JP2000353636A - Laminated ceramic part - Google Patents

Laminated ceramic part

Info

Publication number
JP2000353636A
JP2000353636A JP2000064928A JP2000064928A JP2000353636A JP 2000353636 A JP2000353636 A JP 2000353636A JP 2000064928 A JP2000064928 A JP 2000064928A JP 2000064928 A JP2000064928 A JP 2000064928A JP 2000353636 A JP2000353636 A JP 2000353636A
Authority
JP
Japan
Prior art keywords
layer
electrode
thickness
laminate
ineffective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000064928A
Other languages
Japanese (ja)
Inventor
Hisanao Nakakura
久直 中蔵
Tatsuo Kikuchi
立郎 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2000064928A priority Critical patent/JP2000353636A/en
Publication of JP2000353636A publication Critical patent/JP2000353636A/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Capacitors (AREA)

Abstract

PROBLEM TO BE SOLVED: To form a laminated ceramic part which is improve in the bending resistance strength against deflection of a mounting substrate. SOLUTION: This laminated ceramic part includes a laminate 15 of invalid layers 10 and inner electrode layers 11 and 13 alternately stacked thereon, and a pair of external electrode 16 formed on the exposed both end faces of the inner electrode layers 11 and 13 of the laminate 15 and at least on lower surfaces thereof adjacent to the both end faces. The thickness of the invalid layers 10 sandwiched by the lower surface of the external electrode 16 of the laminate 15 and by the inner electrode layers 11 is set to 1/10 or of the thickness of the laminate 15 or smaller.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は各種電子機器などに
用いられる積層セラミック部品に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic component used for various electronic devices.

【0002】[0002]

【従来の技術】従来における積層セラミック部品として
は図7に示すように構成されていた。すなわち、上下層
に厚み100μm以上のセラミック材料からなる無効層
1,2を設け、この無効層1,2間に同じくセラミック
材料からなる有効層3と内部電極層4とを交互に積層し
て積層体5を構成し、前記内部電極層4が交互に露出す
る積層体5の両端面とこの両端面に隣接する上下面およ
び正面と背面の一部に内部電極層4と電気的に接続され
る外部電極6を設けて構成されていた。
2. Description of the Related Art A conventional multilayer ceramic component has been configured as shown in FIG. That is, invalid layers 1 and 2 made of a ceramic material having a thickness of 100 μm or more are provided on the upper and lower layers, and effective layers 3 made of the same ceramic material and internal electrode layers 4 are alternately laminated between the invalid layers 1 and 2. The body 5 is constituted, and the internal electrode layer 4 is electrically connected to the internal electrode layer 4 at both end surfaces thereof, the upper and lower surfaces adjacent to the both end surfaces, and a part of the front and back surfaces. The external electrode 6 was provided.

【0003】[0003]

【発明が解決しようとする課題】近年、積層セラミック
部品において、実装基板のたわみによる耐曲げ強度は、
実装基板への実装時や実装後の信頼性を保証するうえで
重要な特性となっている。特に回路の高密度化、回路実
装の高速化、使用環境の変化にともない、積層セラミッ
ク部品の実装基板のたわみにより耐曲げ強度のさらなる
向上が求められてきている。
In recent years, in multilayer ceramic parts, the bending strength due to the bending of the mounting board has been
This is an important characteristic in assuring reliability during and after mounting on a mounting board. In particular, as the circuit density increases, the circuit mounting speed increases, and the usage environment changes, there is a demand for further improvement in bending resistance due to the bending of the mounting substrate of the multilayer ceramic component.

【0004】このような背景の中で、上記従来の構成の
積層セラミック部品では、上下層の無効層1,2の厚さ
が100μm以上のため耐曲げ強度が十分とはいえない
ものとなっていた。
[0004] Against this background, the multilayer ceramic component having the above-described conventional configuration has insufficient bending strength because the thickness of the upper and lower ineffective layers 1 and 2 is 100 µm or more. Was.

【0005】本発明は以上のような従来の欠点を除去し
耐曲げ強度の優れた積層セラミック部品を提供すること
を目的とするものである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a laminated ceramic component having excellent bending strength by eliminating the above-mentioned conventional disadvantages.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に本発明の積層セラミック部品は、少なくとも最下層に
セラミック材料からなる無効層を設け、この無効層上に
セラミック材料からなる有効層と内部電極層とを交互に
積層した積層体と、この積層体の前記内部電極層の露出
した両端面と少なくともこの両端面に隣接する下面の一
部に形成した外部電極とを備え、この外部電極の下面部
分と下面部分に対向する内部電極層との間の無効層の厚
みを前記積層体の厚みの1/10以下とした構成とした
ものである。
In order to solve the above-mentioned problems, a laminated ceramic component according to the present invention is provided with an ineffective layer made of a ceramic material at least as a lowermost layer, and an effective layer made of a ceramic material and an internal layer formed on the ineffective layer. A laminate in which electrode layers are alternately laminated; and an external electrode formed on at least a part of a lower surface adjacent to both exposed end faces of the internal electrode layer of the laminate and the both end faces. The thickness of the ineffective layer between the lower surface portion and the internal electrode layer facing the lower surface portion is set to be 1/10 or less of the thickness of the laminate.

【0007】この構成とすることにより、実装基板のた
わみによる耐曲げ強度の向上が図れることになる。
With this configuration, it is possible to improve the bending strength due to the bending of the mounting board.

【0008】[0008]

【発明の実施の形態】本発明の請求項1に記載の発明
は、少なくとも最下層にセラミック材料からなる無効層
を設け、この無効層上にセラミック材料からなる有効層
と内部電極層とを交互に積層した積層体と、この積層体
の前記内部電極層の露出した両端面と少なくともこの両
端面に隣接する下面の一部に形成した外部電極とを備
え、この外部電極の下面部分と下面部分に対向する内部
電極層との間の無効層の厚みを前記積層体の厚みの1/
10以下とした構成であり、実装基板のたわみによる耐
曲げ強度の向上が図れるものとなる。
According to the first aspect of the present invention, at least the lowermost layer is provided with an ineffective layer made of a ceramic material, and an effective layer made of a ceramic material and an internal electrode layer are alternately formed on the ineffective layer. And an external electrode formed on at least a part of a lower surface adjacent to both the exposed end surfaces of the internal electrode layer of the laminate, and a lower surface portion and a lower surface portion of the external electrode. The thickness of the ineffective layer between the internal electrode layer and the internal electrode layer facing the
The configuration is set to 10 or less, and the bending strength due to the bending of the mounting board can be improved.

【0009】請求項2に記載の発明は、積層体の最上層
にも積層体の厚みの1/10以下の厚みの無効層を設
け、この最上層の無効層の上面の一部にも外部電極を設
けた構成であり、実装時の方向性のないものとすること
ができる。
According to a second aspect of the present invention, an ineffective layer having a thickness of 1/10 or less of the thickness of the laminate is provided also on the uppermost layer of the laminate, and a part of the upper surface of the uppermost ineffective layer is also provided with an external layer. This is a configuration in which electrodes are provided, so that there is no directionality during mounting.

【0010】請求項3に記載の発明は、少なくとも最下
層にセラミック材料からなる無効層を設け、この無効層
上にセラミック材料からなる有効層と内部電極層とを交
互に積層した積層体と、この積層体の前記内部電極層の
露出した両端面と少なくともこの両端面に隣接する下面
の一部に形成した外部電極とを備え、前記無効層の積層
体の下面に形成される外部電極の下面部分と対向する無
効層内に補強電極を設け、この補強電極と外部電極の下
面部分との間の無効層の厚みを積層体の厚みの1/10
以下とした構成であり、厚い無効層を用いても耐曲げ強
度の向上が図れるものとなる。
According to a third aspect of the present invention, there is provided a laminate in which an ineffective layer made of a ceramic material is provided at least as a lowermost layer, and an effective layer made of a ceramic material and an internal electrode layer are alternately stacked on the ineffective layer. A lower surface of an external electrode formed on a lower surface of the laminated body of the ineffective layer, comprising: an exposed both end surface of the internal electrode layer of the laminate and an external electrode formed on at least a part of a lower surface adjacent to the both end surfaces. A reinforcing electrode is provided in the ineffective layer facing the portion, and the thickness of the ineffective layer between the reinforcing electrode and the lower surface portion of the external electrode is reduced to 1/10 of the thickness of the laminate.
With the following configuration, the bending strength can be improved even when a thick ineffective layer is used.

【0011】請求項4に記載の発明は、積層体の最上層
にも補強電極を設けた無効層を設け、外部電極の最上層
の無効層上に形成される上面部分と補強電極との間の無
効層の厚みを積層体の厚みの1/10以下とした構成で
あり、実装時の方向性を無くすことができる。
According to a fourth aspect of the present invention, an ineffective layer provided with a reinforcing electrode is also provided on the uppermost layer of the laminate, and an upper surface portion formed on the uppermost inactive layer of the external electrode and the reinforcing electrode. In this case, the thickness of the ineffective layer is 1/10 or less of the thickness of the laminate, and the directionality during mounting can be eliminated.

【0012】請求項5に記載の発明は、外部電極の下面
部分または上面部分と内部電極層または補強電極との間
の無効層の厚さを80μm以下とした構成であり、耐曲
げ強度を向上させる無効層の具体的な厚さ寸法を明確に
したものである。
According to a fifth aspect of the present invention, the thickness of the ineffective layer between the lower surface or upper surface of the external electrode and the internal electrode layer or the reinforcing electrode is set to 80 μm or less, and the bending strength is improved. The specific thickness dimension of the ineffective layer to be made is clarified.

【0013】請求項6に記載の発明は、補強電極を外部
電極と電気的に接続した構成であり、補強電極による浮
遊容量を無くし特性の安定化を図ることができる。
According to a sixth aspect of the present invention, the reinforcing electrode is electrically connected to the external electrode, so that the stray capacitance due to the reinforcing electrode can be eliminated and the characteristics can be stabilized.

【0014】請求項7に記載の発明は、補強電極を外部
電極と電気的に分離した構成であり、補強電極をラフに
形成できることになる。
According to the present invention, the reinforcing electrode is electrically separated from the external electrode, so that the reinforcing electrode can be formed roughly.

【0015】請求項8に記載の発明は、補強電極を無効
層内に2層以上となるように設けた構成であり、厚い無
効層の厚さ方向全てを耐曲げ強度の優れたものとするこ
とができる。
The invention according to claim 8 is a structure in which two or more reinforcing electrodes are provided in the inactive layer, and the bending resistance in all the thickness directions of the thick inactive layer is excellent. be able to.

【0016】請求項9に記載の発明は、請求項3または
4の内部電極層の最外層は対向する内部電極に接続する
外部電極の部分に設けた補強電極とは厚み方向に重なら
ないよう形成したものであり、耐曲げ強度の向上が図れ
るとともに、特に中高圧の用途で用いられるコンデンサ
において耐電圧および表面の外部電極間で発生する沿面
放電の開始電圧を高めることができる。
According to a ninth aspect of the present invention, the outermost layer of the internal electrode layer of the third or fourth aspect is formed so as not to overlap in the thickness direction with a reinforcing electrode provided at a portion of the external electrode connected to the opposing internal electrode. Thus, the bending strength can be improved, and the withstand voltage and the starting voltage of creeping discharge generated between external electrodes on the surface can be increased particularly in a capacitor used for medium to high pressure applications.

【0017】以下、本発明の実施の形態について図面を
用いて説明する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

【0018】(実施の形態1)本発明の実施の形態1の
積層セラミック部品の代表例としての積層セラミックコ
ンデンサについて図1を用いて説明する。図1におい
て、10は最下層のセラミック材料よりなる無効層、1
1はこの無効層10上に形成され一端面側に露出するよ
うに形成された内部電極層、12はこの内部電極層11
上に形成されたセラミック材料からなる有効層、13は
この有効層12上に上記内部電極層11とは異なる他端
面側に露出するように形成された内部電極層、14は上
記内部電極層11、有効層12、内部電極層13を必要
数交互に積層した上面に形成された最上層のセラミック
材料からなる無効層、15はこれらの無効層10,14
および内部電極層11,13、有効層12によって構成
される積層体、16はこの積層体15の両端面と、この
両端面に隣接した上、下面および正、背面の一部に形成
された外部電極である。
Embodiment 1 A multilayer ceramic capacitor as a representative example of a multilayer ceramic component according to Embodiment 1 of the present invention will be described with reference to FIG. In FIG. 1, reference numeral 10 denotes an ineffective layer made of a lowermost ceramic material;
Reference numeral 1 denotes an internal electrode layer formed on the ineffective layer 10 and exposed on one end surface side, and 12 denotes an internal electrode layer 11
An effective layer 13 made of a ceramic material is formed on the effective layer 12, an internal electrode layer formed on the effective layer 12 so as to be exposed to the other end surface side different from the internal electrode layer 11, and 14 is an internal electrode layer 11 , An effective layer 12 and an internal electrode layer 13 are alternately stacked in a required number of layers.
A laminate 16 composed of the internal electrode layers 11 and 13 and the effective layer 12 is provided with both end faces of the laminate 15 and external parts formed on a part of the upper, lower, front, and rear surfaces adjacent to the both end faces. Electrodes.

【0019】上記構成で上記無効層10,14は積層体
15の厚みの1/10以下の厚みを有する構成としてあ
る。これは具体的には約80μm以下の寸法に形成され
ており、薄い無効層10,14となっており、実装基板
に実装されるときや実装後に曲げ応力が加えられても内
部電極層11または13の粘弾性で保護されて割れや欠
けといったことが防止できるものとなる。
In the above configuration, the ineffective layers 10 and 14 have a thickness of 1/10 or less of the thickness of the laminate 15. Specifically, it is formed to a size of about 80 μm or less, and is formed as thin ineffective layers 10 and 14. Even when a bending stress is applied to a mounting board or after mounting, the internal electrode layer 11 or 13 is protected by the viscoelasticity, and cracking and chipping can be prevented.

【0020】(実施の形態2)次に本発明の実施の形態
2の積層セラミック部品の代表例としての積層セラミッ
クコンデンサについて図2を用いて説明する。図2にお
いて10は最下層のセラミック材料よりなる厚い無効
層、11はこの無効層10上に形成され一端面側に露出
するように形成された内部電極層、12はこの内部電極
層11上に形成されたセラミック材料からなる有効層、
13はこの有効層12上に上記内部電極層11とは異な
る他端面側に露出するように形成された内部電極層、1
4は上記内部電極層11、有効層12、内部電極層13
を交互に積層した上面に形成された最下層のセラミック
材料からなる厚い無効層、15はこれらの無効層10,
14、内部電極層11,13および有効層12からなる
積層体、16はこの積層体15の両端面と、この両端面
に隣接する上下面および正背面の一部に形成された外部
電極、17は上記無効層10,14の少なくとも外部電
極16の上下面に形成された部分に対向する位置に上記
積層体15の厚みの1/10以下の厚みの無効層となる
ように形成された補強電極である。
Embodiment 2 Next, a multilayer ceramic capacitor as a representative example of a multilayer ceramic component according to Embodiment 2 of the present invention will be described with reference to FIG. In FIG. 2, reference numeral 10 denotes a thick ineffective layer made of a lowermost ceramic material, 11 denotes an internal electrode layer formed on the ineffective layer 10 and exposed on one end surface side, and 12 denotes an inner electrode layer formed on the inner electrode layer 11. An effective layer of a formed ceramic material,
Reference numeral 13 denotes an internal electrode layer formed on the effective layer 12 so as to be exposed on the other end surface side different from the internal electrode layer 11.
4 is the internal electrode layer 11, the effective layer 12, the internal electrode layer 13
Are formed on the upper surface in which the ineffective layers 10 and 15 are formed of the lowermost ceramic material.
14, a laminate composed of the internal electrode layers 11, 13 and the effective layer 12, 16 is an external electrode formed on both end faces of the laminate 15 and upper and lower surfaces adjacent to the both end faces and a part of the front and rear faces; Is a reinforcing electrode formed so as to be an ineffective layer having a thickness of 1/10 or less of the thickness of the laminated body 15 at a position facing at least portions of the ineffective layers 10 and 14 formed on the upper and lower surfaces of the external electrode 16. It is.

【0021】この構成の積層セラミックコンデンサの製
造方法について説明する。チタン酸バリウムを主成分と
するスラリーを所定の厚さに形成したセラミックグリー
ンシートを複数枚積層して無効層10を形成するに当
り、その積層過程で下面との間が80μm以下となる厚
みとなるように銀あるいはニッケルを主成分とした補強
電極17を印刷により形成し、この無効層10上に同じ
く銀あるいはニッケルを主成分とする内部電極層11を
印刷し、その上に上記と同じセラミックグリーンシート
からなる有効層12を積層し、その上に内部電極層13
を印刷し、その後内部電極層11の印刷、有効層12の
セラミックグリーンシートを積層、内部電極層13の印
刷の工程を複数回繰返し、最後に上面との間が80μm
以下となる位置に補強電極17を印刷した無効層14を
積層した上で焼成し、この焼結した積層体15の両端面
に内部電極層11,13および補強電極17を露出さ
せ、この両端面および両端面に隣接する上下面および正
背面に銀などからなる外部電極16を形成し、この外部
電極16として銀の上にニッケルメッキ、Sn−Pbメ
ッキを行って積層セラミックコンデンサを得た。
A method of manufacturing the multilayer ceramic capacitor having the above configuration will be described. In laminating a plurality of ceramic green sheets formed of a slurry containing barium titanate as a main component to a predetermined thickness to form the ineffective layer 10, a thickness between the lower surface and the lower surface in the laminating process is 80 μm or less. A reinforcing electrode 17 containing silver or nickel as a main component is formed by printing, and an internal electrode layer 11 also containing silver or nickel as a main component is printed on the ineffective layer 10. An effective layer 12 made of a green sheet is laminated, and an internal electrode layer 13 is formed thereon.
Is printed, then the steps of printing the internal electrode layer 11, laminating the ceramic green sheets of the effective layer 12, and printing the internal electrode layer 13 are repeated a plurality of times.
The ineffective layer 14 on which the reinforcing electrode 17 is printed is laminated and fired at the following positions, and the internal electrode layers 11 and 13 and the reinforcing electrode 17 are exposed at both end surfaces of the sintered laminate 15. External electrodes 16 made of silver or the like were formed on the upper and lower surfaces and the front and rear surfaces adjacent to both end surfaces, and nickel plating and Sn-Pb plating were performed on silver as the external electrodes 16 to obtain a multilayer ceramic capacitor.

【0022】この積層セラミックコンデンサは、長さ方
向が3.2mm、幅方向が1.6mm、厚さ方向が0.85
mmで、外部電極16を除いた積層体15の長さ方向が
3.1mm、幅方向が1.5mm、厚さ方向が0.81mmで
静電容量0.1μF、Tanδ1.5%、絶縁抵抗1×
1011Ωとした。
This laminated ceramic capacitor has a length of 3.2 mm, a width of 1.6 mm, and a thickness of 0.85 mm.
mm, the length of the laminate 15 excluding the external electrodes 16 is 3.1 mm in the length direction, 1.5 mm in the width direction, 0.81 mm in the thickness direction, and has a capacitance of 0.1 μF, Tan δ 1.5%, and insulation resistance. 1x
It was 10 11 Ω.

【0023】また、比較例として本実施の形態2と同形
状で同じ静電容量、Tanδ、絶縁抵抗を有し、補強電
極を有さない無効層の厚みを100μm、120μm、
140μmとした積層セラミックコンデンサを準備し
た。
As a comparative example, the thickness of the inactive layer having the same shape, the same capacitance, Tan δ, and insulation resistance as those of the second embodiment and having no reinforcing electrode is set to 100 μm, 120 μm,
A multilayer ceramic capacitor having a size of 140 μm was prepared.

【0024】これらの本発明と比較例の積層セラミック
コンデンサを用いて、実装基板のたわみによる耐曲げ強
度を測定した結果を(表1)に示す。
Using these multilayer ceramic capacitors of the present invention and the comparative example, the results of measuring the bending strength due to the bending of the mounting board are shown in Table 1.

【0025】[0025]

【表1】 [Table 1]

【0026】この耐曲げ強度は、厚み1.6mmの実装基
板に積層セラミックコンデンサを実装し、この実装基板
を0.2mmずつ徐々にたわませていき、積層セラミック
コンデンサの静電容量が低下する直前のたわみ量を実装
基板のたわみによる耐曲げ強度として表した。
The bending strength is determined by mounting a multilayer ceramic capacitor on a mounting board having a thickness of 1.6 mm, and gradually bending the mounting board by 0.2 mm, thereby lowering the capacitance of the multilayer ceramic capacitor. The amount of deflection immediately before was expressed as bending resistance due to deflection of the mounting board.

【0027】この(表1)から明らかなように、外部電
極16と補強電極17との間の無効層10,14の厚み
を80μm以下とした場合、実装基板のたわみによる耐
曲げ強度が著しく向上することがわかる。
As is clear from Table 1, when the thickness of the inactive layers 10 and 14 between the external electrode 16 and the reinforcing electrode 17 is set to 80 μm or less, the bending resistance due to the bending of the mounting board is remarkably improved. You can see that

【0028】なお、無効層10,14を厚く構成する場
合には、図3に示すように外部電極16の下面部分ある
いは上面部分に対向する無効層10,14の内部部分に
複数層の補強電極17を形成することでより実装基板の
たわみによる耐曲げ強度をさらに向上させることができ
る。この場合においても外部電極16と補強電極17間
および補強電極17間の無効層10,14の厚みは80
μm以下にすることが条件となる。
When the invalid layers 10 and 14 are formed to be thick, as shown in FIG. 3, a plurality of reinforcing electrodes are provided on the internal portions of the invalid layers 10 and 14 facing the lower surface or upper surface of the external electrode 16. By forming 17, the bending strength due to the bending of the mounting board can be further improved. Also in this case, the thickness of the inactive layers 10 and 14 between the external electrode 16 and the reinforcing electrode 17 and between the reinforcing electrodes 17 is 80.
The condition is that the thickness be equal to or less than μm.

【0029】なお、上記図2、図3においては補強電極
17を外部電極16と電気的に接続される構成とし、こ
の補強電極17による浮遊容量を無くし特性の安定化を
図っているが、図4に示すように補強電極17は外部電
極16とは分離された状態、すなわち、補強電極17を
外部電極16を形成する端面まで形成しない状態に形成
しても、補強電極17と外部電極16間の無効層10,
14の厚みを80μm以下とすることで実装基板のたわ
みによる耐曲げ強度の向上は図れるとともに、補強電極
17の形成はラフに行えるため、生産性の点で有利にな
る。
In FIGS. 2 and 3, the reinforcing electrode 17 is electrically connected to the external electrode 16, and the stray capacitance due to the reinforcing electrode 17 is eliminated to stabilize the characteristics. As shown in FIG. 4, the reinforcing electrode 17 is separated from the external electrode 16, that is, even if the reinforcing electrode 17 is not formed up to the end face on which the external electrode 16 is formed, the reinforcing electrode 17 and the external electrode 16 can be separated. Invalid layer 10,
By setting the thickness of 14 to 80 μm or less, the bending resistance due to the bending of the mounting substrate can be improved, and the reinforcing electrodes 17 can be formed roughly, which is advantageous in terms of productivity.

【0030】なお、特に中高圧の用途で用いられるコン
デンサにおいては、図5、図6に示すように、内部電極
層11の最外層11aは対向する内部電極13に接続す
る外部電極16aの部分に設けた補強電極17aとは厚
み方向に重ならないよう形成し、内部電極層13の最外
層13aは対向する内部電極11に接続する外部電極1
6bの部分に設けた補強電極17bとは厚み方向に重な
らないよう形成することが望ましい。これにより耐曲げ
強度の向上が図れるとともに、耐電圧および表面の外部
電極間で発生する沿面放電の開始電圧を高めることがで
きる。
As shown in FIGS. 5 and 6, the outermost layer 11a of the internal electrode layer 11 is provided at the portion of the external electrode 16a connected to the internal electrode 13 facing the capacitor, particularly in a capacitor used for medium and high voltage applications. The outer electrode 13a of the internal electrode layer 13 is formed so as not to overlap with the provided reinforcing electrode 17a in the thickness direction.
It is desirable to form the reinforcing electrode 17b provided in the portion 6b so as not to overlap in the thickness direction. Thereby, the bending strength can be improved, and the withstand voltage and the starting voltage of creeping discharge generated between the external electrodes on the surface can be increased.

【0031】さらに詳しくは、例えば内部電極層13の
最外層13aと対向する内部電極11に接続する外部電
極16bの部分に設けた補強電極17bとは厚み方向に
重ならないよう形成し、内部電極層13の最外層13a
と補強電極17bとの間隔を大きくすればするほど耐電
圧および沿面放電の開始電圧を高めることができる。し
かし、最外層13aの長さが積層体の全長の半分以下で
はその効果は減少し静電容量も減少するので、最外層1
3aの長さは積層体の全長の半分程度が好ましい。
More specifically, for example, the inner electrode layer 13 is formed so as not to overlap in the thickness direction with the reinforcing electrode 17b provided at the portion of the outer electrode 16b connected to the inner electrode 11 opposed to the outermost layer 13a. 13 outermost layer 13a
The withstand voltage and the starting voltage of creeping discharge can be increased as the distance between the electrode and the reinforcing electrode 17b is increased. However, when the length of the outermost layer 13a is less than half the total length of the laminate, the effect is reduced and the capacitance is also reduced.
The length of 3a is preferably about half of the total length of the laminate.

【0032】また、例えば内部電極層13の最外層13
aと対向する内部電極11に接続する外部電極16bの
部分に設けた補強電極17bとの間隔を大きくすること
により、図5、図6に示すように、補強電極17bの層
数を増やすことができるので、耐曲げ強度をより向上さ
せることができる。なお、図6では図5と異なり、補強
電極17a,17bは外部電極16a,16bとは分離
された状態に形成しているので、例えば内部電極層13
の最外層13aと補強電極17bとの間隔が図5の場合
に比べて近接しても耐電圧および沿面放電の開始電圧を
高めることができる。さらに、図5、図6では内部電極
層11,13の最外層11a,13aはそれぞれ異なる
外部電極に接続するよう形成しているが、同一の外部電
極に接続するよう形成しても良い。
Also, for example, the outermost layer 13 of the internal electrode layer 13
By increasing the distance between the reinforcing electrode 17b provided at the portion of the external electrode 16b connected to the internal electrode 11 facing the internal electrode 11a, the number of layers of the reinforcing electrode 17b can be increased as shown in FIGS. Therefore, the bending strength can be further improved. In FIG. 6, unlike FIG. 5, the reinforcing electrodes 17a and 17b are formed in a state separated from the external electrodes 16a and 16b.
Even if the distance between the outermost layer 13a and the reinforcing electrode 17b is closer than in the case of FIG. 5, the withstand voltage and the starting voltage of the creeping discharge can be increased. Further, in FIGS. 5 and 6, the outermost layers 11a and 13a of the internal electrode layers 11 and 13 are formed so as to be connected to different external electrodes, but may be formed so as to be connected to the same external electrode.

【0033】また、上記各実施の形態においては、上下
面に無効層10,14を設けた構成のものについて説明
したが、これは実装時の上下の方向性を無くすためであ
り、方向性を問わない場合は、下面のみに無効層10の
みを設ける構成としてもよい。
In each of the above-described embodiments, the structure in which the invalid layers 10 and 14 are provided on the upper and lower surfaces has been described. However, this is to eliminate the vertical direction during mounting. If there is no problem, a configuration in which only the ineffective layer 10 is provided only on the lower surface may be adopted.

【0034】さらに上記実施の形態においては、積層セ
ラミックコンデンサを例として説明したが、積層バリス
タ、積層サーミスタなどの他の積層セラミック部品にお
いても同様の構成を採用することにより耐曲げ強度の優
れたものとすることができる。
Further, in the above embodiment, the multilayer ceramic capacitor has been described as an example. However, other multilayer ceramic components such as a multilayer varistor and a multilayer thermistor may have excellent bending strength by adopting a similar configuration. It can be.

【0035】[0035]

【発明の効果】以上のように本発明の積層セラミック部
品は構成されるため、実装基板のたわみによる耐曲げ強
度が向上する。すなわち、外部電極の下面部分の端部近
傍の無効層にたわみによって割れの入りやすいものが、
内部電極層あるいは補強電極の粘弾性によって割れやす
い無効層が補強されることになり、たわみによる割れが
防止でき、信頼性の高いものとすることができる。
As described above, since the multilayer ceramic component of the present invention is constructed, the bending resistance due to the bending of the mounting board is improved. In other words, those that are easily cracked by bending in the inactive layer near the end of the lower surface portion of the external electrode,
The fragile ineffective layer is reinforced by the viscoelasticity of the internal electrode layer or the reinforcing electrode, whereby cracking due to bending can be prevented, and high reliability can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の積層セラミック部品の一実施の形態に
おける断面図
FIG. 1 is a cross-sectional view of a multilayer ceramic component according to an embodiment of the present invention.

【図2】同他の実施の形態の断面図FIG. 2 is a sectional view of another embodiment.

【図3】同他の例を示す断面図FIG. 3 is a sectional view showing another example.

【図4】同さらに他の例を示す断面図FIG. 4 is a sectional view showing still another example.

【図5】同さらに他の例を示す断面図FIG. 5 is a sectional view showing still another example.

【図6】同さらに他の例を示す断面図FIG. 6 is a sectional view showing still another example.

【図7】従来の積層セラミック部品を示す断面図FIG. 7 is a sectional view showing a conventional multilayer ceramic component.

【符号の説明】[Explanation of symbols]

10,14 無効層 11,13 内部電極層 11a,13a 最外層 12 有効層 15 積層体 16,16a,16b 外部電極 17,17a,17b 補強電極 10, 14 invalid layer 11, 13 internal electrode layer 11a, 13a outermost layer 12 effective layer 15 laminated body 16, 16a, 16b external electrode 17, 17a, 17b reinforcing electrode

フロントページの続き Fターム(参考) 5E001 AB03 AC07 AD00 AF06 AG00 5E082 AB03 BC31 EE04 EE11 EE35 FG26 FG51 FG54 GG10 GG26 GG28 JJ03 JJ15 JJ23 MM24 PP09 5E346 AA33 CC16 EE32 HH11 HH21Continued on front page F term (reference) 5E001 AB03 AC07 AD00 AF06 AG00 5E082 AB03 BC31 EE04 EE11 EE35 FG26 FG51 FG54 GG10 GG26 GG28 JJ03 JJ15 JJ23 MM24 PP09 5E346 AA33 CC16 EE32 HH11 HH21

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも最下層にセラミック材料から
なる無効層を設け、この無効層上にセラミック材料から
なる有効層と内部電極層とを交互に積層した積層体と、
この積層体の前記内部電極層の露出した両端面と少なく
ともこの両端面に隣接する下面の一部に形成した外部電
極とを備え、この外部電極の下面部分と下面部分に対向
する内部電極層との間の無効層の厚みを前記積層体の厚
みの1/10以下とした積層セラミック部品。
1. A laminate in which an ineffective layer made of a ceramic material is provided at least as a lowermost layer, and an effective layer made of a ceramic material and an internal electrode layer are alternately stacked on the ineffective layer.
An external electrode formed on at least a part of a lower surface adjacent to the both end surfaces of the internal electrode layer of the laminate, and an internal electrode layer facing the lower surface portion and the lower surface portion of the external electrode; Wherein the thickness of the ineffective layer is 1/10 or less of the thickness of the laminate.
【請求項2】 積層体の最上層にも積層体の厚みの1/
10以下の厚みの無効層を設け、この最上層の無効層の
上面の一部にも外部電極を設けた請求項1に記載の積層
セラミック部品。
2. The method according to claim 1, wherein the uppermost layer of the laminate has a thickness of 1 / th of the thickness of the laminate.
2. The multilayer ceramic component according to claim 1, wherein an ineffective layer having a thickness of 10 or less is provided, and an external electrode is also provided on a part of an upper surface of the uppermost ineffective layer.
【請求項3】 少なくとも最下層にセラミック材料から
なる無効層を設け、この無効層上にセラミック材料から
なる有効層と内部電極層とを交互に積層した積層体と、
この積層体の前記内部電極層の露出した両端面と少なく
ともこの両端面に隣接する下面の一部に形成した外部電
極とを備え、前記無効層の積層体の下面に形成される外
部電極の下面部分と対向する無効層内に補強電極を設
け、この補強電極と外部電極の下面部分との間の無効層
の厚みを積層体の厚みの1/10以下とした積層セラミ
ック部品。
3. A laminate in which an ineffective layer made of a ceramic material is provided at least as a lowermost layer, and an effective layer made of a ceramic material and internal electrode layers are alternately stacked on the ineffective layer;
A lower surface of an external electrode formed on a lower surface of the laminated body of the ineffective layer, comprising: an exposed both end surface of the internal electrode layer of the laminate and an external electrode formed on at least a part of a lower surface adjacent to the both end surfaces. A laminated ceramic component having a reinforcing electrode provided in an ineffective layer facing the portion, wherein the thickness of the ineffective layer between the reinforcing electrode and the lower surface of the external electrode is 1/10 or less of the thickness of the laminate.
【請求項4】 積層体の最上層にも補強電極を設けた無
効層を設け、外部電極の最上層の無効層上に形成される
上面部分と補強電極との間の無効層の厚みを積層体の厚
みの1/10以下とした請求項3に記載の積層セラミッ
ク部品。
4. An ineffective layer having a reinforcing electrode provided also on the uppermost layer of the laminate, and the thickness of the inactive layer between the upper surface portion formed on the uppermost inactive layer of the external electrode and the reinforcing electrode is laminated. The multilayer ceramic component according to claim 3, wherein the thickness is 1/10 or less of the thickness of the body.
【請求項5】 外部電極の下面部分または上面部分と内
部電極層または補強電極との間の無効層の厚さを80μ
m以下とした請求項1〜4のいずれか一つに記載の積層
セラミック部品。
5. The thickness of an ineffective layer between a lower surface portion or an upper surface portion of an external electrode and an internal electrode layer or a reinforcing electrode is set to 80 μm.
The multilayer ceramic component according to any one of claims 1 to 4, wherein m is equal to or less than m.
【請求項6】 補強電極を外部電極と電気的に接続した
請求項3または4に記載の積層セラミック部品。
6. The multilayer ceramic component according to claim 3, wherein the reinforcing electrode is electrically connected to an external electrode.
【請求項7】 補強電極を外部電極と電気的に分離した
請求項3または4に記載の積層セラミック部品。
7. The multilayer ceramic component according to claim 3, wherein the reinforcing electrode is electrically separated from the external electrode.
【請求項8】 補強電極を無効層内に2層以上となるよ
うに設けた請求項3または4に記載の積層セラミック部
品。
8. The multilayer ceramic component according to claim 3, wherein two or more reinforcing electrodes are provided in the ineffective layer.
【請求項9】 内部電極層の最外層は対向する内部電極
に接続する外部電極の部分に設けた補強電極とは厚み方
向に重ならないよう形成した請求項3または4に記載の
積層セラミック部品。
9. The multilayer ceramic component according to claim 3, wherein the outermost layer of the internal electrode layers is formed so as not to overlap in the thickness direction with a reinforcing electrode provided at a portion of the external electrode connected to the internal electrode facing the internal electrode layer.
JP2000064928A 1999-04-06 2000-03-09 Laminated ceramic part Pending JP2000353636A (en)

Priority Applications (1)

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JP9855299 1999-04-06
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Cited By (14)

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JP2007123389A (en) * 2005-10-26 2007-05-17 Kyocera Corp Laminated electronic component
JP2007243040A (en) * 2006-03-10 2007-09-20 Tdk Corp Laminated ceramic electronic component
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JP2011014698A (en) * 2009-07-01 2011-01-20 Murata Mfg Co Ltd Electronic component
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JP2012044148A (en) * 2010-07-21 2012-03-01 Murata Mfg Co Ltd Ceramic electronic component
WO2012077585A1 (en) * 2010-12-06 2012-06-14 株式会社村田製作所 Multilayer ceramic electronic component
JP2013093374A (en) * 2011-10-24 2013-05-16 Murata Mfg Co Ltd Electronic component
JP2013539605A (en) * 2010-09-09 2013-10-24 エプコス アーゲー Resistance element and manufacturing method thereof
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US8721820B2 (en) 2011-09-05 2014-05-13 Murata Manufacturing Co., Ltd. Method for manufacturing multilayer ceramic electronic component
JP2013093374A (en) * 2011-10-24 2013-05-16 Murata Mfg Co Ltd Electronic component
US20140226255A1 (en) * 2013-02-13 2014-08-14 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic device and method for manufacturing the same
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US20140240897A1 (en) * 2013-02-26 2014-08-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic device
JP2018198326A (en) * 2018-08-21 2018-12-13 太陽誘電株式会社 Multilayer capacitor
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