JP3452249B2 - Cleaning device for tape-shaped members - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape-shaped member, and more particularly to a tape-shaped member cleaning device for removing fine foreign matter adhering to a long tape-shaped member having fine gaps formed at predetermined intervals.

[0002]

2. Description of the Related Art In an electronic component in which a large number of leads are arranged at a narrow pitch, for example, a driver IC used in a liquid crystal display device, the number of leads is determined by the number of pixels, and the number of leads increases as the number of pixels increases. Also this driver IC
Since the package is attached to the liquid crystal display panel integrally, it is required to be small and thin. In order to arrange a large number of leads in a package whose outer dimensions are limited, not only the width of the leads needs to be narrowed, but also the spacing between the leads needs to be narrowed. For that purpose, it is necessary to reduce the thickness of the leads. Generally manufactured using TAB tape. An example of an electronic component (semiconductor device) using this TAB tape is shown in FIGS. 4 and 5. In the figure, reference numeral 1 denotes a long insulating tape 1, which is a middle position in the width direction thereof and is provided with rectangular through holes 1a at predetermined intervals in the longitudinal direction, and feed holes 1b are provided at both sides at regular intervals. There is. Reference numeral 2 is a conductive pattern formed by etching a conductive foil laminated on the insulating tape 1, a part of which is extended into the through hole 1a to form the inner lead 2a,
The outer lead 2b is formed on the insulating tape 1, and the TAB tape 3 is formed by the laminated body of the insulating tape 1 and the conductive pattern 2.
Are configured. A rectangular semiconductor pellet 4 has a large number of electrodes (not shown) formed on one surface thereof, is arranged in the through hole 1a of the TAB tape 3, and is electrically connected to the inner lead 2a. 5 is applied on the semiconductor pellet 4 to cover and protect the connection between the electrode and the inner lead 2a. The array interval of the inner leads 2a of the TAB tape 3 is determined by the electrode interval of the semiconductor pellet 4, and the array interval of the outer leads 2b is determined by the effective length of the insulating tape 1 in the width direction and the number of leads. Therefore, in an electronic component in which the outer lead 2b has a lead-to-lead spacing of, for example, 25 μm, the inner lead 2a has a lead-to-lead spacing of 7 mm.
Since there is no choice but to narrow the width to 10 μm and even a slight deformation of the lead may cause a short circuit, the TAB tape 3 should be handled with care. On the other hand, an apparatus for manufacturing electronic parts has a rotating part and a sliding part, and undesired foreign substances are constantly generated from these parts. Of these, if a foreign substance having conductivity adheres to the space between the leads or the space between the leads, a defective withstand voltage or a short-circuit accident occurs, which causes a failure of the electronic component. Further, since the insulating foreign matter does not cause a problem such as a decrease in withstand voltage or a short circuit, it does not damage the electronic component itself, but it may damage the external connection of the lead or make the electrical connection unstable.
Therefore, electronic components with many leads arranged at a narrow pitch are manufactured in a highly clean work environment, and the parts of the manufacturing equipment where foreign substances may occur are covered to prevent scattering of foreign substances. A static eliminator, a magnetic suction device, an air suction device, etc. are placed in the movement path of the so that even if foreign matter adheres, the adhered foreign matter is separated from the electronic parts, and the separated foreign matter is quickly sucked to prevent re-adhesion. ing. As a device for removing foreign matter in the manufacturing process of electronic parts, a vibrator is applied to the lead frame to vibrate to shake off the attached foreign matter (Japanese Patent Laid-Open No. 59-101844: Prior Art 1), ultrasonic waves. A tool to which vibration is applied is pressed against the lead frame and moved to remove the oxide film formed on the surface of the lead frame (JP-A-61-2).
No. 03645: Prior Art 2), a cleaner in which an air discharge chamber having an air outlet on the bottom surface and an ultrasonic generator inside and an air suction chamber having an air suction chamber on the bottom surface are adjacently arranged. Place the head on the moving panel,
Air blown with ultrasonic waves to the panel to suck and remove foreign matter on the panel surface into the air suction chamber
-80573: Prior art 3), a structure in which an air discharge chamber is arranged in front of and behind the air suction chamber in prior art 3 (Japanese Patent Laid-Open No. Hei 7-60211: Prior art 4), rotation with a rotary shaft horizontally arranged. A rotating brush roll with a brush planted on the peripheral surface of the body is surrounded by a tubular body so that part of the brush projects from the lower end, and the brush is rotated while sucking air from the lower end of the tubular body to mechanically separate it. There is known a device that sucks and removes the foreign matter caused in the tubular body (JP-A-10-309541: Prior art 5). Among the above-mentioned prior arts, the prior arts 1, 2 and 5 are applied to those having a strength capable of withstanding a large external force on the lead frame and panel, but they are flexible like the TAB tape, However, it cannot be applied to fine and narrow array intervals. On the other hand, it is considered that the prior arts 3 and 4 are effective when the foreign matter adhering surface is substantially flat like a TAB tape.

[0003]

By the way, the diameter is 10 μm.
The following foreign particles have an increased electrostatic adhesive force and are easily adhered firmly to the leads and between the leads. In addition, when the distance between the leads is about 10 μm, a large number of them are arrayed with respect to the air blown at high speed. Moreover, the reeds act as one shield and allow the blown air to escape along the surface thereof, so that sufficient pressure cannot be applied between the reeds, making it difficult to remove foreign matter between the reeds. There is also a problem that the leads are easily deformed when the air blowing pressure is increased. As described above, the devices disclosed in the prior arts 3 and 4 are most suitable for removing foreign matter adhering to a flat and strong surface like a liquid crystal display panel, but have a fine lead gap like a TAB tape. Was insufficient for what was formed. Also, if conductive foreign matter remains between the leads without being completely short-circuited between the leads and is resin-sealed, the foreign matter between the leads is fixed by the resin and may be judged as good by electrical inspection. is there. Such electronic components can be used without any problems in low temperature conditions, but when foreign matter expands due to temperature rise and the leads expand in the width direction and the lead interval is narrowed, the foreign matter causes complete conduction between adjacent leads, resulting in liquid crystal. In the case of a display device, there is a risk of causing a serious defect such as a defective line defect on the display panel, and therefore improvement has been desired.

[0004]

SUMMARY OF THE INVENTION The present invention has been proposed for the purpose of solving the above problems, and provides a long tape-shaped member having fine gaps formed at predetermined intervals such as the inner lead of a TAB tape. A tape-shaped member feeding mechanism that moves the tape-shaped member in a substantially horizontal direction, a cover that surrounds the tape-shaped member at an intermediate position of the horizontal movement path of the tape-shaped member and has an opening window formed on the upper surface, and a lower end covers from the opening window of the cover. An ultrasonic horn that is inserted into the tape-shaped member to face the minute gap and irradiates the tape-shaped member with ultrasonic waves to vibrate the tape-shaped member; An air supply mechanism that supplies compressed air and blows air to a vibrating tape-shaped member, and sucks the air blown to the vibrating portion of the tape-shaped member to the outside of the cover to form a tape-shaped portion that includes a minute gap. To provide a cleaning device of the tape-like member, characterized in that it comprises an air suction mechanism for removing foreign matter on.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION A tape-shaped member cleaning device according to the present invention comprises a long tape-shaped member having fine gaps formed at predetermined intervals, and a tape-shaped member which is moved in a substantially horizontal direction. An ultrasonic horn inserted into the cover at an intermediate position causes the tape-shaped member to vibrate and air is blown to the vibrating tape-shaped member, and the air blown to the vibrating portion of the tape-shaped member is blown. The ultrasonic horn used in this device is designed so that the width of the surface facing the tape-shaped member is the width of the tape-shaped member. 70 to 200% of the length of the tape-shaped member is set to 1.5 times or more of the length of the region where the minute gap is formed along the moving path of the tape-shaped member. Further, the inside of the cover surrounding the tape-shaped member is divided into upper and lower parts by the tape-shaped member, and the direction of the air blown to one surface of the tape-shaped member by the air supply mechanism is directed to the other surface side of the tape-shaped member in the cover. Then, the air is sucked by the air suction mechanism. In this case, the inside of the cover is further divided by a shield that extends downward from the inner wall of the cover on the air supply mechanism side to the tape-shaped member moving path, and air is sucked from the space below the shield. In the cleaning device according to the present invention, a guide body for guiding the ultrasonically vibrating tape-shaped member is arranged outside the cover. In this case, the position of the guide body can be adjusted along the movement path of the tape-shaped member, and the position of the guide body is set so that the amplitude of the tape-shaped member becomes maximum. A tape-shaped member suitable for applying the cleaning device according to the present invention has through holes formed at predetermined intervals in the longitudinal direction of the insulating tape, and a part of the conductive pattern laminated on the insulating tape is extended into the through hole. It is a TAB tape in which a large number of inner leads are formed by being present.
Further, the present invention can be applied to a semiconductor device intermediate structure in which a semiconductor pellet is connected to the inner lead of the TAB tape, and further to a semiconductor device intermediate structure in which a connecting portion between the inner lead of the TAB tape and the semiconductor pellet is covered with resin.

[0006]

Embodiments of the present invention will be described below with reference to FIGS. 1 to 3. In the figure, the same components as those in FIGS. 4 and 5 are designated by the same reference numerals, and duplicate description will be omitted. In the figure, reference numerals 6 and 7 constitute a part of a tape-shaped member feeding mechanism that engages with the feeding hole of the TAB tape 3 fed from a supply reel (not shown) to intermittently drive and move horizontally. The first and second sprocket wheels 8 and 8 are covers that surround the TAB tape 3 that is horizontally arranged between the sprocket wheels 6 and 7, and a fixed lower cover 8a and an upper cover 8b that can be opened and closed are attached to the TAB tape 8. It is connected by a hinge 9 on one side wall side along the movement path. The movement path of the TAB tape 3 is arranged in the cover 8 at a position above the cover 8 at substantially equal intervals from the inner walls facing each other, and a hinge 9 is provided below the movement path.
A flat shield 10 extends from the inner wall facing the inner wall on the side. Therefore, the inside of the cover 8 is divided by the movement path of the TAB tape 3 and the shield 10 and communicates vertically with the inner wall of the hinge 9 side, and the air supplied to the upper surface of the TAB tape 3 is shielded from the hinge 9 side. An air flow path is formed so as to wrap around the lower surface of 10. Also, the upper cover 8b
A notch 8c is formed on the upper surface of the notch 8c from the end opposite to the hinge 9 toward the center of the upper surface.
The fine gap formed by the inner leads 2a of the B tape 3 is exposed. 11 is inserted into the cover 8 through the notch 8c of the upper cover 8b, the lower end of which is opposed to a region centered on the semiconductor pellet 4 on the TAB tape 3,
An ultrasonic horn that irradiates the TAB tape 3 with ultrasonic waves. The dimension of the lower end is one side of the inner lead 2 on the TAB tape 3.
The area in which a fine gap is formed on the TAB tape 3 on the other side, which is longer than the diameter of the area in which the a is formed, is approximately the same as the width of the TAB tape 3, that is, the through hole 1a is formed in the TAB tape 3.
Is set to a rectangular shape or a rectangular shape having a length of 1.5 times or more as long as it traverses in the longitudinal direction. Reference numeral 12 is a nozzle of an air supply mechanism that blows air from the notch 8c of the upper cover 8b to the minute gap formed by the inner lead 2a, and 13 is connected to the outside from the opening 8d of the side wall facing the hinge 9 of the lower cover 8a. 3 shows a duct of an air suction mechanism that sucks air in the cover 8. Reference numerals 14 and 15 denote guide bodies for guiding the TAB tape 3 on both sides of the cover 8. The operation of this device will be described below. First, the guide tape connected to the front end of the TAB tape 3 is fed out from the supply reel, engaged with the sprocket wheel 6, mounted on the guide body 14, passed through the inside of the cover 8, and mounted on the guide body 15, and then the sprocket wheel. 7 and engages with a take-up reel (not shown). As a result, the TAB tape 3 is arranged near the ultrasonic horn 11. Next, the ultrasonic horn 11
When ultrasonic vibration is applied on the TAB tape 3 by
The AB tape 3 vibrates between the guide bodies 14 and 15. The amplitude of the tape 3 in the cover 8 depends on the material of the ultrasonic horn 11, the ultrasonic output, the outer shape and dimensions of the ultrasonic horn 11,
In addition to the conditions related to the ultrasonic horn 11 such as the distance between the ultrasonic horn 11 and the TAB tape 3, the amplitude of the tape can be adjusted by the distance between the guide bodies 14 and 15, for example, a polyimide tape having a width of 35 mm and a thickness of 12 μm. In the case where a large number of inner leads 2a each having a width of 50 μm and an arrangement interval of 60 μm (lead interval 10 μm) are formed by laminating the copper foils, the maximum amplitude of the tape 3 is set to 20 to 100 μm. In this way, the ultrasonic horn 11 is operated, the air supply mechanism and the air suction mechanism are operated, and the air blown from the nozzle 12 into the region including the fine gap formed by the inner leads 2a on the TAB tape 3 is operated. Guess The air blown onto the TAB tape 3 moves to the hinge 9 side through the upper surface of the TAB tape 3, the through hole 1a of the TAB tape 3 and the feed holes 1b, T.
Although it branches between the AB tape 3 and the inner wall of the cover 8 to be fed into the space between the TAB tape 3 and the shield 10,
The air that has passed through the respective paths merges on the hinge 9 side in the cover 8, passes through the space formed by the lower cover 8a and the shield 10, and is sucked into the duct 13 connected to the air suction mechanism. Therefore, the foreign matter attached to the surface of the TAB tape 3 is blown away by the air, moves along the air flow path formed in the cover 8, and does not reattach to the TAB tape 3 or the inner wall of the cover 8 and the air suction mechanism. Are removed by. The TAB tape 3 in the cover 8 vibrates with a large amplitude due to the blowing pressure of air, and further vibrates finely at high speed by the ultrasonic waves emitted from the ultrasonic horn 11. On the other hand, the amplitude of this fine vibration is the inner lead 2
The inner lead 2a, which is larger than the thickness of a and vibrates minutely, receives an acceleration obtained by multiplying the square of the vibration angular velocity by the amplitude.
This acceleration also acts on the foreign matter that has entered between the inner leads 2a, but the force applied to the foreign matter from the lead 2a is
Since the movement of a is slightly delayed, the difference in force between the lead and the foreign matter is enlarged when the direction of vibration changes, and a large force is applied to the foreign matter. Further, the TAB tape 3 swings due to the blowing pressure of air and the through hole 1a is slightly twisted. However, since this twist is not uniform, the TAB tapes 3 are arranged in parallel and the semiconductor pellets 5 are arranged in parallel.
The distance between the inner leads 2a fixed to the position slightly changes.
Therefore, foreign matter that enters between the leads in a minute gap and adheres strongly electrostatically and is difficult to remove even with high pressure air expands the lead spacing due to the twisting of the TAB tape 3 and thus widens the lead-foreign matter spacing. At the moment when it is released, it is released from between the leads due to minute vibration. On the other hand, a constant air flow is formed on both upper and lower sides of the TAB tape 3,
Since the surface of the tape 3 is in contact with the air flow and vibrates finely, the foreign matter emitted from between the leads 2a, 2a jumps into the air flow and is removed without reattaching to the TAB tape 3. It In the cleaning device according to the present invention, even if the surface of the TAB tape is roughened by the semiconductor pellets 4 or the like, foreign matter released from the fine gap due to ultrasonic vibration is removed by air to prevent re-adhesion. Foreign matter can be reliably removed without being hit by high-pressure air. The ultrasonic horn 1
Since the ultrasonic waves emitted from the lower end of 1 spread and the energy is attenuated, the width of the lower end facing the TAB tape 3 is T
The width of the AB tape 3 may be 70 to 200%, and the interval between the ultrasonic horn 11 and the TAB tape 3 may be set within this range. If the lower end width of the horn 11 is smaller than 70%, the distance between the horn 11 and the TAB tape 3 must be close to each other, and it becomes difficult to vibrate the entire tape. If the lower end width of the horn 11 is larger than 200%, the cover 8 is The width must also be widened, the internal volume of the cover 8 increases, the pressure of the air flowing through the cover 8 decreases, and a turbulent flow is easily generated, and the flowing foreign matter is easily reattached to the TAB tape.
On the other hand, by extending the dimension of the lower end of the horn 11 along the longitudinal direction of the TAB tape 3, it is possible to collectively vibrate and clean a wide range on the TAB tape. in this case,
Not only the lower end of the ultrasonic horn 11 is formed into one flat surface, but also the through hole 1a portion in which a minute gap is formed is projected, and ultrasonic vibration is applied to a plurality of through hole 1a portions by one ultrasonic horn. Can be concentrated. The dimension along the longitudinal direction of the TAB tape 3 at the lower end of the horn 11 is such that when the TAB tape 3 is intermittently fed and the through hole 1a portion is stopped at the position of the horn 11 to apply ultrasonic vibration, the TAB of the through hole 1a.
It is desirable that the length of the tape 3 along the longitudinal direction be 1.5 times or more, but when the TAB tape 3 is minutely fed without being stopped, it may be narrower than the above-mentioned size of 1.5 times. Further, since the guide bodies 14 and 15 support the TAB tape 3 that vibrates minutely, it is desirable that the surface on which the TAB tape 3 slides is made of a material having a good lubricating property such as a fluororesin. Further, the interval between the guide bodies 14 and 15 can be adjusted according to the width of the TAB tape 3 and the size of the through hole 1a, so that the TAB tape 3 can be fixed at a position where the amplitude is maximum.
Further, in the above-described embodiment, TA which is a tape-shaped member having a minute gap and is fixed with the semiconductor pellet 4 and covered with the resin 5.
I explained the B tape, but TA before coating with resin
The B tape may be used, the TAB tape before connecting the semiconductor pellets 4 may be used, and the cleaning device according to the present invention may be arranged in each work step arranged along the movement path of the TAB tape 3. Further, an ion generator for removing static electricity from the charged foreign matter may be attached to the air supply mechanism, and the magnetic foreign matter can be removed by disposing a magnet along the moving path of the tape member. Further, the tape-shaped member having a minute gap applicable to the device of the present invention is a tape-shaped member having a minute gap in which adhesion of foreign matters becomes a problem, a member having a member having a minute gap fixed to the tape-shaped member, etc. It is not limited to the tape 3.

[0007]

As described above, according to the present invention, a tape-like member having a fine gap formed therein, for example, a foreign substance that has entered the fine gap formed by the inner leads such as a TAB tape is reliably removed. Therefore, it is possible to eliminate the defect caused by the foreign matter.

[Brief description of drawings]

FIG. 1 is a front sectional view of a main part showing a cleaning device according to the present invention.

FIG. 2 is a side sectional view of the apparatus shown in FIG.

FIG. 3 is a plan view of the apparatus shown in FIG.

FIG. 4 is a perspective view of a main part showing a TAB tape as an example of a tape-shaped member having a minute gap.

5 is a side sectional view of the TAB tape shown in FIG.

[Explanation of symbols]

3 Tape-shaped members (TAB tape) 6 Tape-shaped member feeding mechanism (sprocket wheel) 7 Tape-shaped member feeding mechanism (sprocket wheel) 8 covers 8a open window 11 ultrasonic horn 12 Air supply mechanism (nozzle) 13 Air suction mechanism (duct)

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-4-94144 (JP, A) JP-A-4-162733 (JP, A) JP-A-10-321677 (JP, A) JP-A 2000-3942 (JP, A) JP-A-11-235559 (JP, A) JP-A-1-284376 (JP, A) JP-A-1-266726 (JP, A) (58) Fields investigated (Int. Cl. ⁷⁾ , DB name) H01L 21/60 B08B 5/00-11/00

Claims (10)

(57) [Claims] 1. A tape-shaped member feeding mechanism for moving a long tape-shaped member in which fine gaps are formed at predetermined intervals in a substantially horizontal direction, and a tape-shaped member at an intermediate position of a horizontal movement path of the tape-shaped member. The cover is surrounded and has an opening window formed on the upper surface, and the lower end is inserted into the cover through the opening window of the cover to face the minute gap of the tape-shaped member, and the tape-shaped member is irradiated with ultrasonic waves to form a tape shape. An ultrasonic horn that vibrates the member, an air supply mechanism that supplies pressurized air into the cover from the side of the moving path of the tape-shaped member, and blows air to the vibrating tape-shaped member, and vibration of the tape-shaped member. A tape-shaped member cleaning device, comprising: an air suction mechanism that sucks air blown to a portion outside the cover to remove foreign matter on the tape-shaped member including a minute gap. 2. An area in which the width of the surface of the ultrasonic horn facing the tape-shaped member is 70 to 200% of the width of the tape-shaped member, and a gap having a minute length along the moving path of the tape-shaped member is formed. 2. The tape-shaped member cleaning device according to claim 1, wherein the length is set to 1.5 times or more. 3. The inside of the cover surrounding the tape-shaped member is divided into upper and lower parts by the tape-shaped member, and the direction of the air blown to one surface of the tape-shaped member by the air supply mechanism is changed within the cover. The tape-shaped member cleaning device according to claim 1, wherein the tape-shaped member cleaning device is turned upside down and sucked by an air suction mechanism. 4. The inside of the cover is partitioned by a shield extending downward from the inner wall of the cover on the air supply mechanism side to the tape-shaped member moving path, and air is sucked from the space below the shield. The tape-shaped member cleaning device according to claim 3. 5. The tape-shaped member cleaning device according to claim 1, further comprising a guide body arranged outside the cover for guiding the tape-shaped member that vibrates ultrasonically. 6. The tape-shaped member cleaning device according to claim 5, wherein the position of the guide member is adjustable along the movement path of the tape-shaped member. 7. The tape-shaped member cleaning device according to claim 6, wherein the position of the guide member is set so that the amplitude of the tape-shaped member is maximized. 8. A tape-shaped member forms through holes at predetermined intervals in a longitudinal direction of an insulating tape, and a part of a conductive pattern laminated on the insulating tape is extended into the through holes to form a large number of inner leads. The tape-shaped member cleaning device according to claim 1, wherein the cleaning device is a formed TAB tape. 9. The cleaning device for a tape-shaped member according to claim 8, wherein the tape-shaped member is a semiconductor device intermediate structure in which a semiconductor pellet is connected to an inner lead of a TAB tape. 10. The cleaning device for a tape-shaped member according to claim 9, wherein the tape-shaped member is a semiconductor device intermediate structure in which a connecting portion between the inner lead of the TAB tape and the semiconductor pellet is covered with a resin.