CN108834378A - A kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water - Google Patents
A kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water Download PDFInfo
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- CN108834378A CN108834378A CN201810855063.3A CN201810855063A CN108834378A CN 108834378 A CN108834378 A CN 108834378A CN 201810855063 A CN201810855063 A CN 201810855063A CN 108834378 A CN108834378 A CN 108834378A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 238000001816 cooling Methods 0.000 title claims abstract description 84
- 239000007921 spray Substances 0.000 title claims abstract description 25
- 210000004243 sweat Anatomy 0.000 title claims abstract description 19
- 239000012782 phase change material Substances 0.000 claims abstract description 96
- 239000003507 refrigerant Substances 0.000 claims abstract description 40
- 239000000498 cooling water Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 17
- 238000005507 spraying Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000009466 transformation Effects 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000000889 atomisation Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims 1
- 230000005494 condensation Effects 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000004146 energy storage Methods 0.000 abstract 1
- 230000002045 lasting effect Effects 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
Abstract
The invention discloses a kind of airborne spray cooling systems using ram-air and sweat cooling circulating cooling recirculated water, belong to airborne high heat flux density equipment cooling field.The present invention mainly for solve the high heat flux densities such as airborne radar chip and laser weapon surface lasting heat dissipation problem.It mainly include water tank, compressor, evaporator, cold water inlet, cooling water outlet, refrigerant inlet, refrigerant outlet, phase-change material, expansion valve, condenser, phase change material heat exchanger, ram-air entrance, spray chamber, surface to be cooled, nozzle, flowmeter, flow control valve and water pump.The present invention carries out misting cooling to high-temperature electronic equipment surface using the latent heat of vaporization of water in spray chamber, use ram-air as major refrigeration, use sweat cooling circulation as auxiliary cold source, corresponding two kinds of cold sources using two groups of phase-change materials as intermediate energy storage medium, select cold source combination according to surface temperature.The system operational safety stabilizing energy-saving, meets the cooling requirement under airborne complex environment.
Description
Technical field
The present invention relates to a kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water,
Belong to airborne high heat flux density Electronic cooling field.
Background technique
With the rapid development of airborne radar technology, power amplifier chips have developed to the 3rd generation half from silicon chip, GaAs chip
Conductor GaN chip.The some projects of USN and air force are shown, have reached 500W/cm in the GaN chip heat flow density ground2, not
The heat flow density for carrying out chip will be more than 1000W/cm2.Simultaneously with to military aircraft mobility, Stealth Fighter, defending performance
It is required that continuous improvement, high power laser light technology, electronic component it is highly integrated with micromation etc. technologies is rapidly developed.Swash
Light weapon can generate the heat of MW class within several seconds of T-time, its surface is caused to generate hundreds if not thousands of W/cm2Heat
Current density.If not adopting an effective measure reduces radar chip and laser weapon surface temperature, gently if substantially reduce its work effect
Rate, it is heavy then burn electronic device, influence flight safety.
Therefore, how efficiently and safely to solve the problems, such as that the rapid cooling of radar chip and airborne equipment has important research
Meaning.Conventional air-cooled and water-cooling pattern exchange capability of heat has reached the limit, is unable to satisfy the heat dissipation of increasing electronic equipment
Demand.
Misting cooling is that cooling medium is decomposed into countless discrete type droplets by atomization, is sprayed onto heating surface
A kind of novel cooling manner of heat is taken away by single-phase heat exchange and two-phase heat exchange.Spray cooling is in the cooling neck of airborne equipment
Domain has very strong application prospect.
Existing partial monopoly proposes misting cooling in the application method in airborne field, such as patent ZL201510072716.7
A kind of cooling system of airborne heater element based on air swell refrigeration is proposed, is mainly characterized by using turbine as refrigeration
Device and power source can must carry out misting cooling using turbine cold-storage first when the program comes into operation, and cool-storage time is long,
It can not come into operation at any time；Structure is complicated and the device space is big, difficult to install on military aircraft.Patent
ZL201510072716.7 proposes a kind of cooling system of airborne heater element based on air swell refrigeration, is mainly characterized by
Use turbine as refrigeration device and power source, cold source is provided by turbine completely in the program, increases the original turbine system of aircraft
The load of cooling system, it is unfavorable for the operation steadily in the long term of aircraft.
The ram-air that aircraft introduces when operating normally, natural cold source is provided for spray cooling system；If punching press is empty
Air cooling amount is inadequate, and addition auxiliary cold source may be selected.The present invention devises ram-air and recycles the recirculated water combined with sweat cooling
The type of cooling, and punching can be still stored when spray cooling device does not work as intermediate medium using two groups of phase-change materials
Press air and sweat cooling circulation provide cooling capacity, when surface to be cooled need to cool down, according to its temperature change determine two groups it is cold
The combination in source.Using the invention enables misting cooling media can be recycled, and sufficient cooling capacity ensure that misting cooling
Heat exchange efficiency.
Summary of the invention
The airborne spraying of ram-air and sweat cooling circulating cooling recirculated water is used the object of the present invention is to provide a kind of
Cooling system, by extraneous ram-air natural cooling source in conjunction with sweat cooling circulation cold source, using two groups of phase-change materials as centre
Medium changes according to airborne equipment surface temperature and chooses phase-change material combination.The present invention facilitate push phase-change accumulation energy and
Application of the high efficient heat exchanging technology in airborne equipment cooling field.
System mainly includes water tank (1), compressor (2), evaporator (3), the first shut-off valve (4-1), the second shut-off valve (4-
2), third shut-off valve (4-3), the 4th shut-off valve (4-4), the 5th shut-off valve (4-5), expansion valve (5), condenser (6), phase transformation material
Expect heat exchanger (7), ram-air entrance (8), spray chamber (9), surface to be cooled (10), nozzle (11), flowmeter (12), flow
Regulating valve (13), water pump (14).
Wherein, evaporator (3) has cold water inlet (3-1), cooling water outlet (3-2), refrigerant inlet (3-3), refrigerant
It exports (3-4), is inside evaporator (3) phase-change material (3-5)；Phase change material heat exchanger (7) has cold air inlet (7-1), cold
Gas exports (7-2), cold water inlet (7-3), cooling water outlet (7-4), is phase-change material (7-5) inside phase change material heat exchanger (7)；
Condenser (6) has cold air inlet, cold air outlet, refrigerant inlet, refrigerant outlet.
The outlet of water tank (1) is connected with the entrance of water pump (14), the outlet of water pump (14) and entering for flow control valve (13)
Mouth is connected, and the outlet of flow control valve (13) is connected with the entrance of the 5th shut-off valve (4-5), the outlet of the 5th shut-off valve (4-5)
It is connected with the entrance of flowmeter (12), the outlet of flowmeter (12) is connected through the entrance of spray chamber (9) with the entrance of nozzle (11),
The outlet of nozzle (11) is located at the top on surface to be cooled (10), the outlet of spray chamber (9) respectively with third shut-off valve (4-3)
The entrance of entrance and the 4th shut-off valve (4-4) is connected, and the outlet of the 4th shut-off valve (4-4) is cold with phase change material heat exchanger (7)
Water inlet (7-3) be connected, the outlet of third shut-off valve (4-3) respectively with the entrance and the second shut-off valve of the first shut-off valve (4-1)
The entrance of (4-2) is connected, the cooling water outlet (7-4) of phase change material heat exchanger (7) respectively with the entrance of the first shut-off valve (4-1) and
The entrance of second shut-off valve (4-2) is connected, the outlet and cold water inlet (3-1) phase of evaporator (3) of the second shut-off valve (4-2)
Even, the outlet of the first shut-off valve (4-1) is connected with the cold water inlet of water tank (1), the cooling water outlet (3-2) and water of evaporator (3)
The cold water inlet of case (1) is connected.
Ram-air entrance (8) is connected with the cold air inlet (7-1) of phase change material heat exchanger (7), phase change material heat exchanger
(7) cold air outlet (7-2) is connected with the cold air inlet of condenser (6), cold air outlet and the external environment phase of condenser (6)
Even.
The refrigerant outlet of condenser (6) is connected with the entrance of expansion valve (5), the outlet and evaporator (3) of expansion valve (5)
Refrigerant inlet (3-3) be connected, the refrigerant outlet (3-4) of evaporator (3) is connected with the entrance of compressor (2), compressor
(2) outlet is connected with the refrigerant inlet of condenser (6).
A kind of airborne misting cooling system using ram-air and sweat cooling circulating cooling recirculated water provided by the invention
System, when operation include following procedure：
Ram-air heat transfer process：The extraneous stamped air intake of low temperature ram-air (8) enters phase change material heat exchanger
(7) it in, exchanges heat in phase change material heat exchanger (7) with phase-change material (7-5), ram-air is after phase change material heat exchanger (7)
Temperature increases, and into condenser (6), with refrigerant heat exchanger in condenser (6), temperature increases once again becomes hot-air, heat
Air flows into external environment, and phase-change material (7-5) becomes solid-state storage cooling capacity.
Refrigerant circulating process：Refrigerant enters in condenser (6) through compressor (2), empty with punching press in condenser (6)
Gas heat exchange, refrigerant through condenser (6), expansion valve (5) enter evaporator (3), in evaporator (3) with phase-change material (3-5)
Heat exchange, refrigerant enters compressor (2) and completes to recycle after the completion of heat exchange, and phase-change material (3-5) becomes solid-state storage cooling capacity.
Misting cooling process：The quantitative water of storage in water tank (1), when system is run, when surface to be cooled (10), temperature is big
In 80 DEG C, when needing largely to radiate, water pump (14), the second shut-off valve (4-2), the 4th shut-off valve (4-4) and the 5th cut-off are opened
Valve (4-5) closes the first shut-off valve (4-1), third shut-off valve (4-3), and cold water is adjusted through water pump (14), flow in water tank (1)
Valve (13), the 5th shut-off valve (4-5) and flowmeter (12) flow nozzle (11) afterwards, in nozzle (11) after atomization injection to cold
But surface (10) reduce the temperature of surface to be cooled (10), and the hot water after the completion of exchanging heat flows into phase transformation through the outlet of spray chamber (9)
It in heat exchanger (7), exchanges heat and cools down with phase-change material (7-5) in phase change material heat exchanger (7), cooling water is through the second cut-off
Valve (4-2) flows into evaporator (3), cools down again in evaporator (3) with phase-change material (3-5) heat exchange, the cooling after cooling
Water flows into water tank (1) and completes circulation.
When surface to be cooled (10) temperature is less than 80 DEG C, when needing proper heat reduction, water pump (14), the first shut-off valve are opened
(4-1), the 4th shut-off valve (4-4) and the 5th shut-off valve (4-5) close the second shut-off valve (4-2), third shut-off valve (4-3), water
Cold water flow nozzle after water pump (14), flow control valve (13), the 5th shut-off valve (4-5) and flowmeter (12) in case (1)
(11), injection reduces the temperature of surface to be cooled (10), heat exchange is completed to surface to be cooled (10) after atomization in nozzle (11)
Hot water afterwards through the 4th shut-off valve (4-4) flow into phase change material heat exchanger (7) in, in phase change material heat exchanger (7) with phase transformation
Material (7-5) heat exchange cooling becomes cooling water, and cooling water flows into water tank (1) through the first shut-off valve (4-1) and completes circulation.
Phase-change material process of cool：Misting cooling without when, close the 4th shut-off valve (4-4), phase-change material (7-5) with
Become low temperature solid-state, phase-change material (7-5) cold-storage after ram-air heat exchange；Close the second shut-off valve (4-2), phase-change material (3-
5) and become low temperature solid-state, phase-change material (3-5) cold-storage after refrigerant heat exchanger.
Nozzle (11) and surface to be cooled (10), which are all closed, to be mounted in spray chamber (9).
Phase-change material (3-5) and phase-change material (7-5) are Organic-inorganic composite phase-change material for cold storage.
Condenser (6) is plate heat exchanger.
Refrigerant is R22, R134a or R407C.
Phase-change material (3-5) and phase-change material (7-5) original state are liquid, are solid-states after cold-storage.
Detailed description of the invention
Attached drawing 1 is the principle of the present invention figure；
Label title in attached drawing 1：1. water tank, 2. compressors, 3. evaporators, the first shut-off valve of 4-1., 4-2. second are cut
Only valve, 4-3. third shut-off valve, the 4th shut-off valve of 4-4., the 5th shut-off valve of 4-5., 5. expansion valves, 6. condensers, 7. phase transformation materials
Expect that heat exchanger, 8. ram-air entrances, 9. spray chambers, 10. surfaces to be cooled, 11. nozzles, 22. flowmeters, 13. flows are adjusted
Valve, 14. water pumps；
Attached drawing 2 is the structural schematic diagram of evaporator (3)；
Label title in attached drawing 2：3. evaporator, 3-1. cold water inlet, 3-2. cooling water outlet, 3-3. refrigerant inlet,
3-4. refrigerant outlet, 3-5. phase-change material；
Attached drawing 3 is the structural schematic diagram of phase change material heat exchanger (7)；
Label title in attached drawing 3：7. phase change material heat exchanger, 7-1. cold air inlet, 7-2. cold air outlet, 7-3. cold water
Entrance, 7-4. cooling water outlet, 7-5. phase-change material.
Specific embodiment
As shown in Figure 1, a kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water
Mainly go out including water tank 1, compressor 2, evaporator 3, cold water inlet 3-1, cooling water outlet 3-2, refrigerant inlet 3-3, refrigerant
Mouthful 3-4, phase-change material 3-5, the first shut-off valve 4-1, the second shut-off valve 4-2, third shut-off valve 4-3, the 4th shut-off valve 4-4, the
Five shut-off valve 4-5, expansion valve 5, condenser 6, phase change material heat exchanger 7, cold air inlet 7-1, cold air outlet 7-2, cold water inlet
7-3, cooling water outlet 7-4, phase-change material 7-5, ram-air entrance 8, spray chamber 9, surface to be cooled 10, nozzle 11, flowmeter
12, flow control valve 13, water pump 14.
Before taking off, needed to obtain spray cooling system runing time cooling time according to aircraft cruise duration and equipment,
Quantitative water is filled in water tank 1 according to runing time.Flow control valve 13, the first shut-off valve 4-1, the second shut-off valve 4- at this time
2, third shut-off valve 4-3, the 4th shut-off valve 4-4, the 5th shut-off valve 4-5 are in closed state.
After taking off, ram-air entrance 8 sucks ram-air, and phase-change material 7-5 becomes after exchanging heat with ram-air
Low temperature solid-state, phase-change material 7-5 cold-storage；Compressor 2 and expansion valve 5 are opened, becomes low after phase-change material 3-5 and refrigerant heat exchanger
Warm solid-state, phase-change material 3-5 cold-storage.
After taking off, when needing to cool down to electronic equipment or other surfaces, when 10 temperature of surface to be cooled is greater than
80 DEG C, when needing largely to radiate, water pump 14, the second shut-off valve 4-2, the 4th shut-off valve 4-4 and the 5th shut-off valve 4-5 are opened, is closed
The first shut-off valve 4-1, third shut-off valve 4-3 are closed, cold water is through water pump 14, flow control valve 13, the 5th shut-off valve 4-5 in water tank 1
With flow nozzle 11 after flowmeter 12, injection reduces surface 10 to be cooled to surface 10 to be cooled after being atomized in nozzle 11
Temperature, the hot water after the completion of exchanging heat flows into phase change material heat exchanger 7 through the outlet of spray chamber 9, in phase change material heat exchanger 7
With phase-change material 7-5 exchange heat cool down, cooling water through the second shut-off valve 4-2 flow into evaporator 3 in, in evaporator 3 with phase transformation material
Material 3-5 heat exchange cools down again, and the cooling water after cooling flows into water tank 1 and completes circulation；When 11 temperature of surface to be cooled is less than 80 DEG C,
When needing proper heat reduction, water pump 14, the first shut-off valve 4-1, the 4th shut-off valve 4-4 and the 5th shut-off valve 4-5 are opened, closes second
Shut-off valve 4-2, third shut-off valve 4-3, cold water is through water pump 14, flow control valve 13, the 5th shut-off valve 4-5 and flow in water tank 1
Flow nozzle 11 after meter 12, injection reduces the temperature on surface 10 to be cooled, changes to surface 10 to be cooled after being atomized in nozzle 11
Hot water after the completion of heat flows into phase change material heat exchanger 7 through the 4th shut-off valve 4-4, in phase change material heat exchanger 7 with phase transformation
Material 7-5 heat exchange cooling becomes cooling water, and cooling water flows into water tank 1 through the first shut-off valve 4-1 and completes circulation.
The extraneous stamped air intake 8 of low temperature ram-air enters in phase change material heat exchanger 7, in phase change material heat exchanger
It exchanges heat in 7 with phase-change material 7-5, ram-air temperature after phase change material heat exchanger 7 increases, and into condenser 6, is condensing
With refrigerant heat exchanger in device 6, temperature increases once again becomes hot-air, and hot-air flows into external environment.
Refrigerant enters in condenser 6 through compressor 2, exchanges heat in condenser 6 with ram-air, refrigerant is through condenser
6, expansion valve 5 enters evaporator 3, exchanges heat in evaporator 3 with phase-change material 3-5, refrigerant enters compressor 2 after the completion of heat exchange
Complete circulation.
When phase-change material needs cold-storage, the 4th shut-off valve 4-4, the phase-change material 7-5 and ram-air to have absorbed heat are closed
Become low temperature solid-state, phase-change material 7-5 cold-storage after heat exchange；The second shut-off valve 4-2 is closed, the phase-change material 3-5 to have absorbed heat and system
Become low temperature solid-state, phase-change material 3-5 cold-storage after cryogen heat exchange.
This uses the airborne spray cooling system of ram-air and sweat cooling circulating cooling recirculated water, uses water as cold
But medium, and pollution corrosion-free to chip and electronic equipment surface；Use extraneous ram-air as major refrigeration, uses evaporation
Refrigeration cycle respectively corresponds two phase change material heat exchangers, takes for different surface temperatures as auxiliary cold source, two kinds of cold sources
With use, water temperature is effectively controlled, ensure that the heat exchange property of misting cooling.The introducing of phase-change material so that system cold by spraying
But it is not necessarily to that cooling capacity still can be put aside into phase-change material 3-5 and phase-change material 7-5 when work, convenient for opening misting cooling at any time
Device.
Claims (7)
1. a kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water, it is characterised in that packet
Include water tank (1), compressor (2), evaporator (3), the first shut-off valve (4-1), the second shut-off valve (4-2), third shut-off valve (4-
3), the 4th shut-off valve (4-4), the 5th shut-off valve (4-5), expansion valve (5), condenser (6), phase change material heat exchanger (7), punching press
Air intake (8), spray chamber (9), surface to be cooled (10), nozzle (11), flowmeter (12), flow control valve (13), water pump
(14)；
Wherein, evaporator (3) has cold water inlet (3-1), cooling water outlet (3-2), refrigerant inlet (3-3), refrigerant outlet
(3-4), internal evaporator (3) is phase-change material (3-5)；There is phase change material heat exchanger (7) cold air inlet (7-1), cold air to go out
Mouth (7-2), cold water inlet (7-3), cooling water outlet (7-4), internal phase change material heat exchanger (7) is phase-change material (7-5)；Condensation
Device (6) has cold air inlet, cold air outlet, refrigerant inlet, refrigerant outlet；
The outlet of water tank (1) is connected with the entrance of water pump (14), the outlet and the entrance phase of flow control valve (13) of water pump (14)
Even, the outlet of flow control valve (13) is connected with the entrance of the 5th shut-off valve (4-5), the outlet of the 5th shut-off valve (4-5) and stream
The entrance of meter (12) is connected, and the outlet of flowmeter (12) is connected through the entrance of spray chamber (9) with the entrance of nozzle (11), nozzle
(11) outlet is located at the top on surface to be cooled (10), the outlet of spray chamber (9) entrance with third shut-off valve (4-3) respectively
It is connected with the entrance of the 4th shut-off valve (4-4), the outlet of the 4th shut-off valve (4-4) and the cold water of phase change material heat exchanger (7) enter
Mouthful (7-3) is connected, the outlet of third shut-off valve (4-3) respectively with the entrance of the first shut-off valve (4-1) and the second shut-off valve (4-2)
Entrance be connected, the cooling water outlet (7-4) of phase change material heat exchanger (7) entrance and second with the first shut-off valve (4-1) respectively
The entrance of shut-off valve (4-2) is connected, and the outlet of the second shut-off valve (4-2) is connected with the cold water inlet (3-1) of evaporator (3), the
The outlet of one shut-off valve (4-1) is connected with the cold water inlet of water tank (1), the cooling water outlet (3-2) of evaporator (3) and water tank (1)
Cold water inlet be connected；
Ram-air entrance (8) is connected with the cold air inlet (7-1) of phase change material heat exchanger (7), phase change material heat exchanger (7)
Cold air outlet (7-2) is connected with the cold air inlet of condenser (6), and the cold air outlet of condenser (6) is connected with external environment；
The refrigerant outlet of condenser (6) is connected with the entrance of expansion valve (5), the outlet of expansion valve (5) and the system of evaporator (3)
Cryogen entrance (3-3) is connected, and the refrigerant outlet (3-4) of evaporator (3) is connected with the entrance of compressor (2), compressor (2)
Outlet is connected with the refrigerant inlet of condenser (6).
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 2. according to claim 1
But system, it is characterised in that including following procedure：
Ram-air heat transfer process：The extraneous stamped air intake of low temperature ram-air (8) enters phase change material heat exchanger (7)
In, it exchanges heat in phase change material heat exchanger (7) with phase-change material (7-5), ram-air temperature after phase change material heat exchanger (7)
It increases, into condenser (6), with refrigerant heat exchanger in condenser (6), temperature increases once again becomes hot-air, hot-air
Flow into external environment；
Refrigerant circulating process：Refrigerant enters in condenser (6) through compressor (2), changes in condenser (6) with ram-air
Heat, refrigerant enter evaporator (3) through condenser (6), expansion valve (5), exchange heat in evaporator (3) with phase-change material (3-5),
Refrigerant enters compressor (2) and completes to recycle after the completion of heat exchange；
Misting cooling process：The quantitative water of storage in water tank (1), when system is run, when surface to be cooled (10) temperature is greater than 80
DEG C, when needing largely to radiate, open water pump (14), the second shut-off valve (4-2), the 4th shut-off valve (4-4) and the 5th shut-off valve (4-
5) the first shut-off valve (4-1), third shut-off valve (4-3), are closed, cold water is through water pump (14), flow control valve in water tank (1)
(13), the 5th shut-off valve (4-5) and flowmeter (12) flow nozzle (11) afterwards, in nozzle (11) after atomization injection to be cooled
Surface (10), reduces the temperature of surface to be cooled (10), and the hot water after the completion of exchanging heat flows into phase transformation material through the outlet of spray chamber (9)
Expect in heat exchanger (7), exchanges heat and cool down with phase-change material (7-5) in phase change material heat exchanger (7), cooling water is through the second shut-off valve
(4-2) is flowed into evaporator (3), is cooled down again in evaporator (3) with phase-change material (3-5) heat exchange, the cooling water after cooling
It flows into water tank (1) and completes circulation；
When surface to be cooled (10) temperature is less than 80 DEG C, when needing proper heat reduction, open water pump (14), the first shut-off valve (4-1),
4th shut-off valve (4-4) and the 5th shut-off valve (4-5) close the second shut-off valve (4-2), third shut-off valve (4-3), water tank (1)
Middle cold water flow nozzle (11) after water pump (14), flow control valve (13), the 5th shut-off valve (4-5) and flowmeter (12),
Injection reduces the temperature of surface to be cooled (10), the heat after the completion of exchanging heat to surface to be cooled (10) after atomization in nozzle (11)
Water through the 4th shut-off valve (4-4) flow into phase change material heat exchanger (7) in, in phase change material heat exchanger (7) with phase-change material (7-
5) heat exchange cooling becomes cooling water, and cooling water flows into water tank (1) through the first shut-off valve (4-1) and completes circulation；
Phase-change material process of cool：Misting cooling without when, close the 4th shut-off valve (4-4), phase-change material (7-5) and punching press
Become low temperature solid-state, phase-change material (7-5) cold-storage after air heat-exchange；Close the second shut-off valve (4-2), phase-change material (3-5) with
Become low temperature solid-state, phase-change material (3-5) cold-storage after refrigerant heat exchanger.
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 3. according to claim 1
But system, it is characterised in that including following procedure：
The nozzle (11) and surface to be cooled (10), which are all closed, to be mounted in spray chamber (9).
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 4. according to claim 1
But system, it is characterised in that including following procedure：
The phase-change material (3-5) and phase-change material (7-5) are Organic-inorganic composite phase-change material for cold storage.
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 5. according to claim 1
But system, it is characterised in that including following procedure：
The condenser (6) is plate heat exchanger.
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 6. according to claim 1
But system, it is characterised in that including following procedure：
The refrigerant is R22, R134a or R407C.
A kind of the airborne spraying cold of ram-air and sweat cooling circulating cooling recirculated water is used 7. according to claim 1
But system, it is characterised in that including following procedure：
The phase-change material (3-5) and phase-change material (7-5) original state are liquid, are solid-states after cold-storage.
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| CN201810855063.3A CN108834378A (en) | 2018-07-30 | 2018-07-30 | A kind of airborne spray cooling system using ram-air and sweat cooling circulating cooling recirculated water |
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| CN110127066A (en) * | 2019-04-24 | 2019-08-16 | 南京航空航天大学 | Use fuel-cooled light aerocraft centralization cooling system and method |
| CN111336717A (en) * | 2020-02-28 | 2020-06-26 | 江苏大学 | Gas-liquid two-phase circulating cooling system for energy recovery |
| CN111511164A (en) * | 2020-03-30 | 2020-08-07 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Spray cooling phase change heat sink integrated evaporation cooling device |
| CN113623927A (en) * | 2020-05-09 | 2021-11-09 | 合肥华凌股份有限公司 | Refrigeration equipment and control method thereof, refrigeration system and readable storage medium |
| CN114151188A (en) * | 2021-12-06 | 2022-03-08 | 中国空气动力研究与发展中心空天技术研究所 | Engine inlet air cooling method |
| WO2023070745A1 (en) * | 2021-10-25 | 2023-05-04 | 开尔文热能技术有限公司 | Data center thermal management system based on thermal energy storage and method |
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| CN116960101A (en) * | 2023-07-26 | 2023-10-27 | 浙江佳博科技股份有限公司 | High-flow water chiller with bond alloy wires |
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