JPH07271048A - Exposure device - Google Patents

Abstract

PURPOSE:To automatically clean an original film in an exposure device without depending on manual work. CONSTITUTION:In this exposure device, an unexposed base plate supplied to a base plate feeding part is carried to an exposure part by a carrying means 6 and both sides of the base plate are simultaneously exposed through a pair of original films 1 and 2. A cleaning roller unit 40 is attached to the sucking plate 30 of the carrying means 6. When a pinion 44 is rotated by the driving of a motor which is not shown in figure, racks 46 and 47 meshing with the pinion 44 are moved, so that cleaning rollers 56 and 57 coupled with the racks 46 and 47 abut on the upper original film 1 and the lower original film 2, respectively, because the roller 56 ascends and the roller 57 descends. At such a time, both rollers press-contact with the films 1 and 2 by the action of spring members 52 and 53. By moving a slider 36 to the right in such a state, the rollers 56 and 57 rotate in a state where they press-contact with the films 1 and 2 and remove the dust of the films 1 and 2 by attaching the dust to the adhesive parts of their outer peripheries.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus which exposes a pair of original film patterns on both sides of a substrate.

[0002]

2. Description of the Related Art Normally, when manufacturing a printed circuit board,
First, a resin substrate on which copper foils are formed on both front and back surfaces is exposed to ultraviolet rays through an original film on which a desired pattern is formed, and then etching is performed to expose the copper in the portion exposed to ultraviolet rays to the substrate. By peeling from
A printed board having a copper foil pattern is completed in a black-and-white inverted state with respect to the original film. Alternatively, during etching, copper in a portion other than the exposed portion is peeled off from the substrate, and a printed board having a copper foil pattern as the original film is completed.

When performing the exposure step of the above-mentioned manufacturing method, if dust (dust, dust, etc.) exists in the exposed portion, the dust adheres to the substrate or the original film and the desired pattern cannot be exposed. There is a possibility that a defective connection may occur in the wiring pattern of the manufactured printed circuit board, resulting in deterioration of quality. Therefore, conventionally, an operator manually cleans the upper and lower frames and the original film when exchanging the original film or periodically when the original film is continuously operated for a long time.

[0004]

As described above, conventionally, the operation of the exposure apparatus is stopped and the upper and lower frames and the original film are manually cleaned, so that the work is troublesome and the dust is completely removed. Takes a long time to work. In particular, in an exposure apparatus that is large in size to expose a large substrate or has a complicated configuration, it is not easy to manually clean the upper and lower frames and the original film inside the machine, and sufficient cleaning cannot be performed. There is a risk. Further, since it is necessary to clean the original film every time the original film is replaced, the working efficiency is deteriorated particularly in the case of producing a large amount of small quantities.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an exposure apparatus capable of automatically cleaning an original film without manual work.

[0006]

In order to achieve the above object, the present invention provides an exposure section capable of simultaneous exposure on both sides of a substrate with a pair of original films arranged above and below the substrate, and an exposure section. In an exposure apparatus including a substrate loading unit that is provided adjacent to the substrate feeding unit and supplies an unexposed substrate, and a transport unit that can transport the substrate between the exposure unit and the substrate loading unit, the exposure unit includes a lower master plate. A lower frame that holds the film, an upper frame that faces the lower frame and holds the upper original film, and a pair of substrates that can be exposed through both original films on both sides of the substrate that is arranged between the two frames. An exposure light source and a frame alignment means capable of adjusting the relative positional relationship between the two frames are provided, and the transport means is provided with a clean roller unit capable of advancing and retracting between the two frames and cleaning both original films. There is.

The clean roller unit has an adhesive portion on the outer periphery to which dust can be attached and is rotatably held.
It has a pair of clean rollers and a drive mechanism for moving one clean roller upward and the other clean roller downward.

Further, it has an adhesive tape roll capable of removing dust adhering to the adhesive portion by coming into contact with the clean roller.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an exposure apparatus according to an embodiment of the present invention. This exposure apparatus, as shown in FIGS. 1 and 2,
An exposure section 4 for simultaneously exposing the patterns on both films 1 and 2 on both sides of the substrate 3 with a pair of original films 1 and 2 arranged on both sides of the substrate 3, and arranged adjacent to the exposure section 4. The substrate loading unit 5 to which the unexposed substrate is supplied, and the transport unit 6 that transports the substrate 3 between the exposure unit 4 and the substrate loading unit 5.
And a clean roller unit 40 attached to the conveying means 6.

The exposure unit 4 is provided with a base 7, a lower frame 8 arranged on the base 7 for holding the lower original film 1, and above the lower frame 8 so as to face the upper original film. 2, an upper frame 9 that holds the second frame 1, a first alignment unit (frame alignment unit) 10 that aligns the films 1 and 2 by adjusting the position of the lower frame 8 with respect to the upper frame 9, and moves the upper frame 9 up and down. A Z-axis cylinder 11 to be moved and a pair of exposure light sources 12 and 13 are provided.

An XYθ table 16 is fixedly arranged on the base 7, and a lower frame 8 is placed on the upper surface thereof. This XYθ table 16 includes motors 16a, 16
b, 16c (see FIG. 2), the lower frame 8 is moved to X, Y,
The position can be adjusted in the θ direction. A transparent plate 14 made of glass is held in the lower frame 8 and
Are arranged so as to face the opening 7 a of the base 7. As shown enlarged in FIGS. 3 and 4, a transparent electrode 15 made of ITO (Indium Tin Oxide) is formed on the upper surface of the transparent plate 14, and the transparent electrode 15 is partially provided with a cutout 15a. A lead-out portion 15b is provided which is connected to one electrode of an external power source (not shown). The lower original film 1 is disposed on the transparent electrode 15, and the cutout portion 15 is formed on the lower original film 1.
The electrode plate 22 is arranged at a position facing a. Electrode plate 2
The reference numeral 2 partially overlaps a connection plate 22a provided on the lower original film 1, and the connection plate 22a is connected to the other electrode of an external power source (not shown). Therefore, the electrode plate 2
A potential difference is generated between the transparent electrode 15 and the transparent electrode 15, and static electricity is generated. The transparent electrode 15 and the electrode plate 22 act as a suction holding means for holding the substrate 3 on the upper surface of the transparent plate 14 through the lower original film 1 by the generated static electricity.

A transparent plate 9a made of acrylic resin is held in the upper frame 9, and the upper original film 2 is attached to the transparent plate 9a (see FIG. 1). An adhesive tape roll 58 for removing dust on the outer peripheries of clean rollers 56 and 57, which will be described later, is attached to one end of the upper frame 9 (on the left side in the drawing) via an attachment member 59 and can be rotated by a motor (not shown). ing.

The first alignment means 10 comprises an XYθ table 16, a pair of CCD cameras 17, and an alignment light source 18. CCD camera 17
Is arranged in the base 7 so as to be movable between the alignment position shown in FIG. 1 and a retracted position retracted to the left and right from this position. Then, by operating the XYθ table 16 based on the image signal obtained by receiving the illumination light from the alignment light source 18 by the CCD camera 17, the alignment mark of the lower original film 1 becomes the alignment mark of the upper original film 2. The position of the lower frame 8 with respect to the upper frame 9 can be adjusted so as to match with.

The exposure light source 12 is arranged above the upper frame 9, and the exposure light source 13 is arranged below the lower frame 8.

The substrate loading unit 5 is provided with a substrate outer shape alignment means 20 for performing rough positioning when an unexposed substrate 3 is loaded. The board outer shape alignment means 20 is a means for carrying the board 3 which will be described later.
The suction plate 30 can be surely held, and the XYθ table 31 provided on the conveying means 6 can be used for fine alignment so that accurate alignment can be performed in the exposure unit. In the present embodiment, a reference position (a reference position corresponding to the lower original film 1 and a position at which the substrate is accurately positioned with respect to the lower original film 1 when the substrate is translated from this position by a certain amount). Is adjusted so that the error is about ± 1 mm.

The board outer shape aligning means 20 is composed of a pin 23 in the X direction, a width adjusting pin 24 in the Y direction, and a roller conveyor 25, which are arranged on the base 7. The reference position of the tip (right side of FIGS. 1 and 2) is determined according to the dimension of the substrate 3 which is known in advance, and the pin 23 is positioned at that position. Then, when the substrate 3 is loaded, the roller conveyor 25 is rotated to move the substrate 3 forward, and when the substrate 3 comes into contact with the pin 23, the substrate 3 is stopped and positioned in the X direction. Next, the width adjustment pins 24 in the Y direction are simultaneously moved toward the substrate 3,
When either one of the both ends (the upper end or the lower end in FIG. 2) of the substrate 3 comes into contact with the width-adjusting pin 24, the substrate is pushed by the width-adjusting pin 24, and the other end of the substrate 3 is width-adjusted. It stops when it contacts the pin 24. That is, both ends (the upper end and the lower end in FIG. 2) of the substrate are the width-adjusting pins 2
It stops at the position where it comes into contact with 4, and performs positioning in the Y direction.

Next, the transfer means 6 for transferring the substrate will be described with reference to FIGS. 1 and 2. A timing belt 39 is wound around a pulley 28 and another pulley 29 which are driven to rotate by a motor (not shown). The slider 36 is fixed to a part of the timing belt 39. The slider 36 is provided with a guide portion 36a, and the guide portion 36a can slide on a rail 38. The pulleys 28, 29 and the rail 38 are fixedly supported by the body frame. A cylinder 37 is attached to the slider 36.
Is fixed, and a small X is attached to the drive shaft of this cylinder 37.
A Yθ table 31 is attached. A suction plate 30 having a large number of suction holes (not shown) for sucking the upper surface of the substrate 3 is attached to the XYθ table 31. An EL (electroluminescence) element 26 is fixed to the lower surface of the suction plate 30 so as not to interfere with substrate suction.

With such a structure, the slider 36 can be moved in the left-right direction in FIG. 1 by rotationally driving the pulley 28, and the XYθ table 31 can be moved up and down with respect to the slider 36 by the operation of the cylinder 37. , X
By operating the Yθ table 31, the suction plate 30 is moved to X, Y, θ
The position can be adjusted in the direction.

The EL element 26, the XYθ table 31, and the pair of CCD cameras 17 constitute second alignment means (substrate alignment means) 19 for aligning the substrate 3 with respect to the lower frame 8.

The suction plate 30 of the conveying means 6 is attached to the mounting plate 4
A clean roller unit 40 is attached via 1, 42. The structure of the clean roller unit 40 will be described below. That is, the guide plate 43 and the pinion 44 rotatably attached to the guide plate 43.
And a motor (not shown) capable of rotating the pinion 44 forward and backward, and a guide plate 43 that meshes with the pinion 44.
And a pair of racks 46 and 47 that slide up and down along. The connecting shaft 4 is attached to the racks 46 and 47.
8, 49 are connected, and the holding member 5 is connected to the connecting shafts 48, 49.
0, 51 are fitted, and spring members 52, 53 are arranged between the holding members 50, 51 and the racks 46, 47 on the outer circumferences of the connecting shafts 48, 49. Holding member 5
0 and 51 are held by the frictional force between the connecting shafts 48 and 49, the drag force of the spring members 52 and 53, and the action of the stoppers 48a and 49a. Further, the support shafts 54 and 55, which are vertically slidable along the guide plate 43, are attached to the holding member 5.
Clean rollers 56 and 57 are rotatably held on support shafts 54 and 55, respectively. The outer periphery of the clean rollers 56, 57 is an adhesive portion to which dust can be attached. The pinion 44 and the racks 46 and 47 form a drive mechanism for the clean rollers 56 and 57. With such a configuration, the clean roller unit 40 moves to the left and right as the slider 36 moves, and when the pinion 44 rotates by the driving of a motor (not shown), the rack 46 and the connecting shaft 48 and the holding member 50 are integrated. The support shaft 54 and the clean roller 56 are raised. At the same time, the connecting shaft 49, the holding member 51, the support shaft 55, and the clean roller 57 are lowered integrally with the rack 47. When the motor reversely rotates from this state, the clean roller 56 descends and the clean roller 57 rises to return to the initial position.

A general structure of the substrate 3 to be exposed by the exposure apparatus having the above structure will be described. In this substrate 3, copper foil is formed on both front and back surfaces of a substrate body (see FIGS. 1 and 2) made of epoxy resin or the like, and a thin dry film made of resin is attached to cover the copper foil. Further, a protective film 34 made of polyester or the like is attached to both sides of the protective film 34. The protective film 34 does not cover the entire substrate 3, but is adhered at intervals of about 5 mm from each side of the outer periphery of the substrate 3. Although the substrate body, the copper foil, and the dry film are integrally shown in the drawings, this dry film functions as a photoresist having photosensitivity.

Next, the operation of the embodiment having the above construction will be described. First, before attaching the upper and lower frames 8 and 9 to the exposure apparatus, the lower original film 1 is attached to the transparent plate 14 of the lower frame 8 and the upper original film 2 is attached to the transparent plate 9a of the upper frame 9 with an adhesive tape or the like. wear. Next, the electrode plate 22 is attached onto the lower original film 1. The sticking position is set so as to enter the outer edge of the substrate 3 by about 2 to 3 mm. That is, as described above, the outer peripheral portion of the substrate 3 has 5
This is for the electrode plate 22 to come into contact therewith because the dry film surface is exposed by about mm.

Next, the lower frame 8 is attached and fixed on the XYθ table 16, and the upper frame 9 is attached to the upper frame holding means 27. At this time, the clean roller unit 40, the suction plate 30, the slider 3 are provided between the upper and lower original films 1 and 2.
6. The height of the upper frame 9 is adjusted by the Z-axis cylinder 11 so as to secure a space through which the cylinder 37 can pass.

Here, the two original films 1 and 2 are cleaned. A motor (not shown) is driven to move the slider 36 to the right in the drawing while the substrate is not attracted to the attraction plate 30 of the transport means 6. Then, when the clean roller unit 40 reaches between the frames 8 and 9, a sensor (not shown) such as a limit switch operates to drive another motor not shown. As a result, as described above, the clean roller 56 moves up to come into contact with the upper original film 2, and the clean roller 57 goes down to come into contact with the lower original film 1 (see FIG. 5). The holding members 50 and 51 are spring members 5.
The clean rollers 56 and 57 are pressed against the original films 1 and 2 because they are supported by the films 2 and 53. By moving the slider 36 further to the right in this state, the clean rollers 56 and 57 are moved to the original films 1 and 2.
While rotating in pressure contact with, dust on the entire area of the original films 1 and 2 is adhered to and removed from the adhesive portion on the outer periphery.

In this way, when the sensor (not shown) (limit switch or the like) detects that the slider 36 has moved a certain distance, it is determined that the cleaning of the original films 1 and 2 is completed, and the motor (not shown) is reversely rotated to clean the rollers. 56 is lowered and the clean roller 57 is raised to be separated from both the original films 1 and 2. Then, the slider 36 is moved to the left and positioned on the left side of the upper frame 9 (see FIG. 6). In this state, the Z-axis cylinder 11 of the upper frame 9
Is operated to lower the upper frame 9, and the conveying means 6
Actuating the cylinder 37 of the clean roller unit 4
0 is raised to bring the clean rollers 56 and 57 into contact with the adhesive tape roll 58 at the same time (see FIG. 7). Therefore,
By operating a motor (not shown) to rotate the adhesive tape roll 58, the dust adhering to the outer periphery of the clean rollers 56 and 57 is transferred and removed. When the removal of dust is completed in this way, the upper frame 9 is raised and the slider 36 is lowered.

After the cleaning of the original films 1 and 2 and the cleaning of the clean rollers 56 and 57 are completed as described above, the first alignment means 10 causes the upper frame 9 and the lower frame 8 to be removed.
Align the. That is, the alignment light source 18 is turned on while the CCD camera 17 is positioned at the alignment position shown in FIG.
By driving the XYθ table 16 so that the alignment mark of the lower original film 1 matches the alignment mark of the upper original film 2 based on the image signal obtained by receiving the illumination light from the CCD camera 17, The position of the lower frame 8 with respect to the frame 9 is adjusted.

After that, the transparent electrode 15 and the electrode plate 22 are energized to generate static electricity. Due to this static electricity, the lower original film 1 is adsorbed and held on the transparent plate 14 of the lower frame 8.

On the other hand, the unexposed substrate 3 supplied to the substrate loading unit 5 is roughly aligned by the substrate outer shape aligning means 20. As described above, the substrate 3 is moved forward until it comes into contact with the pin 23 for positioning in the X direction, and the width-adjusting pins 24 are moved so as to contact both ends of the substrate 3 for positioning in the Y direction. .

After the rough alignment of the substrate 3 is completed in this way, the substrate 3 is vacuum-sucked by the suction plate 30, and in that state, a motor (not shown) is driven to move the slider 36 in parallel by a predetermined amount so that the two original films 1, 2. Position between two. Then, the cylinder 37 is operated to lower the XYθ table 31, and the clearance between the substrate 3 and the lower original film 1 is set to 1 mm or less. In this state, the substrate 3 and the lower original film 1 are aligned by using the second alignment means 19. That is, the EL element 26 is caused to emit light, the mark of the substrate 3 and the mark of the lower original film 1 are recognized by the CCD camera 17, and the position of the substrate 3 is adjusted by the XYθ table 31 so that they match each other.

The substrate 3 by the second alignment means 19
After the alignment between the lower original film 1 and the lower original film 1, the substrate 3 is further lowered and brought into close contact with the lower original film 1. As described above, since the potential difference is generated between the transparent electrode 15 and the electrode plate 22, static electricity is generated. Specifically, the electrode plate 22 is in contact with the dry film surface of the substrate 3. Since the dry film is extremely thin and has relatively weak insulation, the electrode plate 22 is electrically connected to the copper foil. Therefore, static electricity is generated in a path from the copper foil conducted to the electrode plate to the transparent electrode 15 through the protective film 34 and the lower original film 1. Due to this static electricity, the substrate 3 and the lower original film 1 are adsorbed and held on the transparent electrode 15, that is, the lower frame 8. Therefore, there is no possibility that the substrate 3 is displaced.

Then, a motor (not shown) is driven to return the suction plate 30 to the substrate loading section 5, and thereafter the Z-axis cylinder 1
The upper frame 9 is lowered by 1 to bring the upper original film 2 into close contact with the upper surface of the substrate 3. In this way, with the lower original film 1 and the upper original film 2 in close contact with the lower surface of the substrate 3 and the upper surface of the substrate 3, respectively, the CCD camera 17 of the exposure unit 4
Is retracted from the alignment position shown in FIG. 1 to the left and right.

In this state, the upper and lower exposure light sources 12, 13
By turning on, the patterns of both original films 1 and 2 are simultaneously exposed on both sides of the substrate 3.

After that, the substrate 3 is removed from the exposure apparatus,
After applying heat and drying, the protective film 34 is peeled off and immersed in an etching solution to remove the dry film and the copper foil in the exposed portion. Depending on the type of dry film, the dry film and the copper foil in the portion other than the exposed portion may be removed. In this way, a copper foil pattern is formed. After that, after peeling off the dry film completely, electrical parts of the copper foil pattern are mounted,
A printed circuit board is completed by covering a protective film (not shown) except the portions used as terminals. In the case of manufacturing a multi-layered substrate, a plurality of substrates from which a dry film has been peeled off after forming a copper foil pattern are stacked and fixed, and then protective films are adhered to both upper and lower surfaces.

Although not described in detail, when the substrate 3 is conveyed to the exposure unit 4, the substrate 3 to be exposed next is the substrate loading unit 5.
Is set so that a large number of substrates are exposed one after another.

According to the present invention, the clean roller unit 40 is provided in the transport means 6 for transporting the substrate 3 from the substrate loading portion 5 to the exposure portion 4, and the original films 1 and 2 are automatically cleaned by the movement of the slider 36. Since it is possible to perform the cleaning, it is not necessary to manually clean it as in the conventional case, the cleaning can be performed very efficiently, and the working time can be shortened. Further, since the pair of clean rollers 56, 57 can be moved up and down by the drive mechanism composed of the pinion 44 and the racks 46, 47, normally both clean rollers 56, 57 are
57 are compactly packed so that they do not get in the way when the substrate is transferred.
By expanding 6 and 57 so that they can contact the original films 1 and 2, it is possible to prevent the apparatus from becoming large. The work is further simplified by automatically operating the drive mechanism in conjunction with the sensor.

Since the clean rollers 56, 57 can be cleaned by providing the adhesive tape roll 58 which can come into contact with the clean rollers 56, 57, the original films 1, 2 can be always cleaned with the clean rollers 56, 57. Can be cleaned.

In the above embodiment, the cleaning is performed when the original films 1 and 2 are exchanged. However, when a large number of substrates are exposed, the original films 1 and 2 are periodically cleaned at a predetermined timing. It can be programmed to do so. In this case, the original film can be cleaned without stopping the automatic operation of the exposure device. Further, in the exposure apparatus according to the present invention, the clean roller unit 40 can be operated to clean the upper frame 9 and the lower frame 8 without the original film being attached.

Conventionally, when the substrate 3 is placed on the lower original film 1, the substrate 3 is slippery on the lower original film 1 and is displaced due to the influence of air present in the gap between them. In this embodiment, since the electrostatic force acts on the substrate 3 to attract the substrate 3, the substrate 3 does not slip and no positional displacement occurs. In particular, an electric field is applied to the electrode plate 22 in contact with the dry film surface of the substrate 3 and the transparent electrode 15 located below the substrate 3 via the lower original film 1, and the copper foil of the substrate 3 and the lower original film 1 are transmitted. Since static electricity is generated in the path, a sufficient electrostatic attraction force can be exerted on the substrate 3 and the lower original film 1. As described above, since static electricity is used, it is possible to easily hold an extremely thin substrate (for example, a substrate having a thickness of about 0.4 mm) that is difficult to mechanically hold. Further, the substrate 3 can be easily adsorbed and detached by turning on / off the power supply to the transparent electrode 15 and the electrode plate 22, so that the substrate can be easily transported after exposure.

Further, even if the two original films 1 and 2 and the substrate 3 are adhered to each other in a vacuum at the time of exposure in order to enhance the adhesion between them, there is no possibility of misalignment.

FIG. 8 shows a second embodiment of the present invention. The description of the same parts as those in the first embodiment will be omitted.

In the second embodiment, the transparent electrode 15 made of ITO is formed on the transparent plate 14, and the protective film 35 is further formed on the transparent electrode 15 by sputtering SiO 2. The protective film 35 made of SiO2 is the transparent electrode 1
5 covers the entire surface of the transparent plate 14 provided with 5.

According to this embodiment, even if a high voltage (500 to 2000 V) is applied to the transparent electrode 15 to electrostatically adsorb the substrate 3 through the lower original film 1, it is shielded by the protective film 35 and used. High voltage is not transmitted to the person, and work can be performed safely.

The protective film 35 is capable of transmitting light from the exposure light source 13 and generates static electricity on the lower original film 1 so that the substrate 3 can be adsorbed when a voltage is applied to the transparent electrode 15. In addition to the SiO2 film, it has an insulating function to the extent that it does not affect the human body.
For example, a transparent resin film having O vapor deposited thereon can be used.

[0044]

As described above, since the clean roller unit is attached to the transporting means provided for transporting the substrate from the substrate loading portion to the exposure portion, the original film can be automatically cleaned. Unlike the above, there is no need for manual cleaning, and cleaning can be performed extremely efficiently and easily.

When a pair of clean rollers can be moved up and down by a driving mechanism, both clean rollers are opened only during cleaning so that they can contact the original film.
Normally, both clean rollers can be compactly arranged so that they do not get in the way when the substrate is transported.

Further, when the adhesive tape roll which can contact the clean roller is provided, the original film can be cleaned with the clean roller which is always clean.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of an exposure apparatus according to the present invention.

FIG. 2 is a plan view showing a main part of the exposure apparatus shown in FIG.

3 is an enlarged cross-sectional view showing a lower frame and a substrate of the exposure apparatus shown in FIG.

FIG. 4 is a partially cutaway plan view of FIG.

FIG. 5 is an explanatory diagram showing a cleaning state of the original film of the exposure apparatus according to the present invention.

FIG. 6 is an explanatory view showing a state after cleaning the original film of the exposure apparatus according to the present invention.

FIG. 7 is an explanatory diagram showing a clean roller cleaning state of the exposure apparatus according to the present invention.

FIG. 8 is an enlarged sectional view showing a lower frame and a substrate of a second embodiment of the present invention.

[Explanation of symbols]

1 Lower original film 2 Upper original film 3 Substrate 4 Exposure part 5 Substrate input part 6 Conveying means 8 Lower frame 9 Upper frame 10 First alignment means (frame position adjusting means) 12, 13 Light source for exposure 40 Clean roller unit 44 Pinion (Driving means) 46, 47 Rack (driving means) 56, 57 Clean roller 58 Adhesive tape roll

Claims (3)

[Claims] 1. An exposure unit capable of simultaneously exposing both sides of the substrate in a state where a pair of original films are arranged above and below the substrate,
The exposure unit includes a substrate loading unit provided adjacent to the exposure unit and supplied with an unexposed substrate, and a transporting unit capable of transporting the substrate between the exposure unit and the substrate loading unit. Is a lower frame that holds the lower original film, an upper frame that is provided to face the lower frame and that holds the upper original film, and the both original films on both sides of the substrate arranged between the two frames. A pair of exposure light sources that can be exposed via
A frame aligning means capable of adjusting the relative positional relationship between the two frames is provided, and the conveying means is provided with a clean roller unit capable of advancing and retracting between the both frames and cleaning the both original films. An exposure apparatus characterized by the above. 2. The clean roller unit includes a pair of clean rollers rotatably held by an outer peripheral portion thereof having an adhesive portion capable of adhering dust, and one of the clean rollers upward and the other of the clean rollers. The exposure apparatus according to claim 1, further comprising a drive mechanism that moves the clean rollers downward. 3. The exposure apparatus according to claim 2, further comprising an adhesive tape roll capable of removing dust adhering to the adhesive portion by contacting with the clean roller.