JP2005303192A - Tape cleaning equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape cleaning device causing no meandering of a film carrier for packaging an electronic component and capable of always keeping a pressed state between a cleaning roll and the tape even if the surface of the cleaning roll which contacts with the tape wears, and capable of always keeping a large contact area between the cleaning roll and the tape. <P>SOLUTION: The tape cleaning device comprises not less than two sets of a unit cleaning device comprising a set of a freely-rotatable cleaning roll and a freely-rotatable adhesive foreign-particle-eliminating roll contacting with the cleaning roll, each unit cleaning device does not contact each other, and the cleaning roll of each of the each unit cleaning device closely contacts with the surface and the rear surface of the tape to be cleaned with a twining angle kept. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a tape cleaning device, and in particular, an electronic component mounting film carrier tape (for example, TAB (Tape Automated Bonding) tape, COF (Chip On Film) tape, CSP (Chip Size)) on which electronic components such as semiconductor chips are mounted. The present invention relates to a cleaning device for a package) tape and a film carrier tape for mounting an electronic component such as a BGA (Ball Grid Array) tape. In the present invention, the term “film carrier tape for mounting electronic components” includes not only a carrier tape before mounting electronic components but also a carrier tape after mounting.

  Various printed wiring boards are used to mount electronic components on liquid crystal devices such as personal computers, mobile phones, and televisions, or printers. In recent years, these devices have become smaller and lighter. As the number of display pixels increases as the panel becomes higher in definition, the conductor wiring pattern of the electronic component mounting film carrier tape is becoming finer and higher in density.

  The film carrier tape for mounting electronic components having such a narrow pitch wiring pattern is a long tape in which a wiring pattern for each piece is repeatedly formed in the longitudinal direction of the carrier tape, and the manufacturing process, quality inspection process, In the electronic component mounting process or the like, the carrier tape is conveyed from reel to reel through a sprocket hole or the like. Note that the wiring pattern is covered with a protective solder resist on the entire surface except for the inner lead and outer lead portions as necessary, and the inner lead and outer lead portions are antioxidized and external terminals of the electronic component. For example, tin plating is applied for the purpose of improving connectivity with the electronic component, and the electronic component is bonded to the inner lead, for example, via a bump at the position of the electronic component mounting portion. A predetermined area of the electronic component mounting film carrier tape is punched by a punching device to obtain a semiconductor device.

  However, foreign matter such as dust may be attached to the film carrier tape for mounting electronic components, and the punching device bites the foreign matter, and the foreign matter is pressure-bonded to the semiconductor device. There is a problem that the semiconductor device is easily damaged due to damage.

  Conventionally, as a method for removing foreign matters such as dust, as shown in FIG. 2, two free-rotating cleaning rolls 11 are pressed against each other, and an electronic component mounting film carrier tape is interposed between the two cleaning rolls 11. 12, a foreign substance such as dust existing on the front and back surfaces of the electronic component mounting film carrier tape 12 is moved to the cleaning roll 11, and the dust that has moved to the cleaning roll 11 is in close contact with the cleaning roll 11. The dust collecting roll 13 was adhered and collected.

  However, when removing foreign substances such as dust from the electronic component mounting film carrier tape by the above method, the entrance angle of the electronic component mounting film carrier tape entering between the two cleaning rolls is slightly shifted. However, the film carrier tape for mounting electronic components may meander and damage the film carrier tape for mounting electronic components. In such a case, it was necessary to stop the operation of the device immediately. .

  Further, in the above-described method, since the electronic component mounting film carrier tape is passed between the two cleaning rolls, the portion of the cleaning roll that comes into contact with the electronic component mounting film carrier tape as time passes is increased. As the surface gradually wears and wear progresses, the non-wearing part of the cleaning roll becomes an obstacle and the contact surface between the cleaning roll and the electronic component mounting film carrier tape gradually decreases. Cannot be pressed against the film carrier tape for mounting electronic components, and the removal efficiency of foreign matters such as dust is reduced.

  The present invention does not cause the above-described problems, that is, the electronic component mounting film carrier tape does not meander, and even if the surface of the cleaning roll in contact with the electronic component mounting film carrier tape is worn, cleaning is performed. A tape cleaning device that can maintain a state in which the roll and the electronic component mounting film carrier tape are always in pressure contact, and can always maintain a large contact surface between the cleaning roll and the electronic component mounting film carrier tape. It is intended to provide.

  As a result of intensive studies to achieve the above object, the present inventors have achieved the above object by bringing the front and back surfaces of the electronic component mounting film carrier tape into close contact with the cleaning roll that rotates separately with a winding angle. In addition, the present inventors have found that this method is effective for cleaning not only a film carrier tape for mounting electronic parts but also all long tapes, and thus completed the present invention.

  That is, the tape cleaning device of the present invention, particularly the cleaning device for a film carrier tape for mounting electronic components, includes two unit cleaning devices each composed of a combination of a free-rotating cleaning roll and a free-rotating adhesive dust removing roll in close contact with the cleaning roll. The unit cleaning device is arranged so that each unit cleaning device does not come into contact with each other and the cleaning roll of each unit cleaning device is in close contact with the front and back of the tape to be cleaned with a winding angle. Features.

  In the tape cleaning device of the present invention, even if the tape entry angle is slightly deviated, the film carrier tape for electronic component mounting does not meander, and the portion in contact with the film carrier tape for electronic component mounting does not occur. Even if the surface of the cleaning roll is worn, the cleaning roll and the film carrier tape for mounting electronic components can always be kept in pressure contact, and the contact surface between the cleaning roll and the film carrier tape for mounting electronic components can be maintained. Can always keep big.

  The tape cleaning apparatus of the present invention is effective for cleaning all long tapes, but is particularly effective for cleaning electronic component mounting film carrier tapes, and therefore, cleaning of electronic component mounting film carrier tapes will be described below. .

  As this electronic component mounting film carrier tape, for example, a punch hole such as a sprocket hole for conveyance, a round hole for mounting a solder ball or a metal bump or a device hole for bonding is formed in an insulating film made of polyimide, A copper foil is laminated on the insulating film via an adhesive, and then a wiring pattern is formed by patterning the copper foil on the surface of the tape while transporting the tape using a sprocket hole. A TAB tape and a BGA tape manufactured through a process of forming a solder resist layer on the wiring pattern as required can be used.

  As the insulating film, it is preferable to use a synthetic resin film excellent in heat resistance, chemical resistance, wet heat stability and the like. Polyimide film, polyamideimide film, heat-resistant polyester film, BT resin film, phenol resin film, liquid crystal polymer film can be used as such synthetic resin film, but it has excellent heat resistance, chemical resistance, and wet heat stability. It is particularly preferable to use a polyimide film showing

  The tape cleaning device of the present invention will be described with reference to FIG. The tape cleaning device of the present invention has two or more unit cleaning devices 3 composed of a combination of a free rotating cleaning roll 1 and a free rotating adhesive dust removing roll 2 in close contact with the cleaning roll, and four sets in FIG. . In the tape cleaning device of the present invention, the unit cleaning devices 3 are not in contact with each other, and the cleaning roll 1 of each unit cleaning device is preferably disposed on the front and back surfaces of the tape 4 to be cleaned, preferably in FIG. As shown, it is arranged so as to be in close contact with the front and back surfaces alternately with a winding angle.

  In the tape cleaning device of the present invention, two sets of unit cleaning devices are used, and the cleaning roll 1 of each unit cleaning device makes close contact with the winding angle in the order of the front and back surfaces of the tape 4 to be cleaned or vice versa. Even if they are arranged in such a manner, the cleaning rolls 1 of each unit cleaning device using three sets of unit cleaning devices are closely in contact with each other in the order of the front surface, the back surface, and the surface of the tape 4 to be cleaned or vice versa. Even if it arrange | positions so that it may arrange | position, it winds in the order of the surface of the tape 4 which should be cleaned by the cleaning roll 1 of each unit cleaning device, the front surface, the back surface, or the reverse order using four sets of unit cleaning devices They may be placed close to each other at an angle. The training device may be used 5 or more sets.

  In the tape cleaning device of the present invention, the cleaning roll may be any material as long as it can adsorb foreign matter such as dust on the front and back surfaces of the tape, but is generally a rubber roll, and has a predetermined frequency. It is preferable to use a rubber roll because it is necessary to wash with, for example.

  The adhesive dust removal roll may be anything as long as it receives foreign matter such as dust from the cleaning roll and does not return it to the cleaning roll. However, the adhesive strength decreases due to the attachment of foreign matter such as dust. It is preferable that it is a roll formed by winding the adhesive sheet. Such an adhesive dust removing roll can be used repeatedly and effectively because a new adhesive surface is exposed by peeling off a portion where the adhesive strength is reduced due to adhesion of foreign matters such as dust.

  When cleaning a tape using the tape cleaning device of the present invention, preferably, a guide roll 5 is provided before and after a plurality of unit cleaning devices 3 arranged in succession, and a driving roll is used to move the tape. 6 is provided. Further, in order to ensure that the cleaning roll 1 is in close contact with the front or back surface of the tape 4 to be cleaned with a winding angle, a tape tension adjusting roll 7 is provided. A dancer roll may be used as the tape tension adjusting roll 7 or a roll capable of applying a back tension may be used.

  The tape cleaning device of the present invention is particularly suitable as a cleaning device for a film carrier tape for mounting electronic components, and a manufacturing device for film carrier tape for mounting electronic components including a manufacturing process, a quality inspection process, an electronic component mounting process, etc., for example, AOI Incorporated into film carrier tape manufacturing equipment for electronic component mounting, such as a tape editing machine that cuts and removes tapes in areas containing many defective pieces with a splicer and connects tapes in areas containing non-defective pieces In particular, it is preferable to incorporate the semiconductor chip in the final stage before bonding the semiconductor chip.

It is a schematic explanatory drawing which shows an example of the tape cleaning apparatus of this invention. It is a schematic explanatory drawing which shows an example of the conventional tape cleaning apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cleaning roll 2 Adhesive dust removal roll 3 Unit cleaning apparatus 4 Tape 5 Guide roll 6 Drive roll 7 Tape tension adjustment roll

Claims (5)

  There are two or more unit cleaning devices composed of a combination of a free-rotating cleaning roll and a free-rotating adhesive dust-removing roll that is in close contact with the cleaning roll, and each unit cleaning device does not come into contact with each other and each A tape cleaning device, wherein the cleaning roll of the unit cleaning device is disposed so as to be in close contact with the front and back surfaces of the tape to be cleaned with a winding angle.   2. The tape cleaning device according to claim 1, wherein the cleaning rolls of the respective unit cleaning devices are arranged so as to be in close contact with the front and back surfaces of the tape to be cleaned alternately with a winding angle.   The tape cleaning device according to claim 1 or 2, wherein the cleaning roll is a rubber roll, and the adhesive dust removing roll is a roll formed by winding a back-side peelable adhesive sheet.   4. The tape cleaning device according to claim 1, wherein the tape cleaning device is a film carrier tape cleaning device for electronic component mounting. 4. The tape cleaning device according to claim 1, wherein the tape cleaning device is incorporated in a film carrier tape manufacturing apparatus for electronic component mounting.

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