JP2919063B2 - Manufacturing method of printed wiring board - Google Patents

Description

The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method of applying a resist ink on a conductive layer laminated on both sides of an insulating layer, drying the resist ink, and then exposing and developing the resist ink. To form a resist pattern,
The present invention relates to a method for manufacturing a printed wiring board by forming a predetermined conductive pattern by etching a conductive layer using the resist pattern as a mask.

(Prior Art) In the production of a conventional print delivery board, a resist is formed on a laminated board in which a conductive layer such as copper is laminated on both sides of an insulating board. A printing method, a dry film method, an electrodeposition method, and a liquid resist method are known. The screen printing method directly forms a predetermined resist pattern by a screen printing technique. The dry film method is a method in which a resist film is formed by applying a film made of a resist material on a conductive layer, and the electrodeposition method is a method in which a resist is formed on the conductive layer by electrodeposition. In the resist method, a resist ink is applied onto a conductive layer using an ink roller such as a roller coater.In these methods, a pattern film having a predetermined pattern formed on the resist layer thus formed is laminated. Then, the resist pattern is formed by exposure to ultraviolet rays and development. After forming a predetermined resist pattern on the conductive layer in this manner, etching is performed using the resist pattern as a mask to selectively remove the conductive layer to form a conductive pattern, thereby manufacturing a printed wiring board. I have.

(Problems to be Solved by the Invention) Among the above-mentioned conventional methods for manufacturing a printed wiring board, the screen printing method is a method in which the resist pattern itself is formed by printing, so the process is simple, but the screen printing machine is expensive. Therefore, there is a disadvantage that the cost is high. In addition, the dry film method has a drawback that it is costly to form a dry film and also increases the cost, and also has a drawback that a fine pattern cannot be formed. Further, the electrodeposition method requires an expensive electrodeposition apparatus, resulting in high cost. The liquid resist method does not have such a drawback, but has a drawback that the manufacturing equipment becomes large. That is, when forming a resist on the conductive layer laminated on both sides of the laminate in the conventional liquid resist method, if the resist is applied simultaneously on both sides, the laminate cannot be transported. I didn't get it. That is, the resist ink is applied to one surface by a roll coater and dried, and then the resist ink is applied to the other surface and dried. Therefore, when one roll coater is used, it is necessary to return the laminate to the position of the roll coater after forming a resist on one surface, and the transport path of the laminate becomes longer, and as a result, manufacturing equipment Installation area becomes extremely large. When two roll coaters are used, it is not necessary to return the laminate to the roll coater, but two resist drying areas are required, which also has the disadvantage that the manufacturing equipment becomes large.

Furthermore, the conventional method of forming a resist on the front and back surfaces of the laminate in separate steps has the disadvantage that the efficiency is low and the throughput is low. An object of the present invention is to eliminate the above-mentioned drawbacks of the conventional liquid resist method and to provide a method capable of efficiently manufacturing a printed wiring board by using small equipment having a small installation area.

(Means for Solving the Problems) In a method for manufacturing a printed wiring board according to the present invention, when manufacturing a printed wiring board by patterning a conductive layer of a laminated board in which conductive layers are laminated on both surfaces of an insulating plate, While horizontally transporting a pair of upper and lower ink rollers in the horizontal direction, the resist ink is simultaneously applied to both the front and back surfaces while forming portions where the resist ink is not applied along at least one of the opposite sides of the front and back surfaces of the laminate. After applying the roller to the part where the resist ink is not applied and transporting it,
After holding the hole formed on one side edge of the laminated plate by the robot arm and rotating the laminated plate 90 degrees about the horizontal axis to make it a vertical position, it is suspended through a pin through the hole, and in this vertical position It is characterized in that the resist ink is dried by successively passing through a laminate through a drying area.

In such a manufacturing method according to the present invention, since the resist ink is simultaneously applied to both the front and back surfaces of the laminate and dried, the printed wiring board can be efficiently manufactured and the installation area of the manufacturing equipment is reduced. can do. Further, even if the resist ink is applied to both the front and back surfaces, the resist ink cannot be applied to the side edges of the front and back surfaces facing each other back to back, so that the rollers can be conveyed by applying the rollers to the side edges. Therefore, the applied resist film does not adversely affect the transportation of the laminate.

Furthermore, since the laminated board is passed through the drying area while being suspended by passing the pin through the hole formed in the side edge of the laminated board, a large number of laminated boards can be dried in a state of approaching each other, and the length of the drying area can be reduced. The length of the manufacturing facility can be shortened, and the entire manufacturing facility can be further reduced in size.

(Embodiment) FIG. 1 is a plan view diagrammatically showing the entire structure of a manufacturing facility for carrying out a method for manufacturing a printed wiring board according to the present invention. After drilling through holes at predetermined positions on the laminated board with the copper layer laminated on both sides of the insulating board with an NC drill, plating the inner surface and electrically connecting the conductive layer on the front surface and the conductive layer on the back surface Fill the through-holes with filling ink to protect them and make the surface flat. Further, a pair of holes are formed in one side edge of the laminate, and the function thereof will be described later. In this example, the thickness of this laminated plate is 1.6 mm, and the vertical and horizontal dimensions are 500 × 330 mm. The pre-processed laminate is set in the charging machine 11. A large number of laminated plates set in this laminated plate loading machine 11 are sequentially removed by a charge removing device 13 and a dust cleaner 14 while the electric charges charged on both front and rear surfaces are removed while being conveyed by a conveyor 12, and dust is removed. It is received by the laminate receiving machine 15. The laminates whose surfaces have been cleaned in this way are successively placed on a conveyor 16 and sent to a resist ink coating machine 17 having a pair of roll coaters. In this coating machine 17, as shown in FIG. 2, roll coaters 31 and 32 are arranged vertically, and a laminated plate 30 is passed between them in a horizontal state to simultaneously apply resist ink to both front and back surfaces. In this example, the thickness of these resist ink layers is such that the thickness after drying is 20 to 30 μm. As shown in FIG. 2, ink reservoirs 33 and 34 for supplying resist ink to the roll coaters 31 and 32 are provided so as to be in contact with the respective roll coaters. Further, as shown in FIG. 3, a doctor blade is used to prevent the resist ink from being applied to both side edges of the front and back surfaces of the laminate 30.
35 and 36 are brought into contact with both ends of the roll coater 31. That is, these doctor blades 35, 36 are roll coaters 31
The resist ink is provided on the downstream side of the ink reservoir 33 when viewed in the rotation direction of the roll coater, and the resist ink attached to the surfaces of both ends of the roll coater is scraped off to prevent the resist ink from being applied to both side edges of the surface of the laminate. Similarly, a pair of doctor blades 3 are provided so as to be in contact with the lower roll coater 32 so that the resist ink is not applied to both side edges of the back surface of the laminate 30.
7, 38 (see Fig. 2) are provided. In this way, the resist ink is simultaneously applied to both the front and back surfaces of the laminated plate 30, and as shown in FIG.
A resist ink application portion 41 sandwiched between 39 and 40 is formed. FIG. 3 shows the state of the front surface, but the back surface is also in the same state.

FIG. 4 shows first and second transfer devices 18 and 19 for transferring the laminated plate 30 on which the resist ink has been applied by the roll coaters 31 and 32. The first transporting device 18 is a pair of endless belts arranged to abut on a portion of the back surface of the laminate 30 where the resist ink is not applied.
42 and 43, and a plurality of pressing rollers 44 and 45 arranged so as to be in contact with portions 39 and 40 of the surface of the laminate where the resist ink is not applied. The endless belts 46 and 47 are stretched between a pair of drive rollers 46 and 47 and driven in the direction indicated by arrow A. The laminated plate 30 passed between the roller coaters 31 and 32 is an endless belt 42, 43.
Are conveyed while being sandwiched between the press rollers 45 and 46, and conveyed to the second conveying device 19 at the next stage. These endless belts and the press rollers are brought into contact with the resist ink uncoated portion of the laminate. Therefore, the resist ink layer applied to the laminate is not adversely affected.

The second conveying device 19 includes an endless belt 53 stretched between a pair of drive rollers 51 and 52, and a number of spring clips 54 attached to both side edges of the endless belt at equal intervals. . These spring clips 54 are configured to hold the laminate 30 tightly by the action of a spring. At this time, since the back surface of the laminate is floated and held so as not to contact the surface of the endless belt 53, the resist ink layer applied to the back surface of the laminate is not adversely affected.

As described above, the laminate 30 held by the spring clip 54 of the second transfer device 19 rotates the laminate in a horizontal state by 90 degrees about an axis in a horizontal plane and sends the laminate to the drying line in a vertical posture. It is transported to the position of the transfer robot 20 (see FIG. 1). As shown in FIG. 5, a pair of holes 55 and 56 are formed on one side edge of the laminated plate 30, and the delivery robot 20 has a pair of pins inserted into each of these holes. . A pair of pins 6 inserted into one hole 55 as shown in FIGS.
A pair of pins 63 and 64 inserted into the holes 1 and 62 and the other hole 56 are attached to the distal end of the robot arm so that they can be driven to approach and move away from each other.

7A to 7C are schematic side views illustrating the operation of transferring the laminate 30 conveyed by the second conveying device 19 to the drying line by the transfer robot 20 having the pins 61 to 64 described above. . First, as shown in FIG.
The robot arm is rotated toward the laminated plate with the distances between 1, 62 and 63, 64 reduced, and these pins are inserted into the holes 55 and 56 formed in the laminated plate 30 (see FIG. 6A). . next,
As shown in FIG. 6B, the spacing between pins 61 and 62 is increased and the spacing between pins 63 and 64 is increased so that the laminate can be held by these pins. Then, FIG. 7B
The robot arm having the pins 61 to 64 is rotated by 90 degrees about the arc locus B as shown in FIG. This movement causes the laminate 30 to rotate 90 degrees about the axis C in the horizontal plane to be in a vertical state. Further, as shown in FIG.
The robot arm having the pins 61 to 64 is horizontally moved forward as shown by the arrow D while holding the
The pins 71, 72 provided on the (see FIG. 1) are inserted into the holes 55 and 56. As described above, the gap between the pins 61, 62 and 63, 64 inserted in the holes 55 and 56 is widened, so that a gap is formed between these pins.
71 and 72 can be inserted. In this way, the laminated plates 30 successively conveyed by the second conveying device 19
Can be sequentially delivered to the drying device 21 by the delivery robot 20 in a vertical posture.

In the drying device 21, the pins 71, 7 supporting the laminated plate 30 are provided.
By moving the laminate 2, the laminate is heated by a suitable heating means while being transported to dry the resist ink applied to both front and back surfaces. In the present example, since the laminates 30 are transported in a vertical position in the drying device 21, successive laminates can be brought closer to each other, and thus the length of the drying device can be shortened. As a result, the entire manufacturing apparatus can be downsized. After drying the resist ink applied to both the front and back surfaces in this way, the laminate 30 is received by the receiver 22, stocked in units of a predetermined number of laminates, and further conveyed to the next step via the curve conveyor 23. In the next step, the resist film is patterned by exposure and development as usual, and etching is performed using this resist pattern as a mask to selectively remove the conductive layer and form a conductive pattern to complete the printed wiring board I do. Since these processes are not a main part of the present invention, they will not be described further.

The high-density printed wiring board having a conductor pattern with a pattern width of 80 μm and a pattern interval of 80 μm can be manufactured at a high throughput with a 98% yield by the above-described method for manufacturing a printed wiring board according to the present invention. Further, the installation area of the manufacturing apparatus was almost half of the installation area of the conventional manufacturing apparatus having the same throughput.

The present invention is not limited to the above-described embodiment, and various modifications and variations are possible. For example, in the above-described embodiment, portions where the resist ink is not applied are formed on both side edges of the laminated plate, but portions where the resist ink is not applied may be provided on one side edge. However, in this case, it is necessary to use a mechanism for holding and transporting the laminate while sandwiching one side edge on which the resist ink is not applied. Further, in the above-described embodiment, drying is performed while the laminate is held in a vertical state. However, drying can be performed while the laminate is kept in a horizontal state. Furthermore, in the above-described embodiment, a pin was inserted through a hole formed in the laminated board to rotate the laminated board in a horizontal state on which the resist ink was applied by 90 degrees, but the side on which the resist ink was not applied was used. The edge portion can also be gripped and rotated with something like a nail. In addition, a device having various similar functions can be used as a device for transporting and holding the laminated plate.

(Effect of the Invention) As described above, in the method for manufacturing a printed wiring board according to the present invention, since the resist ink can be simultaneously applied to both the front and back surfaces of the laminate, the installation area of the manufacturing equipment is significantly reduced as compared with the related art. be able to. In addition, since a large number of laminates are transported in a vertical state in the drying area, a large number of laminates can be transported in close proximity to each other, and the manufacturing equipment can be further miniaturized.

[Brief description of the drawings]

FIG. 1 is a plan view diagrammatically showing the entire structure of a facility for carrying out the method for manufacturing a printed wiring board according to the present invention, and FIGS. 2 and 3 are side views showing the structure of the resist ink coating device. FIG. 4 is a plan view showing the configuration of the transfer device after resist ink application, FIG. 5 is a plan view showing the configuration of a laminate coated with resist ink, and FIGS. 6A and 6B are laminate plates. 7A to 7C are diagrams showing the movement of the arm of the delivery robot, which shows the operation of a pin provided at the end of the arm of the robot that delivers the robot to the drying device in a vertical posture. 11 ... Laminate loading machine, 12 ... Conveyor 13 ... Static eliminator, 14 ... Dust cleaner 17 ... Resist ink coating device 18 ... First transport device 19 ... Second transport device 20 ... Layered plate delivery Robot 21 Drying device 22 Laminated plate receiving device 30 Laminated plate 31,32 Roll coater 33,34 Ink reservoir 35,36,37,38 Doctor blade 39,40 Resist ink Uncoated portion 41: Resist ink coated portion 42, 43 Endless belt 44: Press roller 46, 47 Drive roller 51, 52 Drive roller 53 Endless belt 54 Spring clip 55, 56 … Hole 61-64… Robot pin 71,72… Drying device pin

Claims (1)

(57) [Claims] In producing a printed wiring board by patterning a conductive layer of a laminate in which conductive layers are laminated on both sides of an insulating plate, the laminate is transported between a pair of upper and lower ink rollers in a horizontal direction. The resist ink is simultaneously applied to both the front and back surfaces while forming a portion where the resist ink is not applied along at least one side of the front and back surfaces of the laminated plate opposite to each other, and a roller is applied to a portion where the resist ink is not applied and transported. After that, a hole formed in one side edge of the laminated plate is gripped by a robot arm, and the laminated plate is rotated 90 degrees around a horizontal axis to be in a vertical position, and then suspended through a pin through the hole, and this vertical A method for manufacturing a printed wiring board, comprising drying a resist ink by sequentially passing a laminated board through a drying area in a proper posture.