JP3501927B2 - Light emitting display and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting display using a plurality of light emitting elements such as LED chips, and more specifically, surface mountable using a plurality of 7 segment or dot matrix LED chips. The present invention relates to a light emitting display and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional 7-segment structure light emitting display is shown in FIG. This is a lead frame type display, in which an LED chip is mounted on a substrate provided with a plurality of lead frames 1 or lead pins, and each LED
An LED chip is built in a case 3 made of a light-shielding resin in which a plurality of light guide holes 2 for guiding light from the chip to the surface are formed. The light guide hole 2 is filled with a translucent filling resin 4,
A display pattern formed by the light guide holes 2 is formed on the surface.

As a method of manufacturing such a light emitting display, as shown in FIG. 13, the surface of the case 3 is covered with an adhesive tape 5 so that the translucent filling resin 4 does not leak from the light guide hole 2. After covering, inject the filling resin 4 into the case 3,
The lead frame 1 or the substrate to which the LED chip is die-bonded and connected by the conductive metal wire is inserted into the case 3.

Then, after the filling resin 4 is thermally cured,
The lead frame 1 is cut and divided, and the adhesive tape 5 is peeled off from the surface of the case 3 to complete the process.

In this light emitting display, it is necessary to bend the lead frame in advance or provide pins on the substrate so that the electrode terminals for electrical connection to the outside are projected from the back surface side. To mount on the mounting board, the electrode terminals are inserted into the mounting board, and electrical circuit connection is made on the back surface of the mounting board by soldering or the like. By the way, when electrical connection is made on the surface of the mounting board, bending of the electrode terminals is required, and cracks (cracks) are formed in the filling resin that seals the electrode terminals during the bending.
Therefore, it is not suitable for making electrical connection on the surface of the mounting substrate. Moreover, because of the structure for sealing the lead frame or the substrate, there is a sealing portion for sealing the lead frame or the substrate further to the back side than the LED chip, so that it is difficult to thin the display. .

Therefore, as a surface mountable light emitting display, there is an LED display described in Japanese Utility Model Laid-Open No. 6-13162. In this display, a light-transmissive filling resin is injected into a light guide hole of a resin injection case to form a display pattern, and a projecting piece is formed on a lower edge of the resin injection case.
A resin injection case is mounted on a substrate with through holes for electrodes having a fitting recess formed on the upper surface.

As another surface-mountable light emitting display, there is a display disclosed in Japanese Patent Application Laid-Open No. 4-366891. This is shown in FIG.
The segment portion 11 is formed in the plane of the lower body 12
LED chips corresponding to the segment portions 11 are mounted on the upper body 10, and the upper body 10 is adhered to the upper surface of the lower body 12 with an adhesive so that the conductor patterns 14 of the semi-cylindrical through holes 13 are formed on both ends of the lower body 12. It is a numerical display for surface mounting that is made to appear.

The internal connection between the LED chip and the conductor pattern 14 of the through hole 13 is such that the LED chip mounted on the electrode formed on the surface of the lower body 12 is a conductor of the through hole 13 which serves as an electrode terminal via a lead wire. Pattern 1
4 is electrically connected. The through hole 13 corresponds to the circuit pattern 16 of the mounting board 15 and is surface-mounted by the reflow solder 17.

[0009]

In both of the light emitting displays described in the above publications, a light guide hole is similarly formed in the case and the upper body, and the light guide hole is filled with a light-transmitting resin. Is covered with a resin after covering the light guide hole with an adhesive tape. Moreover, it is necessary to sufficiently adhere the adhesive tape to the case etc. so that the filled resin does not leak from the light guide hole of the case etc. However, since the adhesive tape is not necessary for the function of the light emitting display, the adhered adhesive tape Since it has to be peeled off, it is troublesome and complicated in the manufacturing process. Further, in the former light emitting display, since the resin is filled from the side of the substrate, many injection holes for filling the resin are required, and it is difficult to manufacture a small light emitting display.

In such a light emitting display, through holes 1 for electrode terminals are formed on both side surfaces of the lower body 12, for example.
3 is formed, and the conductor pattern 14 is formed in the through hole 13. Then, by cutting both ends of the bodies 11 and 12, the conductor pattern 14 of the through hole 13 is exposed to the outside, and this serves as an electrode terminal portion, which can be electrically connected to the mounting substrate 15. .

However, as shown in FIG. 15, if a part of the conductor pattern 14 is damaged during cutting, such as cracking or breaking, the solder 17 cannot be electrically connected to the mounting substrate 15. Cutting requires a great deal of attention and requires an elaborate cutting device capable of doing so, which makes the cutting operation complicated.

Further, in the latter manufacturing process of the light emitting display, when the upper body 10 is adhered to the lower body 12 and polymerized, if the electrode terminal portion is formed of the through hole 13, as shown in FIG. 18 may flow out from between the two bodies 10 and 12 and adhere to the electrode terminal portion. When the adhesive 18 is adhered to the electrode terminal portion to be hidden, the solder 17 does not adapt to the electrode terminal portion during mounting, and electrical connection to the mounting substrate 15 of the light emitting display is hindered. Moreover, since the work of bonding using the adhesive 18 is required, the manufacturing process becomes complicated.

In view of the above, it is an object of the present invention to provide a surface mountable light emitting display having a structure that can eliminate the complexity of the bonding work and the cutting work in the manufacturing process and can be easily manufactured. And Further, to provide a light emitting display capable of highly reliable electrical connection at the time of surface mounting by preventing damage or concealment of the electrode terminal portion or by adopting a structure in which these are not generated. With the goal.

[0014]

A means for solving the problems according to the present invention comprises an insulating substrate on which a plurality of light emitting elements are mounted and a display plate having a display pattern on its surface, and the light guide hole of the display plate is filled with the insulating substrate. The insulating substrate and the display board are bonded together by a translucent filling resin.

In this manufacturing method, a conductor pattern is formed from the surface of an insulating substrate having a through hole formed therein to the inside of the through hole, and the display plate is inserted into a mold case in which a filling resin is injected to guide the display plate. Fill the light hole with the filling resin, place the insulating substrate on which the light emitting element is mounted on the display plate and bring them into close contact with each other, penetrate the translucent resin between the insulating substrate and the display plate, and pressurize them. It is bonded and the insulating substrate is cut so that the through holes are exposed and become the electrode terminal portions.

Therefore, the work of adhering the insulating substrate and the display plate can be performed together with the work of filling the light guide holes with the resin, which saves labor and simplifies the manufacturing process. At this time, a reinforcing hole is formed in the insulating substrate to allow the filling resin to infiltrate, or the filling resin covers the display plate with a width larger than the width of the insulating substrate so that the filling resin covers a part of the insulating substrate. As a result, the contact area of the filling resin with respect to the insulating substrate can be increased, and the adhesion can be performed firmly.

Further, another means for solving the problems comprises an insulating substrate on which a plurality of light emitting elements are mounted, and a display plate which is joined to the insulating substrate and has a display pattern on the surface, and through the through hole from the surface of the insulating substrate. A conductive pattern is formed through the back surface to the electrode terminal portion on the side surface, and the light guide hole of the display plate is filled with a translucent filling resin.

Therefore, even if the conductor pattern of the electrode terminal portion is damaged and electrical connection becomes impossible at the time of cutting, the conductor pattern is formed on the back surface of the insulating substrate. Does not interfere with the electrical connection of. Therefore, it is not necessary to pay close attention to the cutting work, and the complexity can be eliminated.

At this time, the electrode terminal portion is a vertical groove which is formed on the side surface of the insulating substrate from the back surface side to the front surface and does not penetrate, or a vertical groove reaching the surface from the back surface formed on the side surface of the insulating substrate. The opening on the surface side of the groove is closed by a resist to form a vertical groove that does not virtually penetrate. By doing so, it is possible to prevent the adhesive or the filling resin from entering the electrode terminal portion, and a reliable electrical connection with the mounting substrate can be obtained.

If the side surface of the display plate is made to project so as to cover the electrode terminal portion, it is possible to prevent the filled resin or adhesive flowing out from reaching the electrode terminal portion and adhering thereto. As a result, when the surface mounting is performed on the mounting board, it is possible to surely make the electrical connection even by soldering.

[0021]

DETAILED DESCRIPTION OF THE INVENTION

(First Embodiment) FIG. 1 shows a light emitting display device of the present embodiment. The light emitting display is a 7-segment structure display,
An insulating substrate 21 on which a light emitting element composed of eight LED chips 20 is mounted and a display plate 23 having a display pattern 22 on the surface are provided, and the display plate 23 is integrally superposed on the insulating substrate 21. .

The insulating substrate 21 is a multi-layer substrate made of a material such as glass epoxy, which is less likely to be deformed by heat and capable of forming through holes. Then, on the insulating substrate 21,
Electrode terminal portions 24 are formed on the front surface and both side surfaces, and a conductor pattern 25 such as gold plating is formed from the front surface to the back surface. The electrode terminal portion 24 has a plurality of through holes 2 in the insulating substrate 21.
The conductor pattern 25 is formed on the inner surface of the groove 6 and is cut to form a semi-cylindrical vertical groove.

FIG. 2 shows an example of the conductor pattern 25. The conductor pattern 25 includes a common electrode 27 to which the LED chip 20 is die-bonded, and an individual electrode 29 connected to each LED chip 20 via a conductive metal wire 28, and these electrodes 27 and 29 correspond to each other. It is connected to the electrode terminal portion 24. In addition, the insulating substrate 21
A through hole 30 is formed in a region where the conductor pattern 25 is not formed. The conductor pattern 25 is not limited to this, and can be changed as appropriate.

The display board 23 is made of a white molding resin having a high heat resistance such as liquid crystal polymer and less deformed by heat.
It is molded into a rectangular parallelepiped shape. Since the display board 23 is slightly smaller than the insulating substrate 21, the electrode terminal portion 24 of the insulating substrate 21 is
And a part of the conductor pattern 25 on the surface is exposed from the display plate 23.

The LED chip 2 is attached to the display board 23.
The light guide holes 31 for guiding the light from 0 to the display pattern 22 are L
It is formed corresponding to the ED chip 20. Light guide hole 31
Is a thermosetting filling resin 3 having translucency and light diffusion.
2 is filled, LED chip 20 and wire 28
Are resin-sealed. As the filling resin 32, it is preferable that the stress generated at the time of curing is small, and epoxy resin or the like is suitable. Further, the surface is printed, and as the printing ink, a material different from the filling resin 32 should be selected in consideration of the reaction with the filling resin 32, such as an acrylic type or a urethane type. Other than epoxy type is desirable.

Here, the filling resin 32 functions as an adhesive that integrally joins the insulating substrate 21 and the display plate 23, whereby the front surface of the insulating substrate 21 and the back surface of the display plate 23 are bonded together. It Further, the filling resin 32 covers the outer surface of the display plate 21 to form the cover 33, which protects the printing on the surface. Therefore, the width a of the cover 33 is equal to that of the insulating substrate 2.
The width is larger than the width b of 1 (a> b), and the filling resin 32 adheres to side surfaces other than the side surface of the insulating substrate 21 on which the electrode terminal portions 24 are formed, increasing the contact area with the insulating substrate 21.
The adhesive strength between the insulating substrate 21 and the display board 23 is increased.
Since the filling resin 32 also penetrates into the through hole 30 in the insulating substrate 21, the contact area of the filling resin 32 with the insulating substrate 21 is increased, and the through hole 30 strengthens the insulating substrate 21 and the display board 23. It becomes a reinforcing hole for bonding. The reinforcing hole does not have to penetrate the insulating substrate 21.

Next, a method of manufacturing this light emitting display will be described with reference to FIG. The surface of the display plate 23 is inserted downward into the mold case 34 for molding in which the filling resin 32 is injected in advance. The mold case 34 is preferably made of a material having high heat resistance, little deformation due to heat, and poor adhesiveness with the filling resin 32. Further, the width (= a) of the mold case 34 is larger than the width b of the insulating substrate 21, and a gap is provided between the mold case 34 and the surface of the display plate 23.

When the display plate 23 is inserted into the mold case 34, the filling resin 32 is filled with the light guide hole 31 of the display plate 23.
In addition to satisfying the above condition, it overflows from the periphery of the display board 23 (FIG. 3A).

The insulating substrate 21 to which the LED chips 20 are die-bonded and connected is placed on the display plate 23, and pressure is applied to bring the display plate 23 and the insulating substrate 21 into close contact with each other.

Filling resin 32 overflowing from the light guide hole 31
Is sandwiched between the display board 23 and the insulating substrate 21,
And the insulating substrate 21 penetrates and spreads. Further, it is also sucked up to the side surface of the through hole 30 and the insulating substrate 21.

The pressure is applied to the insulating substrate 21, that is, while the adhesion between the display plate 23 and the insulating substrate 21 is maintained, the filling resin 32 is thermoset and bonded.

After the curing of the filling resin 32 is completed, it is released from the mold case 34 (FIG. 3B).

The insulating substrate 21 is cut and divided at the through holes 26 for each display plate 23, and the electrode terminal portions 24 are exposed on both side surfaces to obtain a light emitting display.

Therefore, when the insulating substrate 21 and the display plate 23 are integrated, the work of filling the light guide hole 31 with the filling resin 32 and the work of adhering both can be progressed at the same time. Then, the work of adhering and the work of sticking or peeling the adhesive tape are not required, and the complexity can be reduced and the manufacturing process can be simplified.

When the light emitting display having such a structure is mounted on the mounting substrate, the electrode terminal portion 24 of the insulating substrate 21 is arranged corresponding to the circuit pattern on the surface of the mounting substrate, and the reflow soldering is performed on the electrode terminal portion 24. Make a mark. As a result, the light emitting display is surface-mounted by being electrically connected to the mounting substrate.

(Second Embodiment) FIG. 4 shows a light emitting display device of the present embodiment. In this light emitting display, the convex portion 40 is formed on the side surface of the display plate 23 and covers the upper side of the electrode terminal portion 24. Other configurations are the same as those in the above-described embodiment.

In this case, as shown in FIG. 5, the depth c of the mold case 34 is larger than the insertion depth d which is the length from the surface of the display plate 23 to the upper surface of the convex portion 40 (c> d). Thus, a gap is provided between the mold case 34 and the surface of the display plate 23, and the display resin 23 can be covered with the filling resin 32.

The method of manufacturing this light emitting display is the same as that of the above-mentioned embodiment. However, when the display plate 23 is inserted into the mold case 34, as shown in FIGS. 6A and 6B, the tip of the mold case 34 contacts the convex portion 40, and the filling resin 32 overflows from this portion. Is prevented. Therefore, the filling resin 32 overflows from the light guide hole 31. When the insulating substrate 21 is placed in this state and pressure is applied to bring the display plate 23 and the insulating substrate 21 into close contact with each other, FIG.
As shown in (d), the filling resin 32 overflowing from the light guide hole 31 permeates and spreads at the interface between the display plate 23 and the insulating substrate 21. Therefore, the insulating substrate 21 and the display plate 23 are more firmly bonded to each other. Finally, as shown in FIG. 6E, the insulating substrate 21 and the convex portion 40 of the display plate 23 are cut and divided at the through holes 26 for each display plate 23 to obtain a light emitting display.

By the way, in this light emitting display, the filling resin 32 is not blocked by the convex portion 40 and adheres to the electrode terminal portion 24. Therefore, when the surface mounting is performed on the mounting substrate, the electrode resin is adhered by the adhered filling resin 32. The contact between the portion 24 and the solder is not hindered, the electrical connection can be surely made, and the reliability of the product can be improved.

(Third Embodiment) In the light emitting display of this embodiment, as shown in FIG. 7, a plurality of wiring through holes 41 are formed in the insulating substrate 21, and the conductor pattern 25 is formed on the surface of the insulating substrate 21. Through the inner surface of the through hole 41, the rear surface, and the electrode terminal portion 24 on the side surface. FIG. 8 shows an example of the conductor pattern 25 on the surface of the insulating substrate 21. The arrangement of the conductor pattern 25 and the through hole 41 is not limited to this, and can be changed as appropriate.
Other configurations are the same as those of the first embodiment. In addition, the insulating substrate 21 and the display board 23 are bonded to each other by the filling resin 3
The two are not limited to be bonded, but an adhesive may be used to bond the both.

In the light emitting display having such a structure, as shown in FIG. 9, the electrode terminal portions 24 are arranged corresponding to the circuit patterns 43 of the mounting substrate 42, and are connected by the solder 44. Here, even if the conductor pattern 25 in the electrode terminal portion 24 is cracked or broken when the through hole 26 portion of the insulating substrate 21 is cut and divided, the conductor pattern 25 from the surface of the insulating substrate 21 is insulated. Since the circuit pattern 43 reaches the back surface and part of the side surface of the board 21, the circuit pattern 43 is solder 4
4 through contact with the conductor pattern 25 of the insulating substrate 21,
The conductor pattern 25 is electrically connected to the circuit pattern 43. Therefore, it is possible to perform surface mounting without disturbing the electrical connection between the light emitting display and the mounting substrate 42. Further, even if the filling resin 32 or the adhesive is attached to the electrode terminal portion 24, the electrical connection to the mounting substrate 42 can be similarly made. Therefore, it is not necessary to pay close attention to the cutting work, and the cutting work becomes easy.

(Fourth Embodiment) In the light emitting display of the present embodiment, as shown in FIG. 10, the electrode terminal portion 24 is formed on the side surface of the insulating substrate 21 from the back surface side to the front surface, and does not penetrate vertically. The groove 45 is formed. That is, when the through hole 26 for the electrode terminal portion 24 is formed, the insulating substrate 21 is not penetrated to form a hole in the middle and the conductor pattern 2 is formed on the inner surface.
5 is formed and cut to expose it to the outside. Other configurations are the same as those in the third embodiment.

With such a structure, when the insulating substrate 21 is joined to the display plate 23, the adhesive that overflows or the filling resin 32 that overflows from the mold case 34 does not reach the electrode terminal portion 24 and adheres thereto. Can be prevented. Therefore, soldering to the mounting substrate can be reliably performed, and highly reliable electrical connection can be achieved.

As another embodiment, as shown in FIG. 11, the electrode terminal portion 24 has the same vertical groove as in the first embodiment, and the opening on the surface side of this vertical groove is closed with a resist 46.
That is, the through holes 26 and 41 are formed in the insulating substrate 21, and the resist 46 is applied to the surface of the insulating substrate 21 except the portion corresponding to the light guide hole 31 to form the through hole 2.
The openings 46 and 41 on the surface side are covered with the resist 46,
The through hole 26 is pseudo-perforated. This also provides the same effect as the vertical groove 45 that does not penetrate.

The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention. Third,
In the fourth embodiment, a convex portion may be provided on the side surface of the display plate. Further, the structure of the present invention may be applied to a display having a dot matrix structure as a light emitting display.

[0046]

As is apparent from the above description, according to the present invention, the insulating substrate and the display plate are adhered by the translucent filling resin which fills the light guide hole of the display plate, thereby filling and adhering. Can be done at once, work efficiency is improved,
The manufacturing process can be simplified and can be easily manufactured.

Then, the filling resin is made to infiltrate into the reinforcing hole of the insulating substrate, or the display plate is covered with the filling resin to bring the filling resin into contact with the outer surface of the insulating substrate as well. It can be made stronger.

When the side surface of the display plate is projected so as to cover the electrode terminal portion, it is possible to prevent the filling resin or the like from adhering to the electrode terminal portion and concealing it, so that a sound electrode terminal portion can be obtained. . Therefore, when surface mounting on a mounting board,
The electrical connection can be surely made.

In addition, a through hole is formed in the insulating substrate joined to the display board, and a conductor pattern is formed from the surface of the insulating substrate to the electrode terminal portion on the side surface through the through hole, the back surface, and the insulating substrate. Even if the electrode terminals are damaged when the board is cut, such as cracks, the conductor pattern is also formed on the back surface of the insulating board, so it does not hinder the electrical connection to the mounting board. Highly reliable surface mounting is possible. Therefore, the cutting work becomes easy,
The complexity can be eliminated and the product can be easily manufactured.

Then, the electrode terminal portion is formed as a vertical groove formed on the side surface of the insulating substrate from the back surface side to the front surface, or the surface side opening of the through vertical groove is closed with a resist,
By using a vertical groove that does not pass through in a pseudo manner, it is possible to prevent the adhesive or filling resin from adhering to the electrode terminal portion, and to obtain a sound electrode terminal portion. Connection can be reliably performed.

[Brief description of drawings]

1A and 1B show a light emitting display according to a first embodiment, in which FIG. 1A is a perspective view and FIG.

FIG. 2 is a plan view of an insulating substrate showing an example of a conductor pattern.

FIG. 3 is a diagram showing a light emitting display in the process of being manufactured, FIG.
Is a state where the display board is inserted into the mold case, and (b) is a state where the insulating substrate and the display board are adhered by the filling resin.

FIG. 4 shows a light emitting display according to a second embodiment, (a) is a perspective view, and (b) is a sectional view.

FIG. 5 is a diagram showing the relationship between the sizes of the molded case and the display plate.

FIG. 6 is a diagram showing a light emitting display in the process of being manufactured, FIG.
Is a state after the display plate is inserted into the molded case, (b) is a state after the insertion, (c) is a state where the insulating substrate is mounted on the display plate, (d) is a state when mounted, and (e) is a molded case. When released from

FIG. 7 is a sectional view of a light emitting display according to a third embodiment.

FIG. 8 is a plan view of an insulating substrate showing an example of a conductor pattern.

9A is a perspective view of a light emitting display device surface-mounted on a mounting substrate, and FIG. 9B is a cross-sectional view showing a connection state when a crack is present in an electrode terminal portion.

FIG. 10 shows a light emitting display according to a fourth embodiment, (a) is a perspective view and (b) is a cross-sectional view.

FIG. 11 shows a light emitting display according to another embodiment, (a) is a perspective view and (b) is a sectional view.

FIG. 12 is a perspective view of a conventional light emitting display.

13A to 13C are diagrams showing manufacturing steps, (a) a step of attaching an adhesive tape to a case, (b) a step of injecting a filling resin into the case, and (c) a step of inserting a lead frame.

FIG. 14 is a perspective view of another conventional light emitting display.

FIG. 15 is a diagram showing a state in which a light emitting display having a defective electrode terminal portion is soldered to a mounting substrate.

FIG. 16 is a diagram showing a state in which a light emitting display having an adhesive attached to an electrode terminal portion is soldered to a mounting substrate.

[Explanation of symbols]

20 LED chips 21 insulating substrate 23 Display board 24 electrode terminals 25 conductor pattern 31 light guide hole 32 Filling resin 33 Cover 34 Molded case 40 convex 41 through hole 45 vertical groove 46 resist

   ─────────────────────────────────────────────────── ─── Continued front page       (56) References JP-A-9-97928 (JP, A)                 JP-A-4-367891 (JP, A)                 JP-A-6-90026 (JP, A)                 JP-A-9-129780 (JP, A)                 JP-A-5-291629 (JP, A)                 JP-A-6-278313 (JP, A)                 Japanese Patent Laid-Open No. 50-103297 (JP, A)                 Actual Kaihei 6-17259 (JP, U)                 Actual development Sho 48-99058 (JP, U)                 Actual development Sho 48-99065 (JP, U)                 Actual development Sho 48-99059 (JP, U)

Claims (11)

(57) [Claims] 1. An insulating substrate having a plurality of light emitting elements mounted thereon, and a display plate having a display pattern on a surface thereof, wherein a conductive pattern extending from the surface of the insulating substrate to an electrode terminal portion on a side surface is formed. A light guide hole for guiding light from each light emitting element to the display pattern is formed on the plate, and
Translucent resin that is printed on the surface and filled in the light guide holes
An outer surface of the display plate is covered with the light emitting display. 2. An insulating substrate on which a plurality of light emitting elements are mounted.
And has a display pattern on the surface that is bonded to the insulating substrate
And a through-hole is formed in the insulating substrate.
From the front surface of the insulating substrate through the through hole to the back surface
A conductor pattern is formed that extends through the
Light from each light emitting element to the display plate.
A light guide hole leading to the screen is formed, and printing can be performed on the surface of the display board.
The light-transmitting resin that is applied and fills the light guide hole
Luminescent display characterized in that the outer surface of the display plate is covered
vessel. 3. The display board is made of white molding resin.
The light emitting display according to claim 1 or 2. 4. Insulation from a translucent resin covering the outer surface of the display plate
The electrode terminal portion on the side surface of the substrate is exposed
The light-emitting display according to claim 1, 2 or 3. 5. An insulating substrate on which a plurality of light emitting elements are mounted.
And a display plate having a display pattern on the surface,
From the surface of the insulating substrate to the side electrode terminals,
A conductive pattern is formed on the display panel.
A light guide hole for guiding the light from the above to the display pattern is formed,
The translucent resin filled in the light guide hole prevents the outside of the display panel.
The surface is covered, and the translucent resin is an electrode end of the insulating substrate.
It is special to cover a part of the side surface other than the side surface where the child part is formed.
Luminescent indicator to collect. 6. The side surface of the display plate covers above the electrode terminal portion.
It is characterized by being projected so as to block the translucent resin.
The light emitting display according to claim 1, 2 or 5. 7. An insulating substrate having a boundary between the insulating substrate and the display panel.
Reinforcement holes are formed to allow the translucent resin that has permeated the surface to enter.
Light emission according to claim 1 or 5, characterized in that
display. 8. A surface of an insulating substrate having a through hole formed therein.
Form a conductor pattern from the surface to the inside of the through hole,
Insert the display board into the molded case filled with translucent resin
The gap between the molded case and the display plate,
A light-transmitting resin is filled in the light guide hole of the display board to mount the light emitting element.
Place the mounted insulating substrate on the display board and
The through hole on the side surface of the insulating substrate.
Cut the insulating substrate so that the exposed part becomes the electrode terminal part
A method of manufacturing a light emitting display, comprising: 9. A surface of an insulating substrate having through holes formed therein.
Form a conductor pattern from the surface to the inside of the through hole,
The depth is greater than the insertion depth of the display board and its width is
Using a mold case larger than the width of the insulating substrate,
Place the display board in the mold case filled with the translucent resin.
Insert and fill the light guide hole of the display board with translucent resin to emit light.
Place the insulating board on which the device is mounted on the display board.
The outer surface of the display board with a translucent resin,
Note that the through hole is exposed and becomes the electrode terminal.
Manufacture of a light emitting display characterized by cutting an insulating substrate
Method. 10. A display board is inserted into a molded case.
The projections formed on the side surface of the display board.
Prevents the translucent resin from leaking out by making contact with the tip of the glass
The light-emitting display according to claim 8 or 9, characterized in that
Manufacturing method. 11. A display panel and an insulating substrate are made of a translucent resin.
Adhesion is performed by adhesive bonding according to any one of claims 8 to 10.
A method for manufacturing the light emitting display device according to.