JP2001010595A - Cooling system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling system for an electronic apparatus on board an aircraft easy in maintenance of a vapor cycle cooling system(VCS). SOLUTION: A skin heat exchanger 3 mounted on an outer shell 3a of a pod on board an aircraft takes in cold outside air to cool a refrigerant such as ethylene glycol inside thereof. The refrigerant is circulated by a circulation pump 1, and heat-exchanged to the refrigerant by a skin condenser 5 of the vapor cycle cooling system(VCS). The refrigerant for an electronic apparatus is cooled by an evaporator 9 of the cooling cycle of the VCS, and fed to the electronic apparatus 13 by the circulation pump 2. The electronic apparatus is cooled thereby.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling system for an aircraft, and more particularly, to cooling electronic equipment housed inside a pod mounted on an aircraft.

[0002]

2. Description of the Related Art Electronic equipment in a pod mounted on an aircraft is cooled by using a refrigerant, for example, an alternative Freon or the like, by using a compressor (compressor), a condenser (condenser), a receiver (liquid receiver), and expansion. A vapor cycle cooling system (hereinafter referred to as VC) for a refrigeration cycle comprising a valve and an evaporator (evaporator).
S). FIG. 4 shows a control block diagram in which the electronic device 13 mounted on the aircraft is cooled by VCS. The cold air of the outside air touches the aircraft pod skin 5a, and the cool air is transmitted to the skin condenser 5 from the pod skin 5a. The high-temperature and high-pressure vapor-state refrigerant compressed by the compressor 6 enters the skin condenser 5, takes heat from the surroundings, condenses, becomes a liquid, flows into the tank of the receiver 7, and is stored. The refrigerant from the receiver 7 is adiabatically expanded by the expansion valve 8 to have a low pressure, enters the evaporator coil of the evaporator 9, takes heat from the surroundings, and turns into steam. The vaporized refrigerant is sucked into the compressor 6 from the cooling coil. Then it is compressed until it condenses. The cooling liquid for cooling the electronic device 13 is exchanged with heat by the evaporator 9 of the refrigeration cycle, and the cooling liquid is circulated by the circulation pump 2 to cool the electronic device 13. FIG. 5 shows a control block diagram in which the electronic device 13 in the pod of the aircraft is cooled separately by the low-temperature electronic device 13a and the high-temperature electronic device 13b. In this case, the coolant that has undergone heat exchange by the evaporator 9 of the VCS is first sent to the low-temperature electronic device 13a, and the high-temperature electronic device 13b is cooled by the residual hot air. This cooling sequence enhances the thermal efficiency.

[0003]

The conventional cooling system is constructed as described above. However, when the outside air temperature of the aircraft is low, the low-temperature heat transmitted from the pod outer plate 5a to the skin condenser 5 is not used. 5, the condensing pressure of the skin condenser 5 decreases, the flow rate of the refrigerant from the expansion valve 8 via the receiver 7 does not reach the predetermined flow rate, and the cooling capacity is insufficient. There is. In addition, a skin capacitor 5 to be attached to an outer plate such as an aircraft pod, and other VCS
In order to directly connect, refrigerant must be collected or filled when installing or removing the equipment. Further, after being stored in a pod or the like mounted on an aircraft, it is necessary to connect the skin condenser 5 and another cooling system, and thus there is a problem that leakage of refrigerant is likely to occur. In addition, since the required temperature of the coolant differs depending on the electronic devices 13, all the electronic devices 13
Cooling with CS increases power consumption, and
There is a problem that the size of the cooling device also increases.

The present invention has been made in view of such circumstances, and when the outside air temperature is low, the temperature of the skin capacitor 5 of the VCS is prevented from being excessively lowered, and the outside air temperature is effectively used. In addition, on the outer skin of aircraft pods,
There is no need to collect or fill refrigerant such as chlorofluorocarbon instead of VCS when installing or removing the equipment, and it is also necessary to cool the low-temperature electronic equipment 13a and the high-temperature electronic equipment 1
An object of the present invention is to provide a cooling system capable of effectively and efficiently cooling 3b.

[0005]

In order to achieve the above object, a cooling system according to the present invention uses a refrigerant to cool electronic equipment in a pod mounted on an aircraft using a compressor, a skin condenser, a receiver, an expansion valve, and an evaporator. When the outside air temperature is low in the vapor cycle cooling system that cools with the system consisting of, the cooling liquid that has been heat-exchanged by the skin heat exchanger cooled by the flow of the outside air is used directly without using the vapor cycle cooling system. Cooling the electronic device, when the outside air temperature is high, stop cooling the electronic device directly by the coolant, the coolant exchanges heat with the refrigerant in the skin condenser of the vapor cycle cooling system,
The cooling system exchanges heat with a cooling liquid for cooling the electronic device by an evaporator, and includes a system for cooling the electronic device with the cooling liquid.

Further, in the second cooling system, the cooling liquid exchanged by the skin heat exchanger cooled by the flow of the outside air exchanges heat with the refrigerant by the skin condenser of the vapor cycle cooling system. The system includes a system in which the refrigerant exchanges heat with a cooling liquid for cooling the electronic device by an evaporator, and the electronic device is cooled by the cooling liquid.

In a third cooling system, a high-temperature electronic device capable of cooling at a high temperature is directly cooled by a cooling liquid heat-exchanged by a skin heat exchanger cooled by a flow of outside air. The coolant exchanges heat with a coolant in a skin condenser of the vapor cycle cooling system, and the coolant exchanges heat with a coolant that cools a low-temperature electronic device by an evaporator. The system includes two high-temperature / low-temperature systems for cooling electronic devices.

[0008] The cooling system of the present invention is configured as described above. Instead of using a skin condenser, a skin heat exchanger is used, the outside air temperature is low, and the temperature of the coolant cooled by the skin heat exchanger is reduced. When lowering, the cooling device directly cools the electronic device. Therefore, even when the outside air temperature is low,
Sufficient cooling capacity is obtained. Furthermore, even if the VCS fails, a direct cooling provides a certain cooling capacity and increases redundancy. Further, a skin heat exchanger is used in place of the VCS skin condenser, a coolant such as ethylene glycol is cooled by the skin heat exchanger, and the VCS skin condenser is cooled by the coolant. Therefore VC
It is possible to package S inside the pod,
It is not necessary to collect and charge the refrigerant, and maintenance becomes easy. Further, the structure is such that the refrigerant hardly leaks. Further, among electronic devices, those which may be cooled at a relatively high cooling temperature directly cool the electronic device with a cooling liquid. Therefore, the heat load of the electronic equipment that needs to be cooled by the VCS is reduced, and a cooling system with high thermal efficiency as a whole is obtained.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a cooling system according to the present invention will be described with reference to FIG. FIG. 1 shows that when the outside air temperature is high, the coolant of the skin heat exchanger 3 cooled by the outside air is heat-exchanged to the coolant by the VCS skin condenser 5 and the coolant is heat-exchanged from the coolant by the VCS evaporator 9. 2 shows a system having two systems, a system circuit for cooling the electronic device 13 and a system circuit for directly cooling the electronic device 13 with a cooling liquid when the outside air temperature is low. That is,
The system comprises a circulation loop A in which the coolant of the skin heat exchanger 3 circulates through the skin condenser 5 of the VCS,
A circulation loop B using the CS refrigerant, a circulation loop C for cooling the electronic device 13 with the coolant indirectly via the VCS evaporator 9, or a coolant for the skin heat exchanger 3 directly cools the electronic device 13. And a circulating loop D. Circulation loop A of the cooling cycle, the aircraft pod skin 3a is cooled by the temperature of the outside air, and the heat is transferred to the skin heat exchanger 3 attached to the pod skin 3a. The coolant filled in the cooling cycle tube of the skin heat exchanger 3, for example, a coolant such as ethylene glycol, is cooled by cold heat from the pod outer plate 3a.
The cooled coolant passes through a valve 4 and is introduced into a skin condenser 5 of the VCS, where it exchanges heat with a coolant of the VCS and loses heat, and is again introduced into the skin heat exchanger 3 by the circulation pump 1. That is, the circulation loop A transfers the cool air of the outside air from the skin heat exchanger 3 to the VCS skin condenser 5.
To communicate. Cooling cycle circulation loop B
Is a vapor cycle cooling system using a refrigerant, for example, an alternative Freon, in which high-temperature and high-pressure vapor-like refrigerant compressed by the compressor 6 enters the skin condenser 5, and the skin condenser 5 surrounds the coolant around the circulation loop A. The heat is removed from the receiver and condensed into a liquid, and the receiver 7
Flows into the tank and is stored. The refrigerant from the receiver 7 is adiabatically expanded by the expansion valve 8 to have a low pressure, enters the evaporator coil of the evaporator 9, takes heat from the surroundings, and turns into steam. The vaporized refrigerant is sucked into the compressor 6 from the cooling coil. Then it is compressed until it condenses. The circulation cycle C of the cooling cycle includes the evaporator 9 of the VCS.
The cooling liquid cooled by the electronic device 1 passes through the valve 10.
Cool 3 Then, the cooling liquid is again introduced into the evaporator 9 by the circulation pump 2. When the temperature of the outside air is low, the circulation loop D of the cooling cycle
Without using the circulation loop B and the circulation loop C, the electronic device 13 is directly cooled by the coolant of the skin heat exchanger 3, and the valves 4 and 10 are closed, and the valves 11 and 12 are opened. The circulating pump 1 circulates a cooling liquid, for example, a cooling liquid such as ethylene glycol. The operating state of each unit when operating the cooling system is controlled as follows. When the outside air temperature is high, the circulation pump 1
Is ON, the circulation pump 2 is ON, the compressor 6 is ON,
The valve 4 is opened, the valve 11 is closed, the valve 12 is closed, and the valve 10 is opened. If the outside air temperature is low,
The circulation pump 1 is turned on, the circulation pump 2 is turned off, the compressor is turned off, the valve 4 is closed, the valve 11 is open, the valve 12 is open, and the valve 10 is closed. In the above embodiment, when the outside air temperature is low, only the circulation loop D is operated to directly cool the electronic device 13, and when the outside air temperature is high, the circulation loop A, the circulation loop B, and the circulation loop C are used.
The electronic device 13 can be efficiently cooled even when the outside air temperature is low. Furthermore, V
Even if the CS fails, a certain cooling capacity can be obtained by directly cooling the electronic device 13, and the redundancy increases.

Next, another embodiment of the cooling system of the present invention will be described with reference to FIG. FIG. 2 shows a cooling fluid in which the coolant of the skin heat exchanger 3 cooled by the outside air exchanges heat with the refrigerant in the skin condenser 5 of the VCS, and the heat exchange of the coolant with the evaporator 9 of the VCS.
1 shows a cooling system. In other words, the system indirectly cools through the circulation loop A in which the coolant of the skin heat exchanger 3 circulates through the VCS skin condenser 5, the circulation loop B using the VCS refrigerant, and the VCS evaporator 9. It is constituted by a circulation loop C for cooling the electronic device 13 with a liquid. This embodiment operates the circulation loop A, the circulation loop B, and the circulation loop C to cool the electronic device regardless of the external temperature, and does not directly attach the VCS to the aircraft pod. VCS because it can be packaged in the aircraft pod
When attaching or detaching the refrigerant, collection and filling of the refrigerant becomes unnecessary, and maintenance becomes easy. Further, a structure in which the refrigerant does not easily leak can be provided.

Further, another embodiment of the cooling system of the present invention will be described with reference to FIG. FIG. 3 is a cooling liquid in which the coolant of the skin heat exchanger 3 cooled by the outside air is heat-exchanged to the refrigerant by the skin condenser 5 of the VCS, and the heat is exchanged from the refrigerant by the evaporator 9 of the VCS. And a system circuit for cooling the high-temperature electronic device 13b with a direct coolant. In other words, the system indirectly cools through the circulation loop A in which the coolant of the skin heat exchanger 3 circulates through the VCS skin condenser 5, the circulation loop B using the VCS refrigerant, and the VCS evaporator 9. Circulation loop Ca for cooling low-temperature electronic device 13a with liquid
Or a circulation loop Da in which the coolant of the skin heat exchanger 3 directly cools the high-temperature electronic device 13b. In this embodiment, the low-temperature electronic device 13a is cooled by the circulation loop A, the circulation loop B, and the circulation loop Ca,
At the same time, the high-temperature electronic device 13b
To cool. The circulation loop Ca is configured such that the circulation loop C cools only the low-temperature electronic device 13a,
On the other hand, the circulation loop Da is such that the circulation loop D cools only the high-temperature electronic device 13b. Since the high-temperature electronic device 13b of the electronic devices 13 is directly cooled by the coolant, the heat load of the high-temperature electronic device 13a that needs to be cooled by the VCS is reduced. Therefore, power consumption is reduced. Then, the VCS can be downsized.

In the embodiment of FIG. 1, when the outside air temperature is low, the method of cooling the electronic device 13 with the cooling liquid from the skin heat exchanger 3 is not limited to FIG. A method may be used in which the circulation pump 1 is provided at the point P and the circulation pump 2 is provided at the point Q, and the circulation pump 1 is stopped and the circulation pump 2 is operated.

[0013]

The cooling system of the present invention is configured as described above. Instead of attaching a VCS skin condenser using a refrigerant to an aircraft pod, a skin heat exchanger using a coolant such as ethylene glycol is used. The electronic equipment is cooled with the cooled coolant from the VCS skin condenser through the evaporator with the cooled coolant. This allows the VCS to be packaged in an aircraft pod,
At the time of removal, collection and filling of the refrigerant becomes unnecessary, and maintenance becomes easy. Further, a structure in which the refrigerant does not easily leak can be provided. Also, if the outside air temperature is low,
Since the electronic device can be directly cooled by the cooling liquid, a sufficient cooling capacity can be obtained. Furthermore, even if the VCS fails, a direct cooling provides a certain cooling capacity and increases redundancy. Separately, the cooling circuits for the high-temperature electronic equipment and the low-temperature electronic equipment are separated, and the high-temperature electronic equipment is cooled directly with the coolant from the skin heat exchanger.
Having a system that can be cooled via VCS reduces the heat load that needs to be cooled by VCS.
Therefore, power consumption is reduced. Further, the VCS can be downsized.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a cooling system of the present invention.

FIG. 2 is a diagram showing another embodiment of the cooling system of the present invention.

FIG. 3 is a diagram showing another embodiment of the cooling system of the present invention.

FIG. 4 is a diagram showing a conventional cooling system.

FIG. 5 is a view showing another conventional cooling system.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circulation pump 2 ... Circulation pump 3 ... Skin heat exchanger 3a ... Pod outer plate 4 ... Valve 5 ... Skin condenser 5a ... Pod outer plate 6 ... Compressor 7 ... Receiver 8 ... Expansion valve 9 ... Evaporator 10 ... Valve 11 ... Valve 12 ... Valve 13 ... Electronic equipment 13a ... Electronic equipment for low temperature 13b ... Electronic equipment for high temperature

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazufumi Otono 1-term, Kuwabaracho, Nishinokyo, Nakagyo-ku, Kyoto F-term in Shimadzu Corporation 5E322 AA05 AA11 DA01 DA02 EA11 FA01

Claims (3)

[Claims] In a vapor cycle cooling system for cooling an electronic device in a pod mounted on an aircraft by a system including a compressor, a skin condenser, a receiver, an expansion valve, and an evaporator using a refrigerant, when an outside air temperature is low, The cooling liquid exchanged by the skin heat exchanger cooled by the flow of the outside air directly cools the electronic device without using the vapor cycle cooling system, and when the outside air temperature is high, the direct liquid by the cooling liquid is cooled. The cooling of the equipment is stopped, and the cooling liquid exchanges heat with the refrigerant in the skin condenser of the vapor cycle cooling system, and the refrigerant exchanges heat with the cooling liquid for cooling the electronic equipment by the evaporator, and cools the electronic equipment with the cooling liquid. A cooling system. 2. A vapor cycle cooling system in which electronic equipment in a pod mounted on an aircraft is cooled by a system including a compressor, a skin condenser, a receiver, an expansion valve, and an evaporator using a refrigerant. The coolant exchanged in the skin heat exchanger exchanges heat with a refrigerant in the skin condenser of the vapor cycle cooling system, and the refrigerant exchanges heat with a coolant that cools an electronic device by an evaporator. A cooling system characterized by cooling equipment. 3. A vapor cycle cooling system that cools electronic equipment in a pod mounted on an aircraft by a system including a compressor, a skin condenser, a receiver, an expansion valve, and an evaporator using a refrigerant, and is cooled by a flow of outside air. The cooling liquid that has been heat-exchanged in the skin heat exchanger directly cools the high-temperature electronic equipment that can be cooled at a high temperature, and at the same time, the cooling liquid exchanges heat with the refrigerant in the skin condenser of the vapor cycle cooling system. The refrigerant exchanges heat with a cooling liquid that cools the low-temperature electronic device by an evaporator, and the cooling liquid cools the low-temperature electronic device that can be cooled at a low temperature. Cooling system.