JP2001170859A - Method and device for polishing and polishing carrier used for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for polishing both front and back faces of a work held inside a work holding hole while rotating and revolving a polishing carrier between an upper surface plate and a lower surface plate to prevent excessive contact resistance of the work with the upper/lower surface plates and having no parsibility of breaking, chipping and damaging for the work such as a very thin wafer in particular. SOLUTION: When the polishing carrier 10 rotates/revolves between the upper/lower surface plates 3 and 4, only one edge 11a of the work holding hole 11 is moved in/out from inner/outer circumference of the upper/lower surface plates by a fixed distance to decrease rotation angle of the polishing carrier from the edge coming out of the inner/outer circumference to coming in again. The rectangle work holding hole is formed such that a straight radial line L1 passing through the center of the hole and one side S1 of the work holding hole adjacent to the edge coming in/out of the inner/outer circumference of the upper/lower surface plates cross each other with a fixed angle θ within minimum and maximum angles determined by a length of side S2 adjacent to the edge that follows it and by that of side S1 that precedes it except for 90 deg..

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing technique generally including a lapping process and a finishing process such as polishing performed in addition thereto, and more particularly to a polishing method and a polishing apparatus for polishing a thin plate-like work surface. And a polishing carrier used for the same.

[0002]

2. Description of the Related Art In recent years, as various types of electronic equipment have become more sophisticated and smaller, thinner materials such as quartz wafers, semiconductor wafers, and liquid crystal panel substrates have been rapidly thinned, and surface polishing has been performed with high precision. Technology is required. In particular, in information communication devices, the thickness of a crystal resonator element has been reduced in order to increase the oscillation frequency of a crystal resonator used as a clock source. Conventionally, in order to polish these thin plate materials, a polishing apparatus such as a flat lapping machine is generally used as described in, for example, JP-A-10-180623.

[0003] Such a conventional polishing apparatus is, for example, shown in FIG.
As schematically shown in FIG. 10, a sun gear 1 rotatably arranged at the center, a ring-shaped internal gear 2 concentrically arranged with the sun gear 1, an upper surface plate 3 and a lower surface plate 4 are provided. . Between the sun gear 1 and the internal gear 2, a plurality of disc-shaped polishing carriers 5 having external teeth 5a are arranged at regular intervals in the circumferential direction so as to mesh with them and rotate and revolve. . When a thin work such as a quartz wafer, a semiconductor wafer, or a liquid crystal panel substrate is polished, a thin polishing carrier obtained by rolling a carbon tool steel or the like is generally used. As shown in FIG. 11, the polishing carrier 5 has a plurality of work holding holes 6 each having a substantially rectangular opening that complements the work and is formed at equal intervals in the circumferential direction, and holds the work 7 therein. Is done.

By rotating the sun gear 1 and / or the internal gear 2, the polishing carrier 5 is planetary-moved so that the polishing surfaces of the upper platen and the lower platen are uniformly reduced over the entire surface. Alternatively, the upper and lower surfaces of the work 7 are polished between the upper and lower surface plates while the slurry 8 containing other abrasive particles such as ceramic particles is supplied between the upper and lower surface plates. Furthermore,
In some cases, by rotating at least one of the upper stool and the lower stool, polishing can be performed while imparting a complicated motion to the work. When the work 7 slides only inside the polishing surface of the upper surface plate 3 and the lower surface plate 4, there is a portion that does not come into sliding contact with the work at the inner and outer peripheral edges of each polishing surface,
There is a possibility that a minute step will occur and hinder the polishing process.
For this reason, when the polishing carrier 5 carries out planetary motion, a part of the work holding hole 6 enters and exits from each peripheral portion of the upper and lower platens, and the work surface becomes each polishing surface of the upper platen 1 and the lower platen 2. Is slid over the entire surface so that each polished surface can be evenly cut over the entire surface.

[0005]

However, in the conventional polishing carrier, a generally rectangular work holding hole is opposed to the center C1 of the polishing carrier as illustrated in FIGS. That is, one of the two opposing sides is moved from the center C1 of the polishing carrier to the center C2 of the work holding hole.
, And the other two opposing sides are arranged in parallel with the straight line L. Therefore, the work holding hole 6 is such that the two adjacent corners 6a and 6b continuously enter and exit from the inner and outer peripheral edges of the upper and lower platens, and the work 7 has a contact resistance with the upper and lower platens at that time. May become large, causing chipping or chipping, jumping out of the work holding hole and breaking, and further causing a serious accident that broken pieces damage or break other works.

Further, the inventor of the present application has examined in detail that the direction of each side of the work holding hole, that is, the angle θ between the straight line L in the radial direction and the side intersecting the straight line L in FIG. Was found to be largely related to

In FIG. 13, when the leading corner 6a of the work holding hole is about to come out of the outer peripheral edges 3a, 4a of the upper and lower platens, the leading side of the work holding hole 6 on the side preceding the corner is referred to. The angle formed by the extension line es1 of the side s1 and the tangent line to1 of the outer peripheral edge at the position of the corner 6a is defined as an outgoing angle αout. When the corner 6a is going to enter from the outer edges 3a, 4a, the outer edge 3 at the position of the corner 6a
a, tangent line to2 of 4a and extension line e of side s1 of work holding hole
The angle formed by s1 is defined as an incident angle αin. And the outgoing angle α
If the difference between out and the entry angle αin is the entry / exit angle difference △ α, this means that the work holding hole 6 rotates until the corner 6a of the work holding hole goes out of the outer peripheral edge of the upper and lower platens and enters inside. (rotation)
Angle.

Similarly, as for the inner peripheral edges 3b and 4b of the upper and lower platens, as shown in FIG. 14, when the leading corner 6a of the work holding hole is going to go out of the inner peripheral edges of the upper and lower platens, Similarly, the angle formed by the extension line es1 of the side s1 of the work holding hole 6 on the side preceding the corner and the tangent ti1 of the inner peripheral edge at the position of the corner 6a is defined as the outgoing angle βout. When the corner 6a is going to enter from the inner peripheral edges 3b, 4b, the angle between the tangent line ti2 of the inner peripheral edge at the position of the corner 6a and the extension line es1 of the side s1 of the work holding hole is defined as the input angle βin. And When the difference between the outgoing angle βout and the incoming angle βin is defined as the outgoing / inward angle difference △ β, the difference between the angle 6a of the work holding hole and the inner edge of the upper and lower stools is likewise increased. The rotation angle of the work holding hole 6.

When the above in-and-out angles at the angle θ = 90 ° were actually obtained, αout = about 119 with respect to the outer peripheral edge.
° and αin = about 93 °, βout = about 12 for the inner periphery
7 ° and βin = about 85 °. Accordingly, the difference between the entrance and exit angles at the inner and outer peripheral edges is △ α = about 25.5 ° and △ β, respectively.
= Approximately 41.7 °, which indicates that the contact resistance between the work and the upper surface plate and the lower surface plate is large.

Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to prevent the contact resistance between the work and the upper and lower platen from becoming excessive, and particularly to the ultra-thin wall required for a quartz vibrating piece or the like. It is an object of the present invention to provide a polishing method and a polishing apparatus that enable a polishing process without causing any problems such as chipping, chipping, and breakage of a wafer, and a polishing carrier used for the polishing method.

[0011]

According to the present invention, a work is held in a rectangular work holding hole of a polishing carrier, and the polishing carrier is rotated and revolved between an upper surface plate and a lower surface plate. In the polishing method of polishing the front and back surfaces of the work with the upper and lower lapping plates, only one corner of the work holding hole is rotated by the upper and lower lapping plates when the polishing carrier rotates and revolves. There is provided a polishing method characterized by entering and exiting from the inner and outer peripheral edges.

In this manner, by rotating and revolving the polishing carrier between the upper surface plate and the lower surface plate, the exit angle of the corner of the work holding hole from when it comes out from the inner and outer peripheral edges of the upper and lower surface plates until it reenters. The difference, that is, the rotation angle of the work holding hole is reduced. Therefore, the contact resistance with the upper and lower platens when the work enters and exits from the inner and outer peripheral edges of the upper and lower platens is reduced, causing chipping and chipping of the work, breakage due to popping out of the work holding holes, and other debris due to fragments thereof. Work damage can be effectively prevented.

In one embodiment, the corner of the work holding hole is
It has been found that if the upper and lower platens are made to protrude by a maximum of 1 mm in the radial direction from the inner and outer peripheral edges, even extremely thin workpieces used especially for high-frequency crystal vibrating pieces can be polished without any problem. .

According to one aspect of the present invention, the work piece has a rectangular work holding hole for holding a work, and rotates and revolves between the upper surface plate and the lower surface plate while rotating between the upper surface plate and the lower surface plate. A polishing carrier for polishing both front and back surfaces of a work by a plate, and this work holding hole, when the polishing carrier rotates and revolves, only one corner of the inside and outside of the upper platen and the lower platen. A polishing carrier characterized by being formed so as to enter and exit from a peripheral edge is provided.

As a result, as described above, the angle difference between the corners of the work holding holes from the inner and outer peripheries of the upper and lower platens until they enter again, that is, the rotation angle of the work holding holes, is reduced, and the work is fixed vertically. Since the contact resistance with the upper and lower platens when entering and exiting from the inner and outer peripheral edges of the board is reduced, it is possible to effectively prevent breakage and chipping of the work, breakage due to jumping out of the work holding hole, and damage to other works due to it. it can.

[0016] In one embodiment, the work holding hole is formed so that the corner thereof is at most one radial direction from the inner and outer peripheral edges of the upper surface plate and the lower surface plate.
It is preferable that the workpiece is formed so as to protrude by only mm, because an extremely thin workpiece used particularly for a high-frequency crystal vibrating piece can be polished without any problem.

According to another embodiment, a straight line in the radial direction passing through the center of the work holding hole and one side of the work holding hole adjacent to a corner coming in and out of the inner and outer peripheral edges of the upper and lower platens have an angle other than 90 °. When the workpiece holding holes are formed so as to intersect at a predetermined angle, only one corner portion of the polishing carrier can enter and exit from the inner and outer peripheral edges of the upper and lower stools during rotation and revolution of the polishing carrier. It is convenient because it can be done.

The predetermined angle is a minimum angle which is determined by the length of one side of a work holding hole which is adjacent to and enters from the inner and outer peripheral edges of the upper and lower platens, and which is adjacent to the corner. In addition, since it is within the range of the maximum angle determined by the length of one side of the work holding hole preceding the above, regardless of the size of the polishing carrier and the size and number of the work holding holes, and the vertical movement of the polishing apparatus. Even if the surface plate is changed, the polishing carrier can always be designed optimally and easily,
This is advantageous because the number of steps and labor can be greatly reduced.

In this case, when the minimum angle and the maximum angle are further determined in consideration of the radial width of the upper and lower stools, it is possible to easily design a desired polishing carrier with higher precision. it can.

Particularly, the predetermined angle is 100 ° to 135 °.
Within the range, the distance between the inner and outer peripheries of the upper and lower platens having a width of 45 to 120 mm, which is generally used for extremely thin workpieces such as quartz wafers, can be reduced to 1 mm or less. Therefore, it is preferable.

According to another aspect of the present invention, the work is held in the rectangular work holding hole of the polishing carrier of the present invention, and the polishing carrier is rotated between the upper surface plate and the lower surface plate. A polishing method characterized in that both front and back surfaces of a work are polished by an upper surface plate and a lower surface plate while rotating and revolving.

According to another aspect of the present invention, there is provided an upper surface plate and a lower surface plate, and the above-described polishing carrier of the present invention. There is provided a polishing apparatus characterized in that both front and back surfaces of a work are polished by an upper surface plate and a lower surface plate while rotating and orbiting a carrier for use between an upper surface plate and a lower surface plate.

[0023]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 schematically shows a configuration of a polishing apparatus to which the present invention is applied. As in the conventional apparatus, the polishing apparatus of the present invention includes a sun gear 1 rotatably arranged at the center, a ring-shaped internal gear 2 concentrically arranged with the sun gear 1, an upper surface plate 3, and a lower surface plate. 4 is provided. A plurality of polishing carriers 1 according to the present invention are provided between the upper surface plate 3 and the lower surface plate 4 at equal intervals in the circumferential direction around the sun gear 1.
No. 0 is arranged so that the external teeth 10a provided on the outer peripheral edge are engaged with the sun gear 1 and the internal gear 2 so as to perform planetary movement.

As shown in FIG. 2, the polishing carrier 10 of this embodiment has a thin disk shape obtained by rolling a plate material such as carbon tool steel, similar to a conventional polishing carrier, for holding a workpiece. A plurality of work holding holes 11 having a rectangular shape are provided at equal angular intervals. Each corner of the work holding hole 11 is formed in a round shape in order to prevent the occurrence of cracks or the like during manufacturing or during use. A work (not shown) such as a quartz wafer is held in the work holding hole 11,
While supplying the abrasive between the four, one or both of the sun gear and the internal gear are rotated in the directions of arrows A and B to rotate the polishing carrier 10 in the direction of arrow C and in the direction of arrow D. By revolving, both surfaces of the work are polished.
Further, when one or both of the upper stool 3 and the lower stool 4 are rotated in either direction, the workpiece and the workpiece can be relatively complicatedly moved to perform polishing.

In the polishing carrier of the present invention, each work holding hole is rotated by its own rotation so that only one corner on the outer peripheral side thereof enters and exits a predetermined distance from the inner and outer peripheral edges of the upper and lower platens.
It is provided to be inclined from the above-described conventional facing position. Specifically, in FIG. 3, the center C of the polishing carrier 10 is
1 and a radial straight line L1 passing through the center C2 of the work holding hole 11 and an outer peripheral edge 3 of the upper and lower platens 3, 4 intersecting the straight line L1.
a, a predetermined inclination angle θ other than 90 ° with the side s1 of the work holding hole 11 adjacent to the corner portion 11a entering and exiting from the 4a.
(> 90 °).

As shown in FIG. 3, the distance d between the corner 11a of the work holding hole 11 and the outer peripheral edges 3a, 4a of the upper and lower platen is from the center C1 of the polishing carrier 10 to the corner 11a.
Is the pitch circle P0 of the carrier.
When the point M intersects with the pitch circle P1 of the internal gear 2. The maximum distance dmax is a result of repeating various tests by the inventor of the present invention. As a result, especially for an extremely thin work such as a wafer used for a quartz vibrating piece,
When the thickness is 1 mm or less, chipping, chipping, and other damage of the work can be almost completely prevented, and it has been found that it is desirable.
Further, the distance between the corners 11a entering and exiting from the inner peripheral edges of the upper surface plate 3 and the lower surface plate 4 is the same as the distance d entering and exiting from the outer peripheral edge, and therefore the maximum distance is also set.

Further, the difference between the angle of entry and exit of the corner of the work holding hole from the inner and outer peripheral edges of the upper and lower platens to the reentry, ie, the rotation angle of the work holding hole, affects the contact resistance between the work and the upper and lower platens. As described above, this is related to the inclination angle θ of the work holding hole. Then, the inventor of the present application considered the inclination angle θ of the work holding hole, and was able to obtain a result as described below.

First, the outer radius R of the upper and lower platens is 191.2.
For the polishing apparatus shown in FIG.
When the polishing carrier of FIG. 2 in which the rectangular work holding hole 11 having a dimension of 33.8 mm × Y = 31.7 mm is provided at an inclination angle θ = 120 ° is used, the rotation angle of the work holding hole 11 is investigated. Here, X is the length of the long side S1 of the preceding work holding hole 11 adjacent to the corner 11a,
Y is the length of the short side S2 to follow.

In FIG. 4, a corner 11a of the work holding hole is provided.
Is about to come out of the outer peripheral edges 3a, 4a of the upper and lower stools, the side S of the work holding hole 11 on the side preceding the corner portion.
Assuming that the angle between the extension line ES1 of FIG. 1 and the tangent line To1 of the outer peripheral edge at the position of the corner 11a is the outgoing angle αout, it was about 152 °. In addition, the corners 11a are the outer peripheral edges 3a, 4
a, the angle between the tangent line To2 of the outer peripheral edges 3a and 4a at the position of the corner 11a and the extension line ES1 of the side S1 of the work holding hole is defined as the angle of incidence αin.
It was about 135 °. Therefore, the outgoing angle αout and the incoming angle α
In / out angle difference △ α, that is, the work holding hole 11 at the outer peripheral edge of the upper and lower platens until the corner 11a goes out and enters inside.
Is about 17 °.

Further, as for the inner peripheral edges 3b and 4b of the upper and lower platens, in FIG. 5, when the corner 11a of the work holding hole is going to go out from the inner peripheral edge, the corner of the work holding hole 11 is moved from the corner. If the angle between the extension line ES1 of the preceding side S1 and the tangent line Ti1 of the inner peripheral edge at the position of the corner 11a is the outgoing angle βout, it is about 158 °. Also, when the corner 11a is going to enter inside from the inner peripheral edges 3b, 4b, the inner peripheral edges 3b, 4b at the position of the corner 11a.
When the angle formed between the tangent line Ti2 of b and the extension line ES1 of the side S1 of the work holding hole is the incident angle βin, the angle was about 129 °.
Therefore, the outgoing / incoming angle difference 出 between the outgoing angle βout and the incoming angle βin
β, that is, the rotation angle of the work holding hole 11 until the corner 11a goes out and enters the inner peripheral edge of the upper and lower platens is
9 °.

As described above, when the inclination angle θ of the work holding hole 11 is 120 °, the difference between the entrance and exit angles △ α and に お け る β at the inner and outer peripheral edges of the upper and lower platens becomes about 17 ° and about 29 °, respectively. The entrance angle difference Δα = about 26 ° and Δβ = about 42 ° when the angle θ = 90 ° is significantly smaller. For this reason, the work, upper platen 3 and lower platen 4
The contact resistance with the workpiece became small, and the occurrence of chipping and chipping of the workpiece, and breakage due to popping out of the workpiece holding hole could be prevented.

Further, the inclination angle θ is changed variously, and in each case, the outgoing angles αout, β
out and the entrance angles αin, βin are measured, and the exit angle difference △ α,
Δβ was calculated. In particular, among them, the inclination angle θ = 100
°, 110 °, and 135 °, the above θ =
120 ° and the conventional θ = 90 ° for comparison.
Table 1 below shows the results together with the case of

[0033]

[Table 1]

From Table 1, when the inclination angle θ of the work holding hole is 100 ° to 135 ° at the platen width W = 120 mm, the difference between the entrance angle and the exit angle Δα is smaller than when the conventional θ = 90 °.
Δβ is small, and therefore, the contact resistance between the work and the upper and lower platens is small, and it can be seen that this is a preferable angle range. Further, it can be seen that θ = 120 ° to 135 ° is more preferable. Also, from the actual measurement results, when the inclination angle θ exceeds 135 °, the in-out angle difference 入 α,
Δβ increased rapidly and was found to be undesirable.

Next, the generally used outer diameter of 200 mm
When the size and shape of the work holding hole of the polishing carrier to be used are fixed and the outer diameter of the polishing carrier, that is, the width W of the upper and lower platens is changed, the surface of the work holding hole becomes The inclination angle θ of the work holding hole required to allow only the two corners to enter and exit from the inner and outer peripheral edges of the upper and lower platens is determined.
β was calculated. In the polishing carrier 10 shown in FIG. 2, the work holding hole is a rectangle of 34 × 30 mm, and the width W of the platen is 47.5.
6A and B were obtained when the distance was changed between ２００200 mm. According to FIG.
It can be seen that Δβ tends to decrease as the platen width W increases.

Further, with respect to the platen width W = 120 mm and 87.5 mm, the inclination angle θ of the work holding hole was changed, and the difference Δα between the outer edges of the upper and lower platens was determined. The result shown in FIG.

[0037]

[Table 2]

It can be seen from Table 2 that, even when the platen width W is 87.5 mm, the difference between the entrance angle and the exit angle Δα at the inclination angle θ = 100 ° to 135 ° is the same as that in the case of the platen width W = 120 mm. = 90 °, which is smaller.

For the upper and lower platens having the same platen width, the dimension X × X of the work holding hole of the polishing carrier used for the platen was used.
The relationship between Ymm and the minimum and maximum inclination angles θmin and θmax required to move only one corner of the work holding hole into and out was examined. Here, the platen width is W = 45 mm, and X
Is the length of the side of the work holding hole preceding the corner coming into and out of the outer peripheral edge of the upper and lower platens, and Y is the length of the side of the work holding hole following the corner.

FIG. 7 shows the change of the minimum inclination angle θmin of the work holding hole when X is fixed at 20 mm and Y is changed from 10 to 30 mm. From the figure,
It can be seen that the minimum inclination angle θmin decreases as Y decreases, and changes so as to approach a substantially constant minimum value. On the other hand, Y is fixed at 15 mm and X
Was changed from 20 to 35 mm, it was found that the minimum inclination angle θmin of the work holding hole was substantially constant and did not substantially change.

FIG. 8 shows the change in the maximum inclination angle θmax of the work holding hole when Y is fixed at 15 mm and X is changed from 15 to 35 mm. From the figure,
It can be seen that the maximum inclination angle θmax increases as X decreases, and changes so as to approach a substantially constant maximum value. On the other hand, X is constant at 20 mm and Y
Was changed from 25 to 35 mm, it was found that the maximum inclination angle θmax of the work holding hole was substantially constant and did not substantially change.

From these results, the minimum inclination angle θmi required to move only one corner of the work holding hole in and out is obtained.
n is determined by the base plate width W of the upper and lower bases and the length Y of the side of the work holding hole that follows the corner coming in and out of the inner and outer peripheral edges, while the maximum inclination angle θmax is It was found that the length was determined by the width W of the upper and lower lapping plates and the length X of the side of the work holding hole preceding the corners coming and going from the inner and outer peripheral edges. Therefore, when a work holding hole is provided for a polishing carrier of a certain size, the inclination angle thereof can be set to an optimum range corresponding to the width of the platen of the upper and lower platens and the size of the work, and the polishing carrier and the polishing apparatus can be used. Design man-hours can be reduced. Even when design conditions such as the dimensions of the upper and lower platens and the polishing carrier, and the size or number of the work holding holes are changed, the design can be changed easily and easily.

Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above-described embodiments, and may be implemented with various modifications and alterations within the technical scope thereof. Can be. For example, the present invention can be similarly applied to various polygonal work holding holes other than a rectangle. Further, when a large number of work holding holes are provided in the polishing carrier, only one corner portion of the outermost work holding hole in the radial direction is made to enter and exit from the inner and outer peripheral edges of the upper and lower platens as described above. What should I do?

[0044]

According to the polishing method of the present invention, when the polishing carrier rotates and revolves between the upper surface plate and the lower surface plate, after the corner of the work holding hole comes out of the inner and outer peripheral edges of the upper and lower surface plates. Since the difference between the entrance angle and the rotation angle of the work holding hole until entering again is reduced, the contact resistance between the work and the upper and lower platens at the time of entering and exiting is reduced, causing chipping and chipping of the work, occurrence of work from the work holding hole. Damage due to protrusion and damage to other workpieces due to fragments thereof can be effectively prevented, whereby the production yield can be improved and the production cost can be reduced.

According to the polishing carrier of the present invention and the polishing apparatus using the same, the above-described polishing method of the present invention can be easily realized, and the design of various dimensions such as the upper and lower platens and the work holding holes can be achieved. Since an optimal polishing carrier can be provided in accordance with conditions or changes thereof, the number of man-hours and labor in design can be reduced, and productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a configuration of a polishing apparatus according to the present invention.

FIG. 2 is a plan view showing an embodiment of the polishing carrier of the present invention.

FIG. 3 is a partially enlarged view showing a state in which a corner of a work holding hole of a polishing carrier is protruded from an outer peripheral edge of an upper and lower platen.

FIG. 4 is a plan view showing a positional relationship when a corner portion of a work holding hole of the polishing carrier enters and exits from the outer peripheral edge of the upper and lower platens.

FIG. 5 is a plan view showing a positional relationship when corners of work holding holes of the polishing carrier enter and exit from inner peripheral edges of the upper and lower platens.

FIG. 6A is a diagram showing a change in an entrance / exit angle difference Δα at the outer peripheral edge of the upper and lower platens with respect to the platen width W, and FIG.
FIG. 4 is a diagram showing a change in an inflow / outflow angle difference Δβ at the inner peripheral edge of the upper and lower stools.

FIG. 7 shows that the length X of the preceding side of the work holding hole is constant.
FIG. 9 is a diagram showing a change in the minimum inclination angle θmin of the work holding hole when the length Y of the trailing side is changed.

FIG. 8 shows that the length Y of the trailing side of the work holding hole is constant.
FIG. 9 is a diagram showing a change in the maximum inclination angle θmax of the work holding hole when the length X of the preceding side is changed.

FIG. 9 is a cross-sectional view schematically showing a configuration of a conventional polishing apparatus.

FIG. 10 is a schematic plan view of the polishing apparatus of FIG. 9;

FIG. 11 is a plan view showing a conventional polishing carrier.

FIG. 12 is a plan view showing a positional relationship when corners of work holding holes of a conventional polishing carrier enter and exit from inner peripheral edges of upper and lower platens.

FIG. 13 is a plan view showing a difference in the angle of entry and exit of a work holding hole at the outer peripheral edge of an upper and lower platen for a conventional polishing carrier.

FIG. 14 is a plan view showing the difference in the angle of entry and exit of a work holding hole at the inner peripheral edge of the upper and lower platens for a conventional polishing carrier.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sun gear 2 Internal gear 3 Upper surface plate 3a Outer edge 3b Inner edge 4 Lower surface plate 4a Outer edge 4b Inner edge 5 Polishing carrier 5a External tooth 6 Work holding hole 6a, 6b Corner 7 Work 8 Slurry 10 Polishing carrier 10a External teeth 11 Work holding hole 11a Corner

Claims (10)

[Claims] 1. A work is held in a rectangular work holding hole of a polishing carrier, and the polishing carrier is rotated and revolved between an upper surface plate and a lower surface plate while rotating the upper surface plate and the lower surface surface of the polishing carrier. In a polishing method for polishing both the front and back surfaces of the work by a plate, when the polishing carrier rotates and revolves, only one corner of the work holding hole enters and exits from the inner and outer peripheral edges of the upper and lower platens. A polishing method characterized in that the polishing is performed. 2. The surface polishing method according to claim 1, wherein the corner portion protrudes by a maximum of 1 mm in a radial direction from inner and outer peripheral edges of the upper surface plate and the lower surface plate. 3. A work holding hole having a rectangular shape for holding a work, and while rotating and revolving between an upper surface plate and a lower surface plate, both upper and lower surfaces of the work are moved by the upper surface plate and the lower surface plate. A polishing carrier for polishing the workpiece, wherein the work holding hole has a first
A polishing carrier characterized in that only two corners are formed so as to enter and exit from the inner and outer peripheral edges of the upper platen and the lower platen. 4. The work holding hole according to claim 3, wherein the work holding hole is formed so that the corner portion protrudes from the inner and outer peripheral edges of the upper and lower stools by a maximum of 1 mm in a radial direction. Polishing carrier. 5. The work holding hole such that a radial straight line passing through the center of the work holding hole and one side of the work holding hole adjacent to the corner intersect at a predetermined angle other than 90 °. Is formed.
Or the polishing carrier according to 4. 6. The minimum angle determined by the length of one side of the work holding hole adjacent to the corner and following the corner, and the predetermined angle adjacent to the corner and preceding the corner. The polishing carrier according to claim 5, wherein the carrier is within a range of a maximum angle determined by a length of one side of the work holding hole. 7. The polishing carrier according to claim 6, wherein the minimum angle and the maximum angle are further determined in consideration of a radial width of the upper stool and the lower stool. 8. The polishing carrier according to claim 5, wherein the predetermined angle is in a range of 100 ° to 135 °. 9. A work is held in a rectangular work holding hole of the polishing carrier according to claim 3, and the polishing carrier is rotated between an upper surface plate and a lower surface plate. A polishing method characterized in that both upper and lower surfaces of the work are polished by the upper and lower stools while rotating and revolving. 10. An upper stool and a lower stool, wherein the upper and lower stools are provided.
With the polishing carrier described in any of the above, while holding a work in the work holding hole of the polishing carrier, while rotating and revolving the polishing carrier between the upper surface plate and the lower surface plate, A polishing apparatus, wherein both the front and back surfaces of the work are polished by the upper and lower stools.