ATE210693T1 - Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen - Google Patents

Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen

Info

Publication number
ATE210693T1
ATE210693T1 AT96937842T AT96937842T ATE210693T1 AT E210693 T1 ATE210693 T1 AT E210693T1 AT 96937842 T AT96937842 T AT 96937842T AT 96937842 T AT96937842 T AT 96937842T AT E210693 T1 ATE210693 T1 AT E210693T1
Authority
AT
Austria
Prior art keywords
composite
adhesive applications
heat curing
polymers
curing polymers
Prior art date
Application number
AT96937842T
Other languages
English (en)
Inventor
Jean Lee
Jack Boyd
Albert Kuo
Original Assignee
Cytec Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cytec Tech Corp filed Critical Cytec Tech Corp
Application granted granted Critical
Publication of ATE210693T1 publication Critical patent/ATE210693T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C08F222/404—Imides, e.g. cyclic imides substituted imides comprising oxygen other than the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/123—Unsaturated polyimide precursors the unsaturated precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09D179/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
AT96937842T 1995-11-13 1996-10-30 Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen ATE210693T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US644795P 1995-11-13 1995-11-13
PCT/US1996/017501 WO1997018255A1 (en) 1995-11-13 1996-10-30 Thermosetting polymers for composite and adhesive applications

Publications (1)

Publication Number Publication Date
ATE210693T1 true ATE210693T1 (de) 2001-12-15

Family

ID=21720935

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96937842T ATE210693T1 (de) 1995-11-13 1996-10-30 Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen

Country Status (9)

Country Link
US (1) US5955566A (de)
EP (1) EP0861280B1 (de)
JP (1) JP2000500795A (de)
AT (1) ATE210693T1 (de)
CA (1) CA2237331C (de)
DE (1) DE69617996T2 (de)
DK (1) DK0861280T3 (de)
ES (1) ES2164926T3 (de)
WO (1) WO1997018255A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
US6207739B1 (en) * 1997-11-20 2001-03-27 Kanegafuchi Kagaku Kogyo Kabushiki Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them
US20050042961A1 (en) * 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
US7129318B2 (en) * 2003-09-02 2006-10-31 I.S.T. (Ma) Corporation RTM and RI processable polyimide resins
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
US7649060B2 (en) * 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
CA2597652A1 (en) * 2005-02-16 2006-08-24 Cytec Technology Corp. Bismaleimide resin with high temperature thermal stability
AU2006240379B2 (en) * 2005-04-28 2011-01-06 Cytec Technology Corp. Bismaleimide resin system with improved manufacturing properties
EP2084241A4 (de) * 2006-11-21 2014-08-20 Henkel US IP LLC Schlagzähmodifizierte binderzusammensetzungen für hochentwickelte verfahren
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
WO2008120484A1 (ja) * 2007-03-29 2008-10-09 Toho Tenax Co., Ltd. 繊維強化プリプレグ及びそれから得られる複合材料
US8268926B2 (en) * 2009-05-28 2012-09-18 Cytec Technology Corp. Particle-toughened polymer compositions
US8080313B2 (en) 2009-05-28 2011-12-20 Cytec Technology Corp. Particle-toughened fiber-reinforced polymer composites
EP2794750B1 (de) 2011-12-22 2020-12-09 Cytec Industries Inc. Maleimidharze

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4175175A (en) * 1963-07-16 1979-11-20 Union Carbide Corporation Polyarylene polyethers
NL6609886A (de) * 1966-07-14 1968-01-15
FR2094607A5 (de) * 1970-06-26 1972-02-04 Rhone Poulenc Sa
CH615935A5 (de) * 1975-06-19 1980-02-29 Ciba Geigy Ag
US4564683A (en) * 1982-08-12 1986-01-14 The United States Of America As Represented By The United States Department Of Energy Bismaleimide compounds
US4546131A (en) * 1985-01-15 1985-10-08 The Dow Chemical Company Polymer modified cyanate mixture and epoxy resins thereof
US4568733A (en) * 1985-04-04 1986-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High performance mixed bisimide resins and composites based thereon
US4654407A (en) * 1985-08-02 1987-03-31 Amoco Corporation Aromatic bismaleimide and prepreg resin therefrom
US4689378A (en) * 1985-12-16 1987-08-25 Ciba-Geigy Corporation Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol
EP0230741B1 (de) * 1986-01-18 1993-08-11 Technochemie GmbH - Verfahrenstechnik Härtbare Harze
CA1274048A (en) * 1986-07-15 1990-09-11 Linda A. Domeier Bismaleimide formulations containing olefinic ether modifiers
US4812511A (en) * 1986-07-15 1989-03-14 Amoco Corporation Ethylenically-unsaturated ethers of alkenyl phenols as reactive diluents for bismaleimides
EP0296112A3 (de) * 1987-06-18 1989-09-06 Ciba-Geigy Ag Lagerstabile härtbare Mischungen
US5003018A (en) * 1988-04-29 1991-03-26 Basf Aktiengesellschaft Slurry mixing of bismaleimide resins
DE3827120A1 (de) * 1988-08-10 1990-02-15 Basf Ag Hitzehaertbare bismaleinimid-copolymere sowie 2,6-disubstituierte pyridin-verbindungen als comonomere
DE3924867A1 (de) * 1989-07-27 1991-01-31 Basf Ag Bismaleinimid-harze
DE3929386A1 (de) * 1989-09-05 1991-03-07 Basf Ag Hitzehaertbare bismaleinimidharze
US5143969A (en) * 1991-06-24 1992-09-01 Basf Aktiengesellschaft Heat-curable bismaleimide molding compositions
JPH05155984A (ja) * 1991-12-04 1993-06-22 Meidensha Corp 耐熱性樹脂組成物

Also Published As

Publication number Publication date
ES2164926T3 (es) 2002-03-01
DK0861280T3 (da) 2002-04-08
CA2237331A1 (en) 1997-05-22
DE69617996T2 (de) 2002-07-04
DE69617996D1 (de) 2002-01-24
US5955566A (en) 1999-09-21
EP0861280A1 (de) 1998-09-02
JP2000500795A (ja) 2000-01-25
WO1997018255A1 (en) 1997-05-22
CA2237331C (en) 2007-06-19
EP0861280B1 (de) 2001-12-12

Similar Documents

Publication Publication Date Title
DE69621635D1 (de) Aushärtendes Bismaleinimid Polymer für Kleb- und Verbundwerkstoffe
ATE210693T1 (de) Wärmehärtende polymere für verbundwerkstoff- und klebstoffanwendungen
NO20004475D0 (no) Fibermateriale preimpregnert med polymer
ATE346107T1 (de) Flexibles polymerelement zur erhöhung der festigkeit von prepregs
ES8800863A1 (es) Procedimiento para fabricar un material compuesto reforzado con fibras a base de dos polimeros termoplasticos.
MY113239A (en) Adhesive, adhesive film and adhesive-backed metal foil
ES8705293A1 (es) Procedimiento para conformar un cuerpo de material termoconformable, que contiene filamentos continuos
TW200517462A (en) Acrylic adhesive sheet
FR2820359B1 (fr) Procede et dispositif de moulage d'une piece en materiau composite, et moyeu d'helice d'ulm qu'ils permettent de realiser
ES8305020A1 (es) Un metodo de formar un articulo rigido chapado con metal.
GB1291759A (en) Carbon-glass composite and manufacturing method therefor
KR900014911A (ko) 적층형 렌즈 구조물
EP0133281A3 (de) Härtbare faserverstärkte Epoxyharzzubereitung
EP0330338A3 (de) Composit mit niedriger Wärmeabgabe
AU585849B2 (en) Curable epoxy resin compositions
ES456022A1 (es) Un metodo para la obtencion de materiales fibrosos reforza- dos.
NO954436D0 (no) Fremgangsmåte for harpiks-transpresstöping
KR890006777A (ko) 페놀이 변형된 에폭시 접착제
EP0159482A3 (de) Harzverbundmaterial mit kontrolliertem Fluss und Klebrigkeit
ES8707143A1 (es) Un procedimiento para producir un material compuesto vulcanizado
MY115930A (en) Thermosetting adhesive and adhesive sheet thereof
GB1321983A (en) Bearing structure
EP0233700A3 (de) Formen einer mit Fasern verstärkter Verbundarmierung
CN220665198U (zh) 一种复合板材
BR8902980A (pt) Composito de fluor-polimero