JP2011067906A - Device and method for polishing sheet-like workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To polish glass sheets smoothly and properly by surely avoiding generation of a bending stress, hanging down of sticking out parts, damage and the like due to sticking out of a part of the glass sheets from an outer peripheral edge of the upper surface of a lower polishing surface plate. <P>SOLUTION: In a sheet-like workpiece polishing device 1 including carriers 4 interposed between a sun gear 2 and an internal gear 3 and spinningly revolving with teeth 4a formed in the outer periphery being meshed with both gears 2, 3, the glass sheets 8 restricted and held by holes 7 formed in the carriers 4, and an upper polishing surface plate 6 and the lower polishing surface plate 5 embracing both front and back surfaces of the glass sheets 8 from above and beneath, a part of the glass sheets 8 sticks out from the outer peripheral edge 5a of the upper surface of the lower polishing surface plate 5 in spinning and revolving of the carriers 4, and receiving parts 11 supporting the sticking out parts of the glass sheets 8 from beneath are arranged on the outer periphery side of the outer peripheral edge 5a of the upper surface. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention has a sun gear, an internal gear, and a carrier that revolves while the teeth formed on the outer periphery mesh with the two gears and revolves, and the plate-like workpiece is held in a hole formed in the carrier. The present invention also relates to a polishing apparatus and a polishing method for simultaneously polishing both the front and back surfaces of the plate-like workpiece.

  As is well known, a glass plate for a package that houses a solid-state imaging device such as a CCD or CMOS, or a glass plate suitable for a microlens array for use as an electronic component optical lens is subjected to a polishing process in its manufacturing process. . The glass plate to be subjected to this polishing process is a non-circular, for example, rectangular thin plate, and due to inevitable problems that occur during heating / cooling or molding in the manufacturing process, Cannot optimize surface properties. Therefore, this type of glass plate is usually subjected to the polishing treatment in order to make these characteristics excellent.

  As an apparatus for polishing this type of glass plate, for example, Patent Document 1 has an upper polishing surface plate and a lower polishing surface plate, and between these gears, an outer peripheral portion is provided between the sun gear and the internal gear. A carrier that revolves while meshing with teeth is interposed, and a circular hole is formed in this carrier to hold a plate-like workpiece such as a wafer, and both the front and back sides of the plate-like workpiece are simultaneously transferred with the revolution and rotation of the carrier. A configuration for polishing is disclosed.

  FIG. 3 of the same document describes a state in which a part of the carrier and a part of the circular hole protrude from the outer peripheral end of the upper surface of the lower polishing surface plate during the rotation and revolution of the carrier. In consideration of this matter, if a part of the circular hole of the carrier protrudes from the outer peripheral edge of the upper surface of the lower polishing surface plate, a part of the plate-like work held in the circular hole is inevitably lower. It protrudes from the outer peripheral edge of the upper surface of the side polishing surface plate.

JP 2003-175456 A

  However, as in the polishing apparatus disclosed in the above-mentioned Patent Document 1, a part of the circular hole of the carrier and a part of the plate-like work protrude from the outer peripheral edge of the upper surface portion of the lower polishing surface plate. If this is the case, an unreasonable bending stress is generated at the protruding portion of the plate-shaped workpiece, and if the plate-shaped workpiece is thin, the protruding portion may hang down or be damaged. Such a problem becomes conspicuous when the plate-like workpiece is a glass plate (particularly, this type of thin glass plate) used for the above-described applications.

  For such a problem, it is only necessary to prevent a part of the plate-shaped workpiece from protruding from the outer peripheral edge of the upper surface portion of the lower polishing surface plate. The part farther away from the part near the center of rotation of the carrier is faster in peripheral speed and the amount of polishing increases, which is disadvantageous in finishing a plate-like workpiece having a uniform thickness. That is, if a portion far from the center of rotation of the carrier in the entire area of the plate-like workpiece is protruded from the outer peripheral edge of the upper surface portion of the lower polishing surface plate along with the rotation and revolution of the carrier, polishing of the portion far from the center is performed. Because there is a period when the amount of polishing is not temporarily polished even though the peripheral speed is high due to protrusion, the amount of polishing at that part becomes a moderate amount as a whole, and the thickness of the plate workpiece Is considered to be uniform over the entire area. Therefore, it is considered that the projecting of the plate-like workpiece as described above is important from the viewpoint of uniform thickness.

  In addition, if a part of the circular hole of the carrier and a part of the plate-like workpiece are protruded from the outer peripheral edge of the upper surface portion of the lower polishing surface plate as described above, a plate can be used by using a transfer robot or the like. An advantage that convenience can be ensured when carrying the workpiece into and out of the circular hole of the carrier is obtained (see Patent Document 1). Therefore, it is considered that the projecting of the plate-like workpiece as described above has an important meaning also from such a viewpoint.

  Considering the above items, this kind of double-sided polishing is responsible for poor polishing due to the above-mentioned bending stress caused by projecting a plate-like workpiece, and for the occurrence of drooping of the protruding part and damage. In the equipment, it is an unavoidable problem, and if the protrusion of the plate-like workpiece is eliminated to avoid this, it will cause a more fatal problem and there is no room for improvement anymore. It is understood.

  And it can be inferred that the above problems appear particularly prominent when the plate-like workpiece is a non-circular glass plate.

  In view of the above circumstances, the present invention ensures a uniform thickness when a glass plate is used as a plate-like workpiece, and ensures the convenience of carrying in and out the glass plate, and then lower polishing surface plate The glass plate can be polished smoothly and properly by accurately avoiding the occurrence of bending stress caused by part of the glass plate protruding from the outer peripheral edge of the upper surface of the steel plate and drooping of the protruding portion and damage. This is a technical issue.

  The device according to the present invention, which has been created to solve the above technical problem, includes a sun gear, an internal gear, and teeth formed between the two gears and formed on the outer peripheral portion of the gears. A carrier that revolves while rotating, a plate-like work held in a hole formed in the carrier, an upper polishing platen and a lower polishing platen that are respectively arranged above and below the movement path of the carrier, In the plate-like workpiece polishing apparatus configured to simultaneously polish both the upper surface and the lower surface of the plate-like workpiece, the plate-like workpiece is a glass plate, and the glass plate is held in the hole of the carrier A part of the carrier and a part of the glass plate protrude from the outer peripheral edge of the upper surface portion of the lower polishing surface plate during rotation and revolution of the carrier, and the upper surface of the lower polishing surface plate On the outer peripheral side of the outer peripheral edge parts, characterized in that it arranged receiving part for supporting from below the protruding portion of at least the glass plate. Here, when polishing the glass plate, the abrasive is turbid in the solvent between the upper surface of the lower polishing surface plate and the lower surface of the glass plate and between the lower surface of the upper polishing surface plate and the upper surface of the glass plate. In general, the polishing slurry is supplied and the both surfaces of the glass plate are polished by the polishing slurry. The upper surface of the lower polishing surface plate and the lower surface of the upper polishing surface plate are used as the polishing surface. In addition, it is not excluded to perform polishing on both surfaces of the glass plate with these abrasive surfaces. The “receiving portion” is preferably configured to rotate integrally with the lower polishing surface plate.

  According to such a configuration, a part of the carrier and a part of the glass plate are separated from the outer peripheral edge of the upper surface portion of the lower polishing surface plate by meshing with the sun gear and the internal gear and revolving while the carrier rotates. Even if it protrudes, the protrusion part of a glass plate will be in the state supported from the downward direction by the receiving part arrange | positioned by the outer peripheral side of the upper surface part outer peripheral end of a lower side polishing surface plate. Therefore, a situation in which an unreasonable bending stress is generated in the protruding portion of the glass plate during polishing and a situation in which the protruding portion hangs down or breaks are effectively avoided. Moreover, it is possible to effectively ensure the uniformity of the thickness of the glass plate by polishing and the convenience of carrying in and carrying it out. The advantages as described above are particularly noticeable when the glass plate is thin. In addition, since this receiving part can play the role which also receives the protrusion part of a carrier, it can also contribute to thickness reduction of a carrier.

  In this case, the radial dimension from the inner peripheral end to the outer peripheral end of the upper surface portion of the lower polishing surface plate and the lower surface portion of the upper polishing surface plate is substantially the same, the radial dimension W, It is preferable that the double value D of the distance from the center of rotation of the carrier to the maximum separation portion of the glass plate is set within the range of the relational expression of D / W = 1.27 ± 0.1.

  In this way, the glass plate held in the hole of the carrier that revolves while rotating can receive proper double-side polishing, and protrudes from the outer peripheral edge of the upper surface portion of the lower polishing surface plate of the glass plate. The part has the optimum protrusion size (the same applies to the protrusion part from the outer peripheral edge of the lower surface of the upper polishing surface plate), and the protrusion part is subjected to the polishing process while being properly supported by the receiving part from below. It becomes possible. That is, when D / W exceeds 1.27 + 0.1, the protruding portion of the glass plate becomes too wide, and there is a possibility that the receiving portion cannot be reliably supported. There is a possibility that the thickness uniformity of the glass plate is impaired due to insufficient polishing of the part. On the other hand, if the D / W is less than 1.27-0.1, the protruding portion of the glass plate becomes too narrow, and the glass plate becomes thicker due to excessive polishing of the protruding portion. There is a risk of hindering loading and unloading. Therefore, when D / W is in the above numerical range, these problems are unlikely to occur. In consideration of the above matters, it is more preferable that the relationship is within the range of the relational expression of D / W = 1.27 ± 0.05.

  In addition, a circumferential groove through which polishing slurry flows is formed on the outer peripheral side of the outer peripheral end of the upper surface portion of the lower polishing surface plate, and the receiving portion is formed in the circumferential groove so as to allow the polishing slurry to flow. It is preferable.

  In this way, the polishing slurry flows through the circumferential groove after being discharged from the upper surface of the lower polishing platen toward the outer circumferential side by centrifugal force, but is formed in this circumferential groove. If the receiving portion is not in an appropriate mode, the polishing slurry is blocked by the receiving portion, and an inappropriate amount of polishing slurry remains on the upper surface of the lower polishing surface plate, thereby preventing proper polishing of the glass plate. . However, since the receiving portion is formed in the circumferential groove so as to prevent the damming by allowing the polishing slurry to flow, the above-described problems are less likely to occur.

  In this case, the receiving portion may be configured by a plurality of receiving pellets that protrude upward from the bottom of the circumferential groove and are intermittently arranged in the circumferential direction of the circumferential groove.

  In this way, the plurality of receiving pellets constituting the receiving portion protrude upward from the bottom of the circumferential groove and are arranged intermittently (with predetermined intervals) in the circumferential direction of the circumferential groove. The problem that the polishing slurry is blocked by the receiving portion and an inappropriate amount of polishing slurry remains on the upper surface of the lower polishing surface plate is efficiently avoided.

  The plurality of receiving pellets are preferably attached to a lower part of the lower polishing surface plate.

  In this way, the lower polishing surface plate and the plurality of receiving pellets rotate integrally around the axis of the lower polishing surface plate, so that there is a gap between the protruding portion of the glass plate and the receiving pellet. Thus, unnecessary sliding does not occur, and troublesome rubbing or the like does not occur at the time of polishing the glass plate.

  In the above configuration, when the carrier rotates and revolves, a part of the carrier and a part of the glass plate protrude from the upper surface portion of the inner peripheral end of the lower polishing surface plate, and the lower polishing constant You may make it arrange | position the 2nd receiving part which supports the protrusion part of the said glass plate from the downward direction at the inner peripheral side of the inner peripheral end of the upper surface part of a board | substrate.

  In this case, the role of the receiving portion disposed on the outer peripheral side of the outer peripheral end of the upper surface portion of the lower polishing surface plate can be assisted on the inner peripheral side by the second receiving portion, and the receiving portion described above. The support of the glass plate can be adjusted with the second receiving portion, and the polishing of the glass plate can be adjusted to an optimum state.

  In the above configuration, it is preferable that the glass plate is held and restrained by the hole of the carrier.

  In this way, when the glass plate is sandwiched between the upper polishing platen and the lower polishing platen to perform double-side polishing, the glass plate does not rattle in the hole of the carrier, and the polishing work Inhibiting factors can be reduced.

  In this case, it is preferable that the glass plate is a non-circular glass plate, particularly a rectangular glass plate, and the hole of the carrier has a shape similar to the glass plate, such as a rectangle into which the glass plate is fitted. .

  In this way, it is possible to smoothly polish a glass plate for a package that houses a solid-state imaging device such as a CCD or CMOS, or a glass plate suitable for a microlens array for use in an electronic component optical lens. Become.

  In the above configuration, it is preferable that the hole of the carrier is formed eccentrically from the center of rotation of the carrier.

  In this way, if the carrier hole exists at the center of rotation of the carrier, the center of rotation moves along a single circular orbit, so the glass plate held in the hole. However, if the hole is eccentric from the center of rotation of the carrier, it is advantageous for uniform polishing.

  On the other hand, the method according to the present invention, which was created to solve the above technical problem, includes a sun gear, an internal gear, and teeth formed between the two gears and formed on the outer peripheral portion. A carrier that revolves while meshing and rotating, and an upper polishing surface plate and a lower polishing surface plate that are respectively disposed above and below the movement path of the carrier, and has a plate shape in a hole formed in the carrier In a plate-like workpiece polishing method for holding a workpiece and simultaneously polishing both the upper and lower surfaces of the plate-like workpiece, the plate-like workpiece is a glass plate, and the glass plate is held in a hole of the carrier, At the time of rotation and revolution of the carrier, a part of the carrier and a part of the glass plate protrude from the outer peripheral edge of the lower polishing surface plate, and at least the protrusion part of the glass plate Characterized in that the support from below the receiving portion disposed on the outer peripheral side of the outer peripheral edge of the polishing platen.

  The explanation items including the operational effects of such a method are substantially the same as the explanation items at the beginning of the apparatus according to the present invention.

  As described above, according to the present invention, the carrier revolves while meshing with the sun gear and the internal gear, so that a part of the carrier and a part of the glass plate are outside the upper surface portion of the lower polishing surface plate. Even when protruding from the end, the protruding portion of the glass plate is supported from below by the receiving portion disposed on the outer peripheral side of the outer peripheral end of the upper surface portion of the lower polishing surface plate. A situation in which an unreasonable bending stress is generated in the protruding portion of the glass plate and a situation in which the protruding portion hangs down or breaks are effectively avoided.

It is a disassembled arrangement perspective view which shows schematic structure of the plate-shaped workpiece grinding | polishing apparatus which concerns on embodiment of this invention. 1 is a schematic plan view showing a state in which an upper polishing surface plate is removed in a plate-like workpiece polishing apparatus according to an embodiment of the present invention. It is the expansion longitudinal cross-sectional front view cut | disconnected according to the AA line of FIG. It is an enlarged plan view which shows the principal part of the plate-shaped workpiece grinding | polishing apparatus which concerns on embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following embodiments, a glass plate for a package that houses a solid-state imaging device such as a CCD or a CMOS, or a glass plate suitable for a microlens array for use as an electronic component optical lens is targeted.

  As shown in FIG. 1, a plate-like workpiece polishing apparatus (hereinafter simply referred to as a polishing apparatus) 1 according to this embodiment includes a sun gear 2 disposed at the center and rotating around an axis, and an outer periphery of the sun gear 2. Ring-shaped internal gear 3 that is disposed on the side and rotates around the shaft center, and is interposed between sun gear 2 and internal gear 3, and teeth 4a on the outer peripheral portion mesh with both gears 2 and 3. And a plurality (5 in the illustrated example) of carriers 4 that revolve while rotating. Below these carriers 4, a circular (specifically, annular) lower polishing surface plate 5 is disposed, and above these carriers 4, an upper polishing surface plate 6 is disposed. In this case, the upper surface portion of the lower polishing surface plate 5 and the lower surface portion of the upper polishing surface plate 6 have substantially the same shape (annular shape), and a carrier is provided between these two polishing surface plates 5 and 6. 4 is interposed.

  As shown in FIG. 2, each carrier 4 is formed with a plurality of (in the illustrated example, five) holes 7 having a substantially rectangular shape, and a rectangular glass plate having substantially the same shape in these holes 7. 8 is restrained and held. In other words, each rectangular glass plate 8 is held in each hole 7 of each carrier 4 in a state where relative rotation with each hole 7 is restricted. Further, each hole 7 is formed at a position deviated by an equal distance from the rotation center x of each carrier 4, so that each rectangular glass plate 8 is also decentered by an equal distance from the rotation center x of each carrier 4. Is retained. In this case, each rectangular glass plate 8 (same for each hole 7) is inclined with respect to the tangent of the revolution track of the carrier 4 so that only one corner is closest to the outer peripheral edge of the carrier 4 in plan view. When the carrier 4 rotates, all rectangular glass plates 8 are set to protrude from the upper surface outer peripheral edge 5a and the upper surface inner peripheral edge 5b of the lower polishing surface plate 5 under the same conditions. Has been.

  In this case, as shown in FIG. 3, the thickness (plate thickness) of the rectangular glass plate 8 is thicker than the thickness of the carrier 4, and accordingly, the upper surface of the lower polishing surface plate 5 and the lower surface of the upper polishing surface plate 6 Between them, only the rectangular glass plate 8 is sandwiched in a state where it can come into contact with both surfaces. And the upper surface outer peripheral end 5a and the upper surface inner peripheral end 5b of the lower polishing surface plate 5, and the lower surface outer peripheral end 6a and the lower surface inner peripheral end 6b of the upper polishing surface plate 6 are set at the same position in the radial direction. Accordingly, each rectangular glass plate 8 is set to protrude from the lower surface outer peripheral edge 6a and the lower surface inner peripheral edge 6b of the upper polishing surface plate 6 under the same conditions as those in the lower polishing surface plate 5 described above. Has been. Further, the polishing apparatus 1 includes an abrasive made of cerium oxide or the like between the lower polishing platen 5 and all the rectangular glass plates 8 and between the upper polishing platen 6 and all the rectangular glass plates 8. The polishing slurry is made to be turbid in a solvent.

  More specifically, as shown in FIG. 4, the distance from the rotation center x of each carrier 4 to the maximum separation site (corner portion 8x) of the rectangular glass plate 8 (passes through the corner portion 8x of the rectangular glass plate 8). The diameter D of the pitch circle) D and the radial dimension W from the upper surface inner peripheral end 5b to the upper surface outer peripheral end 5a of the lower polishing surface plate 5 are D / W = 1.27 ± 0.1 (preferably D / W = 1.27 ± 0.05). In this embodiment, each carrier 4 is formed of a resin such as polyethylene resin, hard rubber, metal, or the like, and the rectangular glass plate 8 has a thickness of 1 to 5 mm and one side perpendicular to each other. The other side is a square or a rectangle of 100 to 500 mm.

  On the other hand, as shown in FIG. 2, a first circumferential groove 9 is formed between the outer peripheral edge 5 a of the upper surface portion of the lower polishing surface plate 5 and the internal gear 3, and the upper surface of the lower polishing surface plate 5. A second circumferential groove 10 is formed between the outer peripheral end 5 b and the sun gear 2. Therefore, each carrier 7 and each rectangular glass plate 8 protrudes from the upper surface outer peripheral end 5 a of the lower polishing surface plate 5 to the upper side of the first circumferential groove 9, and the upper surface inner peripheral end of the lower polishing surface plate 5. It protrudes above the second circumferential groove 10 from 5b. In the first circumferential groove 9 and the second circumferential groove 10, a plurality of first receiving pellets 11 and second receiving pellets 12 are intermittently arranged in the circumferential direction as receiving portions protruding upward from their bottom portions. Has been.

  More specifically, as shown in FIG. 3, an outer protruding portion 5c protruding to the outer peripheral side and an inner protruding portion 5d protruding to the inner peripheral side are formed at the lower portion of the lower polishing surface plate 5, and the outer protruding portion 5c. A first receiving pellet 11 protrudes from the upper surface of the second protruding pellet 12 and a second receiving pellet 12 protrudes from the upper surface of the inner protruding portion 5d. Therefore, the first receiving pellet 11 and the second receiving pellet 12 rotate integrally around the same axis as the upper and lower polishing surface plates 5 and 6. Further, the upper surfaces of the first receiving pellet 11 and the second receiving pellet 12 are respectively flat surfaces and have the same height or substantially the same height as the upper surface of the lower polishing surface plate 5.

  Accordingly, the first receiving pellet 11 and the second receiving pellet 12 receive the weight of the protruding portion of each carrier 4 and at the same time, the protruding portion of the rectangular glass plate 8 (portion with cross-hatching in FIG. 4). It is configured to play the role of receiving the weight of the. In this embodiment, the first receiving pellet 11 and the second receiving pellet 12 are formed in a columnar shape, and their diameters are shorter than the widths of the first circumferential groove 9 and the second circumferential groove 10. Yes. The shape of the first receiving pellet 11 and the second receiving pellet 12 may be a triangular prism shape, a quadrangular shape, a polygonal column shape, or the like, and the structure thereof is not particularly limited. It is a condition that the flow path (outflow path) of the polishing slurry that has flowed to the side can be secured in the first circumferential groove 9 and the second circumferential groove 10 and that no damming of the polishing slurry occurs. A gap for allowing the polishing slurry to flow downward is formed at the bottom of the first circumferential groove 9 and the second circumferential groove 10.

  1 and 2, this polishing apparatus 1 includes an internal polishing surface plate 6 in the arrow a direction, a lower polishing surface plate 5 in the arrow b direction, and the sun gear 2 in the arrow c direction. The lug gear 3 rotates in the direction of arrow d, and the carrier 4 rotates in the direction of arrow f (clockwise or counterclockwise) while revolving in the direction of arrow e. Then, along with the rotation of each component, the rectangular glass plate 8 in each hole 7 is double-side polished with the polishing slurry while being sandwiched between the upper polishing platen 6 and the lower polishing platen 5. It has become so. In this embodiment, the rotation speed (revolution speed) of the carrier 7 in the e direction is the same as the rotation speed of the upper polishing surface plate 6 in the a direction, and the lower polishing surface plate 5 rotates in the b direction. It is set to 1/3 times the speed.

  According to the polishing apparatus 1 having the above configuration, as shown in FIG. 1, the upper polishing surface plate 6 and the lower polishing surface plate 5 rotate in the directions of arrows a and b, respectively, and the sun gear 2 and the internal As the lugear 3 rotates in the directions of arrows c and d, the carrier 4 rotates in the direction of arrow f while revolving in the direction of arrow e. As a result, all the rectangular glass plates 9 are sandwiched between the upper and lower polishing surface plates 5 and 6 while being rotationally moved along with the planetary motion while being restrained and held in the holes 8 of the carriers 4. Both surfaces are polished while the slurry is supplied. In this case, all the rectangular glass plates 8 temporarily protrude from the outer peripheral edge 5 a of the upper surface of the lower polishing surface plate 5, but this protruding portion is the upper surface of the lower polishing surface plate 5. It will be in the state supported from the downward direction by the 1st receiving pellet 11 arrange | positioned by the outer peripheral side of the part outer peripheral end 5a. Therefore, a situation in which an unreasonable bending stress is generated in the protruding portion of each rectangular glass plate 8 during polishing is avoided, and a situation in which the protruding portion hangs down or breaks is effectively avoided. The polishing slurry supplied at the time of polishing flows to the outer peripheral side by centrifugal force and flows into the first peripheral groove 9 from the outer peripheral end 5a of the upper surface portion of the lower polishing surface plate 5. In this case, a plurality of first receiving pellets 11 are arranged in the first circumferential groove 9, but a situation in which the first receiving pellets 11 block the flow of the polishing slurry does not occur. Therefore, after the polishing slurry flows into the first circumferential groove 9, the polishing slurry is smoothly discharged downward, and there is no problem in polishing each rectangular glass plate 8. Moreover, when a part of each rectangular glass plate 8 protrudes as mentioned above, the carrying in and carrying out are performed efficiently. In addition, since a part of each rectangular glass plate 8 protrudes, the thickness of the rectangular glass plate 8 after the polishing is not unduly uneven.

  In the above embodiment, the glass plate is the rectangular glass plate 8, but the glass plate may be a glass plate having another shape such as a circle, an ellipse, or a polygon.

DESCRIPTION OF SYMBOLS 1 Plate-shaped workpiece polishing apparatus 2 Sun gear 3 Internal gear 4 Carrier 5 Lower polishing surface plate 5a Outer peripheral edge 5b of upper surface portion of lower polishing surface plate Inner peripheral edge 5c of upper surface portion of lower polishing surface plate Lower polishing surface plate Lower part (outside protruding part)
6 Upper polishing surface plate 7 Hole 8 Glass plate (rectangular glass plate)
9 circumferential groove (first circumferential groove)
11 Receiving part (first receiving pellet)
12 Second receiving part (second receiving pellet)
D Double value of the distance from the center of rotation of the carrier to the maximum separation site of the glass plate W Radial dimension from the inner peripheral edge to the outer peripheral edge of the upper surface portion of the lower polishing surface plate x Center of carrier rotation

Claims (10)

The sun gear, the internal gear, the carrier that is interposed between these two gears, and the teeth formed on the outer periphery engage with the two gears and rotate while rotating, and are held in the holes formed in the carrier. A plate-like workpiece, and an upper polishing platen and a lower polishing platen arranged above and below the carrier movement path, respectively, so that both the upper and lower surfaces of the plate-like workpiece are polished simultaneously. In the configured plate workpiece polishing apparatus,
The plate-like workpiece is a glass plate, the glass plate is held in the hole of the carrier, and a part of the carrier and a part of the glass plate are formed on the lower polishing surface plate during rotation and revolution of the carrier. It protrudes from the outer peripheral edge of the upper surface part, and on the outer peripheral side of the outer peripheral edge of the upper surface part of the lower polishing surface plate, at least a receiving part that supports the protruding part of the glass plate from below is disposed. A plate-like workpiece polishing device.   The upper surface portion of the lower polishing surface plate and the lower surface portion of the upper polishing surface plate have substantially the same radial dimension from the inner peripheral edge to the outer peripheral edge, and the radial dimension W of the carrier The double value D of the distance from the center of rotation to the maximum separation part of the glass plate is set within the range of the relational expression of D / W = 1.27 ± 0.1. The plate-like workpiece polishing apparatus according to 1.   A circumferential groove through which the polishing slurry flows is formed on the outer peripheral side of the outer peripheral end of the upper surface portion of the lower polishing surface plate, and the receiving portion is formed in the circumferential groove to allow the polishing slurry to flow. The plate-like workpiece polishing apparatus according to claim 1 or 2,   The plate according to claim 3, wherein the receiving portion includes a plurality of receiving pellets that protrude upward from the bottom of the circumferential groove and are intermittently arranged in the circumferential direction of the circumferential groove. -Shaped workpiece polishing equipment.   The plate-like workpiece polishing apparatus according to claim 4, wherein the plurality of receiving pellets are attached to a lower portion of the lower polishing surface plate.   During rotation and revolution of the carrier, a part of the carrier and a part of the glass plate protrude from the upper surface portion of the inner peripheral end of the lower polishing surface plate, and the inside of the upper surface portion of the lower polishing surface plate The plate-shaped workpiece according to any one of claims 1 to 5, wherein a second receiving portion that supports at least the protruding portion of the glass plate from below is disposed on the inner peripheral side of the peripheral end. Polishing equipment.   The plate-like workpiece polishing apparatus according to any one of claims 1 to 6, wherein the glass plate is held and held in a hole of the carrier.   The plate according to any one of claims 1 to 7, wherein the glass plate is a rectangular glass plate, and the hole of the carrier has a rectangular shape into which the rectangular glass plate is fitted. -Shaped workpiece polishing equipment.   The plate-like workpiece polishing apparatus according to claim 1, wherein the hole of the carrier is formed eccentrically from the center of rotation of the carrier. A sun gear, an internal gear, a carrier interposed between the two gears and teeth formed on the outer periphery mesh with the two gears and revolve while rotating, and above and below the movement path of the carrier. A plate-like shape having an upper polishing surface plate and a lower polishing surface plate arranged respectively, and holding the plate-like work in holes formed in the carrier and simultaneously polishing both the upper and lower surfaces of the plate-like work In the workpiece polishing method,
The plate-like workpiece is a glass plate, and the glass plate is held in a hole of the carrier, and when the carrier rotates and revolves, a part of the carrier and a part of the glass plate are formed on the lower polishing surface plate. A plate-shaped workpiece that protrudes from the outer peripheral end and supports at least the protruding portion of the glass plate from below by a receiving portion disposed on the outer peripheral side of the outer peripheral end of the lower polishing surface plate. Polishing method.

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