JP2001054757A - Liquid treating device and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly treat the surface of a substrate and to save space by moving one supply nozzle selected from plural nozzles positioned in a stand-by region on the substrate, supplying a treating liquid on the substrate and standing-by the other nozzles in the stand-by region. SOLUTION: Plural supply nozzles, for example, 2 nozzles 52, 62 are provided in accordance with the kinds of the treating liquids, for example, developers, applied on a wafer W used in each lot. That is, one supply nozzle 52 moves from one end side to another side of the wafer W and applies the developer to the wafer W. At this time, another supply nozzle 62 is on stand-by in the stand-by region outside the wafer W. After the supply nozzle 52 is returned to the stand-by region 7, the position of the supply nozzles 52 and the supply nozzle 62 are switched by the cooperation of a moving structure and an elevating structure. Thus, liquid sagging is not generated on the wafer W so that the wafer W is treated uniformly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing apparatus and method for supplying a developing solution to a surface of a substrate on which, for example, a resist has been applied and which has been exposed to light, for performing a developing process.

[0002]

2. Description of the Related Art A mask for forming a circuit pattern on a surface of a semiconductor wafer (hereinafter, referred to as a wafer) or an LCD substrate of a liquid crystal display is formed by the following steps.
That is, first, a photoresist solution (hereinafter referred to as “resist”) is applied to the wafer surface, and irradiation with light or the like is performed. If the resist is, for example, a negative type, the light hit portion is cured,
An uncured portion, that is, a portion in which the resist is easily dissolved is dissolved by a developer to form a target mask.

Conventionally, the above-described developing process is performed by using the method shown in FIG.
This was performed by the following method shown in FIGS. A wafer W as a substrate to be processed is suction-held by a spin chuck (not shown) having a vacuum suction function, and a supply nozzle 12 in which a number of ejection holes 11 are arranged over a length corresponding to the diameter of the wafer W is used. At the center of the wafer W, the ejection hole 11 is positioned, for example, 1 mm above the surface of the wafer W. Then, the developer 10 is supplied to the center of the surface of the wafer W from the discharge hole 11 to perform liquid filling, and then the wafer W is rotated half a turn (1) while supplying the developer 10 from the discharge hole 11.
(Rotate 80 degrees).

[0004] By doing so, the developing solution 10 initially filled in the central portion of the wafer W is spread, and at the same time, the developing solution 10 is newly supplied. As a result, the liquid film of the developing solution has a predetermined thickness over the entire surface of the wafer W. It will be formed by the above.

[0005]

However, the liquid processing apparatus using the above method has the following problems.
In other words, in this apparatus, the wafer W is not rotated more than half a turn, so that the initially supplied old developing solution and the new developing solution are not mixed, and the unevenness between the mixed portion and the unmixed portion is eliminated. However, in practice, the developer on the wafer moves due to the inertial force, and there are places where the replacement of the developer is intense and places where the replacement of the developer is not so severe that the uniformity of development is deteriorated.

In view of such a problem, a method of performing a developing step by a method shown in FIG. 13 has been studied. In this method, a wafer W is horizontally held by a spin chuck 1 having a vacuum suction function, and a supply nozzle 12 similar to that shown in FIGS. For example, the scanning is performed from one end side to the other end side of the wafer W at a position of 1 mm, and the developing solution is supplied at the time of the scanning to apply the developing solution to the entire surface of the wafer W.

As an apparatus for performing a developing process on a plurality of types of wafers having different developing solutions, FIG.
The device shown in (b) is under study. This apparatus exemplifies a case in which different kinds of developer are supplied to two kinds of wafers, and two kinds of supply nozzles 14a and 14b having the same configuration as the supply nozzle 12 described above are respectively provided. Are provided on a common moving body 18 via a vertical mechanism 16 so as to extend in the Y direction and be able to move up and down independently, and the moving body 18 can be moved along a guide rail 19 extending in the X direction. Have been. Therefore, in this apparatus, the selected supply nozzle 13 is moved to the standby position 20 outside one end of the wafer W.
And the other end is scanned to apply a developer.

However, the above-described device has the following disadvantages. The supply nozzle 13 has a configuration in which the supply nozzle 14a and the supply nozzle 14b move integrally, so that when one of the supply nozzles is used for liquid filling, dripping occurs from the other supply nozzle, and an unintended developer May be supplied onto the wafer W.

During the scanning of the supply nozzle 13, the supply nozzle that is not being used is also moving above the wafer W, so that the discharge nozzle of the supply nozzle that is wet due to the supply of the developing solution or the like is placed above the wafer W. There is also a risk that flying particles will adhere.

In the above-described apparatus, the supply nozzles 14a and 14b are provided on the surface of the standby position 20 shown in FIG.
Although a bus (not shown) is provided in which is fitted an inert gas (N2) atmosphere, the deterioration of the developer stored in the supply nozzles 14a and 14b is suppressed. Therefore, when the supply nozzle 13 moves, the developer in the other supply nozzle that is not used is deteriorated.

Incidentally, it is conceivable to use a separate developing unit for each developer, but in this case, the size of the developing device is increased and the cost is high.

The present invention has been made under such circumstances, and an object of the present invention is to provide a liquid processing apparatus capable of performing uniform processing on a substrate surface and saving space. Is to do.

[0013]

According to the present invention, there is provided a liquid processing apparatus comprising: a substrate holding portion for holding a substrate horizontally; and a processing device having a length substantially equal to or greater than the width of an effective area of the substrate. To guide the plurality of supply nozzles between a plurality of supply nozzles in which liquid ejection holes are arranged, and a substrate and a standby area allocated outside one end of the substrate held by the substrate holding unit, respectively. A plurality of guide portions, a plurality of moving portions that respectively hold the plurality of supply nozzles and move independently along each guide portion, and an elevating mechanism that raises and lowers the supply nozzles, the standby area Moving one supply nozzle selected from the plurality of supply nozzles positioned on the substrate to supply the processing liquid to the substrate, and at this time, the other supply nozzles are waiting in the standby area It is characterized by the following. Regarding the supply of the processing liquid, for example, the supply nozzle is moved from one end to the other end of the substrate in a direction orthogonal to the longitudinal direction of the supply nozzle to supply the processing liquid to the substrate. The other supply nozzles do not move accompanying the supply nozzle, and there is no possibility that a liquid other than the target processing liquid to be supplied to the substrate will fall from the other supply nozzle onto the substrate surface. In addition, after using one supply nozzle, the processing liquid can be supplied by another supply nozzle without making the one supply nozzle stand by on the opposite side of the standby region with respect to the substrate, and an extra space is provided. There is no need to provide

The liquid processing apparatus is provided for exchanging a position between one supply nozzle and another supply nozzle located in a standby area allocated outside one end of a substrate held by a substrate holding unit. A configuration including a position changing mechanism may be employed. For example, by configuring the position changing mechanism so that the moving section and the elevating mechanism are shared, the space of the apparatus can be saved.

Further, in the liquid processing method according to the present invention, the step of horizontally holding the substrate on the substrate holding portion and the step of discharging the processing liquid over a length substantially equal to or longer than the width of the effective area of the substrate. Arranging a plurality of supply nozzles arranged in parallel to a standby area allocated outside one end of the substrate and waiting, and moving one supply nozzle of the standby area onto the substrate to apply the processing liquid to the substrate. Performing the supply and keeping the other supply nozzles in the standby area, and then returning the one supply nozzle to the standby area, and then replacing the substrate on the substrate holding unit with another substrate, Moving the supply nozzle onto the substrate to supply the processing liquid to the substrate.

In the above-mentioned liquid processing method, a step of changing the position between one supply nozzle and another supply nozzle before moving the other supply nozzle from one end to the other end of the substrate is added. You may.

[0017]

1 and 2 are views showing an embodiment in which a liquid processing apparatus according to the present invention is applied to a developing processing apparatus. In the figure, reference numeral 2 denotes a spin chuck which is a substrate holding unit which rotates horizontally around a vertical axis by vacuum-sucking the center of the back surface of the wafer W forming the substrate and holds it horizontally. It is configured to be able to rotate and move up and down.

Around the wafer W held by the spin chuck 3, for example, the sides and the lower side of the wafer W are surrounded so that the cleaning liquid and the developing solution do not scatter outside the apparatus when the wafer W is cleaned. A cup 32 is provided. A lower portion of the cup 32 is formed by a disk 33 surrounding the periphery of the spin chuck 3 and a liquid receiving portion 35 having a recess formed around the entire circumference of the disk 33 and having a drain port 34 formed on the bottom surface. An outer cup 36 whose lower side is formed in a cylindrical shape and whose upper side is formed in a rectangular cylindrical shape is fitted slightly inside the side surface of the liquid receiving portion 35 and straddles the upper level and the lower level of the wafer W. It surrounds the side of the wafer W. Further, between the outer cup 36 and the wafer W, there is provided a cylindrical inner cup 37 whose upper end is located at a height substantially equal to or lower than the surface level of the wafer W.
Is provided with a ring body 38 whose upper end approaches the back surface of the wafer W.

On the outside of the cup 32, guide rails, for example, a first guide rail 41 and a second guide rail 42, which are the same number of guide portions as the number of developer supply portions described later, are arranged in parallel along the X direction. It has been extended. The first guide rail 41 and the second guide rail 42 are provided with a first supply unit 5 and a second supply unit 6 extending in the Y direction so as to be guided respectively. Also, the first guide rail 4
In addition to the first supply unit 5, a cleaning nozzle 40 is also provided in 1 so as to be movable in the X direction.

The first supply unit 5 and the second supply unit 6 will be described with reference to FIGS. 3 and 4, but the first supply unit 5 and the second
Since the supply unit 6 has substantially the same structure as that of the first supply unit 5, the supply nozzle 52 having a large number of processing liquid discharge holes 51 arranged in the Y direction is suspended and supported. The arm unit 53 is configured to be movable along the first guide rail 41 by a driving unit (not shown) via a base unit 54 that is a moving unit. The supply nozzle 52
For example, it is necessary that the ejection holes 51 are arranged over a length equal to or longer than the width of the effective area (device formation area) of the wafer W. In this example, the ejection holes 51 are arranged over the diameter of the wafer W. Are arranged. The base section 54 has an elevating mechanism 56 constituted by, for example, a ball screw mechanism 55 and the like. The arm section 53 can be moved (up and down) in the Z direction by a driving force from a power source (not shown) such as a motor. .

The first supply unit 5 explained with reference to FIG.
6 is replaced with 61 to 66 in the second supply section 6. The height of the base section 64 is, for example, when the arm section 63 is raised to the highest position, It is set so that it can pass above the top and the lower end (discharge hole 61) of the supply nozzle 62 can pass through the top of the arm 53.

The belt cover 51 which slides in accordance with the movement of the base portions 54 and 64 is provided in the movement region of the base portions 54 and 64 in order to prevent the lower side of the region from being contaminated.
a, 52a are provided. The base 54 and the elevating mechanism constitute a position changing mechanism for changing the positions of the supply nozzles 52 and 62.

On the left side of the cup 32 in the drawing (outside one side of the square portion of the cup 32), the waiting area 7 of the first supply unit 5 and the second supply unit 6 is allocated. The waiting area 70 of the cleaning nozzle 40 is allocated to the side. The standby area 7 includes a vertically movable plate 71 and a plate 71.
The bus 7 is provided on the surface of the bus 7 and is configured such that the supply nozzles 52 and 62 of the first and second supply units 5 and 6 are fitted.
2, 73 are provided. When the supply nozzles 52 and 62 are fitted to the buses 72 and 73, a predetermined amount of an inert gas, for example, a nitrogen (N2) gas is supplied into the buses 72 and 73 from an inert gas supply source (not shown). By maintaining the inert gas atmosphere in each bath, the supply nozzles 52, 62
It is configured to suppress the deterioration of the developer stored in the inside. In FIG. 2, the plate 71 is in the raised position, and the buses 72 and 73 have the supply nozzles 5 of the first and second supply units.
2 and 62 show a state where they are fitted.

The driving unit 31, the first supply unit 5, the second supply unit 6, and the elevating unit 74 of the spin chuck 3 described above are connected to a control unit 75, respectively. It is possible to control each unit in cooperation so that the processing liquid is supplied (scanned) by the second supply unit 6 in accordance with the elevation of W. Also cup 3
2. The supply units 5, 6 and the cleaning nozzle 40 are box-shaped casings 76.
Are formed as one unit surrounded by the transfer arm, and the transfer of the wafer W is performed by a transfer arm (not shown). This will be described later.

Next, the operation of the present embodiment will be described with reference to FIGS. In the liquid processing apparatus according to the present embodiment, two types of supply units are selectively used to apply the developer according to the type of the developer. Here, the first supply unit 5 applies the developer to the wafer W. After that, the standby positions of the first supply unit 5 and the second supply unit 6 are switched in the standby area 7, and the second supply unit 6 is transferred to the next wafer W to be loaded next, for example. The description will be made by taking as an example the case where the developer is applied. For convenience of explanation, FIGS.
The supply nozzles 5 of the first and second supply units 5 and 6
The characters "1" and "2" are written in 2, 62, respectively.

First, the supply unit for applying the developing solution, that is, the first supply unit 5 is connected to the wafer W as shown by the solid line in FIG.
The supply nozzle 52 is fitted on the bus 73 on the side closer to the side, and the wafer W loaded by a transfer arm (not shown) is suction-held by the spin chuck 3 inside the cup 32. The first supply nozzle 52 is connected to the outer cup 3
6 and moves between the outer cup 36 and one end of the wafer W. At this time, the height of the first supply nozzle 52 is
Is set at the level where the developer is supplied to
The discharge hole 51 is placed at a position higher than the surface level of the wafer W by, for example, about 1 mm.

Thereafter, the first supply nozzle 52 starts discharging the developing solution while maintaining this height, and moves from one end of the wafer W to the other end as shown by the dotted line in FIG. A liquid film having a height of, for example, 1.2 mm is formed on the surface of W. The first supply nozzle 52 is moved by, for example, 10 cm so that the center of the discharge area where the discharge holes 51 of the supply nozzle 52 are arranged passes above the center of the wafer W.
/ Sec, the liquid film is formed almost uniformly over the entire surface of the wafer W.

Then, the first supply nozzle 52 stops supplying the developing solution at a position between the other end of the wafer W and the outer cup 36, and rises above the outer cup 36 to guide the guide to the guide rail 41. Then, it returns to the initial standby position and fits in the bus 73. When the static development time of the wafer W ends, the first supply nozzle 52 and the cleaning nozzle 40 are switched, and the cleaning nozzle 40 is positioned above the center of the wafer W.
And the spin chuck 3 rotates, and a cleaning liquid, for example, pure water is supplied from the cleaning nozzle 40 to the center of the wafer W, and the centrifugal force of the wafer W moves from the center to the periphery of the wafer W. Spreads out and the developer is washed away. Thereafter, the development process of the wafer W is completed through processes such as back surface cleaning and spin drying. Thereafter, for example, the wafer is replaced with another lot of wafers developed with a different developing solution.

On the other hand, in the standby area 7 outside the cup 32, the scanning by the second supply unit 6 is performed, so that the positions of the first supply nozzle 52 and the second supply nozzle 62 are exchanged to perform the second operation. Is moved to a position close to the wafer W.

Hereinafter, the movement of the first supply nozzle 52 and the second supply nozzle 62 will be described focusing on the positions of the supply nozzles 52 and 62. First, the plate portion 71 descends and the bus 7
3 and 72 are placed at a height where they do not touch (FIG. 6 (a)).

Next, the first supply nozzle 52 is lowered and the second supply nozzle 62 is raised by the elevating mechanism 56 of the base portions 54 and 64, and the positions in the X direction are interchanged at the same height ( In FIG. 6B, the position returns to the initial height at this position (FIG. 6C), and the positions of the supply nozzles 52 and 62 are switched. After that, the plate 71 rises to the original position,
Supply nozzles 52 and 62 fit into buses 72 and 73, respectively. FIGS. 1 and 2 described above show a state where the positions of the first supply unit 5 and the second supply unit 6 have been switched from the state shown in FIG. 5A. After that, the second
The scanning by the supply nozzle 62 is performed in the same manner. When the supply nozzle 52 and the supply nozzle 62 are switched again, the first supply nozzle 52 (the top of the arm portion 53) moves below the lower end of the second supply nozzle 62 and moves. The operation is performed in the reverse order of (c) → (b) → (a) to exchange the positions.

As described above, in the embodiment according to the present invention,
A plurality of supply nozzles, for example, two supply nozzles 52 and 62 are provided in accordance with the type of the processing liquid applied to the wafer used in each lot, for example, the developer. For example, only one supply nozzle 52 for supplying the target developer is provided. Since the upper part of the wafer is scanned and the other supply nozzles 62 are standing by in a standby area outside the wafer, when one supply nozzle scans over the wafer as in the related art, unnecessary supply There is no danger of the developer dropping onto the wafer, and uniformity of processing can be ensured.

The other supply nozzle 62 which does not supply the developing solution is provided in the standby area 7 provided outside the wafer.
, The concern that particles scattered above the wafer adhere to the wet discharge holes 61 of the supply nozzle 62 is reduced, and at the same time, the supply nozzle 62 is protected in an inert gas atmosphere. Supply nozzle 62
The deterioration of the developer stored in the vicinity of the discharge hole 61 can be suppressed.

Therefore, the discharge hole 61 of the other supply nozzle 62 in the standby state is protected by the bus 73, so that the discharge hole 6
It is possible to simultaneously prevent the particles from adhering to the substrate 1 and perform cleaning.

By the way, according to the present invention, each of the supply nozzles 52, 6
2A may be a liquid processing apparatus provided with a plurality of supply nozzles that can move independently and independently.
That is, in this device, the first supply nozzle 52 and the second supply nozzle 62 described in the present embodiment are provided on the common guide rail 43. In this configuration, when the supply of the developing solution by the first supply nozzle 52 is completed and the developing solution is supplied to the wafers of the next lot by using the second supply nozzle 62, FIG. At the right side of the end position of the second supply nozzle 62, the first supply nozzle 5
2 is required, and the size of the apparatus is larger than that of the above-described embodiment by the area S.

On the other hand, as shown in FIG. 7B, according to the above embodiment, each supply nozzle 52,
Since the positions 62 can be interchanged, the size of the device can be reduced by the area S.

In this embodiment, three or more supply units can be provided. This will be described with reference to FIG. 8, for example, in the apparatus shown in the present embodiment, the cup 3
A guide rail 44 is provided parallel to the other guide rails 41 and 42 at a position farthest from the second and the third guide rail 44 is connected thereto.
Are arranged in parallel with the first supply unit 5 and the second supply unit 6. The third supply unit 8 in this embodiment has a structure similar to that of the first supply unit 5 and the second supply unit 6, and includes a third supply nozzle 82. In this case, the third supply nozzle 82 is used to supply, for example, pre-wet water to the wafer W.

When the developing solution is directly supplied to the surface of the wafer W, the impact at the time of the collision generates microbubbles, which may float on the liquid film, which causes uneven development. The method of supplying the pre-wet water described above is, for example, when supplying the developing solution to the wafer W from the first supply nozzle 52, water is supplied in advance to the entire surface of the wafer W to form a water film, Thereby, the impact generated when the developer is supplied to the surface of the wafer W is reduced, and the generation of the microbubbles is suppressed.

In this embodiment, even if the number of supply units is three or more, the positions of the supply nozzles can be changed, for example, above the standby area. It is not necessary to secure a standby position for two supply nozzles at the other end of the supply nozzle 52 and the second supply nozzle 62 when the wafer W is viewed from the standby area 7. As shown in the present embodiment, in the case where the supply rails are provided by increasing the number of guide rails at positions far from the wafer W, the positions of the respective supply parts may be interchanged by, for example, the base of the supply part on the near side as viewed from the wafer W. The supply section on the back side is set higher so that the top can pass below the lower end (discharge hole) of the supply nozzle of the supply section on the back side.

Further, the present embodiment is not limited to the above-described configuration, and for example, it is possible to use the apparatus shown in FIGS. 9 (a) and 9 (b). In this apparatus, a first guide rail 41 and a second guide rail 42 are provided so as to oppose each other with a wafer W interposed therebetween.
, The first supply unit 5 and the second supply unit 6 move separately according to the type of the developer supplied to the wafer W.

According to such an embodiment, the developing process is performed using the selected supply nozzles (52, 62) without performing the step of replacing the supply units 5 and 6 on the standby area 7. be able to. In this case, the positions of the supply nozzles 52 and 62 may be switched.

The liquid processing apparatus according to the present embodiment may be applied not only to the developing process but also to the resist coating process.

Next, an example of a coating / developing apparatus in which the above-described developing apparatus is incorporated in a unit will be described with reference to FIGS.
1 will be described. 10 and 11, reference numeral 9 denotes a loading / unloading stage for loading / unloading a wafer cassette. For example, a cassette C containing 25 sheets is placed by an automatic transfer robot, for example. A transfer arm 90 for the wafer W is provided in a region facing the loading / unloading stage 9 so as to be freely rotatable in X, Y directions and θ (rotation about a vertical axis). Further, behind the transfer arm 90, a coating / developing unit u1 is located on the right side, for example, as viewed from the loading / unloading stage 9, and heating / cooling is located on the left, front and rear sides. System units u2, u3, and u4 are arranged, respectively, and for transferring a wafer W between a coating / developing system unit and a heating / cooling system unit, for example, can be moved up and down, left and right, and can move back and forth. A wafer transfer arm MA rotatably arranged about a vertical axis is provided. However, in FIG. 10, the unit u2 and the wafer transfer arm MA are not drawn for convenience.

In the unit of the coating / developing system, for example, a developing unit 91 provided with the above-described two developing devices is provided in an upper stage, and two coating units 92 are provided in a lower stage. In a heating / cooling system unit, a heating unit, a cooling unit, a hydrophobizing unit, and the like are provided above and below.

If the above-mentioned portion including the coating / developing system unit and the heating / cooling system unit is called a clean track, an exposure apparatus is provided through the interface unit 100 on the back side of the clean track. 101 is connected. The interface unit 100 transfers a wafer W between a clean track and the exposure apparatus 101 by a wafer transfer arm 102 configured to be movable up and down, movable left and right, back and forth, and rotatable about a vertical axis. Is what you do.

The wafer flow of this apparatus will be described. First, a wafer cassette C containing a wafer W is loaded into the loading / unloading stage 9 from the outside, and the wafer transfer arm is moved.
The wafer W is taken out of the cassette C by the
The wafer is transferred to the wafer transfer arm MA via a transfer table which is one of the shelves of the heating / cooling unit u3. Next, after a hydrophobic treatment is performed in the processing section of one shelf of the unit u3, a resist liquid is applied by the coating unit 92 to form a resist film. After being heated by the heating unit, the wafer W coated with the resist film is sent to the exposure apparatus 101 via the interface unit 100, where exposure is performed via a mask corresponding to the pattern.

Thereafter, the wafer W is heated by the heating unit and then cooled by the cooling unit.
The resist film is sent to the developing device 1 and subjected to a development process, thereby forming a resist mask. Thereafter, the wafer W is returned to the cassette C on the loading / unloading stage 9.

[0048]

As described above, according to the present invention, since there is no possibility that unnecessary dripping will occur on the substrate surface, a highly uniform treatment can be performed with the treatment liquid. Further, after returning one supply nozzle to the standby area, the other supply nozzle can be moved to the wafer side, so that the apparatus can be downsized.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a liquid processing apparatus according to the present invention.

FIG. 2 is a sectional view showing one embodiment of the liquid processing apparatus.

FIG. 3 is a side view showing a supply unit of the liquid processing apparatus.

FIG. 4 is a perspective view showing an arrangement of a supply unit and a guide rail of the liquid processing apparatus.

FIG. 5 is an explanatory diagram showing an operation of the liquid processing apparatus.

FIG. 6 is an explanatory diagram showing an operation of the liquid processing apparatus.

FIG. 7 is a plan view showing a comparison between one embodiment of the present invention and another embodiment.

FIG. 8 is a plan view showing still another embodiment of the liquid processing apparatus.

FIG. 9 is an explanatory view showing still another embodiment of the liquid processing apparatus.

FIG. 10 is a perspective view showing an example of a coating / developing apparatus incorporating the liquid processing apparatus.

FIG. 11 is a plan view showing an example of a coating / developing apparatus incorporating the liquid processing apparatus.

FIG. 12 is an explanatory diagram illustrating an example of a conventional liquid processing apparatus.

FIG. 13 is an explanatory view showing another example of the conventional liquid processing apparatus.

FIG. 14 is an explanatory view showing still another example of the conventional liquid processing apparatus.

[Explanation of symbols]

 W Wafer 3 Spin chuck 32 Cup 40 Cleaning nozzle 41 First guide rail 42 Second guide rail 5 First supply section 6 Second supply section 7, 70 Standby area 71 Plate section 72, 73 Bus 74 Elevating section 75 Control unit 76 Housing 8 Third supply unit

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H096 AA25 AA27 GA02 GA29 GA30 GA31 4D075 AC64 AC79 AC84 DA08 DC22 EA45 4F041 AA06 AB01 BA05 BA13 BA22 BA34 4F042 AA07 EB18 5F046 LA03 LA04

Claims (8)

[Claims] A substrate holding portion for holding a substrate horizontally; and a plurality of supply nozzles having processing liquid discharge holes arranged over a length substantially equal to or longer than an effective area of the substrate. A plurality of guide portions for respectively guiding the plurality of supply nozzles between a substrate and a standby area allocated outside one end of the substrate held by the substrate holding portion; and the plurality of supply nozzles. A plurality of moving parts that are respectively held and independently moved along each guide part, and an elevating mechanism that elevates the supply nozzle, and are selected from the plurality of supply nozzles located in the standby area. A liquid processing apparatus, wherein one supply nozzle is moved onto a substrate to supply a processing liquid to the substrate, and at this time, another supply nozzle stands by in the standby area. 2. A position change mechanism for changing the position between one supply nozzle and another supply nozzle located in a standby area allocated outside one end of a substrate held by a substrate holding unit. The liquid processing apparatus according to claim 1, further comprising: 3. The liquid processing apparatus according to claim 1, wherein the lifting mechanism is provided in the moving unit. 4. The liquid processing apparatus according to claim 2, wherein the position changing mechanism is used by both the moving part and the elevating mechanism. 5. The method according to claim 1, wherein the supply nozzle is moved from one end to the other end of the substrate in a direction perpendicular to the longitudinal direction of the supply nozzle to supply the processing liquid to the substrate. The liquid processing apparatus according to any one of the above. 6. A step of horizontally holding a substrate on a substrate holding part, and a step of forming a plurality of supply nozzles having processing liquid ejection holes arranged over a length substantially equal to or longer than an effective area of the substrate. A step of arranging in parallel with a standby area allocated outside one end of the substrate and waiting, and moving one supply nozzle of the standby area onto the substrate to supply a processing liquid to the substrate and another supply nozzle Is a process in which a standby area is kept in a standby area, and then the one supply nozzle is returned to the standby area, and thereafter, after replacing the substrate on the substrate holding unit with another substrate,
Moving the other supply nozzle over the substrate to supply the processing liquid to the substrate. 7. The liquid processing method according to claim 6, wherein a step of exchanging a position between one supply nozzle and another supply nozzle is performed before moving another supply nozzle onto the substrate. 8. The processing liquid is supplied to the substrate by moving the supply nozzle from one end to the other end of the substrate in a direction perpendicular to the longitudinal direction of the supply nozzle. Liquid treatment method.