JP2000345010A5 - - Google Patents

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Publication number
JP2000345010A5
JP2000345010A5 JP2000094811A JP2000094811A JP2000345010A5 JP 2000345010 A5 JP2000345010 A5 JP 2000345010A5 JP 2000094811 A JP2000094811 A JP 2000094811A JP 2000094811 A JP2000094811 A JP 2000094811A JP 2000345010 A5 JP2000345010 A5 JP 2000345010A5
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JP
Japan
Prior art keywords
softening point
conductive paste
anisotropic conductive
component
microcrosslinking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000094811A
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Japanese (ja)
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JP2000345010A (en
JP3904798B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2000094811A priority Critical patent/JP3904798B2/en
Priority claimed from JP2000094811A external-priority patent/JP3904798B2/en
Publication of JP2000345010A publication Critical patent/JP2000345010A/en
Publication of JP2000345010A5 publication Critical patent/JP2000345010A5/ja
Application granted granted Critical
Publication of JP3904798B2 publication Critical patent/JP3904798B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Claims (1)

前記成分（４）が、６０乃至１５０℃の軟化点温度を持ち、一次粒子径が０．０１乃至２μｍの範囲で、ポリマー成分中に０．１〜５質量％の割合でエポキシ基が導入され、かつ微架橋構造を持ったポリ（メタ）アクリレート主成分型の高軟化点ポリマー微粒子であることを特徴とする請求の範囲４乃至８のいずれかに記載の異方導電性ペースト。The component (4) has a softening point temperature of 60 to 150 ° C., and the primary particle diameter is in the range of 0.01 to 2 μm, and an epoxy group is introduced into the polymer component at a ratio of 0.1 to 5% by mass. The anisotropic conductive paste according to any one of claims 4 to 8, wherein the anisotropic conductive paste is a poly (meth) acrylate main component type high softening point polymer fine particle having a microcrosslinking structure.
JP2000094811A 1999-04-01 2000-03-30 Anisotropic conductive paste Expired - Lifetime JP3904798B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000094811A JP3904798B2 (en) 1999-04-01 2000-03-30 Anisotropic conductive paste

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9458299 1999-04-01
JP11-94582 1999-04-01
JP2000094811A JP3904798B2 (en) 1999-04-01 2000-03-30 Anisotropic conductive paste

Publications (3)

Publication Number Publication Date
JP2000345010A JP2000345010A (en) 2000-12-12
JP2000345010A5 true JP2000345010A5 (en) 2005-03-17
JP3904798B2 JP3904798B2 (en) 2007-04-11

Family

ID=26435855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000094811A Expired - Lifetime JP3904798B2 (en) 1999-04-01 2000-03-30 Anisotropic conductive paste

Country Status (1)

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JP (1) JP3904798B2 (en)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4627125B2 (en) * 2001-07-27 2011-02-09 三井化学株式会社 Anisotropic conductive paste
JP4824876B2 (en) * 2001-08-01 2011-11-30 三井化学株式会社 Circuit connection paste material
JP4896366B2 (en) * 2003-09-02 2012-03-14 ソニーケミカル＆インフォメーションデバイス株式会社 Adhesive and method for producing the same
JP2005187637A (en) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd Anisotropically electroconductive adhesive, top/bottom conductive material for liquid crystal display device and liquid crystal display device
JP2006080013A (en) * 2004-09-10 2006-03-23 Mitsui Mining & Smelting Co Ltd Conductive paste and flexible printed wiring board formed by using it
JP4541186B2 (en) * 2005-02-28 2010-09-08 ガンツ化成株式会社 Liquid epoxy resin composition
JP4867181B2 (en) * 2005-03-17 2012-02-01 富士電機株式会社 Thermosetting resin composition for mounting electronic components
WO2006109831A1 (en) * 2005-04-12 2006-10-19 Sony Chemical & Information Device Corporation Processes for production of adhesives
JP5285841B2 (en) * 2005-04-12 2013-09-11 デクセリアルズ株式会社 Method for producing film adhesive
JP4852893B2 (en) * 2005-05-31 2012-01-11 住友ベークライト株式会社 Pre-applied sealing resin composition and method for manufacturing semiconductor device using the same
JP2007317563A (en) * 2006-05-26 2007-12-06 Sumitomo Electric Ind Ltd Circuit connecting adhesive
JP5089089B2 (en) * 2006-06-15 2012-12-05 積水化学工業株式会社 Coating paste
JP5112089B2 (en) * 2008-01-28 2013-01-09 京セラケミカル株式会社 Adhesive composition
JP5499448B2 (en) 2008-07-16 2014-05-21 デクセリアルズ株式会社 Anisotropic conductive adhesive
JP5732389B2 (en) * 2009-06-15 2015-06-10 味の素株式会社 Resin composition and organic electrolyte battery
WO2011086680A1 (en) * 2010-01-15 2011-07-21 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic electrically-conductive adhesive agent
JP5578862B2 (en) * 2010-01-19 2014-08-27 ソマール株式会社 One-pack type epoxy resin adhesive
JP5438783B2 (en) * 2011-02-01 2014-03-12 積水化学工業株式会社 Anisotropic conductive material and connection structure
JP5314713B2 (en) * 2011-02-17 2013-10-16 積水化学工業株式会社 Method for manufacturing connection structure and anisotropic conductive material
JP5802081B2 (en) * 2011-08-24 2015-10-28 株式会社タムラ製作所 Anisotropic conductive paste
CN104379696B (en) * 2012-06-29 2016-10-12 大自达电线股份有限公司 Conductive adhesive composition, conductive adhesive film, adhesive method and circuit base plate
JP6027812B2 (en) * 2012-08-06 2016-11-16 デクセリアルズ株式会社 Circuit connection material
JP6114557B2 (en) * 2013-01-10 2017-04-12 積水化学工業株式会社 Conductive material and connection structure manufacturing method
JP6664147B2 (en) * 2013-04-02 2020-03-13 国立大学法人大阪大学 Anisotropic conductive film and anisotropic conductive connector
JP6269190B2 (en) * 2014-03-10 2018-01-31 三菱ケミカル株式会社 Curable adhesive
WO2015174299A1 (en) 2014-05-14 2015-11-19 積水化学工業株式会社 Conductive paste, production method for conductive paste, connection structure, and production method for connection structure
JP6302818B2 (en) * 2014-10-20 2018-03-28 京セラ株式会社 Repairable adhesive composition and electric / electronic parts
EP3298091B1 (en) * 2015-05-19 2022-12-28 Rohm and Haas Company Curable aqueous composition
KR101908185B1 (en) * 2016-04-29 2018-10-15 삼성에스디아이 주식회사 An anisotropic adhesive film and display devices connected by using the same
JP7028641B2 (en) * 2016-05-19 2022-03-02 積水化学工業株式会社 Conductive materials and connection structures
JP2018104653A (en) * 2016-12-28 2018-07-05 日立化成株式会社 Adhesive composition selection method, circuit member connection method, connection structure, adhesive composition, and film-shaped adhesive
JP6490781B2 (en) * 2016-12-28 2019-03-27 株式会社タムラ製作所 Anisotropic conductive paste and method for manufacturing electronic substrate
JP6772946B2 (en) * 2017-04-26 2020-10-21 信越化学工業株式会社 Low temperature curable liquid epoxy resin composition
EP3677176A4 (en) * 2017-08-29 2021-04-28 Toyobo Co., Ltd. Living-body contact electrode and clothing for measuring living-body information
JP7390236B2 (en) 2020-03-31 2023-12-01 京セラ株式会社 Anisotropic conductive resin composition and micro LED display device
JP7390237B2 (en) 2020-03-31 2023-12-01 京セラ株式会社 Anisotropically conductive resin composition, anisotropically conductive adhesive film, and micro LED display device
KR20220113021A (en) * 2021-02-05 2022-08-12 삼성전기주식회사 Multi-layer ceramic electronic component
JP7122449B1 (en) 2021-05-25 2022-08-19 サンスター技研株式会社 Curable composition and method for producing curable composition
WO2022249282A1 (en) * 2021-05-25 2022-12-01 サンスター技研株式会社 Curable composition and method for producing curable composition

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