JP2000500795A - 熱硬化性重合体の可使時間、ゲル化時間及び貯蔵安定性を改良するための抑制剤 - Google Patents
熱硬化性重合体の可使時間、ゲル化時間及び貯蔵安定性を改良するための抑制剤Info
- Publication number
- JP2000500795A JP2000500795A JP9518888A JP51888897A JP2000500795A JP 2000500795 A JP2000500795 A JP 2000500795A JP 9518888 A JP9518888 A JP 9518888A JP 51888897 A JP51888897 A JP 51888897A JP 2000500795 A JP2000500795 A JP 2000500795A
- Authority
- JP
- Japan
- Prior art keywords
- bismaleimide
- composition
- resin
- reactant
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
- C08F222/404—Imides, e.g. cyclic imides substituted imides comprising oxygen other than the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/123—Unsaturated polyimide precursors the unsaturated precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C09D179/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Reinforced Plastic Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. A.1種以上の固体のビスマレイミド系樹脂反応物、 B.少なくとも1個のオレフィン系の基及び少なくとも1個の芳香族環を 含有する液状オレフィン系共反応物、及び C.1種以上のフリーラジカル抑制剤 を含んで成り、硬化前の組成物が改良された室温貯蔵安定性を有すること を特徴とする熱硬化性の樹脂組成物。 2. ビスマレイミド系樹脂反応物が、メチレンジアニリンビスマレイミド、ビ ス(アミノフェノキシフェニル)プロパンビスマレイミド、オキシジアニリンビ スマレイミド、ビス(アミノフェノキシ)ベンゼンビスマレイミド、ジアミノジ フェニルスルホンビスマレイミド、ジアミノジフェニルイソプロピリデンビスマ レイミド、ジアミノジフェニルケトンビスマレイミド、ジアミノジフェニルスル フィドビスマレイミド、ジアミノジフェニルヘキサフルオルイソプロピリデンビ スマレイミド及びビス(ジアミノジフェニルイソプロピリデン)ベンゼンビスマ レイミドから成る群から選ばれる請求項1に記載の組成物。 3. 液状オレフィン系共反応物がプロペニルフェノキシベンゾフェノン又はプ ロペニルフェノキシピリジンである請求項1に記載の組成物。 4. 液状オレフィン系共反応物が4,4’−ビス[O−(1−プロペニル)− フェノキシ]ベンゾフェノンである請求項1に記載の組成物。 5. 固体のビスマレイミド樹脂反応物の液状共反応物に対する重量比が、80 :20〜20:80の範囲である請求項1に記載の組成物。 6. ビスマレイミド樹脂反応物とオレフィン系共反応物が、硬化時の組成物中 の反応性成分全重量の50%を超える請求項1に記載の組成物。 7. 抑制剤がハイドロキノン、1,4−ナフトキノン、ナフテン酸銅、t−ブ チルハイドロキノン、置換基を有するキノン、立体障害フェノール、フェノチア ジン、置換を有するカテコール、ナフテン酸銅、ジメチルジチオカルバミン酸亜 鉛から成る群から選ばれる請求項1に記載の組成物。 8. 抑制剤が約1ppm〜5重量%である請求項1に記載の組成物。 9. A.1種以上の固体のビスマレイミド系樹脂反応物、 B.少なくとも1個のオレフィン系の基及び少なくとも1個の芳香族環を 含有する液状オレフィン系共反応物、及び C.1種以上のフリーラジカル抑制剤 を含んで成り、硬化前の組成物が改良された室温貯蔵安定性を有すること を特徴とする、高温用の複合材及び接着剤用途の熱硬化性樹脂組成物。 10. ビスマレイミド系樹脂反応物が、メチレンジアニリンビスマレイミド、 ビス(アミノフェノキシフェニル)プロパンビスマレイミド、オキシジアニリン ビスマレイミド、ビス(アミノフェノキシ)ベンゼンビスマレイミド、ジアミノ ジフェニルスルホンビスマレイミド、ジアミノジフェニルイソプロピリデンビス マレイミド、ジアミノジフェニルケトンビスマレイミド、ジアミノジフェニルス ルフィドビスマレイミド、ジアミノジフェニルヘキサフルオルイソプロピリデン ビスマレイミド及びビス(ジアミノジフェニルイソプロピリデン)ベンゼンビス マレイミドから成る群から選ばれる請求項9に記載の組成物。 11. 液状オレフィン系共反応物がプロペニルフェノキシベンゾフェノン又は プロペニルフェノキシピリジンである請求項9に記載の組成物。 12. 液状オレフィン系共反応物が4,4’−ビス[O−(1−プロペニル) −フェノキシ]ベンゾフェノンである請求項9に記載の組成物。 13. 固体のビスマレイミド樹脂反応物の液状共反応物に対する重量比が、8 0:20〜20:80の範囲である請求項9に記載の組成物。 14. ビスマレイミド樹脂反応物とオレフィン系共反応物が、硬化時の組成物 中の反応性成分全重量の50%を超える請求項9に記載の組成物。 15. 抑制剤がハイドロキノン、1,4−ナフトキノン、ナフテン酸銅、t− ブチルハイドロキノン、置換されたキノン、立体障害フェノール、フェノチアジ ン、置換されたカテコール、ナフテン酸銅及びジメチルジチオカルバミン酸亜鉛 から成る群から選ばれる請求項9に記載の組成物。 16. 抑制剤が約1ppm〜5重量%である請求項9に記載の組成物。 17. A.メチレンジアニリンビスマレイミド、 B.4,4’−ビス[O−(1−プロペニル)−フェノキシ]ベンゾフ ェノン、及び C.1,4−ナフトキノン又はナフテン酸銅抑制剤 を含んで成り、硬化前の組成物が改良された室温貯蔵安定性を有することを特徴 とする、高温用の複合材及び接着剤用途の熱硬化性樹脂組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US644795P | 1995-11-13 | 1995-11-13 | |
US60/006,447 | 1995-11-13 | ||
PCT/US1996/017501 WO1997018255A1 (en) | 1995-11-13 | 1996-10-30 | Thermosetting polymers for composite and adhesive applications |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2000500795A true JP2000500795A (ja) | 2000-01-25 |
Family
ID=21720935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9518888A Pending JP2000500795A (ja) | 1995-11-13 | 1996-10-30 | 熱硬化性重合体の可使時間、ゲル化時間及び貯蔵安定性を改良するための抑制剤 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5955566A (ja) |
EP (1) | EP0861280B1 (ja) |
JP (1) | JP2000500795A (ja) |
AT (1) | ATE210693T1 (ja) |
CA (1) | CA2237331C (ja) |
DE (1) | DE69617996T2 (ja) |
DK (1) | DK0861280T3 (ja) |
ES (1) | ES2164926T3 (ja) |
WO (1) | WO1997018255A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008120484A1 (ja) * | 2007-03-29 | 2008-10-09 | Toho Tenax Co., Ltd. | 繊維強化プリプレグ及びそれから得られる複合材料 |
JP2008539304A (ja) * | 2005-04-28 | 2008-11-13 | サイテク・テクノロジー・コーポレーシヨン | 製造特性が向上したビスマレイミド樹脂系 |
JP2012528237A (ja) * | 2009-05-28 | 2012-11-12 | サイテク・テクノロジー・コーポレーシヨン | 粒子強化重合体組成物 |
JP2012528236A (ja) * | 2009-05-28 | 2012-11-12 | サイテク・テクノロジー・コーポレーシヨン | 粒子強化繊維強化重合体複合材料 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
US6207739B1 (en) * | 1997-11-20 | 2001-03-27 | Kanegafuchi Kagaku Kogyo Kabushiki | Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them |
US20050042961A1 (en) * | 2003-08-18 | 2005-02-24 | Henkel Loctite Corporation | Curable compositions for advanced processes, and products made therefrom |
US7129318B2 (en) * | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
CA2597652A1 (en) * | 2005-02-16 | 2006-08-24 | Cytec Technology Corp. | Bismaleimide resin with high temperature thermal stability |
CA2670027A1 (en) * | 2006-11-21 | 2008-05-29 | Henkel Corporation | Toughened binder compositions for use in advanced processes |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
WO2013096523A1 (en) | 2011-12-22 | 2013-06-27 | Cytec Industries Inc. | Maleimide resins |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4175175A (en) * | 1963-07-16 | 1979-11-20 | Union Carbide Corporation | Polyarylene polyethers |
NL6609886A (ja) * | 1966-07-14 | 1968-01-15 | ||
FR2094607A5 (ja) * | 1970-06-26 | 1972-02-04 | Rhone Poulenc Sa | |
CH615935A5 (ja) * | 1975-06-19 | 1980-02-29 | Ciba Geigy Ag | |
US4564683A (en) * | 1982-08-12 | 1986-01-14 | The United States Of America As Represented By The United States Department Of Energy | Bismaleimide compounds |
US4546131A (en) * | 1985-01-15 | 1985-10-08 | The Dow Chemical Company | Polymer modified cyanate mixture and epoxy resins thereof |
US4568733A (en) * | 1985-04-04 | 1986-02-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | High performance mixed bisimide resins and composites based thereon |
US4654407A (en) * | 1985-08-02 | 1987-03-31 | Amoco Corporation | Aromatic bismaleimide and prepreg resin therefrom |
US4689378A (en) * | 1985-12-16 | 1987-08-25 | Ciba-Geigy Corporation | Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol |
EP0230741B1 (en) * | 1986-01-18 | 1993-08-11 | Technochemie GmbH - Verfahrenstechnik | Curable resins |
US4812511A (en) * | 1986-07-15 | 1989-03-14 | Amoco Corporation | Ethylenically-unsaturated ethers of alkenyl phenols as reactive diluents for bismaleimides |
CA1274048A (en) * | 1986-07-15 | 1990-09-11 | Linda A. Domeier | Bismaleimide formulations containing olefinic ether modifiers |
EP0296112A3 (de) * | 1987-06-18 | 1989-09-06 | Ciba-Geigy Ag | Lagerstabile härtbare Mischungen |
US5003018A (en) * | 1988-04-29 | 1991-03-26 | Basf Aktiengesellschaft | Slurry mixing of bismaleimide resins |
DE3827120A1 (de) * | 1988-08-10 | 1990-02-15 | Basf Ag | Hitzehaertbare bismaleinimid-copolymere sowie 2,6-disubstituierte pyridin-verbindungen als comonomere |
DE3924867A1 (de) * | 1989-07-27 | 1991-01-31 | Basf Ag | Bismaleinimid-harze |
DE3929386A1 (de) * | 1989-09-05 | 1991-03-07 | Basf Ag | Hitzehaertbare bismaleinimidharze |
US5143969A (en) * | 1991-06-24 | 1992-09-01 | Basf Aktiengesellschaft | Heat-curable bismaleimide molding compositions |
JPH05155984A (ja) * | 1991-12-04 | 1993-06-22 | Meidensha Corp | 耐熱性樹脂組成物 |
-
1996
- 1996-10-30 CA CA002237331A patent/CA2237331C/en not_active Expired - Fee Related
- 1996-10-30 EP EP96937842A patent/EP0861280B1/en not_active Expired - Lifetime
- 1996-10-30 WO PCT/US1996/017501 patent/WO1997018255A1/en active IP Right Grant
- 1996-10-30 DE DE69617996T patent/DE69617996T2/de not_active Expired - Lifetime
- 1996-10-30 DK DK96937842T patent/DK0861280T3/da active
- 1996-10-30 ES ES96937842T patent/ES2164926T3/es not_active Expired - Lifetime
- 1996-10-30 JP JP9518888A patent/JP2000500795A/ja active Pending
- 1996-10-30 AT AT96937842T patent/ATE210693T1/de active
- 1996-11-13 US US08/748,456 patent/US5955566A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008539304A (ja) * | 2005-04-28 | 2008-11-13 | サイテク・テクノロジー・コーポレーシヨン | 製造特性が向上したビスマレイミド樹脂系 |
WO2008120484A1 (ja) * | 2007-03-29 | 2008-10-09 | Toho Tenax Co., Ltd. | 繊維強化プリプレグ及びそれから得られる複合材料 |
US8034442B2 (en) | 2007-03-29 | 2011-10-11 | Toho Tenax Co., Ltd. | Fiber-reinforced prepreg and composite material obtained from the same |
JP5451379B2 (ja) * | 2007-03-29 | 2014-03-26 | 東邦テナックス株式会社 | 繊維強化プリプレグ及びそれから得られる複合材料 |
JP2012528237A (ja) * | 2009-05-28 | 2012-11-12 | サイテク・テクノロジー・コーポレーシヨン | 粒子強化重合体組成物 |
JP2012528236A (ja) * | 2009-05-28 | 2012-11-12 | サイテク・テクノロジー・コーポレーシヨン | 粒子強化繊維強化重合体複合材料 |
Also Published As
Publication number | Publication date |
---|---|
ES2164926T3 (es) | 2002-03-01 |
EP0861280A1 (en) | 1998-09-02 |
DK0861280T3 (da) | 2002-04-08 |
ATE210693T1 (de) | 2001-12-15 |
CA2237331A1 (en) | 1997-05-22 |
EP0861280B1 (en) | 2001-12-12 |
WO1997018255A1 (en) | 1997-05-22 |
US5955566A (en) | 1999-09-21 |
CA2237331C (en) | 2007-06-19 |
DE69617996T2 (de) | 2002-07-04 |
DE69617996D1 (de) | 2002-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4054062B2 (ja) | 複合材及び接着剤用途の熱硬化性重合体 | |
US5237045A (en) | Curing phthalonitrile resins with acid and amine | |
JP2000500795A (ja) | 熱硬化性重合体の可使時間、ゲル化時間及び貯蔵安定性を改良するための抑制剤 | |
US4689378A (en) | Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol | |
JP3241684B2 (ja) | 強化熱硬化性構造材料 | |
US4927907A (en) | Bisbenzocyclobutene/bisimide/free radical polymerization inhibitor composition | |
US4804740A (en) | Cyanate ester with urea latent cure accelerator | |
KR910000201B1 (ko) | 치환된 비시클로[2.2.1]헵트-5-엔-2,3-디카복스이미드 및 폴리말레이미드를 함유하는 열경화성 혼합물 | |
JPH01319514A (ja) | 貯蔵上安定な硬化性混合物 | |
EP0411050A1 (en) | POLYIMIDE RESIN. | |
US4931496A (en) | Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition | |
WO1999036446A1 (en) | Phthalonitrile prepolymerization composition | |
US4918157A (en) | Thermosetting composition comprising cyanate ester, urea compound and epoxy resin | |
US5122589A (en) | Imido/siloxane bismaleimide/aromatic diamine prepolymers | |
JPH06504071A (ja) | シアン酸エステル化合物およびジオルガノポリシロキサン基を含むポリイミド化合物をベースとする熱硬化性組成物 | |
EP0464940B1 (en) | Modified bismide composition | |
US5189128A (en) | Solution stable polyimide resin systems | |
US4749767A (en) | Stable imide-containing composition from diaminophenylindane-bis-imide, amine and alkenyl phenol or ether | |
JPH03139524A (ja) | 立体障害ジアミンから製造したイミド基含有ポリマー製造用混合物 | |
WO2019124558A1 (ja) | 熱硬化性樹脂組成物 | |
US5183869A (en) | Hardenable compositions | |
US5157105A (en) | Bisbenzocyclobutene/bisimide/dicyanate ester composition | |
US4902778A (en) | Propenylphenoxy-terminated oligomeric tougheners and their use in toughening thermosetting bismaleimide resin compositions | |
US5093459A (en) | Bismaleimide resin containing unreacted monomer reactants | |
JPH01256535A (ja) | ヒンダードジアミンから製造したイミド基含有熱硬化性プレポリマーの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061121 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20061107 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070221 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070409 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070521 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071023 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080123 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20080612 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081118 |