JP2000510641A - マイクロ波による厚壁セラミック部品の接合方法と接合装置 - Google Patents
マイクロ波による厚壁セラミック部品の接合方法と接合装置Info
- Publication number
- JP2000510641A JP2000510641A JP10543150A JP54315098A JP2000510641A JP 2000510641 A JP2000510641 A JP 2000510641A JP 10543150 A JP10543150 A JP 10543150A JP 54315098 A JP54315098 A JP 54315098A JP 2000510641 A JP2000510641 A JP 2000510641A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- microwave
- container
- lid
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/70—Feed lines
- H05B6/701—Feed lines using microwave applicators
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/64—Heating using microwaves
- H05B6/80—Apparatus for specific applications
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- C—CHEMISTRY; METALLURGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/665—Local sintering, e.g. laser sintering
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/667—Sintering using wave energy, e.g. microwave sintering
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
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- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
- C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.少なくとも約2.5cmの厚みを有するセラミック部品を接合する方法であ って、部品と部品の表面どうしを合わせることと、セラミック部品を再加熱 して再反応させることによってセラミック部品間の接合部を封着するため に接合部にマイクロ波エネルギーを集束させることを含み、該マイクロ波エ ネルギーが十分なパワーを有し、接合部を封着するために十分な時間均一に 接合部に加えられる、方法。 2.少なくとも約2.5cmの厚みを有するセラミック部品を接合する方法であ って、 (a)微粒のセラミック組成物をオートクレーブ処理して、セラミック部 品間の接合部にマイクロ波エネルギーを次に加えた際に、セラミック組成 物によるマイクロ波エネルギーの吸収を増大させる濃度にまでその水素形 態含有量を増加させること; (b)該オートクレーブ処理された微粒のセラミック組成物を接合される セラミック部品の表面に塗布すること;及び (c)該接合される部品のセラミック組成物が塗布された表面どうしを合 わせることと、セラミック部品間のセラミック組成物を再加熱して再反応 させることによって接合部を封着するためにセラミック部品間の接合部に マイクロ波エネルギーを集束させること を含み、該マイクロ波エネルギーが十分なパワーを有し、接合部を封着す るために十分な時間均一に接合部に加えられる、方法。 3.前記接合部がガスが透過しないように封着される、請求項2に記載される方 法。 4.前記セラミック部品が、ケイ酸塩材料、カオリン、赤色粘土、ムライト、ア ルミナ、酸化マグネシウム、マグネシウムアルミニウムスピネル、窒化物及 び炭化物セラミックス、その他の金属酸化物及びこれらの混合物から成る群 より選択される構成物を有する、請求項2に記載される方法。 5.前記セラミック部品が、少なくとも約5cmの厚みを有する、請求項2に記 載される方法。 6.前記セラミック部品が、押出し成形によって形成された容器及びその蓋であ る、請求項2に記載される方法。 7.前記セラミック部品が、振動固締めによって形成された容器及びその蓋であ る、請求項2に記載される方法。 8.前記微粒のセラミック組成物が、ケイ酸塩材料、カオリン、赤色粘土、ムラ イト、アルミナ、酸化マグネシウム、マグネシウムアルミニウムスピネル、 窒化物及び炭化物セラミックス、その他の金属酸化物及びこれらの混合物か ら成る群より選択される構成物を有する、請求項2に記載される方法。 9.前記微粒のセラミック組成物が、セラミック部品と同じ構成要素を含む、請 求項2に記載される方法。 10.前記微粒のセラミック組成物の粒径が、微細粒子から粗粒子までの範囲に ある、請求項2に記載される方法。 11.前記微粒のセラミック組成物の粒径が、接合されるセラミック部品の多孔 率によって選択される、請求項10に記載される方法。 12.前記微粒のセラミック組成物の粒径が、約2nm〜約2mmである、請求 項10に記載される方法。 13.前記微粒のセラミック組成物が、セラミック組成物に水素形態を導入する のに十分な時間、最大蒸気圧約2.5GPaでスチームオートクレーブ処理 される、請求項2に記載される方法。 14.前記マイクロ波エネルギーが、約600MHZ〜約6000MHZの範囲 内の1あるいは複数の周波数で供給される、請求項2に記載される方法。 15.前記マイクロ波エネルギーが、約700MHZ〜約4000MHZの範囲 内の1あるいは複数の周波数で供給される、請求項14に記載の方法。 16.前記マイクロ波エネルギーが、約915MHZあるいは約2450MHZ の周波数で供給される、請求項15に記載の方法。 17.前記マイクロ波エネルギーが、約915MHZ及び約2450MHZの両 方の周波数で供給される、請求項15に記載の方法。 18.前記接合されるセラミック部品が、通常、共に円筒形あるいは卵型であり 、工程(c)において軸の周りを共に回転させられる、請求項2に記載の 方 法。 19.前記接合される部品はその境界で突合せ面を有する、請求項2に記載の方 法。 20.前記境界部分の突合せ面は平坦あるいは傾斜させられている、請求項19 に記載の方法。 21.前記接合される部品は、その境界部で山及び溝によって嵌め合わされてい る、請求項19に記載の方法。 22.前記山及び溝の断面が三角形あるいは台形である、請求項21に記載の方 法。 23.前記部品の接合部分が断熱材で覆われ、同様に断熱材はマイクロ波炉によ って覆われる、請求項2に記載の方法。 24.セラミック容器の上にセラミック蓋を接合する方法であって、 a)微粒のセラミック組成物をオートクレーブ処理して、セラミック部品 間の接合部にマイクロ波エネルギーを次に加えた際にセラミック組成物 によるマイクロ波エネルギーの吸収を増大させる濃度にまでその水素形 態含有量を増加させること; b)該オートクレーブで処理されたセラミック組成物を、蓋及び容器の接 合される部分に塗布すること;及び c)容器の上に蓋を置くことと、容器と蓋の間のセラミック組成物を再加 熱して再反応させることによって接合部を封着するために容器と蓋の接 合部にマイクロ波エネルギーを集束させること を含み、該マイクロ波エネルギーが十分なパワーを有し、接合部を封着す るために十分な時間均一に接合部に加えられる、方法。 25.前記セラミック部品が、ケイ酸塩材料、カオリン、赤色粘土、ムライト、 アルミナ、酸化マグネシウム、マグネシウムアルミニウムスピネル、窒化 物及び炭化物セラミックス、その他の金属酸化物及びこれらの混合物から 成る群より選択される構成物を有する、請求項24に記載の方法。 26.前記セラミック部品が、押出し成形あるいは振動固締めによって形成され る容器及びその蓋である、請求項24に記載の方法。 27.前記接合されるセラミック容器及び蓋が、境界部分で突合せ面を有する、 請求項24に記載の方法。 28.前記セラミック容器及び蓋の境界部分で山及び溝が嵌め合わされている、 請求項27に記載の方法。 29.前記山及び溝の断面が、三角形あるいは台形である、請求項28に記載の 方法。 30.前記セラミック容器及び蓋の境界部分にある突合せ面は、平坦あるいは傾 斜させられている、請求項27に記載の方法。 31.前記マイクロ波のエネルギー源がマイクロ波環状炉である、請求項24に 記載の方法。 32.前記マイクロ波エネルギーは、約600MHZ〜約6000HMZの範囲 内の1ないし複数の周波数で供給される、請求項24に記載の方法。 33.前記マイクロ波エネルギーが約700MHZ〜約4000MHZの範囲内 の1あるいは複数の周波数で供給される、請求項32に記載の方法。 34.前記マイクロ波エネルギーが約915MHZあるいは約2450MHZの 周波数で供給される、請求項33に記載の方法。 35.前記マイクロ波エネルギーは、約915MHZ及び約2450MHZの両 方の周波数で供給される、請求項33に記載の方法。 36.前記容器と蓋との間の接合部が、セラミック製の断熱材によって覆われ、 同様に、該断熱材はマイクロ波環状炉によって覆われる、請求項31に記 載の方法。 37.前記容器と前記蓋がマイクロ波環状炉の内側で回転させられる、請求項3 6に記載の方法。 38.マイクロ波でセラミック部品を接合する装置であって、 (a)断面が円形であるセラミック部品間の接合部分を覆うことができる マイクロ波環状炉; (b)該マイクロ波環状炉に取り付けられた少なくとも1つのマイクロ波 導波管;及び (c)該マイクロ波導波管に接続されるマイクロ波源 を含む装置。 39.前記マイクロ波環状炉が、1対の垂直棒に摺動可能に取り付けられる、請 求項38に記載の装置。 40.前記マイクロ波環状炉は、コンテナを回転させるターンテーブルの上の中 央に位置付けられ、断面が円形であるコンテナのセラミック部品間の接合 部は、取り巻くマイクロ波環状炉の内側にある、請求項38に記載の装置 。 41.前記マイクロ波環状炉には2つのマイクロ波導波管が取り付けられている 、請求項38に記載の装置。
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US4312097P | 1997-04-10 | 1997-04-10 | |
US60/043,120 | 1997-04-10 | ||
PCT/US1998/007197 WO1998046047A1 (en) | 1997-04-10 | 1998-04-10 | Process and apparatus for microwave joining thick-walled ceramic parts |
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JP2000510641A true JP2000510641A (ja) | 2000-08-15 |
JP3315414B2 JP3315414B2 (ja) | 2002-08-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP54315098A Expired - Fee Related JP3315414B2 (ja) | 1997-04-10 | 1998-04-10 | マイクロ波による厚壁セラミック部品の接合方法と接合装置 |
Country Status (6)
Country | Link |
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US (1) | US6054700A (ja) |
EP (1) | EP0979595B1 (ja) |
JP (1) | JP3315414B2 (ja) |
AU (1) | AU6964098A (ja) |
DE (1) | DE69838027D1 (ja) |
WO (1) | WO1998046047A1 (ja) |
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JP2007238372A (ja) * | 2006-03-08 | 2007-09-20 | Tokuyama Corp | セラミックス焼結体の補修方法 |
JP2008073767A (ja) * | 2006-09-21 | 2008-04-03 | General Electric Co <Ge> | 粉末材料を用いてマイクロ波ろう付けする方法 |
JP2013181858A (ja) * | 2012-03-02 | 2013-09-12 | Tadashi Matsui | 放射能汚染物の処理方法 |
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EP1361437A1 (en) * | 2002-05-07 | 2003-11-12 | Centre National De La Recherche Scientifique (Cnrs) | A novel biological cancer marker and methods for determining the cancerous or non-cancerous phenotype of cells |
US7498066B2 (en) * | 2002-05-08 | 2009-03-03 | Btu International Inc. | Plasma-assisted enhanced coating |
US6870124B2 (en) * | 2002-05-08 | 2005-03-22 | Dana Corporation | Plasma-assisted joining |
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US7497922B2 (en) * | 2002-05-08 | 2009-03-03 | Btu International, Inc. | Plasma-assisted gas production |
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US20060233682A1 (en) * | 2002-05-08 | 2006-10-19 | Cherian Kuruvilla A | Plasma-assisted engine exhaust treatment |
US7465362B2 (en) * | 2002-05-08 | 2008-12-16 | Btu International, Inc. | Plasma-assisted nitrogen surface-treatment |
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US20060237398A1 (en) * | 2002-05-08 | 2006-10-26 | Dougherty Mike L Sr | Plasma-assisted processing in a manufacturing line |
DE60223726T2 (de) * | 2002-05-08 | 2008-10-30 | Leonhard Kurz Stiftung & Co. Kg | Verfahren zum dekorieren eines grossen, dreidimensionalen plastikgegenstandes |
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- 1998-04-10 JP JP54315098A patent/JP3315414B2/ja not_active Expired - Fee Related
- 1998-04-10 US US09/058,912 patent/US6054700A/en not_active Expired - Lifetime
- 1998-04-10 WO PCT/US1998/007197 patent/WO1998046047A1/en active IP Right Grant
- 1998-04-10 AU AU69640/98A patent/AU6964098A/en not_active Abandoned
- 1998-04-10 EP EP98915462A patent/EP0979595B1/en not_active Expired - Lifetime
- 1998-04-10 DE DE69838027T patent/DE69838027D1/de not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007238372A (ja) * | 2006-03-08 | 2007-09-20 | Tokuyama Corp | セラミックス焼結体の補修方法 |
JP4652255B2 (ja) * | 2006-03-08 | 2011-03-16 | 株式会社トクヤマ | セラミックス焼結体の補修方法 |
JP2008073767A (ja) * | 2006-09-21 | 2008-04-03 | General Electric Co <Ge> | 粉末材料を用いてマイクロ波ろう付けする方法 |
JP2013181858A (ja) * | 2012-03-02 | 2013-09-12 | Tadashi Matsui | 放射能汚染物の処理方法 |
Also Published As
Publication number | Publication date |
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WO1998046047A1 (en) | 1998-10-15 |
AU6964098A (en) | 1998-10-30 |
EP0979595A1 (en) | 2000-02-16 |
EP0979595A4 (en) | 2004-07-21 |
DE69838027D1 (de) | 2007-08-16 |
US6054700A (en) | 2000-04-25 |
JP3315414B2 (ja) | 2002-08-19 |
EP0979595B1 (en) | 2007-07-04 |
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