JP2001114868A5 - - Google Patents
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- Publication number
- JP2001114868A5 JP2001114868A5 JP1999292196A JP29219699A JP2001114868A5 JP 2001114868 A5 JP2001114868 A5 JP 2001114868A5 JP 1999292196 A JP1999292196 A JP 1999292196A JP 29219699 A JP29219699 A JP 29219699A JP 2001114868 A5 JP2001114868 A5 JP 2001114868A5
- Authority
- JP
- Japan
- Prior art keywords
- jis
- succinic anhydride
- anhydride
- measured according
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 7
- 229940014800 succinic anhydride Drugs 0.000 description 7
- OZEHOHQZIRILDX-UHFFFAOYSA-N ctk1b7797 Chemical compound O=C1OC(=O)C2C1C1(C)CC2CC1 OZEHOHQZIRILDX-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000006317 isomerization reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NFWSQSCIDYBUOU-UHFFFAOYSA-N methylcyclopentadiene Chemical compound CC1=CC=CC1 NFWSQSCIDYBUOU-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29219699A JP2001114868A (ja) | 1999-10-14 | 1999-10-14 | エポキシ樹脂組成物及びそれを用いた絶縁封止材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29219699A JP2001114868A (ja) | 1999-10-14 | 1999-10-14 | エポキシ樹脂組成物及びそれを用いた絶縁封止材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001114868A JP2001114868A (ja) | 2001-04-24 |
| JP2001114868A5 true JP2001114868A5 (enrdf_load_stackoverflow) | 2006-11-24 |
Family
ID=17778787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29219699A Pending JP2001114868A (ja) | 1999-10-14 | 1999-10-14 | エポキシ樹脂組成物及びそれを用いた絶縁封止材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001114868A (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003002951A (ja) * | 2001-06-25 | 2003-01-08 | New Japan Chem Co Ltd | 液状エポキシ樹脂組成物の薄膜硬化物 |
| JP2003026766A (ja) * | 2001-07-13 | 2003-01-29 | New Japan Chem Co Ltd | エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物 |
| JP2003026763A (ja) * | 2001-07-13 | 2003-01-29 | New Japan Chem Co Ltd | エポキシ樹脂組成物 |
| JP4375957B2 (ja) * | 2002-11-21 | 2009-12-02 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物 |
| JP4737364B2 (ja) * | 2004-05-18 | 2011-07-27 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
| WO2005121202A1 (ja) | 2004-06-10 | 2005-12-22 | Mitsubishi Gas Chemical Company, Inc. | エポキシ樹脂硬化剤およびエポキシ樹脂組成物 |
| KR101391488B1 (ko) | 2006-08-09 | 2014-05-07 | 미츠비시 가스 가가쿠 가부시키가이샤 | 산무수물 에스테르와 그 조성물, 열경화성 수지 조성물 및그 경화물 |
| CN101809056B (zh) | 2007-09-27 | 2013-06-05 | 三菱瓦斯化学株式会社 | 环氧树脂组合物和环氧树脂固化物以及发光二极管 |
| JP5135287B2 (ja) * | 2009-05-25 | 2013-02-06 | パナソニック株式会社 | エポキシ樹脂組成物、半導体装置の製造方法、及び半導体装置 |
| JP2011052102A (ja) * | 2009-09-01 | 2011-03-17 | Hitachi Chem Co Ltd | エポキシ樹脂硬化剤、その製造方法及びエポキシ樹脂組成物 |
| JP5130397B2 (ja) * | 2010-01-21 | 2013-01-30 | 積水化学工業株式会社 | 熱硬化性樹脂組成物、先塗布型フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置 |
| JP2020021762A (ja) * | 2018-07-30 | 2020-02-06 | 日立オートモティブシステムズ阪神株式会社 | 内燃機関用点火コイル |
-
1999
- 1999-10-14 JP JP29219699A patent/JP2001114868A/ja active Pending
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