opposite to the printed wiring board 5, and is provided on the base material 2 of the printed wiring board 5. The resin 9 is injected from the injected injection hole 11 and cured to form a resin member. The light guide portion is realized by the resin member filling the insertion hole 6, and the light from the LED chip 3 passes through the light guide portion or is diffused and emitted by the light guide portion.

Another example of the prior art light emitting display device in which an injection hole 11 for injecting the resin 9 into the base material 2 of the printed wiring board 5 is provided similarly to the light emitting display device 1 shown in FIG. Are disclosed, for example, in JP-A-2-126656 and JP-A-2-134732.

[0005]

In the light emitting display device 1 shown in FIG. 11, a resin member is formed by injecting a resin 9 from an injection hole 11 provided in a base material 2 of a printed wiring board 5, so that a resin member is formed. Bubbles 10 injected together with 9 are taken into the resin member, that is, into the light guide. The bubbles 10 remaining in the light guide part cause uneven brightness of the light emitting display device 1,
This will reduce the reliability of the product and impair the appearance of the product.

SUMMARY OF THE INVENTION An object of the present invention is to provide a light-emitting display device which reduces bubbles remaining in a light guide portion, has less luminance unevenness, is excellent in reliability and appearance, and a method of manufacturing the same.

[0007]

According to the present invention, there is provided a printed wiring board including a light emitting element mounted on a substrate, a case arranged on the light emitting element side of the printed wiring board so as to cover the light emitting element, A light-transmitting or light-diffusing resin member that fills the inside of the case to realize the light guide portion, wherein the insertion is different from the injection hole for injecting the resin for realizing the resin member. A light-emitting display device having holes.

According to the present invention, the light from the light emitting element mounted on the base material of the printed wiring board passes through the resin member filled in the case or is diffused by the resin member and emitted. Various displays can be realized by combining such a light guide portion formed of a resin member that emits light in a segment or matrix form. The resin member is made by injecting resin from an injection hole,
At this time, the air bubbles injected together with the resin are exhausted from an insertion hole different from the injection hole. Since an insertion hole for exhaust is provided separately from the injection hole, air bubbles can be reliably exhausted. Therefore, luminance unevenness can be reduced, and the reliability of the device can be improved. Further, the appearance of the device can be improved.

Further, the present invention is characterized in that the insertion hole is provided in a printed wiring board.

According to the present invention, the air bubbles injected together with the resin injected from the injection hole are surely exhausted from the insertion hole provided in the printed wiring board and different from the injection hole. Therefore, uneven brightness is reduced, the reliability of the device is improved, and the appearance of the device is improved.

Further, the present invention is characterized in that the resin member is filled in the case and covers the outer surface of the case to realize a light guide.

According to the present invention, the light from the light emitting element mounted on the base material of the printed wiring board passes through the resin member filled in the case or is diffused by the resin member and emitted. Various displays can be realized by combining such a light guide portion formed of a resin member that emits light in a segment or matrix form. The resin member is made by injecting resin from an injection hole,
At this time, air bubbles injected together with the resin are exhausted from an insertion hole different from the injection hole, particularly an insertion hole provided in the printed wiring board. Since an insertion hole for exhaust is provided separately from the injection hole, air bubbles can be reliably exhausted. Therefore, uneven brightness is reduced, the reliability of the device is improved, and the appearance of the device is improved. Moreover, since the resin member covers the outer surface of the case, the light guide can be protected from the external environment.

Further, the present invention is characterized in that a groove is formed on an outer surface of the case.

According to the present invention, the injected resin is guided by the groove on the outer surface of the case and is reliably filled in the case. Further, the light guide portion can be protected by the resin filling the groove without increasing the thickness of the resin member on the outer surface of the case. Therefore, the size of the device can be reduced.

Also, in the present invention, the insertion hole is provided for each light guide portion.
Or a plurality thereof.

According to the present invention, since one or more insertion holes are provided for each light guide, air bubbles can be reliably exhausted from each light guide. Therefore, it is possible to realize segment or matrix display with less luminance unevenness.

According to the present invention, there is provided a printed wiring board including a light emitting element mounted on a base material, a case arranged on the light emitting element side of the printed wiring board so as to cover the light emitting element, and a case filled in the case. A light-transmitting or light-diffusing resin member that realizes the light-guiding portion by using a light-emitting display device, wherein the case has an opening communicating with the light-guiding portion on the inner side of the case. It is a light emitting display device.

According to the present invention, the light from the light emitting element mounted on the substrate of the printed wiring board passes through the resin member filled in the case or is diffused by the resin member and emitted. Various displays can be realized by combining such a light guide portion formed of a resin member that emits light in a segment or matrix form. The resin member is made by injecting resin from an injection hole,
At this time, the air bubbles injected together with the resin are exhausted to an opening provided inside the case. That is, it is an insertion hole different from the injection hole, and is exhausted to the case opening from a communication portion that connects the light guide section and the case opening. Therefore, air bubbles can be reliably exhausted, uneven brightness can be reduced, the reliability of the device can be improved, and the appearance of the device can be improved.

Further, the present invention is characterized in that the case has one or more openings for each light guide.

According to the present invention, since one or more case openings are provided for each light guide, air bubbles can be reliably exhausted from each light guide. Therefore, it is possible to realize segment or matrix display with less luminance unevenness.

According to the present invention, there is provided a printed wiring board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property filled in the case to realize a light guide portion. In the method for manufacturing a light emitting display device comprising: a step of disposing a case on the light emitting element side of the printed wiring board so as to cover the light emitting element, and an opening for forming a light guide portion of the case, While injecting resin from the opening that opens on the opposite side of the printed wiring board,
A method for manufacturing a light-emitting display device, comprising: a step of exhausting bubbles contained in the resin from an insertion hole provided in a printed wiring board; and a step of curing the injected resin.

According to the present invention, the case is arranged on the light emitting element side of the printed wiring board, and for example, an opening opened on the side of the case opposite to the printed wiring board to form a light guide portion, that is, from the injection hole. Inject resin. Bubbles contained in the resin are exhausted from insertion holes provided in the printed wiring board. The injected resin is cured to form a resin member. Bubbles are reliably exhausted from the insertion hole for exhaust, which is different from the injection hole. Therefore, in the light-emitting display device manufactured in this manner, uneven brightness is reduced, and the reliability of the device is improved. Looks better.

Further, the present invention provides a printed wiring board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property filled in the case to realize a light guide portion. In the method for manufacturing a light emitting display device comprising: a step of disposing a case on the light emitting element side of the printed wiring board so as to cover the light emitting element, and an opening for forming a light guide portion of the case, While injecting resin from the opening that opens on the opposite side of the printed wiring board,
A light emitting display device comprising: a step of exhausting bubbles contained in the resin to an opening provided to communicate with the light guide section on the inner side of the case; and a step of curing the injected resin. It is a manufacturing method.

According to the present invention, the case is arranged on the light emitting element side of the printed wiring board, and for example, an opening opened on the side of the case opposite to the printed wiring board to form a light guide portion, that is, from the injection hole. Inject resin. Bubbles contained in the resin are exhausted to a case opening communicating with the light guide. That is, it is an insertion hole for exhaust, which is different from the injection hole, and is exhausted to the case opening from a communication portion that connects the light guide section and the case opening. The injected resin is cured to form a resin member. Bubbles are reliably exhausted from the insertion hole for exhaust, which is different from the injection hole. Therefore, in the light-emitting display device manufactured in this manner, uneven brightness is reduced, and the reliability of the device is improved. Looks better.

Further, the present invention provides a printed wiring board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property which is filled in the case to realize a light guide portion. And a step of disposing a case on the light-emitting element side of the printed wiring board so as to cover the light-emitting element, and gold having an injection hole in a region facing the side of the case. The mold is arranged so that a gap is provided between the mold and the case and the case is covered, resin is injected from the injection hole of the mold, and bubbles included in the resin are inserted into the insertion hole formed in the printed wiring board. And a step of curing the injected resin.

According to the present invention, the case is arranged on the light emitting element side of the printed wiring board, the mold is further arranged, and the resin is injected from the injection hole of the mold. Bubbles contained in the resin
Air is exhausted from the insertion hole provided in the printed wiring board.
The injected resin is cured to form a resin member. Air bubbles
Since the air is reliably exhausted from the insertion hole for exhaust, which is different from the injection hole, the luminance unevenness is reduced in the light emitting display device thus manufactured, the reliability of the device is improved, and the appearance of the device is further improved. Get better. In addition, the resin member can be simultaneously formed on the outer surface of the case together with the inside of the case,
Thus, the light guide can be protected from the external environment.

Further, the present invention is characterized in that a groove is formed on the outer surface of the case.

According to the present invention, the injected resin is guided by the grooves on the outer surface of the case and is reliably filled in the case. Further, since the thickness of the resin member formed on the outer surface of the case for protecting the light guide can be made relatively thin, the size of the device can be reduced.

[0029]

FIG. 1 is a sectional view showing a light emitting display device 21 according to a first embodiment of the present invention. FIG. 2 is a perspective view illustrating an appearance of the light emitting display device 21. The light-emitting display device 21 is a seven-segment light-emitting device using a plurality of LEDs. The light emitting display device 21 includes a printed wiring board 25, a case 27 having light reflectivity, and a resin member 28.

The printed wiring board 25 includes an LED chip 23 bonded to one surface of the base material 22 by wires 24. The case 27 has the insertion hole 2
6 so as to cover the LED chip 23 and the wire 24, that is, the LED chip 23 and the wire 24.
Are arranged on the LED chip 23 side of the printed wiring board 25 so as to be arranged inside the insertion hole 26. The resin member 28 is filled in the case 27, that is, fills the insertion hole 26 of the case 27 to realize the light guide 30. The resin member 28 is made of a resin having a light transmitting property or a resin having a light diffusing property, for example, an epoxy resin.

In such a light emitting display device 21, an insertion hole 29 different from an injection hole for injecting a resin for realizing the resin member 28 is provided. Specifically, in the present embodiment, an insertion hole 29 is provided in the base 22 of the printed wiring board 25.

The light from the LED chip 23 mounted on the base material 22 of the printed wiring board 25 passes through the resin member 28 filling the insertion hole 26 of the case 27 or is diffused by the resin member 28 and emitted. . The light guide portion 30 realized by the resin member 28 from which such light is emitted is combined in a seven-segment shape, and various displays are realized.

FIG. 3 is a cross-sectional view for explaining a method of manufacturing the light emitting display device 21. In the first step, a printed wiring board 25 to which the LED chip 23 is wire-bonded is prepared, and the LED chip 23 and the wire 24 are arranged inside the insertion hole 26 on the LED chip 23 side of the printed wiring board 25. Then, the case 27 is arranged.

In the second step, in order to form the light guide section 30, the resin 31 is injected from an opening of the insertion hole 26 on the side opposite to the printed wiring board 25, that is, an injection hole. The injected resin 31 flows along the tapered inner wall of the case 27 and fills the inside of the case. At this time, the bubbles 32 contained in the resin 31 are exhausted from the insertion holes 29 provided in the base 22 of the printed wiring board 25.

In the third step, the injected resin 31 is cured to form the resin member 28. Here, when the resin hardened by flowing out of the insertion hole 29 is unnecessary, the resin is removed by cutting or the like.

According to the light emitting display device 21 of the first embodiment and the method of manufacturing the same, the resin 31 constituting the resin member 28
Is injected from the injection hole, and at this time, the bubbles 32 injected together with the resin 31 are exhausted from the insertion hole 29 for exhaustion which is different from the injection hole. Insertion hole 2 separately from the injection hole
9 is provided, so that the air bubbles 32 can be reliably exhausted without remaining in the light guide section 30. Accordingly, in the light emitting display device 21, the luminance unevenness is reduced, the reliability of the device 21 is improved, and the appearance of the device 21 is improved.

It is preferable that one or more insertion holes 29 are provided for each light guide 30. Thus, the air bubbles 32 can be reliably exhausted from each light guide section 30.

The insertion hole 29 does not need to be located at the center of the light guide 30, but is provided at an appropriate position where the bubbles 32 are exhausted in consideration of the flow direction of the resin 31 according to the shape of the device 21. Is preferred. Further, in the first embodiment, an example of the light emitting display device 21 adopting the transfer molding method and the method of manufacturing the same have been described. However, for example, the light emitting display device adopting the injection method and the manufacturing method thereof are also included in the scope of the present invention. is there.

FIG. 4 is a sectional view showing a light emitting display device 41 according to a second embodiment of the present invention. FIG. 5 is a plan view of the light emitting display device 41. FIG. FIG. 4 is a sectional view taken along line II of FIG. The light-emitting display device 41 is a seven-segment light-emitting device using a plurality of LEDs, like the light-emitting display device 21. The light emitting display device 41 includes a printed wiring board 45, a case 47 having light reflectivity, and a resin member 48.
Is provided.

The printed wiring board 45 includes an LED chip 43 bonded to one surface of the base material 42 by wires 44. The case 47 has the insertion hole 4
6 and an opening 53 communicating with the insertion hole 46.
The opening 46 is provided on the inner side of the case. Case 47
Are arranged on the LED chip 43 side of the printed wiring board 45 so as to cover the LED chip 43 and the wire 44, that is, such that the LED chip 43 and the wire 44 are arranged inside the insertion hole 46. Resin member 4
8 is a resin member 4 which fills the inside of the case, that is, the insertion hole 46 and the opening 53 of the case 47, and fills the insertion hole 46.
8 realizes the light guide unit 50. The resin member 48
Is made of a resin having a light transmitting or light diffusing property such as an epoxy resin.

The light from the LED chip 43 mounted on the base material 42 of the printed wiring board 45 passes through the resin member 48 filling the through hole 46 of the case 47 or is diffused by the resin member 48 and emitted. . The light guide portion 50 realized by the resin member 48 from which such light is emitted is combined in a seven-segment shape, and various displays are realized.

FIG. 6 is a cross-sectional view for explaining a method of manufacturing the light emitting display device 41. In the first step, a printed wiring board 45 to which the LED chips 43 are wire-bonded is prepared, and the LED chips 43 are arranged inside the insertion holes 46 on the LED chip 43 side of the printed wiring board 45. Then, the case 47 is arranged.

In the second step, in order to form the light guide section 50, the resin 51 is injected from the opening of the insertion hole 46 on the side opposite to the printed wiring board 45, that is, the injection hole. The injected resin 51 flows along the inner wall of the case 47 such as a tapered shape and is filled. At this time, the bubbles 52 contained in the resin 51 are exhausted to the opening 53 of the case 47. That is, the bubble 52 is an insertion hole different from the injection hole, and from a communication portion communicating with the light guide portion 50, specifically, a communication portion communicating the insertion hole 46 of the case 47 and the opening 53 of the case 47, The air is exhausted to the opening 53. In the third step, the injected resin 51 is cured to form the resin member 4.
8 is assumed.

According to the light emitting display device 41 of the second embodiment and the method of manufacturing the same, the resin 51 constituting the resin member 48
Is injected from the injection hole. At this time, the bubbles 52 injected together with the resin 51 are exhausted to the opening 53 from a communication portion which is an insertion hole different from the injection hole. Since the insertion hole for exhaust is provided separately from the injection hole, the air bubbles 52 can be reliably exhausted from the light guide unit 50. Therefore, in the light emitting display device 41, the luminance unevenness is reduced, the reliability of the device 41 is improved, and the appearance of the device 41 is improved.

The opening 53 of the case 47 is
It is preferable to provide one or more for each 0. For example, it is preferable to provide the opening 53 such that the communication portion that connects the insertion hole 46 of the case 47 and the opening 53 is disposed at two opposite ends of the segment. Thus, the air bubbles 52 can be reliably exhausted from each light guide section 50.

Further, in the second embodiment, an example of the light emitting display device 41 adopting the transfer molding method and an example of the manufacturing method thereof have been described. However, for example, a light emitting display device adopting the injection method and an example of the manufacturing method thereof are also applicable to the present invention. It belongs to the range.

FIG. 7 is a sectional view showing a light emitting display device 61a according to a third embodiment of the present invention. Light-emitting display device 61
a includes a printed wiring board 65, a case 67 having light reflectivity, and a resin member 68. Printed wiring board 6
Reference numeral 5 includes an LED chip 63 bonded to one surface of a base material 62 by a wire 64. The case 67 has an insertion hole 66 so as to cover the LED chip 63 and the wire 64, that is, the LED chip 6.
3 and the wire 64 are arranged on the LED chip 63 side of the printed wiring board 65 such that the wire 3 and the wire 64 are arranged inside the insertion hole 66. The resin member 68 fills the inside of the case, that is, the insertion hole 66 of the case 67, and covers the outer surface 67a of the case. The light guide section is realized by the resin member 68 filling the insertion hole 66. The resin member 68 is made of a resin having a light transmitting property such as an epoxy resin or a resin having a light diffusing property.

In such a light emitting display device 61a,
An insertion hole 69 different from an injection hole for injecting a resin for realizing the resin member 68 is provided. Specifically, in the present embodiment, an insertion hole 69 is provided in the base 62 of the printed wiring board 65.

The light from the LED chip 63 mounted on the base material 62 of the printed wiring board 65 passes through the resin member 68 filling the through hole 66 of the case 67 or is diffused by the resin member 68 and emitted. . The light guide portion realized by the resin member 68 from which such light is emitted is combined in a seven-segment shape as in the first and second embodiments to realize various displays.

FIG. 8 is a cross-sectional view for explaining a method of manufacturing the light emitting display device 61a. In the first step, the LED
A printed wiring board 65 having the chip 63 wire-bonded is prepared, and the LED chip 63 and the wire 64 are arranged inside the insertion hole 66 on the LED chip 63 side of the printed wiring board 65, and a case is formed. 67
Place.

In the second step, a mold 75 having an injection hole 73 in a region facing the side of the case 67 is placed in the case 67.
Are arranged so as to open a gap 74 between them and cover the case 67. Further, the resin 7 is injected through the injection hole 73 of the mold 75.
Inject 1. The injected resin 71 flows along the inner wall of the case 67 such as a tapered shape and is filled. The bubbles 72 contained in the resin 71 are
The air is exhausted from the insertion hole 69 provided in the fifth base 62.
In the third step, the injected resin 71 is cured to form the resin member 68.

According to the light emitting display device 61a and the method of manufacturing the same according to the third embodiment, the resin 7 constituting the resin member 68
1 is injected from the injection hole 73 of the mold 75, and at this time, the bubbles 72 injected together with the resin 71 are injected into the injection hole 73.
The air is exhausted from an insertion hole 69 different from the above. Since the insertion hole 69 for exhaust is provided separately from the injection hole 73, the bubble 72 can be reliably exhausted from the light guide. Therefore, in the light emitting display device 61a, the luminance unevenness is reduced, the reliability of the device 61a is improved, and the appearance of the device 61a is improved.
Further, since the resin member 68 covers the outer surface 67a of the case 67, the light guide can be protected from the external environment.
Furthermore, in the third embodiment, the trace of the resin injection hole is smaller than that of the first and second embodiments in which the resin is injected from the light guide portions 30 and 50 from which light is emitted. Therefore, the appearance of the device 61a is improved.

A groove 76 is formed on the outer surface 67a of the case 67.
The light-emitting display device 61b provided with, as shown in FIGS. 9 and 10, also belongs to the scope of the present invention. The injected resin 71 is guided into the insertion hole 66 by the groove 76 on the outer surface 67a of the case, and is reliably filled in the case.
In addition, the resin 71 filling the groove 76 can protect the light guide portion without increasing the thickness of the resin member 68 on the outer surface 67a of the case, and can reduce the size of the device.

The segment provided with the groove 76 and the groove 76
May be used in combination with a segment having no. The mold 75 has an injection hole 73 in a region facing the side portion of the case 67 and is capable of opening a gap 74 between the case 67 and the case 67. The shape may be any shape.

It is preferable that one or more insertion holes 69 are provided for each light guide. Thus, the bubbles 72 can be reliably exhausted from each light guide.

In the first to third embodiments, an example of a seven-segment light-emitting display device has been described. However, the number of segments is not limited to seven, and may be any number other than seven. Absent. The invention is not limited to the segment type device, and for example, an example of a dot matrix type light emitting display device is also included in the scope of the present invention. Further, an element other than the LED chip may be used as the light emitting element.

[0057]

As described above, according to the present invention, apart from the injection hole for injecting the resin for realizing the resin member serving as the light guide portion, the insertion hole for discharging the air bubbles injected together with the resin is provided. Since the air bubbles are provided, air bubbles can be reliably exhausted from the light guide portion, luminance unevenness can be reduced, and the reliability and appearance of the device can be improved.

Further, according to the present invention, air bubbles injected together with the resin can be reliably exhausted from the insertion holes provided in the printed wiring board.

Further, according to the present invention, the resin for realizing the resin member serving as the light guide portion is injected from the injection hole, and the bubbles injected together with the resin are reliably exhausted from the insertion hole different from the injection hole. . Moreover, since the resin member covers the outer surface of the case, the light guide can be protected from the external environment.

According to the present invention, since the groove is provided on the outer surface of the case, the injected resin can be reliably filled in the case, and the resin filling the groove increases the thickness of the resin member on the outer surface of the case. The light guide portion can be protected without performing, and the size of the device can be reduced.

According to the present invention, since one or more insertion holes are provided for each light guide portion, air bubbles are reliably exhausted from each light guide portion, and a segment or matrix display with less luminance unevenness is provided. Can be realized.

Further, according to the present invention, the resin for realizing the resin member serving as the light guide portion is injected from the injection hole, and the air bubbles injected together with the resin are exhausted to the opening of the case. Therefore, air bubbles can be reliably exhausted from the light guide.

Further, according to the present invention, since one or more openings of the case are provided for each light guide portion, air bubbles are surely exhausted at each light guide portion, so that a segment or a matrix shape with less uneven brightness is provided. Display can be realized.

According to the present invention, the case is arranged on the light emitting element side of the printed wiring board, the resin is injected from the injection hole, and the bubbles contained in the resin are exhausted from the insertion hole provided in the printed wiring board. By curing the injected resin, the light emitting display device as described above can be manufactured.

Further, according to the present invention, the case is arranged on the light emitting element side of the printed wiring board, the resin is injected from the injection hole, and the bubbles contained in the resin are exhausted into the opening of the case. By curing, the light emitting display device as described above can be manufactured.

According to the present invention, a case is arranged on the light emitting element side of a printed wiring board, a mold is further arranged, a resin is injected from an injection hole of the mold, and bubbles contained in the resin are printed. By exhausting air from the insertion hole provided in the wiring board and curing the injected resin, the above-described light emitting display device having the resin member for protection on the outer surface of the case can be manufactured.

Further, according to the present invention, the inside of the case can be reliably filled with the resin guided along the groove of the case, and the thickness of the resin member on the outer surface of the case can be made relatively thin to reduce the size of the apparatus. Can be achieved.

[Brief description of the drawings]

FIG. 1 shows a light emitting display device 21 according to a first embodiment of the present invention.
FIG.

FIG. 2 is a perspective view showing the appearance of the light emitting display device 21.

FIG. 3 is a cross-sectional view for explaining a method for manufacturing the light-emitting display device 21.

FIG. 4 shows a light emitting display device 41 according to a second embodiment of the present invention.
FIG.

FIG. 5 is a plan view of the light emitting display device 41.

FIG. 6 is a cross-sectional view for explaining a method for manufacturing the light-emitting display device 41.

FIG. 7 shows a light emitting display device 61 according to a third embodiment of the present invention.
It is sectional drawing which shows a.

FIG. 8 is a cross-sectional view for explaining the method for manufacturing the light emitting display device 61a.

FIG. 9 is a sectional view showing a light emitting display device 61b which is a modification of the third embodiment of the present invention.

FIG. 10 is a cross-sectional view for explaining the method for manufacturing the light emitting display device 61b.

FIG. 11 is a cross-sectional view illustrating a light emitting display device 1 according to the related art.

[Explanation of symbols]

 21, 41, 61a, 61b Light-emitting display device 22, 42, 62 Substrate 23, 43, 63 LED (light-emitting diode) chip 24, 44, 64 Wire 25, 45, 65 Printed wiring board 26, 46, 66 Insertion hole 27, 47, 67 Case 28, 48, 68 Resin member 29, 69 Insertion hole 30, 50 Light guide 31, 31, 51, Resin 32, 52, 72 Bubble 53 Opening 67a Case outer surface 73 Injection hole 74 Gap 75 Mold 76 groove

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA04 CA02 DB10 EC11 EE12 GA01 5F041 AA05 AA41 AA43 DA19 DA20 DA35 DA43 DA75 DA76 DA91 5F061 AA01 BA04 CA02 CB13 FA01

Claims (11)

[Claims] 1. A printed wiring board including a light emitting element mounted on a base material, a case disposed on the light emitting element side of the printed wiring board so as to cover the light emitting element, and a light guide filled in the case. A light-transmitting or light-diffusing resin member for realizing the portion, wherein the light-emitting display device has an insertion hole different from an injection hole for injecting a resin for realizing the resin member. Light-emitting display device. 2. The light emitting display device according to claim 1, wherein said insertion hole is provided in a printed wiring board. 3. The light emitting display device according to claim 1, wherein the resin member is filled in the case and covers the outer surface of the case to realize a light guide. 4. The light emitting display according to claim 3, wherein a groove is formed on an outer surface of the case. 5. The light guide according to claim 1, wherein one or a plurality of said insertion holes are provided for each light guide portion.
The light-emitting display device according to claim 1. 6. A printed wiring board including a light emitting element mounted on a base material, a case arranged on the light emitting element side of the printed wiring board so as to cover the light emitting element, and a light guide filled inside the case. A light-transmitting or light-diffusing resin member for realizing the portion, wherein the case has an opening on the inner side of the case, the opening communicating with the light guide. apparatus. 7. The light emitting display device according to claim 6, wherein the case has one or more openings for each light guide. 8. A printed wiring board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property which is filled in the inside of the case to realize a light guide portion. A method of manufacturing a light-emitting display device, comprising: a step of disposing a case on a light-emitting element side of a printed wiring board so as to cover the light-emitting element; and an opening for forming a light guide portion of the case. A step of injecting a resin from an opening opened on the side opposite to the above, exhausting air bubbles contained in the resin from an insertion hole provided in the printed wiring board, and curing the injected resin. A method for manufacturing a light-emitting display device characterized by the above-mentioned. 9. A printed circuit board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property filled in the case to realize a light guide portion. A method of manufacturing a light-emitting display device, comprising: a step of disposing a case on a light-emitting element side of a printed wiring board so as to cover the light-emitting element; and an opening for forming a light guide portion of the case. A step of injecting resin from an opening opened on the side opposite to the above, and exhausting air bubbles contained in the resin into an opening provided to communicate with the light guide section inside the case; Curing the light emitting device. 10. A printed wiring board including a light emitting element mounted on a base material, a case, and a resin member having a light transmitting or light diffusing property filled in the case to realize a light guide portion. In a method for manufacturing a light emitting display device comprising: a step of arranging a case on the light emitting element side of a printed wiring board so as to cover the light emitting element; and a mold having an injection hole in a region facing a side portion of the case. A gap is provided between the case and the case so as to cover the case, resin is injected from the injection hole of the mold, and air bubbles contained in the resin are exhausted from the insertion hole provided in the printed wiring board. A method for manufacturing a light emitting display device, comprising: a step of curing an injected resin. 11. The method according to claim 10, wherein a groove is formed on an outer surface of the case.