JP2000354950A - 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 - Google Patents

研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Info

Publication number
JP2000354950A
JP2000354950A JP16789299A JP16789299A JP2000354950A JP 2000354950 A JP2000354950 A JP 2000354950A JP 16789299 A JP16789299 A JP 16789299A JP 16789299 A JP16789299 A JP 16789299A JP 2000354950 A JP2000354950 A JP 2000354950A
Authority
JP
Japan
Prior art keywords
polishing
polishing pad
polished
pad
hard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16789299A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000354950A5 (enExample
Inventor
Akihiko Saguchi
明彦 佐口
Wataru Takahashi
渉 高橋
Junji Watanabe
純二 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP16789299A priority Critical patent/JP2000354950A/ja
Publication of JP2000354950A publication Critical patent/JP2000354950A/ja
Publication of JP2000354950A5 publication Critical patent/JP2000354950A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP16789299A 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 Pending JP2000354950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Publications (2)

Publication Number Publication Date
JP2000354950A true JP2000354950A (ja) 2000-12-26
JP2000354950A5 JP2000354950A5 (enExample) 2006-02-23

Family

ID=15858010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16789299A Pending JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Country Status (1)

Country Link
JP (1) JP2000354950A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006062058A (ja) * 2004-08-30 2006-03-09 Fujibo Holdings Inc 仕上げ研磨用研磨布及び研磨布の製造方法
US7192340B2 (en) 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP2008068334A (ja) * 2006-09-12 2008-03-27 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2008194797A (ja) * 2007-02-15 2008-08-28 Mezoteku Dia Kk 表面研磨方法と表面研磨装置と表面研磨板
JP2009269128A (ja) * 2008-05-08 2009-11-19 Disco Abrasive Syst Ltd 研削装置及び研削方法
JP2010094806A (ja) * 2010-02-04 2010-04-30 Mezoteku Dia Kk 表面研磨方法と表面研磨装置と表面研磨板
JP2011230205A (ja) * 2010-04-26 2011-11-17 Fujibo Holdings Inc 研磨パッドおよび研磨パッドの製造方法
JP2012101333A (ja) * 2010-11-11 2012-05-31 Fujibo Holdings Inc 研磨パッドおよび研磨パッドの製造方法
US9960048B2 (en) 2013-02-13 2018-05-01 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
CN109909868A (zh) * 2019-04-23 2019-06-21 蚌埠中光电科技有限公司 一种tft-lcd玻璃面研磨装置及方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7762870B2 (en) 2000-12-01 2010-07-27 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad
US7192340B2 (en) 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
US7329170B2 (en) 2000-12-01 2008-02-12 Toyo Tire & Rubber Co., Ltd. Method of producing polishing pad
US7641540B2 (en) 2000-12-01 2010-01-05 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad
JP2006062058A (ja) * 2004-08-30 2006-03-09 Fujibo Holdings Inc 仕上げ研磨用研磨布及び研磨布の製造方法
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP2008068334A (ja) * 2006-09-12 2008-03-27 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2008194797A (ja) * 2007-02-15 2008-08-28 Mezoteku Dia Kk 表面研磨方法と表面研磨装置と表面研磨板
JP2009269128A (ja) * 2008-05-08 2009-11-19 Disco Abrasive Syst Ltd 研削装置及び研削方法
JP2010094806A (ja) * 2010-02-04 2010-04-30 Mezoteku Dia Kk 表面研磨方法と表面研磨装置と表面研磨板
JP2011230205A (ja) * 2010-04-26 2011-11-17 Fujibo Holdings Inc 研磨パッドおよび研磨パッドの製造方法
JP2012101333A (ja) * 2010-11-11 2012-05-31 Fujibo Holdings Inc 研磨パッドおよび研磨パッドの製造方法
US9960048B2 (en) 2013-02-13 2018-05-01 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
US10453693B2 (en) 2013-02-13 2019-10-22 Showa Denko K.K. Surface machining method for single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface machining single crystal SiC substrate
CN109909868A (zh) * 2019-04-23 2019-06-21 蚌埠中光电科技有限公司 一种tft-lcd玻璃面研磨装置及方法
CN109909868B (zh) * 2019-04-23 2023-11-21 蚌埠中光电科技有限公司 一种tft-lcd玻璃面研磨装置及方法

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