JP2000354821A - Application apparatus - Google Patents

Application apparatus

Info

Publication number
JP2000354821A
JP2000354821A JP11170906A JP17090699A JP2000354821A JP 2000354821 A JP2000354821 A JP 2000354821A JP 11170906 A JP11170906 A JP 11170906A JP 17090699 A JP17090699 A JP 17090699A JP 2000354821 A JP2000354821 A JP 2000354821A
Authority
JP
Japan
Prior art keywords
plate
varnish
coating
printed wiring
hanging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11170906A
Other languages
Japanese (ja)
Other versions
JP4491856B2 (en
Inventor
Takeshi Kawai
毅 川合
Hideki Asano
秀樹 浅野
Makoto Kurachi
真琴 倉地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP17090699A priority Critical patent/JP4491856B2/en
Publication of JP2000354821A publication Critical patent/JP2000354821A/en
Application granted granted Critical
Publication of JP4491856B2 publication Critical patent/JP4491856B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an applicator which can supply air uniformly to a plate to be coated and cure varnish enough by the end of drying. SOLUTION: An apparatus comprises a vertical varnish applicator which supplies a printed-wiring substrate 7 between application rolls of a pair and applies varnish 78, a suspension conveyer 3 which holds the substrate 7 pushed out above from the applicator and conveyes the suspended substrate 7, and a dryer 64 which supplies air from above to the substrate 7 being conveyed. The conveyer 3 comprises a pair of suspension chucks 32 for holding the right end part 74 and the left end part 73 of the substrate 7 and a jig plate 31 which fixed the chucks 32. The jig plate 31, at least between the chucks, has a middle part 311 the plate width P of which is 0.5-7 times as large as the thickness T of the substrate 7.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【技術分野】本発明は,例えばプリント配線基板等の被
塗布板にワニスを塗布する塗布設備に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus for applying a varnish to a plate to be coated such as a printed wiring board.

【0002】[0002]

【従来技術】プリント配線基板等の被塗布板にワニスを
塗布する塗布設備においては,被塗布板にワニスを塗布
した後,ワニスを乾燥させるための乾燥機へ被塗布板を
搬送する場合がある。この場合には,ラックにより複数
の被塗布板を一括して搬送し,乾燥機内にラックを載置
してワニスを乾燥する方法が採用されてきた。しかし,
ラックを用いた搬送,乾燥方法においては,被塗布板を
ラックへ出し入れすることで搬送が断続的になる。ま
た,ラックへの出し入れの際に被塗布板が損傷するおそ
れがある。そのため,ラックを用いることのない搬送,
乾燥方法が望まれていた。
2. Description of the Related Art In a coating equipment for applying a varnish to a plate to be coated such as a printed wiring board, there is a case where after the varnish is coated on the plate to be coated, the plate is transported to a dryer for drying the varnish. . In this case, a method has been adopted in which a plurality of plates to be coated are collectively conveyed by a rack, and the varnish is dried by placing the rack in a dryer. However,
In the transfer and drying method using a rack, the transfer is intermittent by taking the plate to be coated in and out of the rack. Further, the plate to be coated may be damaged when the rack is put in and out of the rack. Therefore, transport without using racks,
A drying method was desired.

【0003】その一方で,発明者らは,生産効率向上の
ため,縦型ワニス塗布装置(図3)を用いてワニスを塗
布することを考えている。上記縦型ワニス塗布装置は,
前後一対の塗布ロールを有し,塗布ロールの間に下方か
ら上方へ被塗布板を供給してワニスを塗布するものであ
る。また,ワニス塗布後の被塗布板は,上記塗布ロール
間から上方に押出される。
On the other hand, the inventors have considered applying varnish using a vertical varnish applicator (FIG. 3) in order to improve production efficiency. The vertical varnish coating device is
It has a pair of front and rear application rolls, and supplies a plate to be applied from below to above between the application rolls to apply varnish. Further, the plate to be coated after the varnish coating is extruded upward from between the coating rolls.

【0004】そのため,発明者らは,上記縦型ワニス塗
布装置から上方へ押出された被塗布板を,吊り下げ搬送
機(図1,図2)を用いて取り上げ,上記ラックに入れ
ることなく1枚ずつ搬送すると共に,乾燥機(図4)を
用いて搬送中の被塗布板に送風し,ワニスを乾燥させる
ことを考えている。
[0004] Therefore, the inventors take up the plate to be coated extruded upward from the vertical varnish coating device by using a hanging transfer machine (FIGS. 1 and 2), and without removing the plate into the rack. It is considered that the varnish is dried while being conveyed one by one and using a dryer (FIG. 4) to blow air to the plate being conveyed.

【0005】上記塗布設備においては,上記吊り下げ搬
送機は,治具プレートの両端に固定した一対の吊り下げ
チャックにより上記被塗布板の両端を保持して,該被塗
布板を搬送する。また,その間,上記乾燥機は,上記吊
り下げ搬送機の上方より上記被塗布板に風を送ることに
より,ワニスの乾燥を行う。
[0005] In the above-mentioned coating equipment, the above-mentioned suspending and conveying machine transports the to-be-coated plate while holding both ends of the to-be-coated plate by a pair of hanging chucks fixed to both ends of the jig plate. In the meantime, the dryer dries the varnish by sending air to the plate to be applied from above the suspending and transferring machine.

【0006】[0006]

【解決しようとする課題】しかしながら,上記吊り下げ
搬送機と乾燥機とを設けた塗布設備においても,次の問
題が残されている。即ち,上記治具プレートは,上記吊
り下げチャックを固定しやすくするために水平方向に幅
広く形成してある。そのため,上記乾燥機より送られて
きた風を遮ってしまい,上記治具プレートの下方におい
て対流が発生する。それ故,上記被塗布板に当たる風が
不均一になり,乾燥終了時において,ワニスが充分に硬
化されていない半硬化部分が残ってしまうという問題が
ある。
However, the following problems still remain in the coating equipment provided with the above-mentioned hanging conveyor and dryer. That is, the jig plate is formed wide in the horizontal direction to facilitate fixing of the hanging chuck. Therefore, the wind sent from the dryer is blocked, and convection occurs below the jig plate. Therefore, there is a problem in that the wind hitting the plate to be coated becomes uneven, and a half-cured portion where the varnish is not sufficiently cured remains at the end of drying.

【0007】本発明は,かかる従来の問題点に鑑みてな
されたもので,上記被塗布板に対して均一に風を当てる
ことができ,乾燥終了時までにワニスを充分に硬化させ
ることができる塗布設備を提供しようとするものであ
る。
The present invention has been made in view of such a conventional problem, and can uniformly blow air to the plate to be coated, and sufficiently cure the varnish by the end of drying. It is intended to provide a coating facility.

【0008】[0008]

【課題の解決手段】請求項1に記載の発明は,一対の塗
布ロールの間に下方から上方へ被塗布板を供給して該被
塗布板の表側面及び裏側面にワニスを塗布する縦型ワニ
ス塗布装置と,該縦型ワニス塗布装置から上方へ押出さ
れた被塗布板においてワニスが塗布されていない左端部
及び右端部を保持し,該被塗布板を吊り下げた状態で搬
送する吊り下げ搬送機と,該吊り下げ搬送機により搬送
されている被塗布板に対して,上記吊り下げ搬送機の上
方より風を送る乾燥機とからなり,上記吊り下げ搬送機
は,上記被塗布板の左端部及び右端部を保持する一対の
吊り下げチャックと,該吊り下げチャックを両端に固定
した治具プレートとよりなり,かつ該治具プレートは,
少なくとも上記一対の吊り下げチャック間において,そ
のプレート幅Pが上記被塗布板の厚みTの0.5〜7倍
である中間部を有することを特徴とする塗布設備にあ
る。
According to a first aspect of the present invention, there is provided a vertical mold for supplying a plate to be coated from below to above between a pair of coating rolls and applying a varnish to the front and rear surfaces of the plate. A varnish coating device, and a suspension for holding the left and right ends of the plate to be coated extruded upward from the vertical varnish coating device where no varnish is applied, and transporting the plate in a suspended state. A transport device, and a dryer for blowing air from above the suspended transport device to the coated substrate transported by the suspended transport device. It consists of a pair of hanging chucks that hold the left end and the right end, and a jig plate having the hanging chuck fixed to both ends.
The coating equipment is characterized in that at least between the pair of hanging chucks has an intermediate portion whose plate width P is 0.5 to 7 times the thickness T of the plate to be coated.

【0009】本発明において最も注目すべきことは,上
記吊り下げ搬送機の上方より被塗布板に対して風を送る
乾燥機を設けてあり,上記吊り下げ搬送機の治具プレー
トは,その中間部のプレート幅Pを上記被塗布板の厚み
Tの0.5〜7倍としていることである。
What is most notable in the present invention is that a dryer is provided for sending air to the plate to be coated from above the hanging carrier, and the jig plate of the hanging carrier is provided in the middle. The plate width P of the portion is 0.5 to 7 times the thickness T of the plate to be coated.

【0010】次に,本発明の作用につき説明する。本発
明においては,上記被塗布板にワニスを塗布するにあた
って,上記縦型ワニス塗布装置の塗布ロール間に下方か
ら上方へ上記被塗布板を供給し,該被塗布板の両面に塗
布ロール上のワニスを塗布する。これにより,上記被塗
布板の両面には,その左端部及び右端部を除いて,ワニ
スが塗布される。なお,上記縦型ワニス塗布装置から上
方へ押出されたワニス塗布直後の被塗布板は,上記一対
の塗布ロールに両面を支持され,立てられた状態であ
る。
Next, the operation of the present invention will be described. In the present invention, when applying varnish to the plate to be coated, the plate to be coated is supplied from below to above between the coating rolls of the vertical varnish coating device, and both sides of the plate to be coated are coated on the coating roll. Apply varnish. As a result, varnish is applied to both surfaces of the plate except for the left end and the right end. The plate to be applied immediately after the varnish application, which has been extruded upward from the vertical varnish application device, is in a state in which both sides are supported by the pair of application rolls and is upright.

【0011】次いで,上記吊り下げ搬送機は,上記被塗
布板においてワニスが塗布されていない左端部及び右端
部を保持し,該ワニス塗布直後の被塗布板を取り上げ,
上記乾燥機へ搬送する。上記乾燥機は,上記吊り下げ搬
送機により搬送中の被塗布板に対して,上記吊り下げ搬
送機の上方より風を送ることにより,上記被塗布板に塗
布されたワニスを乾燥させる。
Next, the hanging carrier holds the left end and the right end of the plate to which the varnish is not applied, picks up the plate immediately after the varnish application,
Convey to the dryer. The dryer dries the varnish applied to the plate to be coated by sending air from above the hanging transporter to the plate being transported by the hanging transporter.

【0012】本発明によれば,上記治具プレートの中間
部のプレート幅Pを,上記のごとく,上記被塗布板の厚
みTの0.5〜7倍の大きさとすることにより,上記乾
燥機より送られてきた風を遮る部分を大幅に減少させて
いる(図1,図2)。そのため,上記治具プレートの下
方における対流の発生を抑え,上記被塗布板に均一に風
を当てることができる。それ故,乾燥終了時までにワニ
スを充分に硬化させることができる。
According to the present invention, by setting the plate width P of the intermediate portion of the jig plate to be 0.5 to 7 times the thickness T of the plate to be coated as described above, The part that blocks the incoming wind is greatly reduced (Figs. 1 and 2). Therefore, the generation of convection below the jig plate is suppressed, and the plate to be coated can be uniformly blown. Therefore, the varnish can be sufficiently cured by the end of drying.

【0013】より好ましくは,上記治具プレートの中間
部のプレート幅Pを,上記被塗布板の厚みTの0.5〜
3倍とすることが望ましい。この場合には,上記対流の
発生を,より確実に防止することができる。
[0013] More preferably, the plate width P at the intermediate portion of the jig plate is set to 0.5 to 0.5 of the thickness T of the plate to be coated.
It is desirable to make it three times. In this case, the occurrence of the convection can be more reliably prevented.

【0014】なお,上記治具プレートの中間部のプレー
ト幅Pが,上記被塗布板の厚みTの0.5倍未満である
場合には,上記治具プレートの強度が出にくい。また,
上記被塗布板の厚みTの7倍を超える場合には,上記治
具プレートの下方において対流が発生する。
When the plate width P at the intermediate portion of the jig plate is less than 0.5 times the thickness T of the plate to be coated, the jig plate hardly has sufficient strength. Also,
If the thickness exceeds seven times the thickness T of the plate, convection occurs below the jig plate.

【0015】次に,請求項2の発明のように,上記被塗
布板としては,プリント配線基板を用いることができ
る。この場合には,上記塗布設備において上記被塗布板
に上記ワニスを塗布することにより,上記プリント配線
基板に対して上記ワニスよりなる絶縁層を形成すること
ができる。
Next, a printed wiring board can be used as the plate to be coated. In this case, an insulating layer made of the varnish can be formed on the printed wiring board by applying the varnish to the plate to be applied in the coating facility.

【0016】上記プリント配線基板は,例えば樹脂基板
の表面に金属メッキを施すことにより導体回路を形成し
たもので,その上に上記のごとくワニスを塗布する。特
に,上記プリント配線基板は精密部品であり,上記ワニ
スを塗布した部分が未乾燥のまま後処理されたときに
は,後処理を正確に行うことができず,層間の絶縁不
良,導通不良という問題が発生する。本発明の塗布設備
によれば,上記治具プレートには上記プレート幅Pの中
間部を設けているので,確実に上記ワニスを塗布した部
分に送風でき,ワニスを乾燥させることができる。その
ため,後処理を正確に行うことができるので,層間の絶
縁不良,導通不良を防止することができる。
The printed wiring board is formed by forming a conductive circuit by, for example, applying metal plating to the surface of a resin board, and a varnish is applied thereon as described above. In particular, the printed wiring board is a precision component, and when the varnish-applied portion is post-processed without being dried, the post-process cannot be performed accurately, resulting in a problem of poor insulation between layers and poor conduction. appear. According to the coating equipment of the present invention, since the jig plate is provided with an intermediate portion of the plate width P, it is possible to reliably blow air to the portion where the varnish is applied, and to dry the varnish. As a result, post-processing can be performed accurately, and insulation failure and conduction failure between layers can be prevented.

【0017】なお,本発明は,プリント配線基板に限ら
ず,他の板状の被塗布板にも適用できる。また,上記ワ
ニスは,絶縁層形成用に限らず,ソルダーレジスト等の
他のワニスであってもよい。
The present invention can be applied not only to a printed wiring board but also to other plate-shaped coated plates. The varnish is not limited to an insulating layer, but may be another varnish such as a solder resist.

【0018】[0018]

【発明の実施の形態】実施形態例 本発明の実施形態例にかかる塗布設備につき,図1〜図
5を用いて説明する。本例においては,多層プリント配
線基板70(図5)の製造に上記塗布設備を適用する例
を示す。本例の塗布設備は,図1〜図5に示すごとく,
一対の塗布ロール11の間に下方から上方へ被塗布板と
してのプリント配線基板7を供給して,該プリント配線
基板7の表側面71及び裏側面72にワニス78を塗布
する縦型ワニス塗布装置1を有する(図3)。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment A coating facility according to an embodiment of the present invention will be described with reference to FIGS. In this example, an example is shown in which the above-described coating equipment is applied to the manufacture of a multilayer printed wiring board 70 (FIG. 5). As shown in FIGS.
A vertical varnish coating apparatus for supplying a printed wiring board 7 as a plate to be coated from below to above between a pair of coating rolls 11 and coating a varnish 78 on a front side 71 and a back side 72 of the printed wiring board 7. 1 (FIG. 3).

【0019】また,上記塗布設備は,上記縦型ワニス塗
布装置1から上方へ押出されたプリント配線基板7にお
いてワニス78が塗布されていない左端部73及び右端
部74を保持し,該プリント配線基板7を吊り下げた状
態で搬送する吊り下げ搬送機3を有する(図1,図
2)。また,上記塗布設備は,上記吊り下げ搬送機3に
より搬送されているプリント配線基板7に対して,上記
吊り下げ搬送機3の上方より風を送る乾燥機64〜67
を有する(図4)。
The coating equipment holds the left end 73 and the right end 74 of the printed wiring board 7 extruded upward from the vertical varnish coating apparatus 1 on which the varnish 78 is not applied. 7 is provided with a hanging conveyor 3 for conveying in a suspended state (FIGS. 1 and 2). Further, the coating equipment includes dryers 64 to 67 for sending air from above the hanging carrier 3 to the printed wiring board 7 carried by the hanging carrier 3.
(FIG. 4).

【0020】上記吊り下げ搬送機3は,図1,図2に示
すごとく,上記プリント配線基板7の左端部73及び右
端部74を保持する一対の吊り下げチャック32と,該
吊り下げチャック32を両端に固定した治具プレート3
1とよりなる。かつ該治具プレート31は,少なくとも
上記一対の吊り下げチャック32間において,そのプレ
ート幅Pが上記プリント配線基板7の厚みTの0.5〜
7倍である中間部311を有する。
As shown in FIGS. 1 and 2, the hanging carrier 3 includes a pair of hanging chucks 32 for holding the left end 73 and the right end 74 of the printed wiring board 7, and the hanging chuck 32. Jig plate 3 fixed to both ends
Consists of 1. The jig plate 31 has a plate width P at least between the pair of hanging chucks 32 of 0.5 to less than the thickness T of the printed wiring board 7.
It has a middle part 311 which is 7 times.

【0021】上記塗布設備について概説する。本例の塗
布設備は,プリント配線基板に対してワニス塗布を2回
行うことにより,図5に示すごとく,ワニスより形成さ
れた絶縁層81,82をプリント配線基板7に積層させ
た多層プリント配線基板70を製造しようとするもので
ある。
The above-mentioned coating equipment will be outlined. The coating equipment of the present embodiment performs varnish coating twice on a printed wiring board, and as shown in FIG. 5, a multilayer printed wiring in which insulating layers 81 and 82 formed of varnish are laminated on a printed wiring board 7. The substrate 70 is to be manufactured.

【0022】上記塗布設備においては,図4に示すごと
く,搬入用のコンベヤ61の搬送方向に沿って,順に,
塗布前計量器62,反転機63,1台目の縦型ワニス塗
布装置1及び塗布後計量器2,乾燥機64を配設してあ
る。上記縦型ワニス塗布装置1,塗布後計量器2,乾燥
機64の上方に配設された上レール34には,上記吊り
下げ搬送機3が多数取付けられている。なお,これら吊
り下げ搬送機3は,上記乾燥機64の内部を通過できる
よう配設されている。
In the above-described coating equipment, as shown in FIG.
A pre-coating meter 62, a reversing machine 63, a first vertical varnish coating device 1, a post-coating meter 2, and a dryer 64 are provided. On the upper rail 34 provided above the vertical varnish coating device 1, the post-coating measuring device 2, and the dryer 64, a large number of the hanging transfer devices 3 are mounted. Note that these suspending and conveying machines 3 are arranged so as to pass through the inside of the dryer 64.

【0023】また,上記乾燥機64と平行に,乾燥機6
5,66,67を配設してある。なお,これらの上方に
は,上記上レール34と同様に,複数の吊り下げ搬送機
3を取付けた上レール35,36,37が配設されてい
る。上記上レール34に取付けた吊り下げ搬送機3は,
1台目の縦型ワニス塗布装置1の上方から塗布後計量器
2の上方へ搬送される。また,上記上レール35,37
に取付けた吊り下げ搬送機3は,上記上レール34に取
付けた吊り下げ搬送機3と反対方向に搬送され,上記上
レール36に取付けた吊り下げ搬送機3は,同じ方向に
搬送される。
In parallel with the dryer 64, the dryer 6
5, 66, 67 are provided. Above these, upper rails 35, 36, 37 to which a plurality of hanging transporters 3 are attached are arranged similarly to the upper rail 34. The hanging carrier 3 attached to the upper rail 34 is
It is conveyed from above the first vertical varnish coating device 1 to above the post-coating meter 2. In addition, the upper rails 35, 37
The suspended carrier 3 attached to the upper rail 34 is carried in the opposite direction to the suspended carrier 3 attached to the upper rail 34, and the suspended carrier 3 attached to the upper rail 36 is carried in the same direction.

【0024】また,上記上レール34,35間には,こ
れらと直角方向に往復移動する移載ローダ68を配設し
てある。また,上記上レール35,36間には,上記塗
布前計量器62,反転機63を配設してあり,上記上レ
ール36の下方には,2台目の縦型ワニス塗布装置1及
び塗布後計量器2を配設してある。また,上記上レール
36,37間には,上記と同様に,上記移載ローダ(図
示略)を配設してある。なお,上記上レール37の後方
には,乾燥後計量器69,搬出用のコンベヤ61を配設
してある。
A transfer loader 68 is provided between the upper rails 34 and 35 so as to reciprocate in a direction perpendicular to these rails. The pre-coating meter 62 and the reversing machine 63 are disposed between the upper rails 35 and 36, and a second vertical varnish coating device 1 and a coating device are disposed below the upper rail 36. A rear measuring device 2 is provided. The transfer loader (not shown) is disposed between the upper rails 36 and 37 in the same manner as described above. A measuring device 69 after drying and a conveyor 61 for carrying out are disposed behind the upper rail 37.

【0025】以下,詳説する。上記1台目の縦型ワニス
塗布装置1は,基板側の絶縁層81を形成するためのワ
ニスを上記プリント配線基板7に塗布するものであり,
上記2台目の縦型ワニス塗布装置1は,絶縁層82を形
成するためのワニスを上記絶縁層81に塗布するもので
ある。
The details will be described below. The first vertical varnish coating apparatus 1 is for applying a varnish for forming the insulating layer 81 on the substrate side to the printed wiring board 7.
The second vertical varnish coating device 1 applies a varnish for forming the insulating layer 82 to the insulating layer 81.

【0026】上記2台の縦型ワニス塗布装置1は,図3
に示すごとく,軸芯を水平に配設された前後一対の塗布
ロール11を有する。また,上記縦型ワニス塗布装置1
は,上記一対の塗布ロール11間の距離を変化させるこ
とにより,塗布圧を調節する塗布圧調節機構(図示略)
を有する。
The above two vertical varnish coating apparatuses 1 are shown in FIG.
As shown in (1), there is a pair of front and rear coating rolls 11 whose shaft cores are arranged horizontally. In addition, the vertical varnish coating device 1
Is a coating pressure adjusting mechanism (not shown) for adjusting the coating pressure by changing the distance between the pair of coating rolls 11.
Having.

【0027】上記塗布ロール11は,その外周面の一部
がワニス供給装置12内に容れられたワニス78に接し
ており,自身の回転により,その外周面にはワニス78
が常時供給されている。なお,1台目の縦型ワニス塗布
装置1に供給されるワニスは,例えばエポキシ樹脂等の
樹脂原料と硬化剤等の副原料とよりなり,2台目の縦型
ワニス塗布装置1に供給されるワニスは,上記樹脂原料
及び副原料にフィラーを含有させたものである。
A part of the outer peripheral surface of the coating roll 11 is in contact with a varnish 78 contained in the varnish supply device 12, and the varnish 78 is applied to the outer peripheral surface by its own rotation.
Is always supplied. The varnish supplied to the first vertical varnish coating device 1 is composed of, for example, a resin material such as an epoxy resin and an auxiliary material such as a curing agent, and is supplied to the second vertical varnish coating device 1. The varnish is obtained by adding a filler to the resin raw material and the auxiliary raw material.

【0028】上記縦型ワニス塗布装置1は,上記上レー
ル34の端部の下方に位置しており,その向きは,上記
塗布ロール11の軸芯が上記上レール34に対して垂直
になるよう配設されている(図4)。
The vertical varnish coating device 1 is located below the end of the upper rail 34 so that the axis of the coating roll 11 is perpendicular to the upper rail 34. (FIG. 4).

【0029】次に,上記吊り下げ搬送機3は,図1,図
2に示すごとく,上記治具プレート31を各上レールに
垂下状態で取付けており,その両端には上記一対の吊り
下げチャック32を配設している。上記一対の吊り下げ
チャック32間の距離Lは,上記プリント配線基板7に
塗布されるワニス78の幅Wよりも大きい。また,上記
吊り下げチャック32は,互いに離反,近接し,上記プ
リント配線基板7を挟持するための爪部321,322
よりなる。
Next, as shown in FIGS. 1 and 2, the hanging carrier 3 has the jig plate 31 attached to each of the upper rails in a hanging state. 32 are arranged. The distance L between the pair of hanging chucks 32 is larger than the width W of the varnish 78 applied to the printed wiring board 7. The hanging chucks 32 are separated from each other and are close to each other, and are claw portions 321 and 322 for holding the printed wiring board 7 therebetween.
Consisting of

【0030】上記治具プレート31の中間部311は,
上記一対の吊り下げチャック32間に配設されており,
かつ上記吊り下げチャック32に保持されたプリント配
線基板7の上方に配設されている。また,上記中間部3
11のプレート幅Pは2mmであり,上記プリント配線
基板7の厚みTは1mmである。本例においては,上記
プレート幅Pは上記プリント配線基板7の厚みTの2倍
である。
The intermediate portion 311 of the jig plate 31 is
It is disposed between the pair of hanging chucks 32,
Further, it is disposed above the printed wiring board 7 held by the hanging chuck 32. In addition, the intermediate part 3
11 has a plate width P of 2 mm, and the printed wiring board 7 has a thickness T of 1 mm. In this example, the plate width P is twice the thickness T of the printed wiring board 7.

【0031】次に,上記塗布後計量器2は,図4に示す
ごとく,測定結果の表示部を有する本体部21と,その
上部に水平に配設された測定台22とを有する。測定台
22には,断面コ字状の縦型ガイド23,24が立設し
てある。次に,上記乾燥機64〜67としては,例えば
トンネル乾燥機等を用いることができる。なお,上記コ
ンベヤ61としては,例えばローラコンベヤ等を用いる
ことができる。
Next, as shown in FIG. 4, the post-coating meter 2 has a main body 21 having a display section for measurement results, and a measuring table 22 disposed horizontally above the main body. Vertical guides 23 and 24 having a U-shaped cross section are erected on the measuring table 22. Next, as the dryers 64 to 67, for example, a tunnel dryer can be used. As the conveyor 61, for example, a roller conveyor or the like can be used.

【0032】次に,上記移載ローダ68は,図4に示す
ごとく,上記上レール34〜37における吊り下げ搬送
機3の搬送方向と直角に配設された下レール上を往復す
る本体部681と,本体部681の両端に立設したアー
ム部に昇降可能に配設された一対の横チャック682と
よりなる。
Next, as shown in FIG. 4, the transfer loader 68 is a main body 681 that reciprocates on a lower rail disposed at a right angle to the transport direction of the hanging transporter 3 on the upper rails 34 to 37. And a pair of horizontal chucks 682 that can be moved up and down on arms that are provided upright at both ends of the main body 681.

【0033】次に,本例の作用につき説明する。本例の
塗布設備においては,図4に示すごとく,まず,上記搬
入用のコンベヤ61により,その上に載置された複数の
プリント配線基板7を連続的に搬入し,横向きのまま上
記塗布前計量器62上を通過させて,個々のプリント配
線基板7の重量を測定する。
Next, the operation of this embodiment will be described. In the coating equipment of the present embodiment, as shown in FIG. 4, first, a plurality of printed wiring boards 7 placed thereon are continuously loaded by the above-mentioned loading conveyor 61, and are placed sideways before the coating. The weight of each printed wiring board 7 is measured by passing over the weighing device 62.

【0034】次いで,上記反転機63は,連続的に搬入
されてくるプリント配線基板7を1枚ずつ90度反転さ
せ,1台目の縦型ワニス塗布装置1の塗布ロール11間
に下方から上方へ向かって挿通し,上記プリント配線基
板7を上記縦型ワニス塗布装置1に供給する。
Next, the reversing machine 63 reverses the printed wiring boards 7 which are continuously carried in one by one by 90 degrees, and places the printed wiring boards 7 between the coating rolls 11 of the first vertical varnish coating apparatus 1 from below to above. Then, the printed wiring board 7 is supplied to the vertical varnish coating apparatus 1.

【0035】次いで,上記縦型ワニス塗布装置1は,図
3に示すごとく,上記プリント配線基板7の表側面71
及び裏側面72に対して,塗布ローラ11の外周面上の
ワニス78を塗布する。このとき,上記縦型ワニス塗布
装置1の塗布圧調整機構は,上記塗布前計量器62より
送られてきた重量データをもとに塗布圧を調節し,絶縁
層81となるべきワニス78の厚みを調節する。これに
より,上記縦型ワニス塗布装置1は,個々のプリント配
線基板7に応じて設定された重量分のワニス78を塗布
する。
Next, as shown in FIG. 3, the vertical varnish coating device 1 is used for the front side 71 of the printed wiring board 7.
Then, the varnish 78 on the outer peripheral surface of the application roller 11 is applied to the back side surface 72. At this time, the coating pressure adjusting mechanism of the vertical varnish coating device 1 adjusts the coating pressure based on the weight data sent from the pre-coating meter 62, and adjusts the thickness of the varnish 78 to be the insulating layer 81. Adjust Thus, the vertical varnish coating device 1 applies a varnish 78 of a weight set according to each printed wiring board 7.

【0036】これにより,上記プリント配線基板7に
は,その左端部73及び右端部74を除いて,両面にワ
ニス78が塗布される。なお,上記プリント配線基板7
は,上記反転機63に押し上げられて,上記縦型ワニス
塗布装置1から上方へ押出される。このワニス塗布直後
のプリント配線基板7は,上記一対の塗布ロール11に
両面を支持され,立てられた状態である。
Thus, the varnish 78 is applied to both sides of the printed wiring board 7 except for the left end 73 and the right end 74 thereof. The printed circuit board 7
Is pushed up by the reversing machine 63 and extruded upward from the vertical varnish coating device 1. Immediately after the varnish application, the printed wiring board 7 is supported by the pair of application rolls 11 on both sides and is in an upright state.

【0037】次いで,上記上レール34に取付けた吊り
下げ搬送機3は,図1,図2に示すごとく,下降して上
記吊り下げチャック32の爪部321,322を近接さ
せて,上記プリント配線基板7においてワニス78が塗
布されていない左端部73及び右端部74の上方部分を
挟持する。
Next, as shown in FIG. 1 and FIG. 2, the hanging carrier 3 attached to the upper rail 34 descends to bring the claw portions 321 and 322 of the hanging chuck 32 close to each other, and The upper part of the left end 73 and the right end 74 of the substrate 7 on which the varnish 78 is not applied is sandwiched.

【0038】次いで,図4に示すごとく,上記吊り下げ
搬送機3は,水平移動して上記塗布後計量器2の上方ま
で上記プリント配線基板7を搬送し,上記プリント配線
基板7を上記縦型ガイド23,24間に載置する。そし
て,上記塗布後計量器2により,プリント配線基板7の
重量測定を行う。これにより,ワニス塗布前後の測定値
の差から上記プリント配線基板7に塗布されたワニス重
量を読み取り,塗布されたワニス重量の良否を判定す
る。
Next, as shown in FIG. 4, the hanging and conveying machine 3 moves horizontally and conveys the printed wiring board 7 to above the post-coating meter 2, and transfers the printed wiring board 7 to the vertical type. It is placed between the guides 23 and 24. Then, the weight of the printed wiring board 7 is measured by the measuring device 2 after application. Thus, the weight of the varnish applied to the printed wiring board 7 is read from the difference between the measured values before and after the varnish application, and the quality of the applied varnish is determined.

【0039】重量測定後,上記吊り下げ搬送機3は,上
記プリント配線基板7を取り上げ,上記乾燥機64へ吊
り下げた状態で搬送する。そして,上記乾燥機64は,
その内部を通過していく複数のプリント配線基板7に対
して,上方より風を送り,各プリント配線基板7に塗布
されたワニス78を乾燥させる。この際,上記乾燥機6
4が送った風は,上記吊り下げ搬送機3の治具プレート
31に遮られることなく,上記プリント配線基板7のワ
ニス78全体に均一に当たる。
After the weight measurement, the hanging carrier 3 picks up the printed circuit board 7 and transports it to the dryer 64 in a suspended state. And the dryer 64 is
Wind is sent from above to the plurality of printed wiring boards 7 passing through the inside, and the varnish 78 applied to each printed wiring board 7 is dried. At this time, the dryer 6
The wind sent by 4 uniformly hits the entire varnish 78 of the printed wiring board 7 without being blocked by the jig plate 31 of the hanging transfer machine 3.

【0040】次いで,上記移載ローダ68は,図4に示
すごとく,上記上レール34に取付けた吊り下げ搬送機
3により搬送されてきたプリント配線基板7を,隣の上
レール35に取付けた吊り下げ搬送機3に移載する。具
体的には,上記移載ローダ68は,上記一対の横チャッ
ク682により上記プリント配線基板7の左端部73及
び右端部74の側方部分を挟持する。そして,上記本体
部681が下レール上を移動することにより,上記上レ
ール35に取付けた吊り下げ搬送機3まで上記プリント
配線基板7を搬送する。
Next, as shown in FIG. 4, the transfer loader 68 transfers the printed wiring board 7 transported by the suspension transporter 3 mounted on the upper rail 34 to the suspension mounted on the adjacent upper rail 35. It is transferred to the lowering conveyor 3. Specifically, the transfer loader 68 sandwiches the side portions of the left end 73 and the right end 74 of the printed wiring board 7 with the pair of horizontal chucks 682. Then, as the main body 681 moves on the lower rail, the printed wiring board 7 is transported to the hanging transporter 3 attached to the upper rail 35.

【0041】次いで,上記と同様に,上記上レール35
の吊り下げ搬送機3により,上記プリント配線基板7に
乾燥機65の内部を通過させる。これにより,上記プリ
ント配線基板7の表側面71及び裏側面72に絶縁層8
1が形成される(図5)。そして,再度,上記と同様
に,塗布前計量,反転,塗布,塗布後計量,乾燥を繰り
返す。これにより,上記絶縁層81の表側面811及び
裏側面812にフィラーを含有した絶縁層82が形成さ
れて,上記多層プリント配線基板70が完成する(図
5)。
Next, similarly to the above, the upper rail 35
The printed wiring board 7 is made to pass through the inside of the dryer 65 by the hanging conveyor 3. Thereby, the insulating layer 8 is formed on the front side surface 71 and the back side surface 72 of the printed wiring board 7.
1 is formed (FIG. 5). Then, the measurement before application, reversal, application, measurement after application, and drying are repeated again as described above. Thus, the insulating layer 82 containing the filler is formed on the front side surface 811 and the back side surface 812 of the insulating layer 81, and the multilayer printed wiring board 70 is completed (FIG. 5).

【0042】そして,図4に示すごとく,上記乾燥後計
量器69により上記多層プリント配線基板70の重量を
測定し,上記多層プリント配線基板70の良否を判定す
る。なお,上記塗布設備により製造された多層プリント
配線基板70には,露光,現像等の後処理が施される。
Then, as shown in FIG. 4, the weight of the multilayer printed wiring board 70 is measured by the measuring device 69 after drying, and the quality of the multilayer printed wiring board 70 is determined. The multilayer printed wiring board 70 manufactured by the above-mentioned coating equipment is subjected to post-processing such as exposure and development.

【0043】本例によれば,上記治具プレート31の中
間部311のプレート幅Pを,上記のごとく,上記プリ
ント配線基板7の厚みTの0.5〜7倍の大きさとする
ことにより,上記乾燥機64〜67より送られてきた風
を遮る部分を大幅に減少させている。そのため,上記治
具プレート31の下方における対流の発生を抑え,上記
プリント配線基板7に塗布されたワニス78に対して,
均一に風を当てることができる。それ故,乾燥終了時ま
でにワニス78を充分に硬化させることができる。
According to this embodiment, by setting the plate width P of the intermediate portion 311 of the jig plate 31 to 0.5 to 7 times the thickness T of the printed wiring board 7 as described above, The portion that blocks the wind sent from the dryers 64 to 67 is greatly reduced. Therefore, the generation of convection below the jig plate 31 is suppressed, and the varnish 78 applied to the printed circuit board 7 is removed.
The wind can be evenly applied. Therefore, the varnish 78 can be sufficiently cured by the end of the drying.

【0044】これにより,上記多層プリント配線基板7
の絶縁層81,82に上記ワニス78の半硬化部分が残
ることを確実に防止することができ,露光,現像等の後
処理を正確に行うことができる。
Thus, the multilayer printed wiring board 7
It is possible to reliably prevent the semi-cured portion of the varnish 78 from remaining on the insulating layers 81 and 82, and to accurately perform post-processing such as exposure and development.

【0045】また,本例においては,被塗布板としてプ
リント配線基板7を用いている。該プリント配線基板7
は,例えば樹脂基板の表面に金属メッキを施すことによ
り導体回路を形成したもので,その上に上記のごとくワ
ニス78を塗布する。
In this embodiment, a printed wiring board 7 is used as a plate to be coated. The printed wiring board 7
Is a conductive circuit formed by applying metal plating to the surface of a resin substrate, for example, and a varnish 78 is applied thereon as described above.

【0046】特に,上記プリント配線基板7は精密部品
であり,上記ワニス78を塗布した部分が未乾燥のまま
後処理されたときには,後処理を正確に行うことができ
ず,層間の絶縁不良,導通不良という問題が発生する。
本例の塗布設備によれば,上記のごとく,確実にワニス
78を乾燥させることでき,後処理を正確に行うことが
できるので,層間の絶縁不良,導通不良を防止すること
ができる。
In particular, the printed wiring board 7 is a precision component, and when the portion coated with the varnish 78 is post-processed in an undried state, the post-process cannot be performed accurately, resulting in poor insulation between layers. The problem of poor conduction occurs.
According to the coating equipment of the present embodiment, as described above, the varnish 78 can be surely dried and the post-processing can be performed accurately, so that insulation failure between layers and conduction failure can be prevented.

【0047】なお,本発明は,プリント配線基板に限ら
ず,他の板状の被塗布板にも適用できる。例えば,上記
ワニス78としては,絶縁層形成用樹脂の代わりに,ソ
ルダーレジスト等を用いることもできる。
The present invention can be applied not only to a printed wiring board but also to other plate-shaped coated plates. For example, as the varnish 78, a solder resist or the like can be used instead of the resin for forming the insulating layer.

【0048】[0048]

【発明の効果】上述のごとく,本発明によれば,上記被
塗布板に対して均一に風を当てることができ,乾燥終了
時までにワニスを充分に硬化させることができる塗布設
備を提供することができる。
As described above, according to the present invention, there is provided a coating apparatus capable of uniformly blowing air to the plate to be coated and sufficiently curing the varnish by the end of drying. be able to.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施形態例における,吊り下げ搬送機の斜視
図。
FIG. 1 is a perspective view of a suspended transfer machine according to an embodiment.

【図2】実施形態例における,吊り下げ搬送機の(a)
平面図,(b)正面図,(c)側面図。
FIG. 2 (a) of a hanging transfer machine according to an embodiment;
Plan view, (b) front view, (c) side view.

【図3】実施形態例における,縦型ワニス塗布装置の斜
視説明図。
FIG. 3 is a perspective explanatory view of a vertical varnish coating device in the embodiment.

【図4】実施形態例における,塗布設備の斜視説明図。FIG. 4 is an explanatory perspective view of a coating facility in the embodiment.

【図5】実施形態例における,プリント配線基板の断面
説明図。
FIG. 5 is an explanatory cross-sectional view of a printed wiring board in the embodiment.

【符号の説明】[Explanation of symbols]

1...縦型ワニス塗布装置, 2...塗布後計量器, 3...吊り下げ搬送機, 31...治具プレート, 311...中間部, 32...吊り下げチャック, 64〜67...乾燥機, 68...移載ローダ, 7...プリント配線基板, 78...ワニス, 1. . . 1. Vertical varnish coating device, . . 2. measuring device after application, . . 30. hanging conveyor, . . Jig plate, 311. . . Middle part, 32. . . Hanging chuck, 64-67. . . Dryer, 68. . . 6. transfer loader, . . Printed wiring board, 78. . . varnish,

───────────────────────────────────────────────────── フロントページの続き (72)発明者 倉地 真琴 岐阜県大垣市木戸町905番地 イビデン株 式会社大垣工場内 Fターム(参考) 4F042 AA06 AB00 DD09 DF02 DF07 DF16 ED01  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Makoto Kurachi 905 Kidocho, Ogaki-shi, Gifu F-term in the Ogaki Plant of IBIDEN CO., LTD. 4F042 AA06 AB00 DD09 DF02 DF07 DF16 ED01

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 一対の塗布ロールの間に下方から上方へ
被塗布板を供給して該被塗布板の表側面及び裏側面にワ
ニスを塗布する縦型ワニス塗布装置と,該縦型ワニス塗
布装置から上方へ押出された被塗布板においてワニスが
塗布されていない左端部及び右端部を保持し,該被塗布
板を吊り下げた状態で搬送する吊り下げ搬送機と,該吊
り下げ搬送機により搬送されている被塗布板に対して,
上記吊り下げ搬送機の上方より風を送る乾燥機とからな
り,上記吊り下げ搬送機は,上記被塗布板の左端部及び
右端部を保持する一対の吊り下げチャックと,該吊り下
げチャックを両端に固定した治具プレートとよりなり,
かつ該治具プレートは,少なくとも上記一対の吊り下げ
チャック間において,そのプレート幅Pが上記被塗布板
の厚みTの0.5〜7倍である中間部を有することを特
徴とする塗布設備。
1. A vertical varnish coating device for supplying a plate to be coated from below to above between a pair of coating rolls to coat varnish on the front and rear surfaces of the plate, and the vertical varnish coating. A suspending transporter for holding the left end and the right end of the plate to be coated extruded upward from which no varnish is applied, and transporting the plate in a suspended state; and For the plate being transported,
A drier for sending air from above the hanging carrier, wherein the hanging carrier comprises a pair of hanging chucks for holding a left end and a right end of the plate to be coated, and both ends of the hanging chuck. Consists of a jig plate fixed to
And a jig plate having an intermediate portion having a plate width P of 0.5 to 7 times the thickness T of the plate to be applied, at least between the pair of hanging chucks.
【請求項2】 請求項1において,上記被塗布板は,プ
リント配線基板であることを特徴とする塗布設備。
2. The coating equipment according to claim 1, wherein the plate to be coated is a printed wiring board.
JP17090699A 1999-06-17 1999-06-17 Application equipment Expired - Fee Related JP4491856B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17090699A JP4491856B2 (en) 1999-06-17 1999-06-17 Application equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17090699A JP4491856B2 (en) 1999-06-17 1999-06-17 Application equipment

Publications (2)

Publication Number Publication Date
JP2000354821A true JP2000354821A (en) 2000-12-26
JP4491856B2 JP4491856B2 (en) 2010-06-30

Family

ID=15913538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17090699A Expired - Fee Related JP4491856B2 (en) 1999-06-17 1999-06-17 Application equipment

Country Status (1)

Country Link
JP (1) JP4491856B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229467A (en) * 2007-03-20 2008-10-02 Daifuku Co Ltd Heat treatment apparatus
JP2014230446A (en) * 2013-05-24 2014-12-08 株式会社日立産機システム Varnish treatment device and varnish treatment method
CN112495679A (en) * 2020-11-24 2021-03-16 赣州市硕祺电子科技有限公司 Electrical protection is with convertible painting equipment to PCB board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066014A (en) * 1992-06-18 1994-01-14 Hitachi Ltd Drying method for printed board and device thereof
JPH06326447A (en) * 1993-05-10 1994-11-25 Tokyo Kakoki Kk Drying device
JPH08309250A (en) * 1995-03-13 1996-11-26 Fujitsu Ltd Double side coating method for coating material, double side coating device as well as double side drying method and double side drying machine
JPH09290191A (en) * 1996-04-26 1997-11-11 Furness:Kk Roll coater
JPH11177219A (en) * 1997-12-16 1999-07-02 Asahi Sunac Corp Board supporting apparatus
JP2001102723A (en) * 1999-09-28 2001-04-13 Kansai Paint Co Ltd Device for forming resist layer on conductive substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066014A (en) * 1992-06-18 1994-01-14 Hitachi Ltd Drying method for printed board and device thereof
JPH06326447A (en) * 1993-05-10 1994-11-25 Tokyo Kakoki Kk Drying device
JPH08309250A (en) * 1995-03-13 1996-11-26 Fujitsu Ltd Double side coating method for coating material, double side coating device as well as double side drying method and double side drying machine
JPH09290191A (en) * 1996-04-26 1997-11-11 Furness:Kk Roll coater
JPH11177219A (en) * 1997-12-16 1999-07-02 Asahi Sunac Corp Board supporting apparatus
JP2001102723A (en) * 1999-09-28 2001-04-13 Kansai Paint Co Ltd Device for forming resist layer on conductive substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008229467A (en) * 2007-03-20 2008-10-02 Daifuku Co Ltd Heat treatment apparatus
JP2014230446A (en) * 2013-05-24 2014-12-08 株式会社日立産機システム Varnish treatment device and varnish treatment method
CN112495679A (en) * 2020-11-24 2021-03-16 赣州市硕祺电子科技有限公司 Electrical protection is with convertible painting equipment to PCB board

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