JP2000332491A - Chip component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a chip part mounting apparatus capable of preventing suction failures, such as a suction errors from occurring. SOLUTION: A chip component mounting apparatus has a function where a cover tape is separated from a part tape Tn, and a chip part housed in the part tape Tn is mounted on a board 2 by the use of a suction nozzle 3, where air is ionized by an ion generator 10, the ionized air 13 is made to blow against a tape feeder 1. As a result, a part tape Tn or a chip component charged with static electricity is neutralized electrically by the ionized air 13, so that suction errors can be reduced when a chip component is sucked up with a suction nozzle 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting machine for mounting a taped chip component on a substrate.

[0002]

2. Description of the Related Art In a chip component mounting machine for mounting a taped chip component on a substrate, a chip component (for example,
The cover tape of the parts tape in which the transistors, IC chips, and the like are enclosed is peeled off, and the chip components in the parts tape are mounted at predetermined positions on the substrate using a suction nozzle.

[0003]

However, when a chip component in a parts tape is sucked by a suction nozzle, the chip component falls off from the suction nozzle, the chip component is sucked in a displaced state, or the chip component cannot be removed. Adsorption errors such as adsorption on the surface opposite to the surface to be adsorbed are ppm
(Parts per million). Such a suction error such as a shift in the suction becomes not negligible as chip components are downsized.

An object of the present invention is to provide a chip component mounting machine which can prevent a suction error such as a suction shift.

[0005]

Embodiments of the present invention will be described with reference to FIGS. 1, 2, and 4 to 6. FIG. (1) According to the first aspect of the present invention, the chip component Pn is taken out by the suction jig 3 from the part tape Tn in which the chip component Pn is sealed between the first and second tape materials Vn and Cn bonded to each other. The ionization means 10, 12 are applied to a chip component mounting machine mounted on the substrate 2 and ionize means 10, 12 for ionizing gas, and a part tape region H1 including at least a chip component Pn capable of being taken out from the part tape Tn. The above-mentioned object is achieved by providing a supply means 10 for supplying a gas 13 ionized by 12. (2) The invention according to claim 2 is the chip component mounting machine according to claim 1, further comprising a parts reel Rn in which the parts tape Tn is wound in a roll shape, and the supply means 10 supplies the ionized gas 13. It is supplied to the parts tape area H2 drawn from the parts reel Rn. (3) According to a third aspect of the present invention, in the chip component mounting machine according to the first or second aspect, the supply means 10 supplies the ionized gas 13 to the parts tape areas H1, H2 and the suction jig 3. Is what you do.

In the section of the means for solving the above-mentioned problems, which explains the configuration of the present invention, the drawings of the embodiments of the present invention are used to make the present invention easier to understand. However, the present invention is not limited to the embodiment.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1A and 1B are external views of a chip component mounting machine, wherein FIG. 1A is a side view, and FIG. Reference numeral 1 denotes a tape feeder on which a plurality of parts reels R1, R2,..., Rn are mounted.
~ Rn is a parts tape in which chip components are enclosed
T1 to Tn are wound. A large number of the same chip components are sealed in each of the part tapes T1 to Tn for each part tape, and a number of parts reels R1 to Rn corresponding to the number of types of chip components to be mounted on the substrate 2 are provided in the tape feeder unit. . Each of the parts reels R1 to Rn is provided with a jig (see FIG. 2) for peeling off the cover tapes C1 to Cn from the part tapes T1 to Tn. In FIG. 1, the parts reel Rn
Only the part tape Tn and the cover tape Cn are shown.

Reference numeral 3 denotes a suction nozzle for mounting a chip component at a predetermined position on the substrate 2 from the part tapes T1 to Tn.
One or a plurality of heads are attached to the head 4 which is a suction nozzle mounting portion. Generally, as shown in FIG. 1, a plurality of suction nozzles 3a to 3e are mounted, and one of several types of suction nozzles 3a to 3e is selected and used according to the shape of a chip component or the like. The substrate 2 is placed on the xy table 5 when the chip component is mounted on the substrate 2. The tape feeder stage 7 on which the tape feeder unit 1 is mounted can be moved in the left-right direction in FIG. 1B, and the tape feeder stage 7 is moved left and right to obtain a part reel for chip components to be sucked. R1 to Rn face the head 4.

Reference numeral 6 denotes a substrate transport conveyor, and the substrate 2 transported by the conveyor 6 is transported by a transport device (not shown).
It is transferred onto the y table 5. The board 2 on which the chip components are mounted is transferred from the xy table 5 onto the conveyor 6, and sent to the next process by the conveyor 6, for example, a chip component mounting machine for mounting another chip component. Reference numeral 10 denotes an ion generator of an ionizer for ionizing compressed air supplied via a pipe 11, and reference numeral 12 denotes an ion generator 1.
0 is a control unit. The ion generator 10 applies a high voltage to a needle-like or fine-line electrode to generate a discharge, and ionizes air around the electrode to positive or negative. Output adjustment can be performed. The air 13 ionized by the ion generator 10 is blown to the tape feeder 1 and the like.

FIG. 2 is a view for explaining a procedure for taking out the chip component Pn from the part tape Tn and mounting it on the substrate 2.
2 is an enlarged view of the tape feeder unit 1. The parts tape Tn is obtained by attaching a cover tape Cn to an upper part of a container portion Vn having a plurality of concave portions formed therein, and each concave portion of the container portion Vn stores a chip component Pn. In FIG. 2, reference numerals 8 and 9 denote jigs for peeling off the cover tape Cn. Reference numeral 8 denotes a reel for winding the cover tape Cn.
Is a holding plate for preventing the parts tape Tn from floating from the tape feeder stage 7 when the cover tape Cn is peeled off.

When the reel 8 winds the cover tape Cn,
At the same time as the part tape Tn is pulled out from the part reel Rn and moves on the tape feeder stage 7 to the front side of the apparatus, the cover tape Cn is peeled off from the container part Vn. Next, the suction nozzle 3 is lowered onto the chip component Pn to suck the chip component Pn, and is raised again, and then mounted on the substrate 2.

When the above-mentioned suction error was examined, static electricity was presumed to be one of the causes. That is, the movement of the tape feeder stage 7 causes the parts reel Rn to vibrate, causing the chip components Pn to rub against the parts tape Tn (the cover tape Cn and the container part Vn),
It is possible that static electricity is generated when Cn is peeled off. The posture of the chip component Pn at the time of suction is shown in FIG.
Is the correct posture, but the static electricity charges the cover tape Cn, the container Vn and the chip component Pn, and the chip component Pn
It has been found that the above-described suction error occurs when the liquid crystal rises as shown in FIG. 3A or turns upside down as shown in FIG. 3B.

In this embodiment, the cover tape C is ionized by ionizing the air in the ion generator 10 and blowing the ionized air to the tape feeder 1 or the like.
n, neutralize static electricity charged on the container part Vn and the chip part Pn. As a result, it was possible to reduce the suction error of the chip component Pn as compared with the related art. Further, even if static electricity is generated in the chip component Pn or the part tape Tn, the static electricity is immediately neutralized by the ionized air 13 to be blown, and the electrostatic damage to the chip component Pn can be reduced.

The location where the ionized air 13 is blown varies depending on the configuration of the mounting machine, the state of generation of static electricity, and the like. Representative examples are shown in FIGS. FIG. 4 shows a case where the ionized air 13 is blown to the range H1 between the tape reel Rn and the suction nozzle 3, and the air 13 ionized by the ion generator 10 is changed to the range H1 using the duct 10a. I led it. FIG. 5 shows a case where the spraying range is narrowed so that the cover tape Cn is peeled off and the chip component Pn is sprayed on the exposed portion (range H2), and ionized using the duct 10b. The air 13 was squeezed and blown into the range H2. Further, the suction nozzle 3 sucks the chip component Pn by sucking air from the nozzle tip, and static electricity may be generated due to friction between the nozzle member and the air. In such a case, as shown in FIG.
By using c, the ionized air 13 may be blown not only to the tape feeder unit 1 but also to the suction nozzle 3. In any case, the ionized air 13 is blown over the entire width of the tape feeder 1 (the size in the left-right direction in FIG. 1B).

FIG. 7 is a view showing another example of the ionization apparatus, in which a blower fan 20 for supplying ambient air to the ion generator 10 is provided. In the embodiment described above,
Although compressed air was externally supplied to the ion generating unit 10 and ionized, in the example of FIG. 7, the surrounding air supplied by the blower fan 20 was ionized by the ion generating unit 10 and the ionized air 13 was taped. The feeder unit 1 was sprayed. The chip component mounting machine shown in FIG. 7 has an advantage that it is not necessary to provide a means for supplying compressed air to the outside. The configuration other than the ionization device is the same as the mounting machine shown in FIG.

As described above, when the ionized air 13 is blown to the tape feeder unit 1 or the like, the blowing location, the amount of the blown air and the ionization state (positive ions, The amount of negative ions generated) is appropriately adjusted. In the above-described embodiment, air is ionized and sprayed, but not limited to air, other gases may be used.

In the correspondence between the above-described embodiment and the elements of the claims, the suction nozzle 3 is a suction jig, the container Vn is a first tape material, and the cover tapes C1 to Cn are second tapes. The material, the ion generation unit 10 and the control unit 12 use the ionization means, and the ion generation unit 10 and the ducts 10a to 10c.
And the blower fan 20 adjusts the supply means to the ranges H1 and H1.
Reference numeral 2 denotes a parts tape region, and the ionized air 13 constitutes an ionized gas.

[0018]

As described above, according to the present invention,
Since the static electricity charged on the parts tape and the chip components is neutralized by the ionized gas, it is possible to reduce a suction error when the chip components are suctioned by the suction jig. In particular, according to the third aspect of the present invention, since the charging of the suction jig can be prevented, the effect of preventing the suction error can be further enhanced. .

[Brief description of the drawings]

1A and 1B are external views of a chip component mounting machine according to the present invention, wherein FIG. 1A is a side view, and FIG.

FIG. 2 is a diagram illustrating a procedure for mounting a chip component Pn on a substrate 2.

FIG. 3 is a view showing a posture of a charged chip component Pn;
(A) shows a case where the chip component Pn rises, and (b) shows a case where the chip component Pn is inverted.

FIG. 4 is a diagram for explaining how to blow ionized air 13 when a duct 10a is used.

FIG. 5 is a view for explaining how to blow the ionized air 13 when a duct 10b is used.

FIG. 6 is a diagram for explaining how to blow ionized air 13 when a duct 10c is used.

FIG. 7 is a diagram showing another example of the ionization apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tape feeder 2 Substrate 3 Suction nozzle 4 Head 5 xy table 6 Conveyor 7 Tape feeder stage 8 Reel 9 Press plate 10 Ion generator 10a-10c Duct 12 Controller 13 Ionized air 20 Blower fan H1, H2 Range

Claims (3)

[Claims] 1. A chip component mounting machine for taking out a chip component from a part tape in which a chip component is sealed between first and second tape materials bonded to each other with a suction jig and mounting the chip component on a substrate, A chip comprising: ionizing means for ionizing a gas; and supply means for supplying a gas ionized by the ionizing means to a part tape region including at least the chip component detachable from the parts tape. Component mounting machine. 2. The chip component mounting machine according to claim 1, further comprising: a part reel on which the part tape is wound in a roll shape, wherein the supply unit draws out the ionized gas from the part reel. A chip component mounting machine characterized by supplying to a part tape area. 3. The chip mounting apparatus according to claim 1, wherein said supply means supplies said ionized gas to said parts tape area and said suction jig. Component mounting machine.