JP2001179782A - Resin sealing mold assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing mold for a semiconductor device perfectly absorbing even the large irregularity of the thickness dimension of a substrate and easy in maintenance. SOLUTION: A lower mold cavity 56 is supported by a plurality of parallelly provided pistons 42, and the lower end parts of the pistons 42 are inserted in the hydraulic cylinder block provided to a lower mold set 40 in a freely slidable manner.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing mold apparatus for resin-sealing electronic components such as semiconductor elements, and more particularly to a resin-sealing metal device for resin-sealing electronic components disposed on only one side of a substrate. Molding device.

[0002]

2. Description of the Related Art Conventionally, as a mold device for resin sealing of electronic parts such as semiconductors, for example, as shown in FIG. There is a set composed of a set 1 and a lower mold set 3 incorporating a lower chess 4. Then, by pushing up the lower mold set 3, the lower mold set 3 is pressed against the upper mold set 1 and clamped, and the cavity 5 assembled on the lower surface of the upper chess 2 and the upper surface of the lower chess 4 The substrate 7 was held by the assembled cavity bar 6. Next, the plunger 3a is protruded through a drive mechanism (not shown) to
The solid tablet 8 in b was heated and compressed to be fluidized, and an electronic component (not shown) mounted on the surface of the substrate 7 was sealed with a resin. In the above-mentioned mold apparatus, for example, variations in the thickness of the metallic substrate 7 (such as a lead frame) (maximum 0.02 mm) are absorbed by the elastic deformation of the elastic pins 2a in the axial direction. Reference numeral 9 denotes a support block that constitutes the lower mold set 3.

However, in recent years, there has been an increasing need for resin-sealing a resin substrate such as a so-called substrate. In general, the thickness variation (maximum 0.2 mm) of the resin substrate is much larger than that of the metal substrate. For this reason, it is difficult for the elastic pin 2a having a small amount of elastic deformation to completely absorb variations in plate thickness.
The formation of gaps cannot be prevented, and burrs are likely to occur. Further, in the above-described conventional example, since the elastic deformation amount of the elastic pin 2a is small, it is necessary to replace the elastic pin 2a according to the substrate to be sealed with resin, and it takes time to disassemble and assemble the mold apparatus. For this reason, it has been proposed to use a plurality of mortar-shaped coned disc springs (not shown) which are larger in elastic deformation than the elastic pins 2a, for example. But,
The mortar-shaped disc spring has a problem in that the spring force (repulsion force) varies, and the spring force (repulsion force) greatly changes depending on the stroke of heating and compression.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a resin sealing mold device which completely absorbs a large variation in the thickness of a substrate and is easy to maintain.

[0005]

According to the present invention, there is provided a resin sealing mold for a semiconductor device, comprising: an upper mold cavity provided on a lower surface of an upper mold set; A resin that sandwiches a substrate with a lower mold cavity arranged on the upper surface, protrudes a plunger provided in a lower mold set to fluidize a solid resin for sealing, and resin seals an electronic component mounted on the surface of the substrate. In the sealing die apparatus, the cavity is supported by a plurality of side-by-side pistons, and the piston is slidably inserted into a hydraulic cylinder block provided in the mold set. According to the present invention, even if the thickness of the substrate varies greatly, the piston slides and absorbs the variation in the hydraulic cylinder block. As a result, there is no gap between the cavity and the substrate, and the substrate can be pressed with a constant pressure, so that generation of burrs can be prevented.

As an embodiment of the present invention, a substrate is sandwiched between an upper mold cavity arranged on a lower surface of an upper mold set and a lower mold cavity arranged on an upper surface of a lower mold set, and is provided in the lower mold set. In a resin sealing mold device for projecting a plunger to fluidize a solid resin for sealing and resin sealing an electronic component mounted on the surface of the substrate, a plurality of lower mold cavities are provided by a plurality of juxtaposed pistons. While supporting, the lower end of the piston may be slidably inserted into a hydraulic cylinder block provided in the lower mold set. For this reason, according to the present invention, as described above, even if the thickness of the substrate varies greatly, the lower end of the piston slides through the hydraulic cylinder block to absorb the variation. As a result, there is no gap between the upper mold cavity and the lower mold cavity and the substrate, and the substrate can be pressed with a constant pressure, so that generation of burrs can be prevented.

[0007] As an embodiment of the present invention, the hydraulic cylinder block may be sandwiched between a base plate constituting the upper and lower portions of a lower mold set and a chess base plate. Conventionally, a support block that supports a central portion of a chess base plate has been provided between the base plate and the chess base plate. However, according to the present embodiment, the support block can also be used as the hydraulic cylinder block, without greatly increasing the number of parts.
The above function can be obtained.

In another embodiment, the lower mold cavity supported by the piston may be detachable from the upper surface of the lower mold set. According to this embodiment, removal when cleaning the cavity is facilitated, and maintenance is simplified.

In another preferred embodiment, a plurality of the pistons arranged in parallel may be connected by a single synchronous bar. As a result, no time lag occurs in the operation of the piston, and the responsiveness is further improved. Therefore, the cavities are simultaneously pushed up and the operation is performed while maintaining the horizontal state, so that there is no inclination or distortion, and the yield of the sealed product is improved.

A plurality of juxtaposed pistons and a base plate which supports an intermediate portion of the pistons and constitutes a lower mold set are provided with through holes for operation confirmation which can communicate with each other on the same straight line. You may leave. According to this embodiment, if the through-hole for checking the operation of the piston is not located on the same straight line as the through-hole for checking the operation of the base plate, light passing through the through-hole is shut off, and a stack or the like is provided on the piston. It means that an abnormal situation has occurred. For this reason, the operating state can be confirmed through the through-hole, which is safe and convenient.

In another embodiment, a vertically movable block which is pressed by the lower surface of the upper mold set and descends, a guide block which is laterally moved to a guide position of the cavity by being pressed by a tapered surface of the vertically movable block. A guide mechanism for guiding the cavity with the guide block at the time of mold clamping and opening the guide block at the time of mold opening, near the outward surface of the lower mold cavity assembled to the lower mold set, that is, the side thereof And the direction of insertion and removal. According to this embodiment, the guide block is positioned at the guide position only when the mold is clamped. For this reason, when the mold is opened, so-called galling does not occur on the guide block, and there is an effect that damage to components can be prevented beforehand.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention is shown in FIG.
This will be described with reference to the accompanying drawings in FIGS. As shown in FIGS. 1 to 8, a resin mold apparatus according to the first embodiment generally includes an upper mold set 10 incorporating an upper chess 20 and a lower mold 10 incorporating a lower chess 50. And a mold set 30.

As shown in FIG. 2, the upper mold set 10 has side blocks 12, 12 arranged on both side edges of a lower surface of an upper base plate 11. As shown in FIG. Guide ridges 13 and 13 are provided on the inward facing surfaces of the side blocks 12, respectively, so that an upper chess 20, which will be described later, can be slid from the side.

As shown in FIG. 1 and FIG. 2, the upper chess 20 has a pin plate 22 and an ejector plate 23 sequentially stacked at the center of the upper surface of a holder base plate 21 and chess space blocks 24 on both sides thereof. 24 are arranged, and a fitting guide groove 25 is formed. On the other hand, upper mold cavities 27 are arranged on both sides of a cull block 26 arranged at the center of the lower surface of the holder base plate 21, respectively.
FIG. 1 shows an upper mold set block 28 for positioning the upper mold chess 20 to a lower mold chess 50 described later.

As shown in FIGS. 1 and 2, the lower mold set 30 is assembled with a lower chess base plate 33 via space blocks 32, 32 arranged on both side edges of the upper surface of a lower mold base plate 31, respectively. Things. Then, the space blocks 32 facing each other,
A plunger constant pressure cylinder block 34 is disposed in the center between the two. The plunger 35 can reciprocate in the axial direction through a through hole provided in the lower chess base plate 33. Further, piston cylinder blocks 40, 40 are arranged on both sides of the plunger constant pressure cylinder block 34, respectively.
As shown in FIG. 1, the lower chess base plate 33 has side blocks 36, 36 arranged on both side edges of an upper surface thereof, and an end block 37 arranged at one end of the upper surface thereof. And the side block 3
The lower inner chess 5 which will be described later,
Guide ridges 36a, 36a for sliding-fitting the 0 are formed respectively.

On the other hand, as shown in FIG. 2, the piston cylinder block 40 has a space 40a sealed by a cylinder cover 41 and a skirt portion 42a of a piston 42.
And an upper liquid chamber 43 and a lower liquid chamber 44 by packing (not shown).
It is divided into. The upper liquid chamber 43 and the lower liquid chamber 44 are connected to hydraulic pumps (not shown) via supply / discharge ports 43a and 44a (FIG. 3) communicating with each other. An upper end portion 45a of a rod 45 extending in the same axial direction from the piston 42 projects from a through hole 33b provided in the lower chess base plate 33 (FIG. 2). Further, the upper end portion 45a of the rod 45
Are formed so as to slide-fit into a detachable block 55 described later. The upper end 45 of the rod 45
a can be directly fitted to the lower mold cavity bar 56 without going through the detachable block 55.

Further, as shown in FIG.
The operation confirmation through holes 45b and 33d are provided on the rod 45 and the base plate 33 so as to communicate with each other on the same line. An optical fiber light source 38a is positioned on one side of the operation confirmation communication hole 33d, and an optical sensor 38b is disposed on the other side. Therefore, in the event that an abnormal situation occurs in which the piston 42 cannot return to the predetermined position due to a stack or the like, the light remains blocked, and the light sensor 38b senses this, and the driving is stopped immediately.

As shown in FIGS. 1 and 2, the lower mold chess 50 has space blocks 52, 52 arranged on both side edges of a lower surface of a lower mold holder base plate 51 to form guide grooves 53, while the upper surface thereof has an upper surface. A center block 54 is arranged at the center. Through holes 54a are formed in the center block 54 at a predetermined pitch.
The molding resin tablet inserted into 4a can be extruded by the plunger 35. Further, detachable blocks 55 are arranged on both sides of the center block 54 and at positions where they can be slidably fitted on the rods 45 of the piston 42. The detachable block 55 is slidably fitted at its lower end to the upper end 45a of the rod 45, and has a lower mold cavity bar 56 slidably fitted at its upper end. Also, as described above, the upper end 4
5a and the lower mold cavity bar 56 can be directly slide-fitted. FIG. 1 shows the upper chess 20
A lower mold set block 57 for positioning the lower mold chess 50 on the lower mold chess 50 is shown.

A guide mechanism 60 shown in FIGS. 4 and 5 is adjacent to the outward surface of the lower mold cavity bar 56. The guide mechanism 60 includes an upper and lower movable block 61 and a guide block 62 which are adjacent to each other via respective tapered surfaces 61a and 62a. Further, the vertically movable block 61 is urged upward via a spring plunger 63. However, since the vertically movable block 61 and the guide block 62 are engaged with the retaining pins 65 provided with the springs 64, they do not fall off.

Next, a description will be given of a sealing step using a resin sealing mold device comprising the above-mentioned components. FIG.
(A), (b), the lower mold cavity bar 56
And a solid tablet 71 is inserted into the through hole 54a. Then, the lower mold set 30 is clamped to the upper mold set 10 by pushing up the lower mold set 30 via a drive mechanism (not shown) (FIG. 6C).

At this time, as shown in FIGS. 4 and 5,
When the lower mold set 30 rises, the lower surface of the upper holder base plate 21 contacts the vertically movable block 61 and pushes it down. For this reason, the vertical movable block 6
1 presses the guide block 62 sideways via the tapered surfaces 61a and 62a, and the guide block 62 is positioned at a regular position for guiding the lower mold cavity bar 56. In this clamped state, the gap between the lower mold cavity bar 56 and the guide block 62 is the gap (0.001 to 0.0
15 mm). Therefore, vertical movement of the lower mold cavity bar 56 that absorbs variations in the thickness of the substrate can be secured.

Next, as shown in FIG. 7A, oil is supplied to the lower liquid chamber 44 to push up the piston 42,
5 and the lower mold cavity bar 56 are raised via the detachable block 55 or directly.
Is clamped by the lower mold cavity bar 56 and the upper mold cavity 27. Further, the plunger 35 of the constant pressure cylinder block 34 is raised, and the solid tablet 71 is heated and compressed to be fluidized, and a resin is injected to seal and mold the substrate 70 (FIG. 7B). Next, the lower mold device 30 is lowered to open the mold (FIG. 7C).

At this time, since the load of the upper holder base plate 21 on the vertically movable block 61 is eliminated,
The vertical movable block 61 is pushed up by the spring force of the spring plunger 63. Therefore, the pressing force on the guide block 62 is released, and the guide block 62 is released.
Are movable in the lateral direction, and are retracted from a predetermined position for positioning the lower mold cavity bar 56. As a result, even if the piston 42 rises significantly during the maintenance of the lower mold cavity bar 56, since the guide block 62 is retracted from the positioning position of the lower mold cavity bar 56, sliding resistance is generated at that position. do not do. Therefore, there is an advantage that so-called galling, stacking (locking) and the like do not occur in the guide block 62.

By raising the plunger 35 of the constant pressure cylinder block 34 to a position higher than the position where the resin is sealed, the product is lifted from the lower mold cavity bar 56, and the molded product is gripped by a carrier (not shown). ,
Take out the product. In addition, a relief (not shown) may be formed in a part of the lower mold set 30, and the molded product may be taken out only by the carrier without raising the plunger of the constant pressure cylinder block. In addition, the ejector may be provided by using a commonly used ejector mechanism.

When the lower mold cavity bar 56 is to be cleaned, the piston 42 is raised to the highest position,
This is performed by sliding the lower mold cavity bar 56 to the side and pulling it out. In addition, depending on the degree of the cylinder stroke (the highest rising position) at this time, it is possible to pull out a part by taking out a part in the sliding direction.

The second embodiment differs from the first embodiment in that the upper end 45a of a rod 45 extending from the piston 42 is connected by a synchronization bar 46 as shown in FIGS.
Since the configuration is the same as that of the embodiment, the same portions are denoted by the same reference numerals and description thereof will be omitted. According to the present embodiment, the synchronization bar 46
Since the pistons 42 are connected with each other, no time lag occurs in the operation of each piston 42, and the responsiveness of the piston 42 is further improved. For this reason, the lower mold cavity bar 56 supported by the piston 42 is simultaneously pushed up, so that the lower mold cavity bar 56 is not inclined or distorted. As a result, there is an advantage that the slidability of the lower mold cavity bar 56 is improved, burrs are not generated, and the yield can be improved.

In the above embodiment, the case where a solid tablet is used as the solid resin for sealing has been described.
The invention is not necessarily limited to this, and a granular or powdery solid resin may be used. Further, the fluidization of the solid resin for sealing may be performed not only by heat compression but also by simple compression work.

[0028]

According to the present invention, the lower end of the piston supporting the lower mold cavity is slidably supported in the hydraulic cylinder block. Therefore, even if the thickness of the substrate to be resin-sealed has a large variation, the piston slides up and down to absorb the variation in the thickness. As a result, there is no gap between the upper and lower cavities and the substrate, and it is possible to prevent the occurrence of burrs and to improve the yield of sealed products.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a resin sealing mold apparatus according to the present invention.

FIG. 2 is a front sectional view of the mold apparatus shown in FIG.

FIG. 3 is a side sectional view of the mold apparatus shown in FIG. 1;

FIG. 4 is a partial front sectional view before operation of the mold apparatus shown in FIG. 1;

FIG. 5 is a partial cross-sectional front view after the operation of the mold apparatus shown in FIG. 1;

FIG. 6 is an operation explanatory view of the mold apparatus shown in FIG. 1;

FIG. 7 is an explanatory view of the operation of the mold apparatus continued from FIG. 6;

FIG. 8 is an explanatory view of the operation of the mold apparatus continued from FIG. 7;

FIG. 9 is an exploded perspective view showing a second embodiment of the resin sealing mold apparatus according to the present invention.

FIG. 10 is a partial sectional view of the mold apparatus shown in FIG. 9 before operation.

FIG. 11 is a partial cross-sectional front view after the operation of the mold apparatus shown in FIG. 9;

FIG. 12 is a front sectional view of a mold apparatus according to a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Upper mold set, 11 ... Upper base plate, 12 ... Side block, 13 ... Guide ridge, 20
... upper chess, 21 ... holder base plate, 22 ...
Pin plate, 23: Ejector plate, 24: Chess space block, 25: Guide groove for fitting, 26:
Cul block, 27: Upper mold cavity, 28: Upper mold set block, 30: Lower mold set, 31: Lower mold base plate, 32: Space block, 33: Lower mold chess base plate, 33d: Operation confirmation through hole, 3
4 ... Constant pressure cylinder block for plunger, 35 ... Plunger, 36 ... Side block, 36a ... Guide ridge, 37 ... End block, 38a ... Light source, 38b ... Light sensor, 40 ... Cylinder block for piston, 40
a: space, 41: cylinder cover, 42: piston,
42a: skirt portion, 43: upper liquid chamber, 44: lower liquid chamber, 4
3a, 44a: supply / discharge port, 45: rod, 45a: upper end, 45b: through hole for operation confirmation, 50: lower chess,
51: Lower holder base plate, 52: Space block, 53: Guide groove, 54: Center block, 5
5: detachable block, 56: lower mold cavity bar, 60:
Guide mechanism portion, 61: vertically movable block, 62: guide block, 61a, 62a: tapered surface, 63: spring plunger, 64: spring, 65: retaining pin, 70: substrate, 71: tablet.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AH33 CA12 CB01 CB12 CK25 CK52 CK75 CK83 4F206 AH37 JA02 JB17 JF05 JN25 JQ81 5F061 AA01 BA03 CA21 DA01 DA06 DA14

Claims (7)

[Claims] 1. A substrate is sandwiched between an upper mold cavity arranged on a lower surface of an upper mold set and a lower mold cavity arranged on an upper surface of a lower mold set, and a plunger provided on the lower mold set is protruded and sealed. In a resin sealing mold device for fluidizing a solid resin for stopping and resin sealing an electronic component mounted on the surface of the substrate, the cavity is supported by a plurality of juxtaposed pistons, while the piston is A resin sealing mold apparatus slidably inserted into a hydraulic cylinder block provided in the mold set. 2. A substrate is sandwiched between an upper mold cavity arranged on a lower surface of an upper mold set and a lower mold cavity arranged on an upper surface of a lower mold set, and a plunger provided on the lower mold set is protruded and sealed. In a resin sealing mold device for fluidizing a solid resin for stopping and resin sealing an electronic component mounted on the surface of the substrate, the lower mold cavity is supported by a plurality of juxtaposed pistons, A lower end portion of the piston is slidably inserted into a hydraulic cylinder block provided in the lower mold set. 3. The resin-sealing mold device according to claim 1, wherein the hydraulic cylinder block is sandwiched between a base plate and a chess base plate which constitute upper and lower portions of a lower mold set. 4. The resin sealing metal according to claim 1, wherein a lower mold cavity supported by a piston is detachable from an upper surface of the lower mold set. Mold device. 5. A piston according to claim 1, wherein said plurality of pistons are connected by a single synchronous bar.
The resin molding die apparatus according to any one of the above. 6. A plurality of pistons juxtaposed and a through-hole for operation confirmation which can communicate on the same straight line with a base plate supporting an intermediate portion of the pistons and constituting a lower mold set, respectively. The resin sealing mold device according to any one of claims 1 to 5, wherein the resin sealing mold device is provided. 7. An upper and lower movable block which is pressed down by a lower surface of an upper mold set, and a guide block which is pressed by a tapered surface of the upper and lower movable block and moves laterally to a guide position of the cavity. A guide mechanism for guiding the cavity with the guide block at the time and opening the guide block when the mold is opened is arranged near the outward surface of the lower mold cavity assembled to the lower mold set. 7. The resin sealing mold device according to any one of 1 to 6.