JP2001007456A5 - - Google Patents
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- Publication number
- JP2001007456A5 JP2001007456A5 JP1999171695A JP17169599A JP2001007456A5 JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5 JP 1999171695 A JP1999171695 A JP 1999171695A JP 17169599 A JP17169599 A JP 17169599A JP 2001007456 A5 JP2001007456 A5 JP 2001007456A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- circuit board
- conductor pattern
- insulating substrate
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009413 insulation Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17169599A JP2001007456A (ja) | 1999-06-17 | 1999-06-17 | 配線回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17169599A JP2001007456A (ja) | 1999-06-17 | 1999-06-17 | 配線回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001007456A JP2001007456A (ja) | 2001-01-12 |
JP2001007456A5 true JP2001007456A5 (ko) | 2005-01-06 |
Family
ID=15927983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17169599A Pending JP2001007456A (ja) | 1999-06-17 | 1999-06-17 | 配線回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001007456A (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4721534B2 (ja) * | 2001-02-21 | 2011-07-13 | 京セラ株式会社 | セラミック回路基板 |
JP4721533B2 (ja) * | 2001-02-21 | 2011-07-13 | 京セラ株式会社 | セラミック回路基板 |
JP4614788B2 (ja) * | 2005-02-25 | 2011-01-19 | 京セラ株式会社 | 配線基板 |
JP5010669B2 (ja) * | 2009-12-07 | 2012-08-29 | パナソニック株式会社 | 配線基板及びその製造方法 |
JP2015208200A (ja) * | 2014-04-23 | 2015-11-19 | 株式会社デンソー | 電源装置 |
JP2016092053A (ja) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | 配線基板 |
JP6640508B2 (ja) * | 2015-09-25 | 2020-02-05 | 京セラ株式会社 | 印刷配線板の製造方法 |
JP6604183B2 (ja) * | 2015-12-16 | 2019-11-13 | 富士電機株式会社 | 半導体モジュール |
CN106604524A (zh) * | 2016-11-21 | 2017-04-26 | 努比亚技术有限公司 | 柔性电路板 |
JP6946776B2 (ja) * | 2017-06-26 | 2021-10-06 | 株式会社リコー | 回路基板 |
JP7024331B2 (ja) * | 2017-11-02 | 2022-02-24 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法、ヒートシンク付き絶縁回路基板の製造方法、及び、絶縁回路基板の積層構造体の製造方法 |
JP7455833B2 (ja) * | 2019-07-08 | 2024-03-26 | 株式会社Fuji | 回路パターン作成システム、および回路パターン作成方法 |
JP7019657B2 (ja) * | 2019-12-10 | 2022-02-15 | 日東電工株式会社 | 配線回路基板の製造方法 |
KR20240044498A (ko) * | 2021-09-29 | 2024-04-04 | 가부시키가이샤 무라타 세이사쿠쇼 | 트래커 모듈 및 통신 장치 |
-
1999
- 1999-06-17 JP JP17169599A patent/JP2001007456A/ja active Pending
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