JP2001085846A - Method for manufacturing wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board for surely removing resin at the bottom surface of a hole, formed at the resin insulating layer laminated on the surface of a laminated substrate. SOLUTION: An insulating layer formation process is provided, where, on a laminated substrate 1 comprising a metal layer 3 on its surface, a resin insulating layer 13 comprising a bottomed hole 12 whose bottom surface is a part of the metal layer 3 is formed. Furthermore, a resin removing process is provided, where a pure water is jetted under high pressure from the side of a surface 13A of the resin insulating layer 13 to remove the resin on the metal layer 3 of a bottomed hole bottom surface 12C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board having a resin insulating layer, and more particularly, to a resin having a bottomed hole having a metal layer as a bottom surface on a surface of a laminated substrate having a metal layer on the surface. The present invention relates to a method for manufacturing a wiring board on which insulating layers are laminated.

[0002]

2. Description of the Related Art Conventionally, in manufacturing a wiring board, a wiring board having a metal layer on the surface, for example, a wiring board formed with a wiring layer on the surface of a core substrate, or a wiring board formed on the surface of a substrate having a resin insulating layer, has In some cases, a resin insulating layer having a bottomed hole such as a via hole having a metal layer as a bottom surface may be further formed on the layer where the layer is formed. Specifically, for example, as shown in FIG. 13A, a photosensitive resin layer is formed on a laminated substrate 81 having a wiring layer 82 on the surface, and is exposed and developed using a mask having a predetermined pattern. Thereafter, the resin layer is cured to form a via hole 83 having a part of the wiring layer 82 as a bottom surface.
Is formed. Thereafter, a plating process, etching, or the like is performed to form a conductor such as a via conductor 85 or a wiring layer 86 in the via hole 83 or on the surface 84A of the resin insulating layer 84, as shown in FIG. . By connecting the wiring layer 82 of the via hole bottom surface 83C and the via conductor 85 in this manner, the wiring layer 82 of the laminated substrate 81 and the resin insulating layer 8
4 is connected to the wiring layer 86.

[0003]

However, the bottom surface 83C of the via hole formed in the resin insulating layer 84 has a structure shown in FIG.
As shown in FIG. 3A, the resin JZ that could not be completely removed due to insufficient development may remain, or the resin JZ dissolved during the development may accumulate. When the via conductor 85 is formed in the via hole 83 in the state where the resin JZ is present, conduction (connection) is established between the via conductor 85 and the wiring layer 82 on the via hole bottom surface 83C as shown in FIG. ) Failure may occur. Further, for example, even when a resin insulating layer is formed on the substrate 81 to be laminated and the via hole is formed by piercing the resin insulating layer with a laser or the like, the resin that cannot be completely removed by the laser or the like may remain on the bottom surface of the via hole. . Also in this case, similarly to the above, poor conduction may occur between the via conductor and the via conductor formed in the via hole.

When the surface of the resin insulating layer 84 is roughened in order to improve the adhesion strength between the resin insulating layer 84 and a wiring layer or a resin insulating layer formed thereon, And the resin JZ remaining on the via hole bottom surface 83C can be removed. However, the resin JZ remaining on the via hole bottom surface 83C
If the etching conditions are increased to completely remove
The surface of the resin insulating layer 84 may be roughened more than necessary, and the adhesive strength to the wiring layer or the resin insulating layer to be formed later may be rather reduced.

The present invention has been made in view of the above situation, and is a wiring which can surely remove the resin at the bottom of a bottomed hole formed in a resin insulating layer laminated on the surface of a substrate to be laminated. An object of the present invention is to provide a method for manufacturing a substrate.

[0006]

Means for Solving the Problems, Actions and Effects The solution is to provide a resin insulating material having a bottomed hole having a part of the metal layer as a bottom surface on the surface of the laminated substrate having a metal layer on the surface. An insulating layer forming step of forming a layer, and a resin removing step of removing a resin on the metal layer on the bottom surface of the bottomed hole by causing an object to collide with at least the bottomed hole at a high speed from the surface side of the resin insulation layer. And a method for manufacturing a wiring board comprising:

According to the present invention, after the resin insulating layer is formed in the insulating layer forming step, the object is caused to collide with the bottomed hole at a high speed in the resin removing step. Thereby, the resin remaining on the bottom surface of the bottomed hole when forming the bottomed hole can be reliably removed, and the metal layer can be completely exposed on the bottom surface of the bottomed hole. Therefore, after that, a conductor layer is formed on the bottom surface of the bottomed hole and the inner wall surface of the bottomed hole to be a via conductor, or a conductor layer is formed on the bottom surface of the bottomed hole to be a pad or a land. Solder is welded to the bottom, or metal balls are fused with solder to form solder bumps or metal ball bumps. At this time, the connection between the metal layer on the bottom surface of the bottomed hole and the conductor, solder, or the like becomes good, and the conduction failure is reduced. Therefore, a wiring board with high connection reliability can be manufactured by the manufacturing method of the present invention.

Here, the substrate to be laminated may be any substrate as long as it has a metal layer such as a wiring layer on the surface and a resin insulating layer can be formed thereon. The surface of a core board made of a resin or a composite material such as an epoxy resin or a glass fiber-epoxy resin composite material, a ceramic board or a ceramic multilayer wiring board made of an alumina or aluminum nitride, etc. Examples include a laminate substrate having a resin insulating layer formed thereon and a metal layer on the surface.

A resin insulating layer having a bottomed hole is obtained by forming a photosensitive uncured resin layer on a substrate to be laminated, forming a bottomed hole by exposure and development, and further curing the uncured resin layer. Can be formed. In this case, the uncured resin may be a negative type in which the exposed portion is insoluble in the developing solution, or a positive type in which the exposed portion is soluble in the developing solution. In addition, the resin insulating layer having a bottomed hole,
It can also be formed by forming a resin insulating layer on the substrate to be laminated, and drilling a bottomed hole at a predetermined position using a laser, a drill, or the like. Further, a resin insulating layer having a bottomed hole can be formed by applying an uncured resin in a predetermined pattern to the substrate to be laminated and then curing the resin. In any case, the resin is likely to remain on the metal layer on the bottom surface of the bottomed hole, so by removing this resin in the resin removing step,
The conduction between the metal layer and a conductor or solder to be formed thereafter is improved.

The object to be collided at a high speed may be selected in consideration of the material and thickness of the resin insulating layer.
For example, a compressed gas such as compressed air or compressed nitrogen, water, an etching solution, a developing solution, a rinsing solution, a liquid such as a fluorine-based solvent,
Solids such as silica powder, plastic powder, and sand blasting media such as glass beads are exemplified. Further, a mixture of these as appropriate, such as a slurry (a mixture of a solid and a liquid) in which a medium such as a silica powder is mixed in water, can also be used.

In the resin removing step, the object may be caused to collide with at least the bottomed hole. In consideration of the object to be used and its speed, the object is caused to collide with the entire surface of the resin insulating layer. By arranging or forming a resist layer, portions other than the bottomed hole may be covered to protect the object from impact.

Further, in the above-described method for manufacturing a wiring board, it is preferable that a liquid is used as the object in the resin removing step.

If a liquid is used as the object to be colliding, a sufficient impact can be obtained, the resin can be efficiently removed, and a solid such as silica powder or a slurry obtained by mixing a solid with the liquid can be used as in the case of using a resin insulating layer. Or the surface of the metal layer is not damaged or penetrated into the resin insulating layer or the metal layer. The liquid may be selected in consideration of the material of the metal layer, the resin insulating layer, and the like. In addition to water, for example, a resin etching solution for etching and roughening the resin insulating layer, an etching solution for etching the metal layer, and a roughening method. For example, a roughening solution, a developing solution for developing a resin insulating layer or a resist layer, a rinsing solution, a fluorine-based solvent, or the like can be used.

Further, in the above method for manufacturing a wiring board, in the resin removing step, a resin etchant for etching and roughening the resin insulating layer is used as the object.
While removing the resin on the metal layer on the bottom surface of the bottomed hole,
It is preferable to provide a method for manufacturing a wiring board, which is a resin removal / resin etching step of etching and roughening the resin insulating layer.

When a resin etching solution such as potassium permanganate for etching and roughening a resin insulating layer is used as an object to be collided, not only the resin remaining on the bottom surface of the bottomed hole is removed by an impact force but also the resin is removed. It can also be removed by dissolution. Therefore, the resin remaining on the bottom surface of the bottomed hole can be more reliably removed, and the metal layer can be exposed. In addition, when the resin etching solution is used, the resin on the bottom surface of the bottomed hole is removed, and the surface of the resin insulating layer becomes rough. Therefore, the adhesive strength between the resin insulating layer and a wiring layer (conductor layer) or a resin insulating layer to be formed later can be increased.

Alternatively, in the above method for manufacturing a wiring board, in the resin removing step, the metal layer is etched using a metal layer etching solution for etching the metal layer on the bottom surface of the bottomed hole as the object. Preferably, the method is a method for manufacturing a wiring board, which is a resin removal / metal layer etching step of removing the resin.

When an etching solution for etching the wiring layer such as a sodium sulfate solution is used as the object to be collided, not only the resin remaining on the bottom of the bottomed hole is removed by an impact force, but also the metal layer on the bottom of the bottomed hole is removed. Can also be removed by dissolving and floating the resin. Therefore, the resin remaining on the bottom surface of the bottomed hole can be more reliably removed, and the metal layer can be exposed.

Alternatively, it is preferable that the method for manufacturing a wiring board described above is characterized in that water is used as the object in the resin removing step. When water is used as the object to be collided, the resin insulating layer and the metal layer do not dissolve or corrode. Further, after the collision with water, drying is sufficient, and the treatment of waste liquid is easy. Note that pure water, preferably pure water having a conductivity of 0.1 mS or less, is preferably used. This is because contamination of the resin insulating layer, the metal layer, and the like by impurities can be prevented.

Further, in the above-mentioned method for manufacturing a wiring board, in the resin removing step, the liquid may be supplied in an amount of 30 kg / cm ^2.
Preferably, the method is a method for manufacturing a wiring board, characterized by spraying at a pressure of 50 kg / cm ² or less.

[0020] to the pressure impinging 30kg / cm ² or more, which in the following, is because the resin of the bottomed hole bottom for shock is small is difficult to remove, 30kg / cm ²
By doing so, the resin on the bottom surface of the bottomed hole can be reliably removed. On the other hand, the reason why the pressure is set to 50 kg / cm ² or less is that if the pressure is more than 50 kg / cm ² , the impact is too large, and the surface of the resin insulating layer is extremely roughened and the bottomed hole is expanded and deformed. / Cm ² or less ensures that the resin can be removed without adversely affecting the resin insulating layer and the like.

Further, in the method for manufacturing a wiring board according to any one of the above, a resin etching step of etching and roughening the resin insulating layer after the insulating layer forming step and before the resin removing step is provided. It is preferable to provide a method for manufacturing a wiring board, comprising:

When the resin insulating layer is roughened by etching in the resin etching step, a part of the resin remaining on the bottom surface of the bottomed hole is dissolved and removed by the etchant. Thereafter, by performing the resin removing step, The resin can be more reliably removed. Moreover, by performing such a resin etching step, the adhesion strength between the resin insulating layer and the conductor layer formed in the bottomed hole is improved by the anchor effect. In the case where a wiring layer (conductor layer) or a resin insulating layer is formed on the resin insulating layer, the adhesive strength between the wiring layer and the resin insulating layer is improved.

Further, instead of removing the resin remaining on the bottom surface of the bottomed hole only by resin etching (resin etching step) as in the prior art, the resin etching step and the resin removal step are used in combination, so that the bottom surface of the bottomed hole is removed. Since the resin is removed, the condition of the resin etching is not made too strong and the surface of the resin insulating layer is not unnecessarily roughened. Therefore, the surface of the resin insulating layer can be made to have a desired roughness, and the resin remaining on the bottom surface of the bottomed hole can be reliably removed.
In addition, as this etching roughening, the resin insulating layer may be treated with a resin etching solution such as an aqueous solution of potassium permanganate, and in consideration of the surface roughness of the resin insulating layer,
What is necessary is just to select the composition of the resin etching solution, reaction conditions, and the like as appropriate.

Further, in the method for manufacturing a wiring board according to any one of the above, after the insulating layer forming step or after the resin etching step when the method includes the resin etching step, the resin removing step Preferably, the method further comprises a metal layer etching step of etching the metal layer on the bottom surface of the bottomed hole.

When the metal layer is etched before the resin removing step, the resin remaining on the bottom surface of the bottomed hole is removed together,
Alternatively, the resin is likely to partially float from the bottom surface of the bottomed hole. Therefore, the resin is more reliably removed by performing the resin removing step thereafter. Further, when the above-described resin etching step is provided before the metal layer etching step, even if the resin covers the entire metal layer on the bottom surface of the bottomed hole after the insulating layer forming step, a part of the resin is removed. In some cases, the metal layer is exposed in some places. Therefore, the metal layer on the bottom surface of the bottomed hole can be efficiently etched in the metal layer etching step.

In this etching, the metal layer on the bottom surface of the bottomed hole may be treated with a metal layer etching solution such as a sodium sulfate solution or a metal layer etching solution containing a pseudo acid (roughening solution). Considering the material of the layer,
The composition and reaction conditions of the metal layer etching solution may be appropriately selected. When a roughening solution is used as the metal layer etching solution, the surface of the metal layer can be roughened in the metal layer etching step, so that the adhesion strength between the metal layer and the conductor layer formed on the bottom surface of the bottomed hole is reduced. The height can be increased by the anchor effect.

Further, the method for manufacturing a wiring board according to any of the above, further comprising a plasma processing step of performing a plasma processing on the resin insulating layer after the insulating layer forming step and before the resin removing step. It is preferable to use a method of manufacturing a characteristic wiring board. When the resin insulating layer is roughened in the plasma processing step, a portion of the resin remaining on the bottom surface of the bottomed hole is partially removed.
The resin can be more reliably removed. Further, the plasma treatment improves the adhesion strength between the resin insulating layer and the conductor formed in the bottomed hole due to the anchor effect. Also,
When a wiring layer (conductor layer) or a resin insulating layer is formed on the resin insulating layer, the adhesive strength with these layers is also improved.

[0028]

Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In manufacturing a wiring substrate, a laminated substrate 1 whose partial enlarged sectional view is shown in FIG. 1 is prepared in advance. This laminated substrate 1 is made of glass
It consists of a BT resin core substrate 2 and has a wiring layer 3 (metal layer) on its upper surface 2A and lower surface (not shown).
Further, through-hole conductors 5 are provided on the inner peripheral surface of the large number of holes 4 formed in the core substrate 2 and are electrically connected to the upper and lower wiring layers 3. The through-hole of the through-via conductor 5 is filled with a resin 6.

The laminated substrate 1 is manufactured as follows. That is, a double-sided copper-clad board having copper foil on both sides of the core board 2 is drilled by a drill. Then, electroless plating and electrolytic plating are sequentially performed on the substrate, and a plating layer is formed on the copper foil and on the inner peripheral surface of the perforated hole. After that, it is etched into a predetermined pattern. As a result, the wiring layer 3 is formed on the upper surface 2A and the lower surface of the core substrate 2, and the through via conductor 5 is formed on the inner peripheral surface of the perforated hole. Thereafter, when the through-hole of the through via conductor 5 is filled with the resin 6, the laminated substrate 1 is obtained.

First, in the insulating layer forming step, as shown in FIG. 2, a photosensitive uncured (semi-cured) resin layer 11 is formed on the surface 1A of the substrate 1 to be laminated. Specifically, a dry film (uncured film-like resin) made of an epoxy resin is attached to the surface 1A of the substrate 1 to be laminated. The photosensitive resin layer 11 is of a negative type in which an exposed portion is cured and becomes insoluble in a developer. Next, the resin layer 11 is exposed using a glass mask (not shown) on which a light-shielding pattern is formed, and the exposed portions are cured.

Next, a developer is showered from the surface 1A side of the laminated substrate 1 (the surface side of the resin layer 11) to form via holes (holes with bottoms) 12 (see FIG. 3). In this state, the via hole bottom (bottomed hole bottom) 12C should be
The wiring layer 3 on the surface 1A of the substrate 1 to be laminated should be exposed, but the resin which has not been sufficiently developed and has not been hardened becomes the via hole bottom surface 1A.
It may remain on part or the entire surface of 2C. Or,
The resin dissolved during development may adhere to the via hole bottom surface 12C and remain as a resin film (see FIG. 3).

After the development, the resin layer 11 is heated and sufficiently cured, and as shown in FIG. 3, a resin having a large number (one in the figure) of via holes (bottomed holes) 12 at predetermined positions. An insulating layer 13 is formed. Even in this state, the uncured resin that cannot be completely removed from the via hole bottom surface (bottomed hole bottom surface) 12C by development is hardened and remains. Therefore, when a via conductor (conductor layer) is formed on the via hole bottom surface 12C and the via hole inner wall surface (bottomed hole inner wall surface) 12D in this state, the resin JS causes the via conductor 1 described later to be formed.
7 and the wiring layer 3 on the via hole bottom surface 12C may cause a conduction failure (connection failure).

Next, in the resin etching step, FIG.
As shown in (2), the resin insulating layer 13 formed in the insulating layer forming step is roughened by etching. Specifically, an etching solution composed of an aqueous solution of potassium permanganate is showered onto the substrate 1 on which the resin insulating layer 13 is formed, and the surface 13A of the resin insulating layer 13 is etched and roughened. By this etching roughening, the via hole bottom surface 12C
The resin JS remaining in the resin can be partially dissolved and removed. Here, the stronger the etching conditions, the more the resin JS
However, since the surface 13A of the resin insulating layer 13 becomes too rough, the conditions must be determined in consideration of the material and the surface roughness of the resin insulating layer 13. Therefore, the resin JS may remain on the via hole bottom surface 12C without being completely removed.

Next, in the metal layer etching step, as shown in FIG. 5, the wiring layer 3 exposed at the via hole bottom surface 12C is etched. Specifically, a sodium sulfate solution is showered on the substrate 1 to be laminated after the resin etching step, and the surface 3A of the 18 μm-thick wiring layer 3 on the via hole bottom surface 12C is etched by about 1.5 μm.

By this etching, the via hole bottom 1
The surface layer of the 2C wiring layer 3 is dissolved, and a part of the resin JS remaining on the wiring layer 3 is also removed. Alternatively, a part of the resin JS is partially peeled from the wiring layer 3,
Become floating. In the etching of the wiring layer 3 as well, the stronger the etching conditions, the more easily the resin JS is removed. However, the etchant reaches the lower wiring layer 3 under the resin insulating layer 13 and is etched, causing a problem. Therefore, it is necessary to control the etching conditions so as not to be too strong. Therefore, the resin JS may remain on the via hole bottom surface 12C without being completely removed. In this embodiment, since the resin etching step is performed before the metal layer etching step, even if the resin JS remains thick after the resin insulating layer 13 is formed, a part of the resin JS is formed in the resin etching step. Is removed and the wiring layer 3 is exposed in some places (see FIG. 4), so that the wiring layer 3 can be efficiently etched.

Next, in the resin removing step, FIG.
Pure water WA is caused to collide at high pressure (high speed) as shown in
As shown in FIG. 7, the resin JS on the via hole bottom surface 12C is completely removed. Specifically, as shown in FIG. 6A, in the housing J, a high-pressure pump PM is applied to the resin insulating layer 13 of the substrate 1 to be stacked and conveyed, which is placed on the conveyor CON. The pressurized pure water WA is ejected from the nozzle NZ through the pipe PI to collide. Thereby, as shown in FIG. 7, the resin JS on the via hole bottom surface 12C is completely removed, and the wiring layer 3 on the surface 1A of the laminated substrate 1 is exposed on the via hole bottom surface 12C.

In this embodiment, before the resin removing step, the surface 13A of the resin insulating layer 13 is etched by a resin etching step.
And the resin JS on the via hole bottom surface 12C
Are further removed, and in the metal layer etching step, the surface of the wiring layer 3 on the via hole bottom surface 12C is etched, and a part of the resin JS on the via hole bottom surface 12C is removed. Therefore, the resin JS on the via hole bottom surface 12C can be surely removed by the resin removing step,
The wiring layer 3 can be completely exposed at the via hole bottom surface 12C.

In this embodiment, the pure water WA is set to about 4
The collision was performed at a pressure of 0 kg / cm ² . If the pressure is 30 kg / cm ² or less, the resin JS may not be completely removed, and as a result, a conduction failure may occur in the wiring board. When the pressure is 50 kg / cm ² or more,
In some cases, the resin insulating layer 13 on the laminated substrate 1 was damaged or the via hole 12 was deformed. Therefore, as in the present embodiment, the pressure at which the pure water WA collides is 30 kg / cm ² or more and 50 kg / cm ^2.
It is preferable to set the following range.

The pure water WA has a conductivity of 0.1 mS.
The following are used. By using pure water having a small amount of impurities as described above, it is possible to prevent the resin insulating layer 13 and the wiring layer 3 from being contaminated. Further, by using the pure water WA, the resin insulating layer 13 and the wiring layer 3 do not dissolve or corrode, and after spraying, it is only necessary to dry, and the disposal of waste liquid is easy.

Next, in the conductor forming step, a conductor layer is formed on the via hole bottom surface 12C, the via hole inner wall surface 12D, and the surface 13A of the resin insulating layer 13. Specifically, electroless plating is applied to the entire surface to form a via hole bottom surface 12.
C and via hole inner wall surface 12D, and resin insulating layer 13
An electroless plating layer is formed on the surface 13A of the substrate, and electrolytic plating is further performed to form an electrolytic plating layer on the electroless plating layer. Thereafter, an etching resist layer having a predetermined pattern is formed, and unnecessary portions of the plating layer are removed by etching. As a result, the via conductor 17 (conductor layer) is formed on the via hole bottom surface 12C and the via hole inner wall surface 12D, and the wiring layer 18 (conductor layer) is formed on the resin insulating layer 13.

At this time, since the wiring layer 3 is completely exposed from the via hole bottom surface 12C, the wiring layer 3 and the via conductor 17 are securely connected. For this reason, the occurrence of the above-described conduction failure between the wiring layer 3 on the via hole bottom surface 12C and the wiring layer 18 on the via conductor 17 and the resin insulating layer 13 which is conductive therewith is reduced. Since the resin insulating layer 13 is roughened in the resin etching step, the adhesion strength between the resin insulating layer 13 and the via conductor 17 or the wiring layer 18 increases. Also, unlike the case where the resin JS on the via hole bottom surface 12C is removed only by the resin etching process, the resin removal process by spraying a liquid (pure water WA) is also used, so that the surface 13A of the resin insulating layer 13 is too rough. Failures can be prevented from occurring.

After the conductor forming step, a resin insulating layer (not shown) is further laminated on the resin insulating layer 13 and the wiring layer 18 to form a via conductor, a wiring layer, and the like. Further, if necessary, a resin insulating layer, a wiring layer, and the like, a solder resist layer, an input / output terminal, and the like are formed to complete the wiring substrate. In the wiring board manufactured in this manner, the wiring layers 3 and 18 and the via conductors 17 are securely connected to each other, so that the connection reliability between the wiring layers 3 and 18 is high.

As described above, according to the method for manufacturing a wiring board of the present embodiment, in the resin removing step, pure water WA is applied from the surface 13A side of the resin insulating layer 13 at a pressure of 30 to 50 kg / cm ^2. Collides with the via hole bottom surface 12C
The resin JS remaining on the substrate can be reliably removed. Therefore, the connection reliability between the wiring layer (metal layer) 3 on the via hole bottom surface 12C and the via conductor (conductor layer) 17 is high.

Before the resin removing step, a resin etching step is performed. In this step, the resin J on the bottom surface 12C of the via hole is removed.
Since a part of S is removed, the wiring layer 3 on the via hole bottom surface 12C can be more reliably exposed in the resin removing step. Further, after the resin etching step and before the resin removing step, a metal layer etching step is performed, and in this step, a part of the resin JS on the via hole bottom surface 12C is removed.
In the resin removing step, the wiring layer 3 on the via hole bottom surface 12C can be more reliably exposed. In the present embodiment, the pure water WA is made to collide in the resin removing step, but a liquid other than water may collide with high pressure. If you use liquid,
A sufficient impact is obtained, the resin JS can be efficiently removed, and the resin JS can be stuck and remain in the resin insulating layer 13 or the like as in the case of using a solid such as silica powder or a slurry in which the solid is mixed with a liquid. Absent.

(Embodiment 2) Next, Embodiment 2 will be described with reference to FIG. In the present embodiment, terminal holes (bottomed holes) 11 are provided on the surface of the laminated substrate 101.
After forming the resin insulating layer 113 having a terminal 2, a terminal conductor 117 is formed in the terminal hole 112, and thereafter,
This embodiment differs from the first embodiment in that a pin 121 as an external terminal is soldered to the terminal conductor 117.

First, as in the first embodiment, the substrate to be laminated 101 is prepared in advance, and a wiring board is manufactured in the same manner as in the first embodiment until the resin removing step. That is, in the insulating layer forming step, the resin insulating layer 113 having the terminal holes (bottomed holes) 112 is formed on the laminated substrate 101. Next, in the resin etching step, the laminated substrate 1
In addition, the resin insulating layer 113 formed on the substrate 01 is roughened by etching, and at least a part of the resin on the terminal hole bottom surface 112C is removed. Further, in the metal layer etching step, the wiring layer 103 exposed on the terminal hole bottom surface 112C is formed.
And the terminal hole bottom surface 112C
At least a part of the resin remaining in is removed. Next, in a resin removing step, pure water is caused to collide with high pressure to completely remove the resin from the terminal hole bottom surface 112C.
Completely exposed.

Thereafter, in the present embodiment, in the conductor forming step, a terminal conductor 117 is formed on the terminal hole bottom surface 112C, the terminal hole inner wall surface 112D, and the resin insulating layer 113 on the periphery of the terminal hole 112. The terminal conductor 117 may be formed by plating the entire surface and removing unnecessary portions by etching, similarly to the formation of the via conductor 17 of the first embodiment.

Next, the solder resist layer 120 is formed on the resin insulating layer 113 with a slight gap from the terminal conductor 117.
Is formed (see FIG. 9). Next, a substantially cylindrical tip 1
21A, a base end 121C having a substantially cylindrical shape and shorter than the front end 121A, and a front end 121A and a base end 121A.
A pin 121 including a substantially disk-shaped intermediate portion 121B having a diameter larger than C is prepared. Then, as shown in FIG. 9, the base end portion 121C of the pin 121 is inserted into the terminal conductor 117, and the intermediate portion 121B is brought into contact with the terminal conductor 117.
The pin 121 is fixed to the terminal conductor 117 with a solder material 123. Thus, a wiring board is completed.

In the manufacture of the wiring board of this embodiment,
As in the first embodiment, in the resin removing step, the resin on the terminal hole bottom surface 121C is completely removed, so that the wiring layer 103 exposed on the terminal hole bottom surface 121C is removed.
And the terminal conductor 117 can be reliably connected.
Therefore, a wiring board with high connection reliability can be manufactured. Further, since the surface of the resin insulating layer 113 is etched and roughened in the resin etching step as in the first embodiment, the adhesion strength between the terminal conductor 117 and the resin insulating layer 113 can be increased by the anchor effect. it can. Further, the adhesion strength between the solder resist layer 120 and the resin insulating layer 113 can be increased by the anchor effect.

(Embodiment 3) Next, Embodiment 3 will be described with reference to FIG. The present embodiment is different from the second embodiment in that solder bumps 223 as external terminals are formed on terminal conductors 217 formed in terminal holes (bottomed holes) 212 of a resin insulating layer 213. First, similarly to the first and second embodiments, the laminated substrate 2
01, an insulating layer forming step, a resin etching step,
A metal layer etching step and a resin removing step are performed to remove the resin from the bottom surface 212C of the bottomed hole, exposing the wiring layer 203. Then, in the same manner as in the second embodiment, in the conductor forming step, the terminal conductors 217 are formed on the terminal hole bottom surfaces 212C, the terminal hole inner wall surfaces 212D, and the resin insulating layer 213 on the periphery of the terminal holes 212. .

Next, in this embodiment, the terminal conductor 217 is used.
The solder resist layer 220 is formed on the resin insulating layer 213 so as to slightly cover the periphery of the solder resist layer 213. Thereafter, solder bumps 223 which fill the terminal conductors 217 and bulge substantially hemispherically from the terminal conductors 217 exposed from the solder resist layer 220 are formed. This solder bump 223
The terminal conductor 217 is formed using a mask having a predetermined pattern.
Is formed by printing a solder paste and then reflowing. Thus, the wiring board of the present embodiment is completed.

In the production of such a wiring board, as in the first and second embodiments, in the resin removing step,
Since the resin of the terminal hole bottom surface 212C is completely removed, the wiring layer 20 exposed on the terminal hole bottom surface 212C is removed.
3 and the terminal conductor 217 can be reliably connected. Therefore, a wiring board with high connection reliability can be manufactured. Further, as in the first and second embodiments, the surface of the resin insulating layer 213 is etched and roughened in the resin etching step, so that the terminal conductor 217 and the resin insulating layer 21 are formed.
3 can be made higher by the anchor effect. Also, the solder resist layer 220 and the resin insulation layer 2
13 can be similarly increased.

(Embodiment 4) Next, Embodiment 4 will be described with reference to FIG. In the present embodiment, after a resin insulating layer 313 having a bottomed hole 312 is formed on the surface of the laminated substrate 301 (the surface of the wiring layer 303), a pin 321 as an external terminal is inserted into the bottomed hole 312, The third embodiment differs from the first to third embodiments in that it is soldered to the wiring layer 303 of the bottomed hole bottom surface 312C. First, the first embodiment
As in the same manner as in Steps 1 to 3, a substrate 301 to be laminated is prepared in advance, and an insulating layer forming step, a resin etching step, a metal layer etching step, and a resin removing step are performed. To expose.

Next, a substantially cylindrical distal end 321A and a substantially disk-shaped base end 321B larger in diameter than the distal end 321A.
Is prepared. Then, as shown in FIG. 11, the base end 321 </ b> B and the tip 32
1A is inserted into the bottomed hole 312, and the base end portion 321B is inserted.
Is brought into contact with the wiring layer 303 on the bottom surface 312C of the bottomed hole, and is fixed to the wiring layer 303 with a solder material 323. Thus, a wiring board is completed.

In the manufacture of the wiring board of this embodiment,
Similarly to the above embodiment, in the resin removing step, the resin on the bottom surface 312 </ b> C of the bottomed hole is completely removed. Therefore, the wiring layer 303 exposed on the bottom surface 321 </ b> C of the bottomed hole and the pin 321 can be reliably connected by the solder material 323.
Therefore, a wiring board with high connection reliability can be manufactured. In this embodiment, as in the first to third embodiments, the wiring layer 1 is formed on the resin insulating layers 13, 113, and 213.
8 and the solder resist layers 120 and 220 are not formed, so that the surface of the resin insulating layer 313 does not need to be roughened.
Accordingly, although the resin etching step can be omitted, as described above, by performing the resin etching step, a part of the resin on the bottomed bottom surface 312 can be removed in the resin etching step. Thus, the resin can be more reliably removed.

(Fifth Embodiment) Next, a fifth embodiment will be described with reference to FIG. The present embodiment is different from the above-described fourth embodiment in that solder bumps 423 that bulge in a substantially hemispherical shape from inside the bottomed holes 412 are formed in the bottomed holes 412 formed in the solder resist layer (resin insulating layer) 413. . First, as in the first to fourth embodiments, the laminated substrate 401 is prepared in advance. Then, in the insulating layer forming step,
An uncured resin is applied to the surface of the laminated substrate 401 in a predetermined pattern, and then cured to form a solder resist layer 413 having a bottomed hole 412.

Thereafter, unlike the above-described first to fourth embodiments, the wiring layer 403 exposed to the bottomed hole 412 is etched in the metal layer etching step without performing the resin etching step, and the bottomed hole bottom surface 412C is formed. At least a part of the resin remaining in is removed. Then, in a resin removing step, pure water is caused to collide with high pressure to remove the resin on the bottom surface 412C of the bottomed hole, thereby completely exposing the wiring layer 403. Next, a solder bump 423 that fills the bottomed hole 412 and bulges substantially hemispherically from the bottomed hole 412 is formed. The solder bumps 423 may be formed by printing a solder paste using a mask having a predetermined pattern and performing reflow, similarly to the third embodiment. Thus, the wiring board of the present embodiment is completed. Also in the manufacture of the wiring board of the present embodiment, the resin of the bottomed bottom surface 412C is completely removed in the resin removing step, as in the first to fourth embodiments. Therefore, the wiring layer 403 exposed on the bottomed bottom surface 412C and the solder bump 423 can be reliably connected. Therefore, a wiring board with high connection reliability can be manufactured.

As in the prior art, the surface of the solder resist layer (resin insulating layer) 413 is roughened by etching in a resin etching step, and the bottom surface 412 of the bottomed hole is formed.
When the C resin is removed, for example, a problem may occur when an IC chip is mounted on the wiring board.
That is, when an IC chip is connected to the solder bumps 423 of the wiring board and an underfill material is filled and fixed between the wiring board and the IC chip, the surface of the solder resist layer 413 is too rough. In such a case, the flow of the underfill material is deteriorated, which may cause a problem that the lower side of the IC chip cannot be filled properly.

On the other hand, in the present embodiment, since the resin etching step is not performed, the surface of the solder resist layer 413 does not become rough, so that the above-mentioned problem does not occur. Further, in the case where the resin etching step is performed after the insulating layer forming step and before the metal layer etching step as in each of Embodiments 1 to 4, in the present embodiment, the bottomed bottom surface is formed by the resin removing step and the like. Since the resin 412C can be removed, the solder resist layer 413
The conditions for resin etching can be adjusted so that the surface is not too rough.

In the above, the present invention has been described with reference to each of Embodiments 1 to 5.
However, it is needless to say that the present invention is not limited to the above-described embodiment, and can be appropriately modified and applied without departing from the gist of the present invention. For example, in each of Embodiments 1 to 5, in the resin removing step, pure water WA is caused to collide with the entire surface of the resin insulating layer 13 (FIG. 6).
6 (a)), as shown in FIG. 6 (b), a protective mask MSK having a through hole MSKT at a predetermined position is placed on the resin insulating layer 1.
3 and the pure water WA is placed on the surface 1 of the resin insulation layer 13 and the like.
Only the portion corresponding to the through hole MSKT in 3A may be applied. By doing so, the protection mask MSK
Thereby, the resin insulating layer 13 and the like can be protected from the impact of the pure water WA, which is more preferable. On the other hand, the protective mask MSK
In the above-described embodiment that does not use, there is no trouble such as preparing the protection mask MSK or positioning and mounting the protection mask MSK, so that the resin removing step can be simplified.

In each of the first to fourth embodiments, the resin etching step is provided, but this step may be omitted. In particular, when a wiring layer, a resin insulating layer, a solder resist layer, and the like are not formed on the resin insulating layers 313 and 413 as in the above-described fourth embodiment, it is not necessary to consider adhesion strength with these. It can be omitted. However, the resin etching step is preferable because the resin JS on the bottom surface 12C of the bottomed hole can be more reliably removed as described above.

In each of the first to fifth embodiments, the metal layer etching step is provided, but this step can be omitted. However, as described above, the via hole bottom surface 12
It is preferable to perform a metal etching step because the adhesion strength between the wiring layer 3 and the like such as C and the conductor and the like can be improved and the resin JS on the via hole bottom surface 12C and the like can be more reliably removed.

In each of the first to fifth embodiments, the pure water WA is caused to collide with the high pressure in the resin removing step. However, a liquid other than water, a solid such as a powder, or a slurry obtained by mixing the solid with the liquid is used. Can be removed at a high speed to remove the resin JS from the via hole bottom surface 12C and the like. In the case of using a material other than water, the conditions for collision are appropriately changed in consideration of the influence on the laminated substrate 1 and the like and the resin insulating layer 13 and the like.

When a resin etchant for etching and roughening the resin insulating layer 13 and the like is used instead of the pure water WA, not only the impact force but also the dissolution of the resin can be used to obtain the bottomed bottom surface 3C and the like. Of the resin JS can be removed, and the resin insulating layer 13 and the like can be roughened by etching. Therefore, in this case, it is not necessary to separately perform the resin etching step.

Further, instead of the pure water WA, the via hole bottom 1
When an etching solution for etching the wiring layer 3 such as 2 is used, not only the impact force but also the dissolution of the wiring layer 3 and the like to float the resin JS can be used to obtain the via hole bottom surface 1.
Part of the resin JS such as 2C can be removed. Therefore, in this case, it is not necessary to separately perform the metal layer etching step. Also, in the case where a mixture of a liquid such as water and a medium such as a silica powder is collided at a high speed in place of the pure water WA, the resin can be removed more efficiently than in the case of using only the liquid. .

In each of the first to fourth embodiments, in the insulating layer forming step, the photosensitive resin is used, and the resin insulating layer 13 having the bottomed holes such as the via holes 12 is formed by exposure and development. A resin insulating layer having a bottomed hole can be formed by other methods. Specifically, for example, a film-shaped resin insulating layer may be attached to the surface 1A of the laminated substrate 1 or the like and thermally cured, and then a bottomed hole may be formed by a laser or a drill. Also in this case, the resin that cannot be completely removed by the laser or the like can be surely removed in a resin removing step or the like, so that a wiring board with high connection reliability can be manufactured.

Further, as in the fifth embodiment, a resin insulating layer having bottomed holes can be formed by applying a resin on the surface 1A of the laminated substrate 1 or the like in a predetermined pattern and curing the resin. In this case, too, the resin may wet and spread on the bottom surface of the bottomed hole, causing a conduction failure. Therefore, by performing the resin removing step or the like as described above, the resin on the bottom surface of the bottomed hole is reliably removed, and the via conductor is removed. It is possible to improve the connection reliability with the like.

Further, instead of or in addition to the resin etching step of each of the above-described embodiments 1 to 4, a plasma processing step of performing a plasma processing on the resin insulating layer 13 and the like may be performed. By the plasma treatment, a part of the resin JS on the via hole bottom surface 12C and the like is removed, and the resin JS can be more reliably removed in the resin removing step. Further, since the surface of the resin insulating layer 13 and the like is roughened, the adhesion strength to a conductor and the like formed on the resin insulating layer 13 and the like can be increased.

[Brief description of the drawings]

FIG. 1 is a partially enlarged cross-sectional view showing a laminated substrate according to a first embodiment.

FIG. 2 is a partial enlarged cross-sectional view illustrating a state in which an uncured resin layer is formed on the laminated substrate, according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a method of manufacturing the wiring board according to the first embodiment and is a partially enlarged cross-sectional view illustrating a state where a resin insulating layer having a via hole is formed.

FIG. 4 is a view showing the method for manufacturing the wiring board according to the first embodiment, and is a partially enlarged cross-sectional view showing a state where the resin insulating layer is roughened by etching.

FIG. 5 is a view showing the method for manufacturing the wiring board according to the first embodiment, and is a partially enlarged cross-sectional view showing a state in which the wiring layer on the bottom surface of the bottomed hole is etched and roughened.

6A and 6B are diagrams illustrating a method for manufacturing the wiring board according to the first embodiment, in which FIG. 6A is an explanatory diagram illustrating a resin removing process without using a mask, and FIG. 6B is a diagram illustrating a resin removing process using a mask. FIG.

FIG. 7 is a view illustrating the method of manufacturing the wiring board according to the first embodiment, and is a partially enlarged cross-sectional view illustrating a state where the resin on the bottom surface of the via hole is removed in the resin removing step.

FIG. 8 is a diagram illustrating the method of manufacturing the wiring board according to the first embodiment, and is a partially enlarged cross-sectional view illustrating a state where a via conductor and a wiring layer are formed.

FIG. 9 is a partially enlarged cross-sectional view illustrating a wiring board according to a second embodiment.

FIG. 10 is a partially enlarged sectional view showing a wiring board according to a third embodiment.

FIG. 11 is a partially enlarged sectional view showing a wiring board according to a fourth embodiment.

FIG. 12 is a partially enlarged sectional view showing a wiring board according to a fifth embodiment.

13A and 13B are diagrams illustrating a method of manufacturing a wiring board according to the related art, and FIG. 13A is a partially enlarged cross-sectional view illustrating a state in which a resin insulating layer having a via hole is formed in a laminated substrate;
(B) is a partial enlarged sectional view showing a state where a via conductor is formed.

[Explanation of symbols]

1,101,201,301,401 Laminated substrate 1A Surface (of laminated substrate) 3,103,203,303,403 Wiring layer (metal layer) (of laminated substrate surface) 3A (Wiring of laminated substrate surface) Layer)
Surface 11 Resin layer 12 Via hole (bottomed hole) 12C Via hole bottom (bottomed hole bottom) 12D Via hole inner wall (bottomed hole inner wall) 13, 113, 213, 313, 413 Resin insulating layer 13A (of resin insulating layer) Surface 17 Via conductor 18 Wiring layer (on resin insulating layer) 112, 212 Terminal hole (bottomed hole) 112C, 212C Terminal hole bottom (bottomed hole bottom) 117, 217 Terminal conductor 121, 321 Pin 223 423 Solder bump 312, 412 Bottom hole 312C, 412C Bottom hole bottom JS resin WA Pure water

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E343 AA12 DD76 EE10 EE36 EE37 GG02 5E346 AA43 CC08 CC55 EE19 FF24 FF34 GG09 GG15 GG22 GG27 HH07 HH31

Claims (5)

[Claims] An insulating layer forming step of forming a resin insulating layer having a bottomed hole with a part of the metal layer as a bottom surface on the surface of the laminated substrate having a metal layer on the surface; A resin removing step of colliding an object with at least the bottomed hole at a high speed from the surface side of the layer to remove the resin on the metal layer on the bottom surface of the bottomed hole. 2. The method for manufacturing a wiring board according to claim 1, wherein a liquid is used as the object in the step of removing the resin. 3. A method of manufacturing a wiring board according to claim 2, wherein in the resin removing step, the wiring board, characterized in that spraying the liquid at 30kg / cm ² or more 50 kg / cm ² or less of pressure Manufacturing method. 4. The method for manufacturing a wiring board according to claim 1, wherein said resin insulating layer is etched after said insulating layer forming step and before said resin removing step. A method for manufacturing a wiring board, comprising: a step of etching a resin. 5. The method for manufacturing a wiring board according to claim 1, wherein after the insulating layer forming step or after the resin etching step when the method includes the resin etching step. And a metal layer etching step of etching the metal layer on the bottom surface of the bottomed hole before the resin removing step.