JP2001114868A - エポキシ樹脂組成物及びそれを用いた絶縁封止材料 - Google Patents

エポキシ樹脂組成物及びそれを用いた絶縁封止材料

Info

Publication number
JP2001114868A
JP2001114868A JP29219699A JP29219699A JP2001114868A JP 2001114868 A JP2001114868 A JP 2001114868A JP 29219699 A JP29219699 A JP 29219699A JP 29219699 A JP29219699 A JP 29219699A JP 2001114868 A JP2001114868 A JP 2001114868A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
weight
curing agent
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29219699A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001114868A5 (enrdf_load_stackoverflow
Inventor
Shintaro Kikuchi
慎太郎 菊地
Kazutoshi Takatsuna
和敏 高綱
Hideyuki Fujinami
秀之 藤浪
Tomio Nobe
富夫 野辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tonen Chemical Corp
New Japan Chemical Co Ltd
Original Assignee
Tonen Sekiyu Kagaku KK
Tonen Chemical Corp
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tonen Sekiyu Kagaku KK, Tonen Chemical Corp, New Japan Chemical Co Ltd filed Critical Tonen Sekiyu Kagaku KK
Priority to JP29219699A priority Critical patent/JP2001114868A/ja
Publication of JP2001114868A publication Critical patent/JP2001114868A/ja
Publication of JP2001114868A5 publication Critical patent/JP2001114868A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP29219699A 1999-10-14 1999-10-14 エポキシ樹脂組成物及びそれを用いた絶縁封止材料 Pending JP2001114868A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29219699A JP2001114868A (ja) 1999-10-14 1999-10-14 エポキシ樹脂組成物及びそれを用いた絶縁封止材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29219699A JP2001114868A (ja) 1999-10-14 1999-10-14 エポキシ樹脂組成物及びそれを用いた絶縁封止材料

Publications (2)

Publication Number Publication Date
JP2001114868A true JP2001114868A (ja) 2001-04-24
JP2001114868A5 JP2001114868A5 (enrdf_load_stackoverflow) 2006-11-24

Family

ID=17778787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29219699A Pending JP2001114868A (ja) 1999-10-14 1999-10-14 エポキシ樹脂組成物及びそれを用いた絶縁封止材料

Country Status (1)

Country Link
JP (1) JP2001114868A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002951A (ja) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd 液状エポキシ樹脂組成物の薄膜硬化物
JP2003026766A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2004168921A (ja) * 2002-11-21 2004-06-17 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物
JP2005330315A (ja) * 2004-05-18 2005-12-02 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
EP1754734A4 (en) * 2004-06-10 2009-02-11 Mitsubishi Gas Chemical Co HARDENERS FOR EPOXY RESINS AND EPOXY RESIN COMPOSITIONS
WO2009041389A1 (ja) 2007-09-27 2009-04-02 Mitsubishi Gas Chemical Company, Inc. エポキシ樹脂組成物、その硬化物及び発光ダイオード
JP2010270265A (ja) * 2009-05-25 2010-12-02 Panasonic Electric Works Co Ltd エポキシ樹脂組成物、半導体装置の製造方法、及び半導体装置
JP2011052102A (ja) * 2009-09-01 2011-03-17 Hitachi Chem Co Ltd エポキシ樹脂硬化剤、その製造方法及びエポキシ樹脂組成物
WO2011090038A1 (ja) * 2010-01-21 2011-07-28 積水化学工業株式会社 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置
US8034962B2 (en) 2006-08-09 2011-10-11 Mitsubishi Gas Chemical Company, Inc. Acid anhydride ester and composition thereof, and heat-curable resin composition and cured product thereof
JP2020021762A (ja) * 2018-07-30 2020-02-06 日立オートモティブシステムズ阪神株式会社 内燃機関用点火コイル

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002951A (ja) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd 液状エポキシ樹脂組成物の薄膜硬化物
JP2003026766A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP2003026763A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ樹脂組成物
JP2004168921A (ja) * 2002-11-21 2004-06-17 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物
JP2005330315A (ja) * 2004-05-18 2005-12-02 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
EP1754734A4 (en) * 2004-06-10 2009-02-11 Mitsubishi Gas Chemical Co HARDENERS FOR EPOXY RESINS AND EPOXY RESIN COMPOSITIONS
US8703010B2 (en) 2004-06-10 2014-04-22 Mitsubishi Gas Chemical Company, Inc. Curing agent for epoxy resins and epoxy resin compositions
US8034962B2 (en) 2006-08-09 2011-10-11 Mitsubishi Gas Chemical Company, Inc. Acid anhydride ester and composition thereof, and heat-curable resin composition and cured product thereof
WO2009041389A1 (ja) 2007-09-27 2009-04-02 Mitsubishi Gas Chemical Company, Inc. エポキシ樹脂組成物、その硬化物及び発光ダイオード
US9102786B2 (en) 2007-09-27 2015-08-11 Mitsubishi Gas Chemical Company, Inc. Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
JP2010270265A (ja) * 2009-05-25 2010-12-02 Panasonic Electric Works Co Ltd エポキシ樹脂組成物、半導体装置の製造方法、及び半導体装置
JP2011052102A (ja) * 2009-09-01 2011-03-17 Hitachi Chem Co Ltd エポキシ樹脂硬化剤、その製造方法及びエポキシ樹脂組成物
WO2011090038A1 (ja) * 2010-01-21 2011-07-28 積水化学工業株式会社 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置
US20120326301A1 (en) * 2010-01-21 2012-12-27 Sekisui Chemical Co., Ltd. Thermosetting resin composition, flip-chip mounting adhesive, semiconductor device fabrication method, and semiconductor device
JP2020021762A (ja) * 2018-07-30 2020-02-06 日立オートモティブシステムズ阪神株式会社 内燃機関用点火コイル

Similar Documents

Publication Publication Date Title
TWI540149B (zh) 絕緣調配物
JP6030125B2 (ja) 絶縁配合物
EP2230267B1 (en) Method of producing a curable epoxy resin composition
EP1389631B1 (en) Epoxy resin compositions
JP2001114868A (ja) エポキシ樹脂組成物及びそれを用いた絶縁封止材料
JP2003026766A (ja) エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP2003002951A (ja) 液状エポキシ樹脂組成物の薄膜硬化物
US3637572A (en) Epoxy resins with organoboron cure promotors
JP2004051824A (ja) 注形用エポキシ樹脂組成物
JP2000086744A (ja) エポキシ樹脂組成物、インダクタンス部品および半導体封止装置
JPH1171503A (ja) エポキシ樹脂組成物及びこれを用いた電気機器の絶縁処理法
JP2511691B2 (ja) エポキシ樹脂硬化剤組成物並びにエポキシ樹脂組成物
JP2000086869A (ja) エポキシ樹脂組成物およびコイル
JP2014040538A (ja) ２液タイプのエポキシ樹脂組成物
JPH06128352A (ja) エポキシ樹脂組成物
JPS6253009B2 (enrdf_load_stackoverflow)
JP2888661B2 (ja) 注型用樹脂組成物
KR100373980B1 (ko) 자동차 이그니션 코일용 에폭시수지 조성물
JPH09137042A (ja) エポキシ樹脂組成物及びこれを用いた電気機器
JP3497293B2 (ja) 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JPS6224004B2 (enrdf_load_stackoverflow)
JPS58206622A (ja) 一液型エポキシ樹脂組成物
JPH0535729B2 (enrdf_load_stackoverflow)
JPS61174220A (ja) 半導体装置封止用エポキシ樹脂組成物
JPH10310685A (ja) エポキシ注形用樹脂組成物

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061005

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061005

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090825

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091023

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100202