JP2007123389A - Laminated electronic component - Google Patents

Laminated electronic component Download PDF

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JP2007123389A
JP2007123389A JP2005310957A JP2005310957A JP2007123389A JP 2007123389 A JP2007123389 A JP 2007123389A JP 2005310957 A JP2005310957 A JP 2005310957A JP 2005310957 A JP2005310957 A JP 2005310957A JP 2007123389 A JP2007123389 A JP 2007123389A
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ceramic
layer
electrode
electronic component
thickness
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JP4771787B2 (en
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Masahiro Nishigaki
Koushirou Sugimoto
幸史郎 杉本
政浩 西垣
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Kyocera Corp
京セラ株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a small laminated electronic component capable of preventing cracks that are generated in a protective layer in a solder thermal resistance test, even if the volume proportion of the protective layer is made small for the entire area of an electronic component body, because a ceramic layer or an internal electrode layer becomes thin and highly laminated. <P>SOLUTION: Where a thickness of t0 in the laminating direction of the electronic component body 1 is 1, a thickness t01 in the laminating direction of the protective layer 11 of both the upper and lower layers is in a ratio of 0.15 or smaller. Internal electrode layers 7 in a function section 9, alternately laminating ceramic layers 5 and the internal electrode layers 7 therein have a capacity electrode 7a, clamping the ceramic layers 5 in polar extreme, when applying voltage to attribute to the exhibition of electrostatic capacity, and a leading-out electrode 7b, extending from the capacity electrode 7a and formed on the external electrode 3 side. The leading-out electrode 7b is bent from the uppermost lower layer side of the laminating direction of the function section 9 to a center (laminate intermediate layer) side, and the thickness of the protective layer 11, positioned at the leading-out electrode 7b side in the function section 9, is made larger than the thickness of the protective layer 11 of the capacity electrode 7a side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a multilayer electronic component, and more particularly to a multilayer electronic component such as a ceramic capacitor, an actuator, and an inductor obtained by thinning and highly laminating ceramic layers and internal electrode layers.

  FIG. 4 is a typical example of a multilayer electronic component, and is a schematic cross-sectional view showing a conventional multilayer ceramic capacitor. The illustrated multilayer ceramic capacitor includes a functional unit 105 that contributes to electrostatic capacity by alternately laminating ceramic layers 101 and internal electrode layers 103 exhibiting ferroelectricity, and ceramic layers 101 on the upper and lower surfaces of the functional unit 105. The capacitor body 109 is formed from the protective layer 107, and an external electrode 111 is formed on the end surface of the capacitor body 109.

In recent years, such a multilayer ceramic capacitor has been required to be small in size and high in capacity. For this reason, the ceramic layer and the internal electrode layer are made thinner and multi-layered. Eliminating the level difference caused by the internal electrode layer to be formed (for example, Patent Document 1) and improving the characteristics of the ceramic particles constituting the protective layer formed on the upper and lower surfaces of the capacitor portion (For example, Patent Document 2)
In addition, the response to thinner and higher multilayer ceramic capacitors is remarkable for each company, but in addition to this, each manufacturer has higher dimensions while satisfying the external dimensions defined in the electronic component standards. In order to obtain a capacitance, a device has been devised in which the thickness of the protective layer laminated on the upper and lower surfaces of the capacitor body is reduced, and conversely, the volume ratio of the capacitor portion constituting the capacitor body is increased.
JP 2003-17356 A Japanese Patent Application No. 2004-356305

  A surface-mount type electronic component such as a multilayer ceramic capacitor is usually mounted on a wiring board by soldering and mounted on various electronic devices. Usually, such an electronic component is subjected to a solder heat test as an evaluation method as to whether or not the electronic component can withstand soldering conditions in an evaluation stage of the manufacturing process. In the solder heat resistance test, a multilayer electronic component such as a multilayer ceramic capacitor is immersed in a molten solder bath to examine whether or not an appearance defect such as a crack is generated.

  Here, regarding the small multilayer ceramic capacitor in which the ceramic layer and the internal electrode layer are thin and highly laminated as described above, and the volume ratio of the protective layer is small with respect to the entire volume of the capacitor body, the above-described When the solder heat resistance test is performed, as shown in FIG. 4, a crack CR may occur so as to penetrate through the protective layer obliquely in the direction of the end face from the external electrode.

  When such a crack CR is generated in the multilayer ceramic capacitor, there is a problem that the multilayer ceramic capacitor is deteriorated in insulation property or short-circuited due to moisture entering from the crack CR.

  Therefore, according to the present invention, the ceramic layer and the internal electrode layer are thin and highly laminated, and even if the volume ratio of the protective layer is reduced with respect to the total volume of the electronic component body, cracks generated in the protective layer in the solder heat resistance test are reduced. It is an object of the present invention to provide a small multilayer electronic component that can be prevented from occurring.

The multilayer electronic component of the present invention is
(1) An electronic component body composed of a functional part in which ceramic layers and internal electrode layers are alternately laminated and a protective layer made of a ceramic layer provided on the upper and lower surfaces of the functional part;
An external electrode connected to the end face from which the internal electrode layer of the electronic component body is derived;
In a multilayer electronic component comprising:
When the thickness t0 in the stacking direction of the electronic component main body is 1, the thickness t01 in the same direction of the protective layer aligned in the vertical direction is a ratio of 0.15 or less,
The internal electrode layer in the functional part holds the ceramic layer oppositely when a voltage is applied, and contributes to the expression of capacitance, and a lead electrode extended from the capacitive electrode part and formed on the external electrode side And consists of
The extraction electrode portion is convexly curved from the uppermost lower layer side in the stacking direction of the functional portion toward the central portion side, and the thickness of the protective layer positioned on the extraction electrode portion side in the functional portion is the capacitance It is characterized by being thicker than the thickness of the protective layer on the electrode part side.

In the multilayer electronic component, (2) when the thickness of the protective layer on the extraction electrode portion side is t1, and the thickness of the protective layer on the capacitive electrode portion side is t2, t1 / t2 ≧ 1.5. Satisfying the relationship
(3) The average particle diameter of the ceramic particles constituting the ceramic layer on at least one of the upper surface side and the lower surface side in the laminating direction in the functional part is the ceramic particle constituting the ceramic layer in the central part in the laminating direction in the functional part Smaller than the average particle size of
(4) The average particle size of the average particle size of the ceramic particles constituting the ceramic layer in the central portion in the stacking direction in the functional portion is a, and the ceramic on at least one of the upper surface side and the lower surface side in the stacking direction in the functional portion When the average particle size of the ceramic particles constituting the layer is b, the range is 1.3 <a / b <2.7.
(5) It is desirable that the average particle size of the ceramic particles is gradually decreased from the central portion in the stacking direction of the functional portion toward the upper surface side and the lower surface side.

  According to the configuration of the multilayer electronic component of the present invention described above, the ceramic layer and the internal electrode layer are thin and highly laminated, and even if the volume ratio of the protective layer is reduced with respect to the total volume of the electronic component main body, Generation of cracks in the protective layer in the heat resistance test can be prevented.

  In the multilayer electronic component of the present invention, the ceramic layer strength is increased by reducing the average particle size of the ceramic particles constituting the ceramic layer of a part of the ceramic layer constituting the electronic component body, thereby increasing the thermal shock resistance. It can be further increased, and by reducing the average particle size of the ceramic particles in the ceramic layer, high insulation can be secured even if the layer is thinned, the high temperature load life can be improved, and the temperature characteristics of the capacitance can be flattened. .

  The multilayer electronic component of the present invention will be described by taking a multilayer ceramic capacitor as an example. FIG. 1 is a schematic cross-sectional view of a multilayer electronic component of the present invention.

  In the multilayer electronic component of the present invention, the external electrode 3 is formed on the end surface of the electronic component body 1. The electronic component body 1 includes a functional part 9 in which ceramic layers 5 and internal electrode layers 7 are alternately stacked, and a protective layer 11 made of a ceramic layer 5 provided on the upper and lower surfaces of the functional part 9. The external electrode 3 is connected to the end surface of the electronic component body 1 from which the internal electrode layer is derived.

  Here, in the electronic component body 1 of the present invention, when the thickness t0 in the stacking direction is 1, the thickness t01 (= t2 + t2 ′) in the same direction of the protective layer 11 aligned vertically is a ratio of 0.15 or less. It is important that That is, the present invention is effective in the thermal shock test when the thickness of the protective layer 11 is reduced and the structure becomes weak against the thermal shock test. This is because when the thickness ratio of the protective layer 11 is high, the structure is strengthened with respect to the thermal shock test.

  In this functional portion 9, the internal electrode layer 7 constituting the same sandwiches the ceramic layer 5, and is extended from the capacitive electrode portion 7a, and the capacitive electrode portion 7a that contributes to the development of electrostatic capacity in an opposite manner when a voltage is applied. It is comprised from the extraction electrode part 7b formed in the external electrode 3 side.

  In the present invention, the extraction electrode portion 7b is curved (w) in a convex shape from the uppermost lower layer 13a in the stacking direction of the function portion 9 toward the central portion (stacking middle layer) 13b, and the output electrode portion 7b side of the function portion 9 It is important that the thickness t1 of the protective layer 11 positioned at is greater than the thickness t2 of the protective layer 11 provided on the upper and lower surfaces of the capacitive electrode portion 7a.

  According to the embodiment of the present invention, the extraction electrode portion 7b in the functional portion 9 is curved toward the center side in the stacking direction, and the thickness t1 of the protective layer 11 with the extraction electrode portion 7b is on the other capacitance electrode portion 7a side. Since the thickness is larger than the thickness t2 of the protective layer 11 positioned, for example, in a thermal shock test such as a solder thermal test, a crack is generated from the external electrode toward the end surface as shown in FIG. However, thanks to the allowable thickness t1 of the protective layer 11, there is an advantage that the capacitive electrode portion 7a and the extraction electrode portion 7b are prevented from being cut off due to the occurrence of cracks.

  In particular, in the present invention, the thickness t1 of the protective layer 11 located on the side of the extraction electrode portion 7b in the functional portion 9 and the upper and lower surfaces of the capacitance electrode portion are capable of preventing cracks that cut the capacitance electrode portion 7a and the extraction electrode portion 7b. It is desirable that the relationship t1 / t2 ≧ 1.5 is satisfied with respect to the thickness t2 of the protective layer 11 provided on the surface. The t1 / t2 ratio is preferably 1.9 or less.

  The multilayer electronic component of the present invention is suitable for a highly multilayered electronic component in which the ceramic layer 5 and the internal electrode layer 7 are thinned to be multilayered. In this case, the number of layers depends on the internal electrode layer 7. It is desirable that the number of layers of the electronic component body 1 is 100 or more because stress on the electronic component body 1 is increased and cracks are likely to occur in the thermal shock test. The thickness of the ceramic layer is preferably 0.5 μm or more and 3 μm or less from the viewpoint of ensuring insulation and increasing the capacity.

  Further, the internal electrode layer 7 is desirably 0.3 μm or more and 1.5 μm or less from the viewpoint of reducing a step on the ceramic layer 5 and ensuring an effective area while enabling high lamination.

  In the multilayer electronic component of the present invention in which the lead electrode portion 7b in the protective layer 11 has a curvature (w), it is desirable to atomize the ceramic particles constituting the ceramic layer 5 on the uppermost lower layer side than the middle layer. .

  In the multilayer electronic component in which the size of the ceramic particles constituting the ceramic layer 5 changes as described above, the following countermeasures can be taken to suppress the occurrence of cracks in the protective layer 11, and the ceramic layer 5 can be thinned. However, insulation can be ensured and reliability in a high temperature load life test can be improved. That is, the average particle size of the ceramic particles 5b constituting the ceramic layer 5 on at least one of the upper surface side and the lower surface side in the stacking direction of the functional unit 9 is set to be the ceramic particles forming the ceramic layer 5 in the central portion of the functional unit 9 in the stacking direction. It is desirable to make it smaller than the average particle diameter of 5a.

  In this case, when the average particle diameter of the ceramic particles 5a in the laminated middle layer in the functional part 9 is Da and the average particle diameter of the ceramic particles 5b in the uppermost lower layer is Db, a range of 1.3 <Da / Db <2.7. More desirable.

  In the present invention, it is more desirable that the average particle diameter of the ceramic particles 5a and 5b is gradually reduced from the middle layer of the functional unit 9 to the uppermost layer.

  As described above, when the ceramic particles 5b constituting the uppermost ceramic layer 5 are made smaller than the ceramic particles 5a in the laminated middle layer, the smaller the particle size in the laminated ceramic capacitor, the temperature characteristics (temperature dependence) of the capacitance. There is an advantage that can be reduced.

  Here, the average particle size of the ceramic particles according to the present invention is desirably 0.1 μm or more and 0.4 μm or less for the purpose of ensuring insulation while increasing the relative dielectric constant.

The ceramic particles 5a and 5b according to the present invention are mainly composed of barium titanate and contain additives such as Ca, Mg, rare earth elements, Mn, etc. to improve insulation, reduction resistance, temperature characteristics, and dielectric constant. Furthermore, when the total amount of alkaline earth elements such as Ba, Sr and Ca is A mol and Ti is B mol, the A / B ratio is 1 as a barium titanate-based dielectric. When it is 0.003 or more, grain growth can be suppressed to obtain high strength, and thermal shock resistance can be improved. For this reason, the ceramic layer 5 is preferably formed of ceramic particles having an A / B ratio of 1.003 or more. Further, in addition to changing the A / B ratio, it is more preferable to add fine BaCO 3 as a grain growth inhibitor.

  In the present invention, when the ceramic layer having the above structure is used, the high temperature load life can be improved in addition to the thermal shock resistance. When the ceramic particles are small, the ceramic layers having fine ceramic particles after sintering are in the stacking direction. Since it is arranged on the uppermost layer side, it becomes high strength due to high sinterability by the fine ceramic particles, and it can further prevent cracks occurring in the protective layer 11 at the position of the extraction electrode part 7b, Due to the atomization of the ceramic particles, it becomes highly insulating, which can improve the high temperature load life.

  Further, when the average particle size of the ceramic particles of the uppermost ceramic layer closer to the protective layer is reduced, the temperature characteristics of the capacitance can be flattened.

  In the present invention, the average particle size of the ceramic particles in the center of the functional unit 9 in the stacking direction and the uppermost layer is the capacitance in which the internal electrode layers 7 of the counter electrode are alternately stacked in the capacitor body 1. It is within the range of the electrode part 7a.

  The internal electrode layer 7 is preferably Ni, Cu or an alloy thereof in terms of cost reduction. However, Ni is mainly used in that the ceramic layer 5 is made of a barium titanate-based dielectric material and can be simultaneously fired therewith. What is made into a component is more preferable.

  Next, the manufacturing method of the multilayer electronic component of the present invention will be described. FIG. 2 is a schematic diagram showing a process for manufacturing the multilayer electronic component of the present invention. The multilayer electronic component of the present invention comprises the following steps. First, as the step (a), a plurality of ceramic green sheets 31 including ceramic powder having an average particle size DM are formed. Next, as a step (b), a plurality of internal electrode patterns 33 are formed on one main surface of each of the plurality of ceramic green sheets 31.

  Next, as a step (c), a reference pattern sheet in which a ceramic pattern 35a including ceramic powder having an average particle diameter DM is formed around the internal electrode pattern 33 of the ceramic green sheet 31 including ceramic powder having an average particle diameter DM. A ceramic pattern including an SMM and a ceramic powder having an average particle diameter DL larger than the average particle diameter DM and around the internal electrode pattern 33 of the ceramic green sheet 31 including the ceramic powder having an average particle diameter DM A pattern sheet SML on which 35b is formed is formed.

  Next, as step (d), the pattern sheet SMM is laminated at the center in the laminating direction and the pattern sheet SML is laminated on the uppermost lower layer side in the laminating direction, and ceramic green containing ceramic powder having an average particle size DM on the upper and lower surfaces. A plurality of sheets 31 are laminated and heated under pressure to form a laminate. FIG. 2D shows the state in the side margin direction.

Next, as a step (e), the laminate is baked to form an electronic component main body 37 with the internal electrode pattern 33 exposed on the end face. (E) of a figure shows the state of a side margin direction and an end margin direction.

  Next, as a step (f), it is manufactured through a step of forming an external electrode 39 on the end face of the electronic component main body 37.

  Here, the average particle diameter DM of the ceramic powder is 0.1 μm or more and 0.5 μm in that the dielectric constant of the ceramic powder can be secured, the grain growth can be suppressed, and a thinner and higher density ceramic green sheet can be formed. The following is desirable.

  The average particle diameter DL of the ceramic powder having an average particle diameter larger than the average particle diameter DM used in the ceramic pattern is preferably 0.2 μm or more and 0.7 μm or less.

  When the same binder is used for the ceramic green sheet formed using the ceramic powder having a large average particle size, the deformability of the pressure heating becomes larger than that of the ceramic powder having a small average particle size. In the present invention, the ceramic pattern having a large average particle size is used for the ceramic pattern formed around the internal electrode pattern to promote deformation of a region having the ceramic pattern, but the particle size of the ceramic powder is limited. This can improve reliability in high temperature load tests.

  That is, in the present invention, the deformation of the portion of the ceramic green sheet on which the ceramic pattern is formed has a higher deformability than the portion of the ceramic green sheet on which the internal electrode pattern is formed. A laminated electronic component having only a curved portion can be formed.

  The thickness of the ceramic green sheet is preferably 1 μm or more and 4 μm or less for the reason in the ceramic layer 5 described above.

  The heating under pressure in the production method of the present invention is made under the condition that the amount of the binder used in the ceramic green sheet is optimized and the addition amount is added so that the ceramic green sheet has adhesive force, and the temperature is higher than the glass transition point of the binder. Achieved by doing.

  A high-density sintered body can be obtained by optimizing the firing temperature according to the average particle diameter of the ceramic powder used and the composition and amount of the additive.

  Next, in addition to the thermal shock test, a multilayer electronic component having excellent high temperature load life characteristics can be obtained by the following manufacturing method. In order to obtain a multilayer electronic component excellent in a high temperature load life test, in the present invention, as described above, the ceramic of the ceramic green sheet used for the ceramic layer 5 positioned in the middle layer of the functional unit 9 constituting the electronic component body 1 is used. Compared to the powder, the ceramic powder used for the ceramic green sheet for forming the ceramic layer 5 on the lowermost layer side in the stacking direction has a small particle size, so that the ceramic particles on the lowermost layer side in the stacking direction after sintering Due to the high sinterability, the ceramic layer joined with the internal electrode layer can be made high in strength, which can further prevent the development of cracks occurring in the protective layer 11 at the position of the extraction electrode portion 7b and It becomes highly insulating due to the atomization, so that the high temperature load life (HALT test) can be improved.

  That is, the method for producing a multilayer electronic component of the present invention is characterized by comprising the following steps. FIG. 3 is a process diagram for illustrating another production method of the present invention. First, as the step (a), ceramic ceramics having an average particle diameter DS smaller than the average particle diameter DM are used together with the ceramic green sheet 31 based on the ceramic powder having the average particle diameter DM. A plurality of ceramic green sheets 32 formed so that the average particle diameter of the powder is different from DS is formed.

  Next, as a step (b), a plurality of internal electrode patterns 33 are formed on one main surface of each of the plurality of ceramic green sheets 31 and 32 formed so that the average particle diameter of the ceramic powder is different from that of DM and DS. To do.

  Next, as a step (c), the standard pattern in which the ceramic pattern 35a including the ceramic powder having the average particle size DM is formed around the internal electrode pattern 33 of the ceramic green sheet 31 including the ceramic powder having the average particle size DM. A pattern sheet SMM is formed. At the same time, the pattern sheet SSL in which the ceramic pattern 35b is formed on the ceramic green sheet containing the ceramic powder having the average particle diameter DS so as to include the ceramic powder having the average particle diameter DL larger than the average particle diameter DM. Form.

  Next, as step (d), the pattern sheet SMM is laminated at the center in the laminating direction, and the pattern sheet SSL is laminated on the lowermost layer side in the laminating direction, and heated under pressure to form a laminate.

  Next, as a step (e), the laminate is baked to form an electronic component main body 37 with the internal electrode pattern 33 exposed on the end face.

  Next, the step (f) is obtained through a step of forming the external electrode 39 on the end face of the electronic component main body 37.

  Here, the average particle diameter DL of the ceramic powder having an average particle diameter DL larger than the average particle diameter DM increases the sinterability while suppressing excessive deformation, and has high strength against the thermal shock test. It is desirable that it is 0.5-0.7 micrometer at the point obtained.

  The average particle size DS of the ceramic powder having an average particle size DS smaller than the average particle size DM is 0.15 to 0.3 μm in that abnormal grain growth is suppressed and high insulation and high strength are obtained. It is desirable that Also in this case, the lamination conditions and firing conditions are the same as those of the electronic component main body 37 described above.

The multilayer ceramic capacitor according to the present invention was produced as follows. Here, as the barium titanate powder, BT (barium titanate) and BCT (barium calcium titanate, Ba 0.95 Ca 0.05 TiO 3 ) powders are mixed in equimolar amounts, and the A / B molar ratio is 1. And 1.003.

As the additive, MgO, Y 2 O 3 and MnO having an average particle diameter of 0.5 μm were used. These addition amounts were both 0.5 mol per 100 mol of barium titanate powder. In addition, 1.2 parts by mass of glass powder composed of SiO 2 50 mol%, Li 2 O 10 mol%, BaO 20 mol%, and CaO 20 mol% was added to 100 parts by mass of the barium titanate powder. . The average particle size of the glass powder was also 0.5 μm. Further, BaCO 3 having an average particle size of 0.1 μm was used as a particle size controlling agent.

  The ceramic powder used had an average particle size DM of 0.4 μm and an average particle size DL of three types of barium titanate powders of 0.5 μm, 0.6 μm and 0.7 μm.

  Three types of barium titanate powders having an average particle diameter DS of 0.15, 0.2, and 0.26 μm were used.

A mixed powder obtained by adding the above MgO, Y 2 O 3 , MnO (added as MnCO 3 ) to each of the DM and DS barium titanate powders is used as a solvent with toluene and alcohol as a solvent. And a mixed solvent were added and wet mixed.

  Next, a mixed solvent of polyvinyl butyral resin and toluene / alcohol is added to the wet-mixed powder, and a ceramic slurry is prepared by wet-mixing using a zirconia ball having a diameter of 5 mm, and a ceramic green sheet having a thickness of 3 μm by the doctor blade method Was made.

  Further, ceramic green sheets (average particle diameter DS) having different raw material particle diameters were prepared in the same procedure as described above.

  Next, a plurality of rectangular internal electrode patterns mainly composed of Ni were formed on the upper surface of the ceramic green sheets having the average particle diameters DM and DS. A ceramic pattern was formed using a ceramic slurry containing a barium titanate-based powder having an average particle size DM or DL around the internal electrode pattern of the ceramic green sheet on which the internal electrode pattern was printed. The ceramic pattern had substantially the same thickness as the internal electrode pattern.

Next, pattern sheets SMM, SML, and SSL in which the above internal electrode pattern and ceramic pattern are formed on a ceramic green sheet having an average particle size of DM or DS are collectively laminated so as to have the layer configuration shown in Table 1. A base laminate was formed by pressurization and heating, and then the base laminate was cut to produce an electronic component body molded body. The number of functional parts was 120, and the protective layer was formed by stacking ceramic green sheets having an average particle diameter of DM and a thickness of 3 μm on the upper and lower layers so as to have respective thickness ratios. The pressure heating conditions were a temperature of 60 ° C., a pressure of 10 7 Pa, and a time of 10 minutes.

Next, the electronic component body molded body is subjected to binder removal treatment at 300 ° C./h in the air at a temperature rising rate of 10 ° C./h, and the temperature rising rate from 500 ° C. is 300 ° C./h. 1170 ° C. (calcined at an oxygen partial pressure of 10 −6 Pa for 2 hours, subsequently cooled to 1000 ° C. at a temperature lowering rate of 300 ° C./h, reoxidized at 1000 ° C. in a nitrogen atmosphere for 7.5 hours, The capacitor body was manufactured by cooling at a temperature drop rate of ° C./h, the size of the capacitor body was 2 × 1 mm 2 and the thickness was 0.7 to 0.8 mm.The thickness of the dielectric layer was 2 It was 5 μm.

  Next, after the sintered electronic component body was barrel-polished, an external electrode paste containing Cu powder and glass was applied to both ends of the electronic component body, and baked at 850 ° C. to form external electrodes. Thereafter, using an electrolytic barrel machine, Ni plating and Sn plating were sequentially performed on the surface of the external electrode to produce a multilayer ceramic capacitor.

  Next, the following evaluation was performed on these multilayer ceramic capacitors.

  The thickness ratio of the protective layer to the total thickness of the electronic component body is obtained by polishing the cross-section in the stacking direction of the obtained multilayer ceramic capacitor, and the thickness of the capacitor body and the thickness of the protective layer positioned above and below the capacitor electrode portion (upper and lower layers). The total thickness) ratio was measured.

  The ratio of the thickness of the protective layer sandwiched between the capacitive electrode parts and the thickness of the protective electrode in the curved lead electrode part is the maximum thickness of the protective electrode lead electrode part in the functional part of the capacitor body and the capacity electrode part. The thickness of the protective layer was measured and the ratio was determined.

  The calculation of the porcelain particle size ratio was performed using the following method. First, the external electrode surface of the multilayer ceramic capacitor was buried in a resin and polished to the center of the porcelain using abrasive paper. Next, chemical etching was performed using a solution (HCl = 0.09%, HF = 0.04%) at 25 ° C. for 5 seconds to expose the grain boundaries. The laminated middle layer and the upper or lower layer of the polished surface with exposed grain boundaries were photographed with an electron microscope (SEM), the area of the porcelain particle cross section was converted to a diameter, and used for calculation of the particle size ratio. Here, the middle layer of the stack was the center layer ± 5 layers, and the upper layer or the lower layer was the outermost layer 1 to 5 layers, 6 to 10 layers, or 11 to 15 layers of the functional part, and the left and right central portions were observed. The number of porcelain particles used in the particle size calculation was n = 100.

  For the temperature characteristics of the capacitance, the capacitance was measured at 25 ° C. and 85 ° C. for the obtained multilayer ceramic capacitor, and the ratio at 85 ° C./25° C. was evaluated. The number of samples was 30 each.

  The thermal shock test uses a solder bath at temperatures of 320 ° C. and 350 ° C., and the obtained multilayer ceramic capacitor sample is immersed in this solder bath for 1 minute, and the cracks generated in the multilayer ceramic capacitor after immersion are substantive. It confirmed using the microscope. The number of samples was 100 each.

The HALT (high temperature, high voltage acceleration reliability) test was performed with a DC voltage of 22 V applied at 125 ° C. and 145 ° C., and the time when the leakage current exceeded 10 mA was defined as the failure time. After the measurement was completed, conversion at DC = 9.45 V was performed, and a determination was made at a 0.3% cumulative failure of 1000 hours.

  From the results shown in Tables 1 and 2, a sample using a ceramic layer having a larger particle diameter than the ceramic powder for the ceramic green sheet as the ceramic powder for the ceramic pattern in the ceramic layer from the uppermost lower layer side of the capacitor body to the middle layer. No. 3 to 15, the lead electrode is curved in the protective layer, and the thickness of the portion is increased by 1.3 to 2.1 times, so that the upper and lower protective layers have a thickness in the stacking direction of the capacitor body. Even when the thickness was 0.14, there was no crack in the thermal shock test at 320 ° C.

  In the thermal shock test at 350 ° C., 1 to 4 defects were found in these samples, but the ceramic powder used for the ceramic pattern was enlarged to increase the curvature and increase the thickness of the part. The number of defects in the thermal shock test at 350 ° C. decreased.

  Further, Sample No. using a ceramic green sheet formed of ceramic powder having a small particle size as the uppermost layer. In 9 to 15, the number of defects in the thermal shock test at 350 ° C. is reduced as compared with the sample (No. 3 to 8) in which the particle size of the ceramic powder used for the ceramic green sheet is the same, and the capacitance The temperature dependence becomes small, and in particular, the ceramic powder whose particle size is gradually reduced over the uppermost lower layer 1 to 5, 6 to 10 and further to the 11 to 15 layer showed no defect in the HALT test. .

  On the other hand, even when the ratio of the thickness of the protective layer was 0.14, sample No. 1 in which the ceramic layer and the ceramic green sheet were formed of ceramic powder having the same particle diameter was used. In No. 2, the lead electrode portion was not curved, and there were many defects in the thermal shock test.

It is sectional drawing of the multilayer electronic component of this invention. It is process drawing which shows the manufacturing method of the multilayer electronic component of this invention. It is process drawing which shows the manufacturing method of another multilayer electronic component of this invention. It is a cross-sectional schematic diagram which shows the conventional multilayer ceramic capacitor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component main body 3 External electrode 5 Ceramic layer 5a, 5b Ceramic particle 7 Internal electrode layer 7a Capacitance electrode part 7b Extraction electrode part 9 Functional part 11 Protective layer 13a Uppermost layer 13b Lamination middle layer t1, t2 Protective layer thickness 31 Ceramic green Sheet 33 Internal electrode patterns 35a, 35b Ceramic patterns 37, 37a Electronic component body molded body

Claims (5)

  1. An electronic component main body composed of a functional layer in which ceramic layers and internal electrode layers are alternately laminated and a protective layer made of a ceramic layer provided on the upper and lower surfaces of the functional portion;
    An external electrode connected to the end face from which the internal electrode layer of the electronic component body is derived;
    In a multilayer electronic component comprising:
    When the thickness t0 in the stacking direction of the electronic component main body is 1, the thickness t01 in the same direction of the protective layer aligned in the vertical direction is a ratio of 0.15 or less,
    The internal electrode layer in the functional part holds the ceramic layer oppositely when a voltage is applied, and contributes to the expression of capacitance, and a lead electrode extended from the capacitive electrode part and formed on the external electrode side And consists of
    The extraction electrode portion is convexly curved from the uppermost lower layer side in the stacking direction of the functional portion toward the central portion side, and the thickness of the protective layer positioned on the extraction electrode portion side in the functional portion is the capacitance A multilayer electronic component characterized in that it is thicker than the thickness of the protective layer on the electrode portion side.
  2. 2. The laminate according to claim 1, wherein t1 / t2 ≧ 1.5 is satisfied, where t1 is a thickness of the protective layer on the lead electrode portion side, and t2 is a thickness of the protective layer on the capacitor electrode portion side. Type electronic components.
  3. The average particle diameter of the ceramic particles constituting the ceramic layer on at least one of the upper surface side and the lower surface side in the stacking direction in the functional part is the average particle diameter of the ceramic particles forming the ceramic layer in the central part in the stacking direction in the functional part. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is smaller than the diameter.
  4. The average particle size of the average particle size of the ceramic particles constituting the ceramic layer in the central portion of the functional part in the stacking direction is a, and the ceramic layer on at least one of the upper surface side and the lower surface side in the stacking direction of the functional unit is configured. 4. The multilayer electronic component according to claim 3, wherein the average particle diameter of the ceramic particles to be processed is in a range of 1.3 <a / b <2.7 when b is set.
  5. 5. The multilayer electronic component according to claim 3, wherein the average particle diameter of the ceramic particles is gradually decreased from the central portion in the stacking direction of the functional unit toward the upper surface side and the lower surface side.
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CN102810398A (en) * 2011-05-31 2012-12-05 三星电机株式会社 Multilayer ceramic electronic component
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