JP2000354950A5 - - Google Patents

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Publication number
JP2000354950A5
JP2000354950A5 JP1999167892A JP16789299A JP2000354950A5 JP 2000354950 A5 JP2000354950 A5 JP 2000354950A5 JP 1999167892 A JP1999167892 A JP 1999167892A JP 16789299 A JP16789299 A JP 16789299A JP 2000354950 A5 JP2000354950 A5 JP 2000354950A5
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JP
Japan
Prior art keywords
polishing pad
polishing
polished
open cells
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999167892A
Other languages
English (en)
Japanese (ja)
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JP2000354950A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP16789299A priority Critical patent/JP2000354950A/ja
Priority claimed from JP16789299A external-priority patent/JP2000354950A/ja
Publication of JP2000354950A publication Critical patent/JP2000354950A/ja
Publication of JP2000354950A5 publication Critical patent/JP2000354950A5/ja
Pending legal-status Critical Current

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JP16789299A 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 Pending JP2000354950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Publications (2)

Publication Number Publication Date
JP2000354950A JP2000354950A (ja) 2000-12-26
JP2000354950A5 true JP2000354950A5 (enExample) 2006-02-23

Family

ID=15858010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16789299A Pending JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Country Status (1)

Country Link
JP (1) JP2000354950A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100379522C (zh) 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
JP4566660B2 (ja) * 2004-08-30 2010-10-20 富士紡ホールディングス株式会社 仕上げ研磨用研磨布及び研磨布の製造方法
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP4942170B2 (ja) * 2006-09-12 2012-05-30 東洋ゴム工業株式会社 研磨パッド
JP4737689B2 (ja) * 2007-02-15 2011-08-03 メゾテクダイヤ株式会社 表面研磨方法と表面研磨装置と表面研磨板
JP5172457B2 (ja) * 2008-05-08 2013-03-27 株式会社ディスコ 研削装置及び研削方法
JP5050064B2 (ja) * 2010-02-04 2012-10-17 メゾテクダイヤ株式会社 表面研磨方法と表面研磨装置と表面研磨板
JP5544213B2 (ja) * 2010-04-26 2014-07-09 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP5639854B2 (ja) * 2010-11-11 2014-12-10 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP6016301B2 (ja) 2013-02-13 2016-10-26 昭和電工株式会社 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート
CN109909868B (zh) * 2019-04-23 2023-11-21 蚌埠中光电科技有限公司 一种tft-lcd玻璃面研磨装置及方法

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