JP3028873B2 - Mold device for molding resin-sealed parts of electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for molding a resin-sealed portion of an electronic component used for transfer molding of a resin-sealed portion of an electronic component such as a semiconductor element. Related to the protrusion mechanism.

[0002]

2. Description of the Related Art For example, a resin sealing portion of an electronic component such as a semiconductor element is formed by transfer molding with a thermosetting resin. Here, an example of a conventional mold device for molding a resin sealing portion of an electronic component will be described with reference to FIGS. 4 and 5. Reference numeral 1 denotes an upper mold, 2 denotes a lower mold, and the upper mold 1 and the lower mold 2 are attached to a transfer molding machine main body, and move up and down relative to each other to open and close. For example, the upper mold 1 is fixed, and the lower mold 1 is driven up and down by a lower mold drive source such as a hydraulic cylinder device or an electric motor provided on the transfer molding machine body side. The upper mold 1 includes a plurality of upper blocks 7 on a lower surface of an upper mold plate 6 having a heater (not shown).
Are mounted, and an upper mounting plate 9 is mounted on the upper surface of the upper die plate 6 via a spacer 8. on the other hand,
The lower mold 2 has a plurality of lower blocks 12 mounted on an upper surface of a lower mold plate 11 containing a heater (not shown), and a lower mounting plate 14 provided on a lower surface of the lower mold plate 11 with a spacer 13 interposed therebetween. Is installed. A concave-shaped cull 16 is formed on the lower surface of the upper block 7, while a pot 17 overlapping the cull 16 during mold clamping is fixed to the lower block 12 and the lower mold plate 11 in a penetrating state. ing. At the time of mold clamping, a runner 18 communicating with the cull 16 and a mold cavity 20 communicating with the runner 18 via a gate 19 are formed between the upper block 7 and the lower block 12. Has become.

Further, on the upper mold 1 and lower mold 2 sides, respectively, an upper protruding mechanism 21 and a lower protruding mechanism for releasing a molded product formed between the two dies 1 and 2 when the mold is opened. 22 are provided. Here, first, the upper protrusion mechanism 21
Will be described. Upper protruding plates 23 and 24 are supported between the upper die plate 6, the spacer 8 and the upper mounting plate 9 so as to be vertically movable relative to them. A plurality of upper protruding pins 25 are fixed to the upper protruding plates 23 and 24 by protruding downward. These upper protruding pins 25 penetrate the upper die plate 6 and the upper block 7 so as to be vertically slidable, and protrude the molded product relatively downward from the upper block 7. A stopper 26 is attached to the lower surface of the upper protruding plate 24. Further, between the upper protruding plate 24 and the upper mounting plate 9, there is provided a protruding spring 27 for urging the upper protruding plates 23 and 24 relatively downward with respect to the upper mounting plate 9. At the same time, the return pins 28 are fixed to the upper protruding plates 23 and 24 by protruding downward. The return pin 28 penetrates the upper die plate 6 and the upper mounting plate 9 so as to be vertically slidable. Next, the configuration of the downward protrusion mechanism 22 will be described. Lower template 11 and spacer
Lower protruding plates 31, 32 are supported between the lower mounting plate 14 and the lower mounting plate 13 so as to be able to move up and down relatively to these. A plurality of lower protruding pins are attached to the lower protruding plates 31, 32.
33 is fixed by protruding upward. The lower protruding pins 33 penetrate the lower mold plate 11 and the lower block 12 so as to be vertically slidable, and protrude the molded product relatively upward from the lower block 12. Further, a stopper 34 is attached to the lower surface of the lower protruding plate 31. Further, a return spring 35 is provided between the lower protruding plate 31 and the lower mounting plate 14 for urging the upper protruding plates 31, 32 relatively downward with respect to the lower mounting plate 14. At the same time, a receiving pin 36 is fixed to the lower surface of the lower protruding plate 31. The receiving pin 36 is pushed upward by a protruding rod 37 of the transfer molding machine main body when the mold is opened. Reference numeral 38 denotes a plunger that moves up and down the transfer molding machine main body.
Penetrates through the lower mounting plate 14 and the lower protruding plates 31, 32,
The lower mold 2 is slidably fitted in the pot 17.

Next, the operation of the above configuration will be described. At the time of molding, the molds 1 and 2 are attached to the transfer molding machine main body, and the electronic components before resin sealing are mounted on the lower mold 2 while the mold is open as shown in FIG. Load the curable resin tablet. Then, as shown in FIG.
2 is clamped, and the plunger 38 is raised. The thermosetting resin in the pot 17 is brought into a molten state by pressurization by the plunger 38 and heating by the heaters in the mold plates 6 and 11, and is pushed by the plunger 38 to move the runner 18 and the gate 19 from the cull 16. The mold cavity 20 is filled sequentially. Thus, the resin sealing portion of the electronic component is formed. Thereafter, the molds 1 and 2 are opened. With the opening of the molds, the upper protruding plates 23 and 24 are lowered relative to the upper die plate 6 and the upper block 7 by the urging of the protruding spring 27. The upper protruding pins 25 descending together with the upper protruding plates 23 and 24 push down the molded product from the upper mold 1. Thus, the molded product is first released from the upper mold 1. The upper protruding plates 23 and 24 descend until the stopper 26 hits the upper die plate 6. Thereafter, as the lower mold 2 descends, the fixed protrusion rod 37 on the transfer molding machine main body side is fixed.
Abuts on the receiving pin 36 of the lower protruding plate 31, and pushes up the receiving pin 36. Accordingly, the lower protruding plates 31 and 32 relatively rise with respect to the lower mold plate 11 and the lower block 12 against the bias of the return spring 35, and the lower protruding pins which rise together with the lower protruding plates 31 and 32. 33
Pushes up the molded product from the lower mold 2. Thereby, the molded product is released from the lower mold 2. When the protruding rod 37 separates from the receiving pin 36 in accordance with the mold clamping, the lower protruding plates 31, 32 are lowered relative to the lower die plate 11 and the lower block 12 by the bias of the return spring 35, The lower protruding pin 33 returns to the position at the time of molding. At this time, the lower protruding plates 31 and 32 descend until the stopper 34 abuts on the lower mounting plate 14. When the return pins 28 fixed to the upper projecting plates 23 and 24 abut against the upper surface of the lower block 12, the upper projecting plates 6 and 7 are pressed against the upper die plate 6 and the upper block 7 against the urging of the projecting spring 27. 23 and 24 relatively rise, and the upper protruding pin 25 returns to the position at the time of molding.

[0005]

However, in the above-described conventional mold apparatus for molding a resin-sealed portion of an electronic component, the upper protruding plates 23 and 24 urged by the protruding spring 27 are used to lower the lower mold at the time of mold clamping. 1 is returned to the position at the time of molding by the return pin 28 which abuts on the upper block 7. When the mold is open, the upper protruding pin 25 always projects downward from the upper block 7 and the return pin 28 Also project downward from the upper block 7. However, when the protruding pins 25 and the return pins 28 protrude, the pins 25 and 28 hinder the cleaning of the molds 1 and 2 performed in the mold open state. Also, at the time of mold clamping, the return pin 28 is pushed to raise the upper protruding plates 23 and 24 by applying a force from the lower mold 1 side. A strong mold clamping force will be required. this is,
This is disadvantageous when trying to use an electric motor which is difficult to obtain a strong force for the lower mold driving source. Further, even when a foreign object is sandwiched between the dies 1 and 2 at the time of mold clamping, since a load is naturally applied to the return pin 28, it is difficult to determine whether the foreign object has actually been sandwiched.

On the other hand, Japanese Patent Laying-Open No. 55-59918 discloses that a lower protruding pin and an upper protruding pin are driven by a hydraulic cylinder mechanism. With the configuration in which the protruding pins are driven by the hydraulic cylinder mechanism as described above, it is considered that these protruding pins can be driven independently of opening and closing of the mold, and the problem of the cleanability and the like can be solved. However, the protruding pin of the upper mold has various disadvantages due to the fact that the molded product sticks to the upper mold side without opening to the lower mold side when opening the mold,
For example, it is to prevent the molded product from being damaged or from being unable to remove the molded product.Therefore, it is necessary to ensure that the molded product does not stop on the lower mold at the first stage of mold opening in synchronization with the mold opening. No. However, if the ejection pin is driven by a hydraulic cylinder mechanism, additional components such as a sensor and a control device are required to interlock the ejection timing with the mold opening. It is difficult to link with.

The present invention is intended to solve such a problem. When the mold is cleaned, the upper protruding pin does not become an obstacle, and the required mold clamping force can be reduced.
Provided is a mold device for molding a resin-sealed portion of an electronic component, in which it is easy to determine whether or not a foreign object has been sandwiched between molds, and furthermore, the protruding operation of an upper protruding pin can be reliably linked to mold opening. With the goal.

[0008]

According to the present invention, there is provided a mold apparatus for molding a resin-sealed portion of an electronic component according to the present invention.
An upper mold and a lower mold that are opened and closed with respect to each other in a vertical direction, and a protruding mechanism that is provided on each of the upper mold side and the lower mold side and that releases a molded product formed between the two molds when the mold is opened. The projecting mechanism on the side of the upper mold, a projecting pin for projecting a molded product, a projecting spring for urging the projecting pin downward, and a force in an upward direction acting on the projecting pin independently of opening and closing of the mold. And a driving source.

[0009]

In the mold apparatus for molding a resin-sealed portion of an electronic component of the present invention, the mold is clamped in a state where the protruding pin is raised against the urging of the protruding spring by driving the driving source. After molding the resin-sealed portion of the electronic component between the mold and the lower mold, when the mold is opened, the molded products are released by the protruding mechanisms provided on the upper mold side and the lower mold side, respectively. At the time of opening the mold, especially in the projecting mechanism on the upper mold side, the driving source does not apply a force in the upward direction to the ejecting pin. For this reason, with the opening of the mold, the projecting pin releases the molded product on the upper mold side by the urging of the projecting spring. Also, when cleaning the mold in the mold open state, if the ejection pin is raised by the driving of the drive source and returned to the position at the time of molding, the ejection pin does not interfere.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a mold apparatus for molding a resin sealing portion of an electronic component according to the present invention will be described below with reference to FIGS. Since the mold apparatus of this embodiment has the same configuration and operation as those of the conventional mold apparatus shown in FIGS. 4 and 5 except for the upward projection mechanism, the same parts are denoted by the same reference numerals. Therefore, description of the configuration and operation will be omitted. The upper protrusion mechanism 41 of the mold device of the present embodiment does not have the return pin 28 unlike the conventional mold device,
The upper protruding plates 23, 24, on which the upper protruding pins 25 for protruding a molded product are fixed, are driven vertically by a hydraulic cylinder device 42 and a protruding spring 27, which are driving sources, independently of the opening and closing of the dies 1, 2. It is. That is, the vertically moving rod 43 of the hydraulic cylinder device 42 attached to the upper mounting plate 9 is fixed to the upper protruding plates 23 and 24. The upper protruding plates 23 and 24 are urged downward relative to the upper mounting plate 9 by a plurality of protruding springs 27 provided between the upper protruding plates 23 and 24 and the upper mounting plate 9. On the other hand, the hydraulic cylinder device 42 acts to raise the upper mounting plate 9 when hydraulic pressure is applied. Further, a stopper 44 is mounted on the upper surface of the upper protruding plate 23.

Next, the operation of the above configuration will be described. The resin-sealed portion of the electronic component is molded in a mold-clamped state as shown in FIG. At the time of such forming, the hydraulic cylinder device 42 is put in a pressurized state, and by driving the hydraulic cylinder device 42, the upper protruding plates 23 and 24 are moved against the upper die plate 6 and the upper block 7 against the urging of the protruding spring 27. Raise it and retract the upper protruding pin 25. In addition, upper protruding plate 2
3, 24 are raised until the stopper 44 abuts on the upper mounting plate 9. After molding, as shown in FIG.
Opens the mold. At this time, the hydraulic cylinder device 42 is set in a non-pressurized state so that no upward force is applied to the upper protruding plates 23 and 24 by the hydraulic cylinder device 42. Therefore, as the mold is opened, the upper mold plate 6 and the upper block 7 are urged by the urging spring 27 on the upper mold 1 side.
The upper protruding plates 23 and 24 are relatively lowered, and the upper protruding pins 25 which are lowered together with the upper protruding plates 23 and 24 push down the molded product from the upper mold 1. Thus, the molded product is first released from the upper mold 1. Thereafter, in the same manner as in the conventional mold device, the lower protrusion mechanism 22 on the lower mold 2 side
The molded product is released from the lower mold 2. When the molds 1 and 2 are cleaned in the mold opened state, the upper protruding plates 23 and 24 and the upper protruding pins 25 are raised by driving the hydraulic cylinder device 42, as shown in FIG. twenty five
If this is returned to the position at the time of molding, the upper protruding pin 25 does not hinder the cleaning.

As described above, according to the configuration of the present embodiment,
By driving the upper protruding pin 25 independently of the opening and closing of the molds 1 and 2, the upper protruding pin 25 can be prevented from protruding downward from the upper block 7 in the mold open state. This facilitates cleaning of the molds 1 and 2 in combination with the fact that there is no return pin. Further, since the configuration is not such that the upper protruding pin 25 is returned to the position at the time of molding by using the mold clamping force, the mold clamping force required for the lower mold driving source of the transfer molding machine main body is reduced. This is advantageous in using an electric motor, which hardly obtains a strong force, for the lower mold driving source. Further, when foreign matter is sandwiched between the molds 1 and 2 at the time of mold clamping, this is clearly understood. Further, since the protruding of the molded product by the upper protruding pin 25 is performed only by driving the protruding spring 27, it is possible to reliably interlock with the mold opening without using a sensor or a control device. Therefore, it is possible to reliably prevent various inconveniences caused by the molded product being attached to the upper mold 1 side without stopping at the lower mold 2 side at the time of opening the mold, for example, damage to the molded product and failure to remove the molded product.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made. For example,
As a drive source of the upper protruding plates 23 and 24, a pneumatic cylinder device or the like can be used in addition to the hydraulic cylinder device.

[0014]

According to the present invention, in the projecting mechanism on the upper mold side, the projecting pin is urged downward by the projecting spring, and the same projecting pin is moved upward by the driving source independently of the opening and closing of the mold. When the mold is cleaned with the mold open, the projecting pin can be returned to the position at the time of molding so that the projecting pin does not get in the way, thus eliminating the return pin. Together with this, mold cleaning becomes easier,
In addition, the required mold clamping force can be reduced, and it becomes easier to determine whether or not a foreign object has been caught between the molds during mold clamping. In addition, the protrusion of the molded product by the upper protruding pin can be reliably linked to the mold opening without using a sensor or a control device. Therefore, when the mold is opened, the molded product does not stop at the lower mold side, and the upper metal mold does not stop. Various inconveniences caused by sticking to the mold side can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an embodiment of a mold device for molding a resin sealing portion of an electronic component according to the present invention in a mold-clamped state.

FIG. 2 is a cross-sectional view of a state in which an upper protruding pin is protruded in the same mold open state.

FIG. 3 is a cross-sectional view showing a state in which the upper protruding pin is returned to a position at the time of molding in the same mold open state.

FIG. 4 is a cross-sectional view of a conventional mold device for molding a resin sealing portion of an electronic component in a mold-clamped state.

FIG. 5 is a cross-sectional view of the same mold open state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper mold 2 Lower mold 22 Lower protruding mechanism (protruding mechanism) 25 Upper protruding pin (protruding pin) 27 Protruding spring 41 Upper protruding mechanism (protruding mechanism) 42 Hydraulic cylinder device (drive source)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-55-59918 (JP, A) JP-A-2-59309 (JP, A) JP-A-54-101860 (JP, A) (58) Survey Field (Int.Cl. ⁷ , DB name) B29C 45/26-45/44

Claims (1)

(57) [Claims] 1. An upper mold and a lower mold which are opened and closed with respect to each other in a vertical direction, and a molded product provided between the upper mold and the lower mold and molded between the two molds is released when the mold is opened. A protruding mechanism, wherein the protruding mechanism on the upper mold side includes a protruding pin for protruding a molded product, a protruding spring for urging the protruding pin downward, and an upward direction independent of opening and closing of the die by the protruding pin. And a drive source for applying a force of (1).