JPH07289972A - Resist dryer - Google Patents

Abstract

PURPOSE:To provide a resist dryer which, firstly can dry a printed circuit substrate surely while preventing the printed circuit substrate from curving, curling, and buckling; secondly, prevents damages of the printed circuit substrate due to contact; and thirdly, carries out the drying easily, continuously, and automatically with a simple structure. CONSTITUTION:A resist drying apparatus A dries and cures a photosensitive resist B in liquid phase applied to a printed circuit substrate P by a roll coater 1. The resist drying apparatus A comprises a drying furnace 2 in which hot air is circulated, a conveyer 4 which successively transports printed circuit substrates P in the drying furnace 2 while holding the printed circuit substrates by catching means 3, and a catching means 3 which is installed in the way it can rotate by a horizontal axis at least in a transporting stage of the substrates to the drying furnace 2, can be postured in specific transverse posture W, vertically rotated and displaced posture X, and vertical posture Z, and has a structure to be opened or closed freely.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist drying device. That is, the present invention relates to a resist drying apparatus that is used in a manufacturing process of a printed wiring board and that dries and cures a liquid photosensitive resist applied to the outer surface of the printed wiring board.

[0002]

2. Description of the Related Art First, the technical background will be described. Recently, printed wiring boards have become extremely thin and high-density. For example, its wall thickness is 1.0 mm to 0.8 mm, and even 0.4 mm, which is becoming extremely thin to the same level as that of paper, and the progress of circuit densification is remarkable. Of course, it is necessary to realize such an extremely thin and high-density printed wiring board at low cost and with excellent economical efficiency, and it is important to consider the cost.

For printed wiring boards, for example, the steps of cutting materials, drilling, polishing, through-hole plating, polishing, applying and drying etching resist, or sticking, exposing, developing, etching, removing resist from circuit parts, and the like. Is manufactured by following. Further, as a post-treatment process which is a part of such a manufacturing process, in order to form a protective film on the formed circuit portion, solder resist coating, drying, or sticking, exposure, development, and resist for parts mounting portion are performed. Each process such as removal, etc. is performed. In the process of manufacturing such a printed wiring board, the process of coating, drying or sticking an etching resist for forming a circuit or a solder resist after forming a circuit has been conventionally performed as follows. That is, first of all, in the so-called printing method / wet method, a liquid photosensitive resist is applied to the outer surface of a printed wiring board by screen printing and then dried, and secondly, so-called. In the dry method,
A dry film-shaped photosensitive resist was adhered to the outer surface of the printed wiring board while being pressed by a roll.

However, in such a conventional example, it is pointed out that it is difficult to sufficiently meet the above-mentioned demands of the printed wiring board such as ultra-thinness, high density and cost. That is, in the above-described first printing method / wet method, regarding the applied photosensitive resist,
As is well known, the film thickness is large and its uniformity is difficult, and for example, it has an adverse effect on the exposure resolution at the time of post-exposure exposure, and pinholes are also pointed out. It is becoming difficult to meet the current demand for higher density. Further, in the above-mentioned second dry method, since a dry film-shaped photosensitive resist is used, it is extremely expensive, and it has been difficult to meet the current demands of printed wiring boards from the viewpoint of cost.

Therefore, a so-called roll coater method has recently been developed as a third method. That is, in the third roll coater method, in the step of applying an etching resist for forming a circuit on a printed wiring board or a solder resist after forming the circuit, the printed wiring board is passed between upper and lower roll coaters to form an outer surface thereof. This is a method in which a liquid photosensitive resist is transferred onto and applied to and then dried. According to this roll coater method,
Compared to the above-mentioned first printing method / wet method, the film thickness can be made thinner and the film thickness is more uniform,
The same exposure resolution as that of the second dry method described above can be obtained, and the occurrence of pinholes can be eliminated, so that the circuit of the printed wiring board can be sufficiently densified. In addition to this, the roll coater method uses a liquid photosensitive resist instead of the dry film type photosensitive resist as compared with the second dry method described above, and thus the first printing method / wet method described above is used. It can be as economical as, does not become expensive, and can sufficiently meet the cost requirements of printed wiring boards.

[0006]

By the way, the following problems have been pointed out in the roll coater method. First of all, the liquid photosensitive resist transferred and applied to the outer surface of the printed wiring board by a roll coater is immediately dried by a resist drying device. At that time, when the thickness of the printed wiring board is thick, a conventional horizontal transfer type resist drying device is used, and the printed wiring board is conveyed in a horizontal state on a horizontal conveyor while passing through a drying oven. As a result, the liquid photosensitive resist can be dried without any problem. However, as mentioned above, recent printed wiring boards have become extremely thin, so if you try to transfer them horizontally on a horizontal conveyor using a conventional horizontal transfer type resist dryer, the printed wiring boards will be There was a problem that it was bent, curled, and bent.

That is, the printed wiring board onto which the photosensitive resist is transferred and applied and which is carried out horizontally between the roll coaters is extremely thin and extremely flexible, and is pressed upward or downward by pressure contact between the roll coaters. The directionality of is easily given. Therefore, when the roll coater is carried out between the roll coaters, it is likely to be immediately bent, curled, and bent at the waist, which makes it difficult to maintain the horizontal state on the horizontal conveyor. And in the end,
Sufficient drying cannot be carried out, and the subsequent exposure and development processes are often hindered, resulting in serious defects in the quality of the manufactured printed wiring board. As described above, it has been pointed out that the conventional resist drying apparatus cannot cope with the roll coater method and the extremely thin printed wiring board.

Secondly, the printed wiring board to which the photosensitive resist is transferred and applied by the roll coater needs to be dried while maintaining the non-contact state except for the gripping marginal portion of the end portion. However, if the circuit parts come into contact with other members or themselves, causing damage, the circuit will short, break,
This causes other defects, which makes it impossible to deal with the high density of the circuit of the printed wiring board described above. However, in the conventional horizontal transfer type resist drying apparatus, the printed wiring board is placed on a horizontal conveyor and conveyed in a horizontal state, and the above-mentioned first printed wiring board is bent, curled, or bent. It has been pointed out that such contacts and scratches are generated due to such factors, and that it is not possible to sufficiently cope with high circuit density. In particular, not only on one surface of the printed wiring board but also on both front and back surfaces,
In view of the recent situation in which a photosensitive resist is often transferred and applied, such contact and scratches frequently occur, which has been a problem.

Thirdly, various attempts have been made even in the conventional resist drying apparatus in order to prevent the occurrence of the first bending, curling, bending of the waist, second contact and scratches. However, problems such as relying on manual work, interrupting the process, insufficient connection with the roll coater, complicated structure, and problems with the cost of the printed wiring board, etc. Was pointed out.

The present invention has been made as a result of earnest research efforts by the inventor in order to solve the above-mentioned problems of the conventional example in view of the above-mentioned circumstances. First, by adopting a chucking means which is attached and can change its posture in a predetermined horizontal posture, rotational displacement posture, vertical posture, etc., first, the printed wiring board is prevented from being bent, curled, and bent. At the same time, secondly, a resist drying device is proposed in which damages caused by the contact of the printed wiring board are prevented, and thirdly, these are realized easily, automatically and continuously by a simple structure. To aim.

[0011]

The technical means of the present invention for achieving this object are as follows. First, claim 1
About: That is, the resist drying device according to the first aspect is used in a manufacturing process of a printed wiring board, and dries and cures a liquid photosensitive resist transferred and applied to the outer surface of the printed wiring board by a roll coater. It is a thing. Then, a drying oven in which hot air is blown out and circulated, a conveyor for sequentially carrying the printed wiring board while holding it by a chucking means in the drying oven, etc., and a stage for carrying the conveyor into at least the drying oven In this case, the chucking means is rotatably mounted on a horizontal shaft and has an openable and closable structure. The chucking means is positioned opposite to the end portion of the printed wiring board that is unloaded horizontally between the roll coaters, and can be held in a horizontal position by opening and closing, and is completely unloaded from between the roll coaters. Further, while holding the end portion of the printed wiring board, the printed wiring board is gradually displaced downward, and a vertical rotational displacement posture in which the printed wiring board is rotated 90 degrees downward, and the upper end portion of the printed wiring board is held as it is, The posture can be sequentially changed to a vertical posture in which the conveyor is hung vertically and at right angles to the conveying direction of the conveyor so that it can be conveyed in the drying furnace.

Next, claim 2 is as follows. That is, the resist drying apparatus according to the second aspect is used in a manufacturing process of a printed wiring board, and dries and cures a liquid photosensitive resist transferred and applied to the outer surface of the printed wiring board by a roll coater. It is a thing. And, a drying furnace in which a large number of irradiation lamp groups are arranged side by side, and a conveyor for sequentially carrying the printed wiring boards along the irradiation lamp groups while holding the printed wiring board by chucking means in the drying furnace or the like. And at least the chucking means which is rotatably attached to the conveyor at a stage of loading into the drying furnace by a horizontal shaft and which can be opened and closed. The chucking means is positioned opposite to the end portion of the printed wiring board that is unloaded horizontally between the roll coaters, and can be held in a horizontal position by opening and closing, and is completely unloaded from between the roll coaters. While holding the end portion of the printed wiring board, it is gradually displaced downward,
The vertical rotational displacement posture of rotating the printed wiring board and the upper and lower parts of the printed wiring board being vertically suspended and gradually displaced to the left and right, and being parallel to the conveying direction of the conveyor. The horizontal rotation displacement posture of rotating the vertical axis by 90 degrees to the vertical axis and the upper end portion of the printed wiring board as it is, while suspending the upper end portion of the printed wiring board in parallel and vertically to the conveying direction of the conveyor. With a vertical posture that allows it to be transported inside the drying oven,
The posture can be changed sequentially.

The third aspect of the present invention is as follows. That is, the resist drying device according to claim 3 is the resist drying device according to claim 1 or 2, wherein the photosensitive resist is transferred and coated on both sides of the outer surface of the printed wiring board by the roll coater. Has been done.

Claim 4 is as follows. That is, the resist drying apparatus according to claim 4 is the resist drying apparatus according to claim 1 or 2, wherein the chucking means has a structure that can be opened and closed by magnetic force, and thus holds the end portion of the printed wiring board. It is possible.

Claim 5 is as follows. That is, the resist drying device according to claim 5 is the resist drying device according to claim 1 or 2, wherein the photosensitive resist liquid on the outer surface of the printed wiring board is replaced by a printing machine instead of the roll coater. Is printed and applied. Therefore, the chucking means holds the lateral position facing the end of the printed wiring board that is unloaded horizontally from the printing machine, and the end of the printed wiring board that is completely unloaded from the printing machine. The posture can be sequentially changed to a vertical rotational displacement posture in which it is rotated while rotating, and other postures.

The claim 6 is as follows. That is, the resist drying apparatus according to claim 6 is the resist drying apparatus according to claim 1, 2 or 5, wherein the conveyor is a first conveyor located at a lower position for loading into the drying furnace. And a second conveyor dedicated to the inside of the drying furnace and located at a higher level. The chucking means for holding the printed wiring board is rotatably attached to the first conveyor on a horizontal axis and magnetically attached to the second conveyor.

[0017]

Since the present invention comprises such means, it operates as follows. This resist drying apparatus has a chucking means having a structure that can be opened and closed and is rotatably attached to a conveyor on a horizontal shaft. Further, in claims 1 and 2, after the photosensitive resist is transferred and applied to the outer surface of the printed wiring board by the roll coater, the printed wiring board is unloaded horizontally between the roll coaters. Then, the front end portion of the printed wiring board is inserted into the chucking means in the horizontal posture in the open state, and then held by the chucking means in the closed state. Then, the printed wiring board is further carried out, the corresponding chucking means is also slightly conveyed by the conveyor, and when the printed wiring board is completely carried out from between the roll coaters, the chucking means changes from the horizontal posture to the vertical posture. Since the printed wiring board is held in a vertical rotational displacement posture toward the vertical direction, the printed wiring board whose upper end is held by the chucking means is rotated 90 degrees downward from the horizontal state and is hung vertically at a right angle to the conveying direction of the conveyor. It will be in the state where it was set.

According to the first aspect of the present invention, the chucking means is conveyed in the dryer in the vertical position by the conveyor, so that the printed wiring board is conveyed in the drying furnace in which hot air is blown and circulated. The photosensitive resist is dried and cured. On the other hand, according to claim 2, the chucking means further takes a horizontal rotational displacement posture on a vertical axis, and the printed wiring board also holds the upper end portion by such chucking means, and It is rotated 90 degrees from the right angle to the parallel state with respect to the transport direction. After that, the chucking means takes the vertical posture as it is and is conveyed in the drying furnace by the conveyor. As a result, the printed wiring board is transported in a drying oven in which a large number of irradiation lamp groups are arranged side by side, and the photosensitive resist is dried and cured.

In the third aspect, the photosensitive resist is transferred and applied on both surfaces of the outer surface of the printed wiring board, dried and cured. In claim 4, the chucking means is opened and closed by magnetic force to hold the end portion of the printed wiring board. In claim 5, a printing machine is used instead of the roll coater.
A photosensitive resist is printed and applied on the outer surface of the printed wiring board. Further, according to claim 6, the conveyor comprises a first conveyor and a second conveyor, and the chucking means for holding the printed wiring board is attached to the first conveyor by a horizontal shaft, and is carried into the drying furnace after being installed. It is magnetically attached to the upper second conveyor and conveyed in the drying furnace.

Then, in these resist dryers, firstly, the printed wiring board carried out horizontally between roll coaters and from the printing machine is extremely thin and extremely flexible, so A downward direction is easily given. Therefore, the leading edge of the printed wiring board is held by the chucking means immediately after it is carried out from the roll coater or the printing machine, and then the printed wiring board is suspended from the horizontal state to the vertically suspended state and conveyed and dried. As a result, the occurrence of such bending, curling and waist bending can be prevented. Secondly, for the same reason, it is also possible to prevent the printed wiring board from contacting other members or themselves and causing scratches or the like. Third, and yet they are automatically, continuously and easily realized with a simple structure.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings. FIG. 1 is a front explanatory view of an embodiment of the present invention, and FIG. 2 is a plan explanatory view of a main part of the embodiment. FIG. 3 is a front explanatory view of another embodiment of the present invention, and FIG. 4 is a plan explanatory view of the same embodiment. FIG. 5 is a front explanatory view of a main part of still another embodiment of the present invention. Figure 6
FIG. 4 is a front explanatory view showing an example of a conveyor in each of these embodiments. FIG. 7 is a front explanatory view of the chucking means in each of these embodiments, and FIG.
An example, (2) shows another example.

First, the printed wiring board P will be described. The printed wiring board P has various kinds such as a double-sided board for OA, a multi-layered board for computer, a flexible board for computer, etc., and a variety of manufacturing processes thereof. In recent years, the printed wiring board P is becoming smaller and lighter, is extremely thin, is multi-layered, has a higher density and finer circuit portion, and the like. Further, such a printed wiring board P is manufactured as follows, for example. That is, the printed wiring board P is manufactured by following steps such as material cutting, drilling, polishing, through-hole plating, polishing, coating and drying of etching resist, or sticking, exposure, development, etching, resist peeling of a circuit portion, and the like. To be done.

Explaining these in detail, first, a double-sided copper foil-clad laminate in which copper foil is laminated on both sides of a material, that is, an insulating material, is cut into a short work size, and then a through hole drilling process is performed. After that, cleaning and double-side polishing are performed, and then through-hole plating is performed. That is, the inner wall of the through hole is plated so that the electric circuit on the front surface and the electric circuit on the rear surface are electrically connected. Then, after washing, double-side polishing treatment, washing, drying, etc. are performed again, the photosensitive resist B, which is an etching resist, is applied in a film form and dried or adhered, and then the circuit is formed. A portion of the negative film, that is, a circuit photograph, is exposed to light. After that, the photosensitive resist B leaves the exposed and cured circuit portion, and the other portion is dissolved and removed by spraying a developing solution. Then, after cleaning and drying, the copper foil of the circuit portion where the photosensitive resist B has been hardened is left in the etching machine, and the copper foil of the portion where the photosensitive resist B has been dissolved and removed as described above. However, it is dissolved and removed by the spray of the corrosive liquid. Then, the remaining photosensitive resist B of the above-mentioned cured circuit portion is dissolved and removed by spraying a stripping solution, and then washed and dried to obtain a printed wiring board P on which a predetermined circuit portion is formed. To be The printed wiring board P is, for example, 550 mm in length and width.
It has a size of about 550 mm or 500 mm x 300 mm,
The peripheral edge of the central circuit portion has a width of about 10 mm and serves as a grip margin portion.

With respect to the printed wiring board P manufactured by following these steps, a protective film for the formed circuit portion is formed as a post-treatment step which is a part of the manufacturing step. That is, after the photosensitive resist B, which is a solder resist, is applied, dried, and adhered to the entire surface of the printed wiring board P on which the circuit portion is formed, a negative film is applied and exposed and developed. Is performed, and the photosensitive resist B in the component mounting portion such as the through hole portion and the round portion, that is, the portion where the post soldering is performed is dissolved and removed to be exposed. In this way, the protective coating of the photosensitive resist B is formed on the printed wiring board P, the circuit portion is covered and protected, and after that, the solder is attached to the component mounting portion, so that the printed wiring board P is protected. The circuit part is protected.

In the manufacturing process of such a printed wiring board P, the photosensitive resist B which is an etching resist for forming a circuit portion and the photosensitive resist B which is a solder resist for forming a protective coating on the circuit portion are used. In place of the dry method using a dry film, a wet method using a liquid film has been rapidly spreading recently. That is, this wet method is based on the photosensitive resist B.
The printed wiring board P
It has excellent adhesiveness, embedding degree, covering property, acid resistance, etc. to the circuit part that is becoming denser and finer, and it is about 1/3 the cost of dry film and it is excellent in cost and economy. , Is being widely adopted instead of the dry method using a dry film. As such a liquid photosensitive resist B, for example, a diluted alkali developing type photo solder resist, an epoxy liquid resist, a resist using other photosensitive resin, or the like is used.

Further, such a liquid photosensitive resist B is used.
As for the wet method using the method, a roll coater method has recently been developed and is becoming widespread instead of a conventional printing method. That is, the printing method of applying the photosensitive resist B to the outer surface of the printed wiring board P by printing.
The wet method has a large film thickness due to the applied photosensitive resist B and also has difficulty in uniformity of the film thickness, which adversely affects the exposure resolution at the time of subsequent exposure and may cause pinholes. To be done. Therefore, the roll coater method, which is one of the wet methods in which the film thickness of the photosensitive resist B can be made thin and the film thickness is excellent in uniformity, and thus the exposure resolution is high and the occurrence of pinholes can be eliminated, has been widely spread recently. I am doing it.

The resist drying apparatus A of each of the embodiments shown in FIGS. 1, 2 and 3 and 4 is used in the manufacturing process of such a printed wiring board P, and the roll coater 1 prints the printed wiring. The liquid photosensitive resist B transferred and applied to the outer surface of the substrate P is dried and cured.

The resist drying apparatus A of each embodiment shown in FIGS. 1, 2 and 3 and 4 has a drying oven 2 in which hot air is blown and circulated in the embodiment of FIGS. The chucking means 3 holds the printed wiring board P in the drying oven 2 or the like.
Conveyor 4 that is sequentially held while being held by
At least in the stage of loading into the drying furnace 2, there is provided a chucking means 3 which is rotatably mounted on a horizontal shaft and which can be opened and closed. On the other hand, in the embodiment of FIGS. 3 and 4,
The drying furnace 2 in which the irradiation lamp groups 5 are arranged side by side is used, and the conveyor 4 conveys the printed wiring board P along the irradiation lamp groups 5 in the drying furnace 2.

The resist drying device A shown in each embodiment of FIGS. 1, 2, 3 and 4 will be described in more detail. First, the illustrated roll coater 1 includes a coating roller 6 which is vertically opposed to each other, a tray 7 of the photosensitive resist B which is respectively arranged above and below, and an interposing roller 8 which is interposed between the coating roller 6 and the tray 7. ,,. And
When the upper and lower application rollers 6 are rotated, the printed wiring board P passes while being pressed against each other, and at that time,
The photosensitive resist B that has passed through the tray 7 and the interposing roller 8 is transferred and applied from the applying roller 6 to the outer surface of the printed wiring board P. The printed wiring board P is
Pre-treatment to activate its outer surface has been previously performed,
The film thickness of the photosensitive resist B transferred and applied can be freely set by adjusting the interval between the application rollers 6. Further, in the illustrated example, the photosensitive resist B is transferred and applied to both the front and back surfaces of the printed wiring board P, but only one of the outer surfaces, that is, either one of the front and back surfaces. , Transfer photosensitive resist B,
It is also possible to apply.

The resist drying apparatus A is arranged in the next step of the roll coater 1 as described above. First, in the embodiment of FIGS. 1 and 2, the drying oven 2 of the resist drying apparatus A is of a hot air circulation type in which hot air is blown and circulated, and a large number of hot air outlets and hot air inlets are provided. A hot air zone is formed inside, and a hot air source such as a heater and a fan and a ventilation duct are additionally provided. On the other hand, in the embodiment of FIGS. 3 and 4, the drying furnace 2 of the resist drying apparatus A is of an irradiation type in which the irradiation lamp group 5 is arranged side by side. Far-infrared lamps are arranged in rows as irradiation lamp groups 5 on both sides, and both sides of the printed wiring board P conveyed by the conveyor 4 are directly irradiated.

Next, the conveyor 4 of the resist drying apparatus A
Are linearly arranged inside and outside the drying furnace 2, that is, from the vicinity of the outlet of the roll coater 1 described above to the inlet, the inside, and the outlet of the drying furnace 2. This conveyor 4
The chucking means 3 holds the printed wiring board P and sequentially conveys the printed wiring board P, and it is conceivable to adopt a conveyor belt, rails, rollers, or other known types of conveyors. In any case, as shown in FIG. 2, for example, the conveyor 4 has a space corresponding to the printed wiring board P at least at the loading stage, that is, between the exit of the roll coater 1 and the entrance of the drying furnace 2. At the same time, they are arranged linearly while facing each other on the left and right sides and run. The conveyor 4 of the embodiment shown in FIG. 1 and FIG. 2 is stretched in the drying furnace 2 with the same structure.
Unlike the conveyor 4 of the embodiment shown in FIG. 4, a single linear conveyor is used in the drying furnace 2.

Next, the chucking means 3 of the resist drying device A will be described in detail. The chucking means 3 is provided on the conveyor 4 at least at the stage of loading into the drying furnace 2.
It is rotatably mounted on a horizontal shaft. In the example shown in FIG. 2, the base end shaft rod 9 of the chucking means 3 is formed in each of the left and right conveyors 4 and the mounting groove 1 whose upper surface is open is formed.
It is bridged between 0 and both ends of the base shaft 9 are held in the left and right mounting grooves 10. Therefore, the chucking means 3 as a whole is mounted in a substantially hanger-like manner via the base end shaft bar 9 and the mounting groove 10 on the side of the conveyor 4 so as to be rotatable with respect to the conveyor 4 by a horizontal shaft. A large number of such a pair of left and right mounting grooves 10 is formed on the left and right conveyors 4 at appropriate intervals in the transport direction.

The chucking means 3 has a structure that can be opened and closed by magnetic force, for example.
It is possible to hold the end of. First, for example, the chucking means 3 shown in FIG.
1, a lower grip 12, a magnet 13 provided on the upper grip 11, a magnet 14 arranged above the magnet 13 to be movable up and down, and a spring 15 for urging the upper grip 11 toward the lower grip 12. And a guide shaft 16 when the upper grip 11 is moved up and down.
Is mounted on the guide shaft 16 between the upper grip 11 and the immovable portion. For example, a permanent magnet is used as the magnet 13, and an electromagnet is used as the magnet 14, but it is also possible to use an electromagnet or a permanent magnet, respectively. As shown in the figure, the chucking means 3 always closes the upper grip 11 and the lower grip 12 by the urging force of the spring 15, and functions as a strong grip of the printed wiring board P. On the other hand, by slightly lowering the magnet 14 and generating a magnetism opposite to that of the magnet 13 by energization, the magnet 13 and the upper grip 11 are pulled up by a magnetic force against the biasing force of the spring 15, and the upper grip 11 and The space between the lower grips 12 can be opened.
Of course, when the magnet 14 is de-energized and its magnetism and magnetic force are released and the magnet 14 is raised, the magnet 13 and the upper grip 11 are lowered again by the urging force of the spring 15, and a gap between the upper grip 11 and the lower grip 12 is shown. It will be closed.

The chucking means 3 shown in FIG. 7 (2) is an upper grip 11, a lower grip 12, a magnet 13 attached to the upper grip 11, and a magnet attached to the lower grip 12. 14 and a guide shaft 16 when the upper grip 11 is moved up and down. For example, a permanent magnet is used as the magnet 13 and an electromagnet is used as the magnet 14, but conversely, an electromagnet may be used as the magnet 13 and a permanent magnet may be used as the magnet 14. As shown in the figure, the chucking means 3 always sets the magnets 13 and 14 in opposite magnetic directions so that the magnetic force between the magnet 13 and the magnet 14 causes a space between the upper grip 11 and the lower grip 12. It is closed and functions as a strong grip of the printed wiring board P by such a magnetic coupling.
On the other hand, for example, by setting the magnetic directions of the magnets 14 to be opposite to each other so as to match the magnetic directions of the magnets 13, a repulsive force is generated between the magnets 13 and 14, and the upper grip 11 and the lower grip 12 are opened. Become. Of course, by returning the magnetic direction of the magnet 14, the magnetic force between the magnet 13 and the magnet 14 causes the upper grip 11 and the lower grip 12 to be closed again as shown in the drawing. The setting change of the magnetic direction of the magnet 14 is performed depending on the presence or absence of energization.

The chucking means 3 which can be opened and closed as shown in FIGS. 7 (1) and 7 (2) is, as described above, conveyed to the conveyor 4 at least at the stage of loading into the drying furnace 2. In this case, it is rotatably mounted on a horizontal shaft and can be sequentially changed to the following postures. The chucking means 3 is of course not limited to a structure that can be opened and closed by magnetic force as shown in FIGS. 7A and 7B and FIG. A structure may be adopted, for example, an upper grip 11 and a lower grip 12
A structure may be employed in which a spring is interposed between the two and the structure can be opened and closed by its urging force, so that the end portion of the printed wiring board P can be held. In any case, the chucking means 3 can be sequentially changed to the following postures.

First, the chucking means 3 of the embodiment shown in FIGS. 1 and 2 has the following horizontal posture W and vertical rotational displacement posture X.
And the vertical posture Z, the posture can be changed. That is, the chucking means 3 is located in the vicinity of the exit of the printed wiring board P, which is carried out horizontally between the coating rollers 6 of the roll coater 1, near the exit thereof.
The horizontal posture W capable of holding this by opening and closing, and the tip portion, that is, the upper end portion of the printed wiring board P completely carried out from between the coating rollers 6 of the roll coater 1 are held and gradually displaced downward, and this is lowered. In the drying oven 2 in a state in which the vertical rotational displacement posture X of rotating by 90 degrees and the upper end portion of the printed wiring board P are held as they are and are hung vertically and vertically to the conveying direction of the conveyor 4. Vertical posture Z for transporting
And the posture can be changed sequentially.

The chucking means 3 of the embodiment shown in FIGS. 3 and 4 has the following horizontal posture W, vertical rotational displacement posture X,
It is possible to change between a horizontal rotational displacement posture Y and a vertical posture Z. That is, the chucking means 3 is
The horizontal position W, which is located facing the front end of the printed wiring board P that is unloaded horizontally between the coating rollers 6 of the roll coater 1 and can hold it by opening and closing, and between the coating rollers 6 of the roll coater 1 completely. While holding the front end portion, that is, the upper end portion of the printed wiring board P that has been carried out, the printed wiring board P is gradually displaced downward, and the vertical rotational displacement posture X in which it is rotated 90 degrees downward, A horizontal rotational displacement posture Y in which it is held and vertically suspended and is gradually displaced to the left and right, and is rotated 90 degrees on a vertical axis from a right angle to a parallel state with respect to the conveying direction of the conveyor 4 , The posture can be sequentially changed to a vertical posture Z in which the upper end of the printed wiring board P is held as it is and is hung in parallel and vertically to the conveying direction of the conveyor 4 so that the drying furnace 2 can be conveyed. Has become. In addition, the horizontal rotational displacement posture Y of the chucking means 3 described above is set so that the chucking means 3 and the printed wiring board P are vertically moved by the turning mechanism (not shown) arranged between the conveyors 4. It is realized by swinging left and right on the axis of. The chucking means 3 of the resist drying apparatus A has such a structure.

Next, FIG. 5 shows still another embodiment of the resist drying apparatus A. The resist drying apparatus A of FIG. 5 is used in combination with the roll coater 1 of the resist drying apparatus A of FIGS. 1, 2 and 3 and 4 described above, but is combined with the printing machine 17. Used. That is, the liquid photosensitive resist B is printed and applied to one surface of the outer surface of the printed wiring board P by the printing machine 17 instead of the roll coater 1. Therefore, the chucking means 3 of the resist drying apparatus A is provided at the front end portion of the printed wiring board P which is carried out from the printing machine 17 in a horizontal state.
A horizontal posture W facing each other through the interposition conveyor 18, a vertical rotational displacement posture X for rotating while holding the front end portion, that is, the upper end portion, of the printed wiring board P completely discharged from the printing machine 17, are required. Depending on the above, the lateral rotational displacement posture Y
Then, the posture can be sequentially changed to the vertical posture Z described above. In addition, in the resist drying apparatus A of FIG. 5, other configurations are the same as those of FIGS. 1, 2 and 3 and 4 described above.
The description is omitted because it is similar to that of the embodiment.

FIG. 6 shows an example of the conveyor 4 in each of these embodiments. The conveyor 4 of the resist drying apparatus A shown in FIG. 6 includes a roll coater 1 and a printing machine 1.
It is provided with a first conveyor 4M located at a lower position for loading from 7 into the drying furnace 2 and a second conveyor 4N dedicated to the inside of the drying furnace 2 and located at an upper position. Then, the printed wiring board P
The chucking means 3 for holding the
As for M, as described above with reference to FIGS. 1, 2, 3, 4, and 5, for example, the proximal shaft 9 and the mounting groove 10 are used.
Is rotatably mounted on a horizontal shaft. Next, the chucking means 3 is attached to the second conveyor 4N by magnetic force. For example, while the base end shaft bar 9 of the chucking means 3 is magnetized,
On the side of the endless second conveyor 4N, a large number of magnetized magnet members 19 are laterally provided at appropriate intervals in the longitudinal direction. Therefore, this magnet member 1
The base end shaft rod 9 of the chucking means 3 which is carried in below by the first conveyor 4M and pushed up to the upper side can be detached, that is, magnetically coupled by the magnetic force, so that the chucking means below the second conveyor 4N. 3 and the printed wiring board P is attached, and is transported and dried. After drying, the magnet coupling between the magnet member 19 and the base shaft 9 is released, and the chucking means 3 and the printed wiring board P are returned to the lower position.

The present invention is constructed as described above. Then it becomes as follows. The resist drying apparatus A has a structure that can be opened and closed and employs a chucking means 3 that is rotatably attached to a conveyor 4 with a horizontal shaft. In the embodiments of FIGS. 1, 2 and 3 and 4, first, the liquid photosensitive resist B is transferred onto the outer surface of the printed wiring board P by the upper and lower application rollers 6 of the roll coater 1. ， Applied. Then, the printed wiring board P on which the photosensitive resist B has been transferred and applied in this manner is sequentially extruded from between the application rollers 6 of the roll coater 1 from the tip end side, and is conveyed in a horizontal state. Then, the front end portion of the printed wiring board P which is carried out in the horizontal state as described above is inserted into the chucking means 3 which has been opposed to the open posture W in the vicinity of the exit, and then the chucking means. The front end portion of the printed wiring board P is held by the chucking means 3 by opening and closing the horizontal position W of the printed wiring board P.

Then, the printed wiring board P is further carried out from between the roll coaters 1, and in response to this, the chucking means 3 holds the front end portion of the printed wiring board P carried out in such a horizontal state. As it is, it is slightly conveyed in the direction of the anti-roll coater 1 by the conveyor 4. As a result, when the printed wiring board P is completely carried out from between the roll coaters 1 and separated, the chucking means 3 turns vertically from the horizontal posture W to the vertical posture Z with the conveyor 4 as a horizontal axis. The displacement posture X is taken, and it is gradually displaced downward and rotated 90 degrees. Therefore, the printed wiring board P whose front end portion, that is, the upper end portion is held by the chucking means 3 as described above, is rotated 90 degrees downward from the horizontal state until then, with the rear end portion as a free end, and the conveyor 4 is rotated. It is in a state of being hung vertically in a state perpendicular to the conveying direction of.

Resist drying apparatus A of the embodiment shown in FIGS. 1 and 2.
Then, after that, the chucking means 3 is conveyed in the drying furnace 2 by the conveyor 4 while maintaining the vertical posture Z.
The printed wiring board P has such a chucking means 3 as described above.
While being held at the upper end thereof, the hot air is blown out and conveyed in the drying furnace 2 which is hung vertically at a right angle to the conveyance direction of the conveyor 4. Then, the photosensitive resist B transferred and applied on the outer surface of the printed wiring board P is dried and cured by hot air.

On the other hand, in the resist drying apparatus A of the embodiment shown in FIGS. 3 and 4, after the steps from above are followed,
As an alternative to the above-described case of the embodiment of FIGS. 1 and 2, the chucking means 3 holds the upper end portion of the printed wiring board P and hangs vertically while keeping the horizontal rotation with the vertical axis. Take the dynamic displacement posture Y and gradually displace in the left-right direction.
Rotate 0 degrees. Accordingly, the printed wiring board P is also rotated 90 degrees from the right angle to the conveyance direction of the conveyor 4 to the parallel state while the upper end portion is held by the chucking means 3 as described above. Then, the chucking means 3 takes the vertical posture Z as it is, and is conveyed in the drying furnace 2 by the conveyor 4. Therefore, in the embodiment of FIG. 3 and FIG.
As an alternative to the above in the case of the embodiment of FIG. 2, the printed wiring board P is hung in parallel and vertically with respect to the conveying direction of the conveyor 4 while the upper end portion is held by such chucking means 3. In this state, a large number of irradiation lamp groups 5 are conveyed in the drying oven 2 arranged side by side. Then, the photosensitive resist B transferred and applied on the outer surface of the printed wiring board P is dried and cured by the irradiation of the irradiation lamp group 5.

The printed wiring board P, on which the photosensitive resist B has been dried and cured in this way, is then exposed by exposing a negative film to the photosensitive resist B in an exposing device and developing in a developing device. The liquid is jetted and the developing process is performed. Then, when the photosensitive resist B is used as an etching resist, etching is performed,
Further, when the photosensitive resist B is used as a solder resist, parts are mounted on the parts mounting parts by soldering. By the way, in the above-described embodiments of FIGS. 1, 2 and 3 and 4, the photosensitive resist B is transferred and applied on both surfaces of the outer surface of the printed wiring board P, and the resist drying device A is used to did,,,,,,
By following the steps of ,,, the photosensitive resists B on both sides are dried and cured. Further, the chucking means 3 used in such a resist drying apparatus A
Has a structure that can be opened and closed by magnetic force as shown in FIG. 7, for example, so as to hold the end portion of the printed wiring board P.

Further, in the embodiment of FIG. 5, the above-mentioned FIG.
A photosensitive resist B is printed and applied on the outer surface of the printed wiring board P by a printing machine 17 in place of the roll coater 1 in the embodiments of FIGS. 2, 3 and 4. The resist drying apparatus A of the embodiment shown in FIG.
According to the embodiment shown in FIGS. 2, 3 and 4, the chucking means 3 is first positioned in the lateral position W so as to face the end of the printed wiring board P carried out from the printing machine 17, and then In the vertical rotational displacement posture X, the printed wiring board P that has been completely discharged from the printing machine 17 is rotated while holding the end portion thereof. FIG. 6 shows an example of the conveyor 4 in the resist drying apparatus A shown in FIGS. 1, 2, 3, 4, and 5, and the conveyor 4 shown in FIG.
M and the second conveyor 4N. The chucking means 3 for holding the printed wiring board P has the first
After being attached to the conveyor 4M by a horizontal shaft and loaded into the drying furnace 2, it is magnetically attached to the upper second conveyor 4N and transported in the drying furnace 2.

Now, the resist drying apparatus A, that is, the resist drying apparatus A of each embodiment shown in FIG. 1, FIG. 2, FIG. 3, FIG. 4, FIG. The second and the third.

First of all, the printed wiring board P carried out horizontally between the roll coaters 1 and from the printing machine 17 is
In recent years, the thickness has become extremely thin, and it is extremely flexible. Furthermore, the printed wiring board P is carried out from between the roll coaters 1.
In particular, due to the pressure contact between the coating rollers 6 of the roll coater 1, the upward and downward directions are particularly likely to be imparted.
Therefore, in the resist drying apparatus A, the leading end of the printed wiring board P is held by the chucking means 3 in the horizontal posture W immediately after being carried out from the roll coater 1 or the printing machine 17. Further, after that, the chucking means 3 takes the vertical posture Z through the vertical and horizontal rotational displacement postures X and Y, so that the printed wiring board P whose upper end is held by the chucking means 3 as described above. Is transported from the horizontal state to the vertically suspended state and dried. In this way, the printed wiring board P is immediately suspended by its own weight in a vertically suspended state, so that the occurrence of bending, curling, and bending of the waist can be reliably prevented.

Secondly, similarly, after the printed wiring board P is completely carried out from the roll coater 1 or the printing machine 17,
Immediately, it is transported from the horizontal state to the vertically suspended state and dried. Therefore, it is possible to reliably prevent the circuit portion of the printed wiring board P from coming into contact with other members such as the conveyor 4 and causing scratches or the like except for the gripping portion of the end portion held by the chucking means 3. To be done. Further, as described above, the occurrence of the bending, curling and bending of the waist is avoided, so that the printed wiring boards P themselves, that is, the circuit portions thereof may come into contact with each other to cause a scratch or the like. Certainly prevented.

Thirdly, the chucking means 3 having an openable and closable structure is attached to the conveyor 4 so as to be rotatable about a horizontal axis, and the horizontal posture W, the vertical and horizontal rotational displacement postures X,
This is realized by making the posture variable such as Y or vertical posture Z. That is, the above-described first and second points are easily realized by a simple configuration, by being continuously used for the roll coater 1 or the like automatically without being interrupted in the process and manually.

[0050]

As described above, the resist drying apparatus according to the present invention employs a chucking means which has an openable and closable structure and is rotatably attached to a conveyor on a horizontal shaft, and has a predetermined lateral width. The following effects are exhibited by making it possible to change the posture sequentially such as posture, rotational displacement posture, and vertical posture.

First, the printed wiring board is prevented from being bent, curled, and bent. That is, even an extremely thin printed wiring board is transported without being bent, curled, or bent at the waist, so that the applied photosensitive resist is surely and sufficiently dried, so that the post exposure, The quality of the manufactured printed wiring board is improved without adversely affecting the development process and the like. As described above, the resist drying device can reliably handle the transfer and coating of the photosensitive resist by the roll coater, and can also sufficiently support the recent extremely thin printed wiring board.

Secondly, scratches and the like due to contact with the printed wiring board are prevented. In other words, the printed wiring board does not come into contact with others or between themselves, and the occurrence of scratches, etc. is prevented, so that the cause of circuit shorts, disconnections, and other defects is eliminated. The device can sufficiently cope with the recent increase in density of printed wiring boards.

Thirdly, these are easily, automatically and continuously realized with a simple structure. That is,
According to this resist drying apparatus, the above-described first and second points are realized by a simple configuration, not manually but automatically without interruption of the process, and continuously used in a roll coater or the like. It is excellent in economic efficiency and can sufficiently meet the recent cost demands of printed wiring boards. As described above, the effects of the present invention are remarkably large, such as the problems existing in this type of conventional example are eliminated.

[Brief description of drawings]

FIG. 1 is a front explanatory view showing an embodiment of a resist drying apparatus according to the present invention.

FIG. 2 is a plan view of a main part of the embodiment shown in FIG.

FIG. 3 is a front explanatory view showing another embodiment of the resist drying apparatus according to the present invention.

FIG. 4 is an explanatory plan view of the embodiment of FIG.

FIG. 5 is a front explanatory view of a main part, showing still another embodiment of the resist drying apparatus according to the present invention.

FIG. 6 is a front explanatory view showing an example of a conveyor in each of these embodiments.

7A and 7B are front explanatory views of the chucking means in each of these embodiments, FIG. 1A shows one example thereof, and FIG. 7B shows another example.

[Explanation of symbols]

 1 Roll Coater 2 Drying Furnace 3 Chucking Means 4 Conveyor 4M First Conveyor 4N Second Conveyor 5 Irradiation Lamp Group 6 Coating Roller 7 Tray 8 Interposition Roller 9 Base End Shaft 10 Mounting Groove 11 Upper Grip 12 Lower Grip 13 Magnet 14 Magnet 15 Spring 16 Guide shaft 17 Printing machine 18 Interposed conveyor 19 Magnet member A Resist drying device B Photosensitive resist P Printed wiring board W Horizontal posture X Vertical rotational displacement posture Y Horizontal rotational displacement posture Z Vertical posture

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01L 21/027 H05K 3/06 F 3/28 E

Claims (6)

[Claims] 1. A resist drying apparatus for drying and curing a liquid photosensitive resist used in a manufacturing process of a printed wiring board and transferred and applied to the outer surface of the printed wiring board by a roll coater. A drying oven in which hot air is blown and circulated, a conveyor for sequentially carrying the printed wiring board while holding it by a chucking means in the drying oven, etc., and a horizontal conveyor at least at the stage of loading into the drying oven. The chucking means is rotatably mounted on the shaft and is openable / closable, and the chucking means is an end of the printed wiring board that is carried out horizontally between the roll coaters. And a horizontal posture in which it can be held by opening and closing, and it is gradually displaced downward while holding the end portion of the printed wiring board that has been completely carried out between the roll coaters. , A vertical rotational displacement posture of rotating it 90 degrees downward, and holding the upper end portion of the printed wiring board as it is, and suspending it in a state perpendicular to the conveying direction of the conveyor and vertically. A resist drying apparatus characterized in that the posture can be sequentially changed to a vertical posture so that the furnace can be transported. 2. A resist drying apparatus for drying and curing a liquid photosensitive resist used in a manufacturing process of a printed wiring board and transferred and applied to the outer surface of the printed wiring board by a roll coater, A drying furnace in which a large number of irradiation lamp groups are arranged side by side, and a conveyor that sequentially conveys along the irradiation lamp groups while holding the printed wiring board by chucking means in the drying furnace or the like, The chucking means is rotatably attached to the conveyor at least at a stage of loading into the drying furnace by a horizontal shaft, and has a structure capable of opening and closing. The chucking means is provided between the roll coaters. From the roll coater, and a horizontal position facing the end of the printed wiring board that is unloaded horizontally from the roll coater. Hold the edge of the board and gradually displace it downward, and rotate vertically by 90 degrees, and hold the upper end of the printed wiring board and hold it vertically. Hold the upper end of the printed wiring board as it is, with a horizontal displacement position that is gradually displaced to the left and right, and that is rotated 90 degrees on a vertical axis from a right angle to a parallel state with respect to the convey direction of the conveyor. ,
A resist drying apparatus, in which the posture can be sequentially changed to a vertical posture in which it can be transported in the drying furnace in a state of being suspended vertically and in parallel to the transport direction of the conveyor. 3. The resist drying device according to claim 1 or 2, wherein the photosensitive resist is transferred and applied by the roll coater on both outer surfaces of the printed wiring board. A resist drying apparatus characterized by: 4. The resist drying apparatus according to claim 1 or 2, wherein the chucking means has a structure that can be opened and closed by magnetic force, and can hold an end portion of the printed wiring board. A resist drying device characterized by the following. 5. The resist drying apparatus according to claim 1, wherein the liquid photosensitive resist is printed and applied on the outer surface of the printed wiring board by a printing machine instead of the roll coater. Therefore, the chucking means has a horizontal position facing the end of the printed wiring board that is unloaded in the horizontal state from the printing machine, and an end of the printed wiring board that is completely unloaded from the printing machine. A resist drying apparatus, which is capable of sequentially changing its posture to a vertical rotational displacement posture in which it is rotated while being held, and other postures. 6. The resist drying apparatus according to claim 1, 2, or 5, wherein the conveyor is a first conveyor located at a lower position for loading into the drying furnace, and the drying furnace. And a chucking means for holding the printed wiring board.
A resist drying apparatus, which is rotatably attached to the first conveyor along a horizontal axis and magnetically attached to the second conveyor.