JPH0575234A - Manufacture of wiring board - Google Patents

Abstract

PURPOSE:To provide a method for applying resist ink accurately to both falls front and rear of a thin lamination board, especially of a thickness of about 0.5 to 0.6mm. CONSTITUTION:After a lamination board 30 is transferred in a horizontal state and changed to a vertical state in a posture converter 16, it is sent to a resist ink applicator 17. Here, it is made to pass through between a pair of right and left roll coaters 33, 34 and resist ink is applied simultaneously to both faces front and rear of the lamination board excepting both side edges thereof, both right and left side edge parts whereto resist ink is not applied are held by transfer rollers 51, 52, and the board is made to pass through a drying device while being transferred in a horizontal direction which crosses a plane of the lamination board in a vertical state at right angles.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and in particular, a resist pattern is formed by applying a resist ink on a conductive layer laminated on both sides of an insulating layer, drying the resist ink, and then exposing and developing the resist ink. The present invention relates to a method for manufacturing a printed wiring board by etching a conductive layer using this resist pattern as a mask to form a predetermined conductive pattern.

[0002]

2. Description of the Related Art In manufacturing a conventional printed wiring board, a photoresist film is formed on a laminated plate in which conductive layers such as copper are laminated on both sides of an insulating plate. Known are a screen printing method, a dry film method, an electrodeposition method, and a liquid resist method.

The screen printing method directly forms a predetermined resist pattern by a screen printing technique. Further, the dry film method is to form a resist film by pasting a film made of a resist material on a conductive layer, and the electrodeposition method is to form a resist on the conductive layer by electrodeposition, which is a liquid. The resist method is a method in which a resist ink is applied onto the conductive layer using an ink roller such as a roller coater. In these methods, a pattern film having a predetermined pattern is laminated on the resist film thus formed. And exposed to ultraviolet rays and developed to form a resist pattern. After forming a predetermined resist pattern on the conductive layer in this manner, etching is performed using the resist pattern as a mask to selectively remove the conductive layer to produce a printed wiring board having a desired conductor pattern. There is.

[0004]

Among the conventional methods for manufacturing a printed wiring board described above, the screen printing method is a simple method because the resist pattern itself is formed by printing, but it is limited to fine patterning. There are drawbacks. In addition, the dry film method has a drawback that it is expensive and costly to form a dry film, and that a fine pattern cannot be formed. Further, the electrodeposition method requires an expensive electrodeposition apparatus and high cost. Although the liquid resist method does not have such a defect, it has a defect that the manufacturing facility becomes large.

That is, when the resist is formed on the conductive layers laminated on both sides of the laminated plate in the conventional liquid resist method, if the resist is applied simultaneously on both sides, the laminated plate cannot be transported, so that the treatment is performed on each side. I had to do it. That is, the resist ink is applied to one surface by a roll coater and dried, and then the resist ink is applied to the other surface and dried. For this reason, when using one roll coater, it is necessary to return the laminated plate to the position of the roll coater again after forming the resist on one surface, and the conveyance route of the laminated plate becomes long, resulting in a manufacturing facility. The installation area of is greatly increased. Also, when using two roll coaters, it is not necessary to return the laminated plate to the roll coater, but if the resist dry area is 2
There is a drawback that it requires more parts and the manufacturing equipment becomes larger. Further, the conventional method of forming the resist on the front surface and the back surface of the laminated plate in separate steps has a drawback that the efficiency is low and the throughput is low.

In order to solve such a drawback, the applicant of the present invention applies a resist ink to both front and back surfaces of a laminated plate while conveying it horizontally between a pair of upper and lower ink rollers.
We proposed a method of carrying and drying the laminated plate while holding the laminated plate at one side edge not coated with resist ink. In such a method, the thickness of the laminated board is 0.6 mm or more, especially 0.6 to 3.2.
If the thickness is relatively thicker than 10 mm, no problem will occur, but if the thickness of the laminated plate is smaller than this, the laminated plate may bend and cannot be applied effectively when it is held horizontally. I confirmed.

An object of the present invention is to eliminate the above-mentioned drawbacks of the conventional liquid resist method, to efficiently manufacture a printed wiring board with a small equipment having a small installation area, and to have a thickness of less than 0.6 mm. Laminates, especially 0.
It is intended to provide a method for manufacturing a printed wiring board that can be effectively applied to a thin laminated board having a thickness of 05 to 0.4 mm.

[0008]

According to the method for manufacturing a printed wiring board of the present invention, the printed wiring board is manufactured by patterning a conductive layer of a laminated board in which conductive layers are laminated on both sides of an insulating board. While the wafer is conveyed so that its plane is vertical, the resist ink is simultaneously applied to both the front and back surfaces while forming the portions not applied with the resist ink along the opposite side edges of the front and back surfaces, and the resist ink is applied. It is characterized in that the laminated plate is conveyed while being held vertically at both side edges, and then dried.

[0009]

In the manufacturing method of the present invention as described above, since the resist ink is applied to both the front and back surfaces of the laminate at the same time and dried, the printed wiring board can be efficiently manufactured and the installation area of the manufacturing equipment can be increased. Can be reduced. Further, even if the resist ink is applied to both the front and back surfaces, the resist ink is not applied to the side edges of the front and back surfaces facing each other back to back, so that the laminated plate can be transported by utilizing these side edges. Therefore, the applied resist film is not adversely affected by the transportation of the laminated plate.

Further, when the resist ink is applied, since the laminated plate is conveyed in a vertical posture, even if the laminated plate becomes thin, the laminated plate does not bend and the resist ink is applied to the laminated plate. Can be accurately applied to both sides of.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view diagrammatically showing the overall construction of a manufacturing facility for carrying out the method for manufacturing a printed wiring board according to the present invention. In this example, the resist ink is applied to the inner layer board of the multilayer board, and the resist ink is applied to the front and back of the copper clad laminate. In this example, the thickness of this laminate is 0.1 mm, and the length and width are 500 × 330 mm. The laminated plate thus pretreated is set in the feeding machine 11.

A large number of laminated plates set in the laminated plate loading machine 11 are successively conveyed by the conveyor 12 while the static eliminator 13
Also, the dust cleaner 14 removes the electric charges charged on both the front and back surfaces and removes the dust. The laminated plates whose surfaces have been cleaned in this way are placed on the conveyor 15 one after another, sent to the posture changing device 16 for converting the laminated plates from the horizontal state to the vertical state, and conveyed vertically upward, and a pair of left and right roll coaters. Is sent to the resist ink applicator 16 having. Since the posture changing device 16 and the resist ink applicator 17 are arranged vertically, they appear to overlap in FIG.

FIG. 2 shows the detailed configurations of the posture changing device 16 and the resist ink applicator 17. Conveyor 15
The laminated plate 30 that has been placed on the and is carried into the posture changing device 16 in a horizontal state is further conveyed by being inserted between the pair of posture changing rollers 31 and 32 arranged vertically at this point. As shown in FIG. 3A, when the posture conversion rollers 31 and 32 grip near the rear end of the laminated plate 30, the rotation of these posture conversion rollers is stopped, and then one of the posture conversion rollers 31 is rotated.
The other posture changing roller 32 is rotated by 90 degrees about the axis of (3) to change the posture of the laminated plate to the vertical state as shown in FIG. 3B. After holding the laminated plate 30 in the vertical state in this way, the posture changing rollers 31 and 32 are rotated in opposite directions, and the laminated plate 30 is fed upward as shown in FIG. 3C.

As shown in FIG. 2, a laminated plate 30 which is converted from a horizontal state to a vertical state by a posture changing device 16 and is conveyed upward.
Is sent to the resist ink applicator 17. In this resist ink applicator 17, roll coaters 33 and 34 are arranged on the left and right as shown in FIG.
The resist ink is applied to both the front and back sides at the same time by passing through 30 vertically. In this example, the thickness of these resist ink layers is set to be 5 to 20 μm after drying. As shown in FIG. 2, ink reservoirs 35 and 36 for supplying resist ink to the roll coaters 33 and 34 are provided so as to be in contact with the roll coaters 33 and 34, respectively.

Further, as shown in FIG. 2, a pair of doctor blades 37 and 38 are provided on the roll coater 33 and 38 so that the resist ink is not applied to both side edges of the front and back surfaces of the laminated plate 30.
Abut on both ends of 34. That is, these doctor blades 37 and 38 are provided on the downstream side of the ink reservoirs 35 and 36 as viewed in the rotation direction of the roll coaters 33 and 34, and are stacked by scraping off the resist ink adhering to the surfaces of both end portions of the roll coater. Avoid applying resist ink to both edges of the plate surface. Further, so that the contact pressure between the laminated plate 30 and the roll coaters 33 and 34 becomes a predetermined value,
Air pressure sensors 39 and 40 are provided, and pressure contact drive mechanisms 41 and 42 for pressing the roll coater to the laminated plate are controlled by the output signals of these air pressure sensors so that the roll coater always hits the laminated plate at a desired constant pressure. ..

In this way, the resist ink is simultaneously applied to both the front and back surfaces of the laminated plate 30, and as shown in FIG. 4, a resist ink application portion 45 sandwiched by the portions 43 and 44 on both side edges where the resist ink is not applied is formed. To be done. Although FIG. 4 shows the state of the front surface, the back surface is in the same state.

As shown in FIG. 2, a resist ink coating machine 18
The laminated plate 30 having the resist ink applied on both sides thereof is further conveyed upward, and the portions 43 and 44 formed on the side edges of the front and back surfaces of the laminated plate which are not coated with the resist ink are conveyed by four pairs of conveying rollers 51, 52. It is gripped by (only the two pairs of front-side transport rollers are visible in FIG. 2). These transport rollers 51 and 52 are attached to endless chains 53 and 54, and these endless chains are connected to the drying device 18
Has been extended to. In this way, the sequential laminated plates 30 are conveyed in the horizontal direction orthogonal to the plane while being held in the vertical state, and are carried into the drying device 18.

In the drying device 18, the laminated plate 30 is held by the conveying rollers 51 and 52, and these conveying rollers are moved by the endless chains 53 and 54 to heat the laminated plate while conveying the laminated plate by an appropriate heating means. The resist ink applied on both the front and back sides is dried. In the present invention, the laminated plate 30 is conveyed in a direction perpendicular to the plane of the laminated plate in the drying device 18 in a vertical posture, so that successive laminated plates can be brought close to each other, and therefore the drying device The length can be shortened, and as a result, the entire manufacturing apparatus can be downsized.

After drying the resist ink applied to the front and back surfaces in this way, the laminated plate 30 is received by the receiver 20, stocked in units of a predetermined number of laminated plates, and further conveyed to the next step via the curve conveyor 21. To do. In the next step, exposure and development are performed as usual to pattern the resist film, and etching is performed using this resist pattern as a mask to selectively remove the conductive layer and form a conductor pattern to complete the printed wiring board. To do. These processes are not essential to the invention and will not be described further.

A high-density printed wiring board having a conductor pattern having a pattern width of 80 μm and a pattern interval of 80 μm is manufactured by using the above-described method for manufacturing a printed wiring board according to the present invention and using an extremely thin laminated board having a thickness of 0.1 mm. It was possible to manufacture at a high throughput with a yield of 98%.
Moreover, the installation area of the manufacturing apparatus was about 2/1 or less of the installation area of the conventional manufacturing apparatus having the same throughput.

The present invention is not limited to the above-described embodiments, but many modifications and variations are possible. For example, in the above-mentioned embodiment, as the laminated plate, one having no holes is used like the inner layer plate of the multilayer laminated plate, but with an NC drill at a predetermined position of the laminated plate in which copper layers are laminated on both surfaces of the insulating plate. After making a through hole, plating the inner surface of the through hole to electrically connect the conductive layer on the front surface and the conductive layer on the back surface, filling the through hole with filling ink to protect it and make the surface flat After forming a thick laminate or holes
It is also possible to use a relatively thin laminated plate or the like that is only plated. For example, forming holes, plating,
When using a laminated plate that has been subjected to hole filling processing,
Apply the resist ink to a thickness of 20 to 30 μm. Also,
Even in the case where the through-hole is formed, such as the IVH substrate, when the plate thickness is thin, the resist ink can be directly applied by the method of the present invention without performing the hole filling. Further, in the above-mentioned embodiment, the thickness of the laminated plate is 0.1 mm.
However, in the method of the present invention, a laminated plate having a thickness of 0.05 mm or more can be used, and it is particularly effective when an extremely thin laminated plate having a thickness of 0.05 to 0.4 mm is used. further,
In the above-described embodiment, in order to convey the laminated plate in a vertical state coated with the resist ink in the drying device,
Although the conveying roller attached to the endless chain is used, any conveying device may be used as long as it can move the laminated plate by grasping the side surface of the laminated plate not coated with the resist ink. ..

[0022]

As described above, in the method for manufacturing a printed wiring board according to the present invention, the resist ink can be simultaneously applied to both front and back surfaces of the laminated board, so that the installation area of the manufacturing equipment can be remarkably reduced as compared with the conventional case. be able to. Further, when the resist ink is applied, since the laminated plate is in a vertical state, it does not bend even when the laminated plate is thin, and therefore the resist ink can be applied accurately. Furthermore, since the resist ink is applied in a vertical state and then conveyed in the drying device in the same posture, it is possible to convey a large number of laminated plates close to each other in the drying area, which further reduces the size of the manufacturing equipment. can do.

[Brief description of drawings]

FIG. 1 is a plan view diagrammatically showing the overall configuration of equipment for implementing a method for manufacturing a printed wiring board according to the present invention.

FIG. 2 is a side view showing a configuration of a posture changing device and a resist ink applicator of the same.

3A to 3C are side views for similarly explaining the operation of the posture conversion device.

FIG. 4 is a front view showing a laminated plate coated with resist ink.

[Explanation of symbols]

 11 Laminated board loading machine 12 Conveyor 13 Static eliminator 14 Dust cleaner 16 Attitude change device 17 Resist ink application device 18 Drying device 31, 32 Attitude change roller 33, 34 Roll coater 35, 36 Ink reservoir 37, 38 Doctor blade 39, 40 Air pressure Sensor 41, 42 Drive unit 43, 44 Resist ink non-applied part 45 Resist ink applied part 51, 52 Conveyor roller 53, 54 Endless chain

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Namiki 3-12-5 Yahei, Kawaguchi City, Saitama Prefecture Pilot Seiko Co., Ltd.

Claims (2)

[Claims] 1. When manufacturing a printed wiring board by patterning a conductive layer of a laminated plate in which conductive layers are laminated on both sides of an insulating plate, the laminated plate is conveyed so that its plane is vertical, While simultaneously forming resist ink non-coated portions along both opposite edges of both sides, resist ink is simultaneously applied to both front and back surfaces, while holding the laminated plate in a vertical state at both edges not coated with the resist ink. A method for manufacturing a printed wiring board, which comprises transporting and drying. 2. The laminated plate is conveyed in the horizontal direction while gripping the front and back surfaces of both side edges by a pair of rollers, and then the shaft of the other roller is rotated 90 degrees about the shaft of the other roller. The attitude of the laminated plate is changed to a vertical state by further rotating the roller to convey the laminated plate in the vertical direction between the pair of left and right ink rollers, and the resist ink is applied to both front and back surfaces thereof. 1. The method for manufacturing a printed wiring board according to 1.